Custom Connectors Overview

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1 Company Overview March 12, 2015 Custom Connectors Overview Tuesday, October 03, 2017

2 CONNECTOR OVERVIEW Engineering Manufacturing Connector Products HiLo FlexFrame Custom Connectors Standard Connectors IC Obsolescence Solutions

3 ENGINEERING Collaborative design approach starting with concept & feasibility 3D Solidworks Design Signal Integrity analysis & validation Thermal and Power modeling CTE (Coefficient of Thermal Expansion) optimized material selection Mold & contact design IC Obsolescence Solutions

MANUFACTURING In-house mold making & high-volume injectionmolding equipment Full tool shop - CNC machines, wire EDMs Contact stamping and forming Multi-head drilling & routing

4 MANUFACTURING In-house mold making & high-volume injectionmolding equipment Full tool shop - CNC machines, wire EDMs Contact stamping and forming Multi-head drilling & routing for laminate insulator Automated contact insertion equipment 100% Optical Inspection capability for flatness and contact co-planarity and true position IC Obsolescence Solutions

wide range of commercial, industrial, and

concept to mass production in weeks, not

5 CONNECTOR PRODUCTS ISI s standard and custom connector technologies support a wide range of commercial, industrial, and defense applications. Our in-house design and manufacturing capabilities allows us to quickly go from concept to mass production in weeks, not months and allows for surprisingly affordable NRE. Our design services include signal-integrity analysis, co-efficient of thermal expansion matching, vibration and shock testing. HiLo Interconnect FlexFrame Interconnect Custom Connectors Standard Connectors Area Array Interconnect Emulate Leadframe IC Package Application Specific Solutions Board-to-Board Interconnect IC Obsolescence Solutions

HiLo FLEXIBLE INTERCONNECT BGA/LGA Socketing Module Interconnect Highs Lows Flexibility High Density: 0.8mm pitch and above High Speed: 1 db cut-off measured at 9.

Socket height less than 2mm Low Cost: A few cents per mated pair in high volume production Low Tooling Cost: Tooling cost for custom footprints less than $1,000 Low Insertion Force: One ounce per

6 HiLo FLEXIBLE INTERCONNECT BGA/LGA Socketing Module Interconnect Highs Lows Flexibility High Density: 0.8mm pitch and above High Speed: 1 db cut-off measured at 9.3 GHz High I/O: Available with over 2400 positions High Reliability: Proven dual-beam gold-plated high strength copper alloy contacts High Speed Assembly: Pick and place compatible Low Profile: Socket height less than 2mm Low Cost: A few cents per mated pair in high volume production Low Tooling Cost: Tooling cost for custom footprints less than $1,000 Low Insertion Force: One ounce per contact Any Application: Production IC socket, module-to-board connector, flex to PCB Quick Delivery: Prototype quantities shipped in 2 weeks Any Footprint: Not limited to standard arrays or geometries. Design freedom for mixed pitch, selectively populated, and non-grid arrays CTE Compliant: Designed to accommodate thermal mismatch

HiLo DESIGN The HiLo system consists of two contacts: A pin (male) and socket (female) Dual beams make contact to pin Pin (Male) Base material: Phosphor Bronze (typical) Plating: Gold over Nickel

7 HiLo DESIGN The HiLo system consists of two contacts: A pin (male) and socket (female) Dual beams make contact to pin Pin (Male) Base material: Phosphor Bronze (typical) Plating: Gold over Nickel (typical) Diameter 0.3mm (0.012 ) for 1mm pitch + Diameter 0.2mm (0.008 ) for 0.8mm pitch + Socket (Female) Base material: Beryllium Copper Plating: Selective Gold over Nickel (typical) Different contacts tooled for different pitch J-Lead on bottom of contact is surface mount soldered to BGA pattern on PCB

HiLo DESIGN HiLo connector housings are manufactured from drilled laminate instead of molded plastic: Improved Solder Joint Reliability: For large area array connectors, a CTE mismatch between the

8 HiLo DESIGN HiLo connector housings are manufactured from drilled laminate instead of molded plastic: Improved Solder Joint Reliability: For large area array connectors, a CTE mismatch between the connector and PCB materials can result in significant stresses and failures under thermal cycling applications. HiLo minimizes these CTE mismatch stresses by utilizing a laminate with a CTE similar to the customer s PCB. Better Flatness: Drilled laminate connectors also exhibit less warp and twist during reflow compared to molded connectors. ISI s HiLo designs have a tendency to conform to the substrate material during reflow resulting in high quality, reliable solder joints. HiLo is available with the following laminate materials: Resin Tg X-Y CTE Dielectric Constant FR4 125 o C High Temp Epoxy 210 o C Polyimide 250 o C

solders to PCB Note: Drawings shown are for reference only.

