40-Position BGA/LGA PCBeam Connector for Texas Instruments Series 310 DMD
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1 PCBeam Connector for 40-Position BGA/LGA PCBeam Connector for Texas Instruments Series 310 DMD Neoconix P/N: FBX0040CMFF6AU00 FEATURES High density mm area-array pitch Low profile, 1.06mm mated height PCBeam high reliability LGA spring contacts Hard gold-plated contact interface to DMD Standard SMT assembly ROHS 2011/65/EU compliant IPC-4101B compliant (halogen free) OVERVIEW This one-piece, high density connector product was developed specifically for the Texas Instruments Series 310 DMD. Featuring Neoconix s patented PCBeam interconnect technology, this product offers high performance and high reliability in an extremely compact form factor. Solder balls are pre-attached for ease of assembly onto the target flex circuit or rigid circuit board. PCBeam Technology Side View Top (LGA) Bottom (BGA) ORDERING INFORMATION: Part Number: FBX0040CMFF6AU00 Production Packaging: Jedec Compliant Low Profile Matrix Trays Minimum Production Order Size: 2,352 units (8 trays) 1 of 7
2 PCBeam Connector for SPECIFICATIONS MECHANICAL Contact Configuration single-beam Contact Pitch mm x mm Contact Count (10x4) Target Load / Contact N (approx. 40g) Contact Deflection mm typical ELECTRICAL Current Rating A per position Resistance < 50mΩ per position Dielectric Withstanding Voltage VDC Insulation Resistance M ENVIRONMENTAL Operating Temperature C to 85 C Storage Temperature C to 85 C Humidity hrs, 90%-95% RH, 40 C Heat Resistance hrs, 85 C Cold Resistance hrs, -20 C Temperature Cycling cycles, -20 C to 85 C Solder Heat Resistance C, 10 sec Salt Spray hrs, 5% salt mist & air Durability mating cycles Random Vibration hrs, 1.5mm, Hz, 3 axis MATERIALS Core Dielectric..... MCL E-75G or equivalent Contact Elements..... copper alloy Contact Plating..... hard Au over Ni Surface Insulator.... polyimide or soldermask RoHS Compliant..... yes, per RoHS Dir. 2011/65/EU Halogen free.. yes, per IPC-4101B NOTE: Specifications are subject to change without notice. 2 of 7
3 PCBeam Connector for DIMENSIONAL INFORMATION (FBX0040CMFF6AU00 rev08) 3 of 7
4 PCBeam Connector for RECOMMENDED FPC OR PCB LAYOUT (dimensions in mm) Note: If FPC is used, a 0.8mm thick FR4 (or similar) stiffener is recommended on backside of FPC to provide rigidity and reduce warp. ASSEMBLY & HANDLING GUIDELINES The use of latex gloves is recommended when handling interposers. As with any normal force connector, avoid touching contact tips and handle the product only by its edges. When clamping the DMD device onto the connector, please ensure that the force is applied uniformly. Force should be applied vertically through the z-axis and not in an angled direction. Cleaning is typically not needed if the product is kept in original packaging. When necessary, cleaning can be employed with the use of compressed air. Direct the flow of air in the direction that the contact elements are pointing. Cleaning can also be performed with an ultrasonic bath of isopropyl alcohol (IPA). A 5 minute soak can be followed by a 10 minute bake at 65 C. When not in use, please keep product stored in original packaging. 4 of 7
5 PCBeam Connector for PICK & PLACE GUIDELINES A protective pick and place cap has been developed to simplify surface mount assembly. A corner chamfer is used to identify the pin 1 location. All production interposers will be shipped with a pick & place cover pre-attached. Detailed dimensional information is below for reference. 5 of 7
6 PCBeam Connector for SOLDER REFLOW GUIDELINES The Neoconix interposer is provided with Pb-free solder balls for assembly onto the target FPC or PCB. Below is a recommended reflow profile for reference only. A cool-down rate of 2-4 C/second is recommended. Some optimization may be required for your specific assembly. The recommended solder paste has composition Sn96.5/Ag3.0/Cu0.5. Recommended stencil thickness is 0.15mm and recommended stencil aperture is 0.40 mm. Courtesy: Amtech LF-4300 Product Datasheet, 3/06 PACKAGING INFO Production parts are provided in Jedec Low Profile Matrix Trays (variation AG) with 294 pockets per tray. Detailed drawings are available upon request. (dimensions in mm) 6 of 7
7 PCBeam Connector for CONTACT INFO For any additional questions, please contact Neoconix at the address below: Neoconix, Inc C Paragon Dr. San Jose, CA USA (408) (phone) ADDITIONAL REFERENCES Assembly Services: Flex One Technologies 1963 Concourse Drive San Jose, CA USA (408) Texas Instruments is a registered trademark of Texas Instruments Incorporated. PCBeam is a trademark of Neoconix Incorporated. REVISION HISTORY Rev A 11/3/2010 Initial Release Rev B 2/20/2011 Removed info on prototype pick & place adapter. Added detail on pick & place cap. Changed Jedec tray to accommodate pick & place cap. Changed MOQ based on different parts/tray in new tray design. Added solder mask as another surface insulator material Increased operating temperature to 85C Rev C 4/27/2011 Corrected pockets / tray to 294 Minor changes to pick & place cap drawing (slightly increased width of one tab) Rev D 3/7/2012 Updated to reference drawing rev8. Rev E (ECN1151) 10/9/2014 Updated company contact info. Confirmed RoHS & halogen-free compliance. Clarified specific cap material. Incorporated product-specific environmental test specs. 7 of 7
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