9 HiLo DESIGN Typical Configurations: Pin Field (Male) Socket (Female) Pin inserts into This end of pin is soldered to PCB, BGA or LGA dual beam contact This end of pin is inserted into socket J-lead solders to PCB Note: Drawings shown are for reference only. ISI manufactures with different materials, dimensions, etc. to suit various applications. Please consult ISI for accurate drawings for your application.

HiLo CROSS SECTION HiLo Cross Section - BGA Socketing Application BGA

prevents solder from wicking up contact J-Lead soldered to motherboard

10 HiLo CROSS SECTION HiLo Cross Section - BGA Socketing Application BGA Substrate Solder ball forms joint around pin tip Pin inserted into dual beam contact. (Gold to Gold contact) Motherboard Nickel plating in inside of barrel prevents solder from wicking up contact J-Lead soldered to motherboard (J cut off in cross-section) Cross Section Samples Indicate: Good alignment of socket J lead to PCB pad Uniform wetting of solder

HiLo MANUFACTURING HiLo uses a standard, high volume,

driven process: Engineering files load directly into

job-specific tooling Standard materials + standard process +

inspection ensures quality on 100% of units manufactured

11 HiLo MANUFACTURING HiLo uses a standard, high volume, production process to make custom product variants: Data driven process: Engineering files load directly into production equipment Standard panel size eliminates job-specific tooling Standard materials + standard process + unique data file = custom product Automated optical inspection ensures quality on 100% of units manufactured High-accuracy, multi-head drilling Precision routing Automated contact insertion Automated optical inspection

12 HiLo APPLICATIONS Optimize interconnect for your application without increasing cost or lead-time Any Pitch (& Mixed Pitch!) Any Pattern Positions Mounting hardware and alignment features available

13 HiLo APPLICATIONS ISI HiLo Connectors

14 HiLo APPLICATION IC SOCKETING Step 1: IC soldered to HiLo Pin Field to create MicroPGA Step 2: Socket soldered to motherboard Pin Field Socket Step 3: IC + Pin Field inserted into Socket High Pin-Count ASIC Optical Module

15 HiLo APPLICATION IC SOCKETING HiLo Standard Products for FPGA BGA Packages for the list online, click here.

16 HiLo APPLICATION - 3D MODULE INTERCONNECT Pinfield Socket Mated set Daughter Card HiLo Pin Field Motherboard HiLo Socket Board-to-board spacing can be changed by increasing pin length and pin carrier thickness

17 HiLo SUPERCOMPUTER PROGRAM ISI s HiLo system was selected as the exclusive interconnect for supercomputer that involved nearly 21 million contacts per system. Product Products per Board Boards per System Products per System Contacts per System HiLo Pin Field, 540 Position ,520 5,140,800 HiLo Socket, 540 Position ,520 5,140,800 HiLo Pin Field, 630 Position ,256 3,941,280 HiLo Socket, 600 Position ,256 3,941,280 Board to Board, 141 Position ,248 1,303,968 HiLo Socket, 141 Position ,248 1,303,968 Leaded Carrier, 8 leads, 7 pins , ,080 Total ,920 20,980,176

HiLo APPLICATION INFORMATION ISI offers a family of removal tools that can be

Adjust tool to proper width with three adjustment screws P/N E00001-2 2.

Press on edges of tool to extract pinned IC P/N E00002-2: 4-sided tool P/N

18 HiLo APPLICATION INFORMATION ISI offers a family of removal tools that can be used with HiLo BGA socketing systems 1. Adjust tool to proper width with three adjustment screws P/N E Hook end of tool under pin field 3. Press on edges of tool to extract pinned IC P/N E : 4-sided tool P/N E : 4-sided tool P/N E : 2-sided tool with minimum keepout requirement. Recommended for HiLo systems up to 700 positions P/N E : 2-sided tool. Recommended for HiLo systems with 700 to 1200 positions P/N E : 4-sided tool. Recommended for HiLo systems with over 1200 positions, or over 45mm in size

19 HiLo ADDITIONAL DOCUMENTATION Available upon request: HiLo Signal Integrity Test Report Customer test report for 0.8 and 1 mm pitch HiLo evaluation board. Socket Assembly Guideline Provides PCB and stencil design guidelines for HiLo socket assembly. Qualification Data / Reliability Testing (Contech Research) Performance qualification testing performed to EIA 364 and MIL-STD-1344 connector standards Low Level Circuit Resistance (LLCR) Durability Vibration Normal Force Mechanical Shock Gas Tightness (separate report) Insulation Resistance (IR) Mixed Flowing Gas (separate report) Dielectric Withstanding Voltage (DWR) Current Carrying Capacity Thermal Shock Characteristic Impedance Humidity (Thermal Cycling) Voltage Standing Wave Ratio (VSWR) Engagement and Separation Force Propagation Delay Via Time Domain Transmission (TDT) Mating and Unmating Force Crosstalk Via Network Analysis (Frequency Domain) Thermal Aging Loop Inductance

FLEXFRAME A unique ISI interconnect used to solder high

Emulates leads of a semiconductor leadframe package (QFP,

) QFP Module Top QFP Module Bottom Enable modules to be

Available with a wide range of pin locations, pitches,

20 FLEXFRAME A unique ISI interconnect used to solder high density modules to motherboards FlexFrame Connector Emulates leads of a semiconductor leadframe package (QFP, PLCC, SOIC, SOJ, etc.) QFP Module Top QFP Module Bottom Enable modules to be placed & soldered on PCBs using standard SMT process Available with a wide range of pin locations, pitches, and standoff heights Qualified and used in many rugged, high reliability applications Connectors: FlexFrame

21 FLEXFRAME A flexible, cost effective way to implement 3D assembly Replace a standard IC with a high density module Connectors: FlexFrame

CUSTOM CONNECTORS ISI has a state-of-the-art

quickly go from concept to mass production in

Our in house mold facility provides flexibility

requirements, and our QA department ensures each

Advanced Orthogonal Interconnect Pluggable Power

22 CUSTOM CONNECTORS ISI has a state-of-the-art mold/tooling fabrication shop which allows us to quickly go from concept to mass production in weeks, not months. Our in house mold facility provides flexibility to react quickly to changes in customer requirements, and our QA department ensures each part meets specification. Advanced Orthogonal Interconnect Pluggable Power Supply Double Capacitor IC Obsolescence Solutions 10 Automotive / Industrial Custom Connectors Overmolded Connectors

23 STANDARD CONNECTORS pins / socket contacts / plating / plastic / dimensions / surface mount / press fit / solder tail through-hole / solder array Disk Drive Connectors Combo Power & Signal Power Connectors Mixed Pitch Headers Right Angle Spacing Headers Through Hole Box Headers SMT & Through Hole Right Angle Headers Surface Mount Staple & Saddle Mount Connectors Three Row Headers & Sockets Straight Pin Headers Surface Mount Stacking Headers Surface Mount Single Row Sockets Through Hole Double Row Sockets Through Hole 1 & 2 Row Sockets Surface Mount Top or Bottom Entry Sockets Four Row Headers Through Hole Four Row Sockets Through Hole Horizontal Right Angle Sockets Right Angle Sockets Surface Mount Double Row Sockets Straddle Mount Straight Pin Headers Through Hole Right Angle Headers Through Hole Stacking Headers Through Hole Shunts & Jumpers Multi Position Right Angle Socket Through Hole IC Obsolescence Solutions

Address: Phone: Website: 741 Flynn Road /

(714) 993-9618 (714) 261-3733 dave.gagnon@molex.

24 THANK YOU! Contact ISI to engage on your next project: Address: Phone: Website: 741 Flynn Road / Camarillo, California (805) Dave Gagnon Western USA Office: Cell: (714) (714) dave.gagnon@molex.com» Bob Garon Midwest USA Cell: (630) bob.garon@molex.com» Brian Witzen Eastern USA Cell: (919) brian.witzen@molex.com

Company Overview March 12, Company Overview. Tuesday, October 03, 2017

Company Overview March 12, Company Overview. Tuesday, October 03, 2017 Company Overview Tuesday, October 03, 2017 HISTORY 1987 2001 2008 2016 Company started to design and manufacture low-cost, highperformance IC packages. Focus on using advanced organic substrates to reduce