Automated Sl Selective Laser Assembly System

Transcription

1 Automated Sl Selective Laser Assembly System Ray Prasad Ray Prasad Consultancy Group President, BeamWorks Inc ( ) Spark 400 Note: BeamWorks Ltd, an Israeli Based Company filed for Liquidation in April 2012 May 26,

2 All In One Same Here Super Tool BeamWorks Super Tool Spark 400 Dispense Paste Place Components Laser Solder Rework 2006 VISION AWARD WINNER May 26,

3 Spark 400 for All your SMT Needs For One or All of Your SMT Process Steps Flexibility Versatility Spark 400: 2006 Vision Award Winner Pick & Place Reflow Oven Rework May 26,

4 State of Our Industry: SMT * SMT is the predominant technology for assembly of today s electronics products * Even though SMT has been in high volume production since the mid 80 s, fewer than 10% of companies have first pass yield of over 90%. * Another Issue in Our Industry: How to selectively l add components to an already assembled board without impacting previously assembled components. And do it in an automated manner and not manually May 26,

5 Competitive Advantages Of BeamWorks Spark 400 * Spark 400 addresses the automated selective assembly issues of the industry. One good example: Automated selective assembly of missing, planned or unplanned, components Spark k400 provides capability for automated t selective dispensing, i placement, and reflow without impacting the neighboring components * Electronics products are getting gsmaller and lighter every day by packing components on a board closer and closer together, so much so that it is almost impossible to rework these boards. Cell phones, PDAs, laptops and even desktops are good examples of tightly packed assemblies. Rework in tight spacing is one of the key competitive advantages of Spark 400 (Removal and replacement even in tight spaces, as low as 20 mils) May 26,

6 Competitive Advantages Of BeamWorks Spark 400 * The traditional SMT assembly, if done correctly, produces high quality assemblies at a very high speed. * But when something goes wrong - and something does go wrong and will go wrong as long as humans are involved - the same line will produce scrap at the same high speed. In such cases you need a high volume automated rework system Such a system has not been available, until now Spark 400 is an ideal system for automated mass rework There is simply no comparable system for automated mass rework. Bar none. May 26,

7 Competitive Advantages Of BeamWorks Spark 400 * Spark 400 is able to solder moisture sensitive components without baking resulting in faster cycle time, a key concern in a production environment. This is an important advantage of the Spark 400. * Spark 400 addresses not only today s technologies but is poised to deal with emerging technologies: Assembly of optoelectronic components where the component cannot be subjected to reflow temperatures Lead free soldering is another emerging technology. All lead free solders have about 40 deg C higher melting point than that of tin lead (179 or 183 deg C) To implement lead free we need to use higher temperature board and component package materials that will be more expensive than the current materials being used. We may also need new equipment to accommodate these higher temperatures. Spark 400 will address these issues without the need for high temperature circuit board material or need for any modification. May 26,

8 Competitive Advantages Of BeamWorks Spark 400 * A current trend in the electronics industry is for most high volume manufacturing to move to low cost countries such as China * Spark 400 is a beneficiary of this emerging trend since it is a perfect system for quick-turn prototype and engineering gbuilds * Spark 400 can be placed in any engineering lab where engineers can refine and debug their products before shipping them offshore for high volume manufacturing. * There are some technical key advantages of Spark 400 that are not available in any other system on the market today Spark 400 can monitor and control body and lead temperatures of components Spark 400 provides not only unique profile for each component but even unique profile for each lead May 26,

9 Point and Click Programming May 26,

10 Spark 400 Multi Process Assembly Capability Multi Process Head: 1. Pick & Place Vacuum Nozzle 2. Dispensing 3. Laser Soldering Components Feeding : Trays, Reels, Sticks May 26,

11 Head Assembly Laser Window X4 Down Looking Camera Pick Up Tool Dispenser (Solder Paste, Flux) May 26,

12 Full llsystem Layout (Top View) Adjustable Conveyor 29 Reel Feeders Nozzle replacement Station & Up Looking Camera Supporting Plate Automated Tray Feeder Bottom Heater Controller May 26,

13 Feeder Shuttle Option 2 groups of 51 feeders (8 mm) each. Total 102 feeders May 26,

14 Selective Paste Dispensing * Positive displacement for controlled paste deposit * Accurate dispensing for discrete and fine pitch components * Consistent quality May 26,

15 Selective Component Placement * Up to 40 trays and 102 tape feeders * Vision capability for accurate placement * Good throughput * Accommodate small and large boards (up to 16 X 20 ) * CAD data input for programming * Extremely Short set up time May 26,

16 Unique Tray for Tape & Reel Strips (Good for R/Cs on Short Strips) May 26,

17 Sl Selective Rfl Reflow * 4 lasers acting simultaneously for high throughput * Not heating adjacent components * Getting the solder hot but keeping the board cool May 26,

18 Automated Dispensing, Placement and Soldering of Resistors and Capacitors May 26,

19 Automated Dispensing, Placement and Soldering of QFP QFP Dispensing QFP Placement QFP Soldering NOTE: CLICK ON VIDEO CLIPS TO PLAY May 26,

20 Automated Dispensing, Placement and Soldering of BGA BGA Dispensing BGA Soldering BGA Placement NOTE: CLICK ON VIDEO CLIPS TO PLAY May 26,

21 Typical ltemp Profile for BGA225 4 Soldering or Rework 4 Lasers controlled by 4 IR temp sensors acting simultaneously T (Deg-C) Seconds May 26,

22 Spark 400 Current Market * Low Volume General Applications Small Subcontractors - small lot production OEMs for New Product Introduction work R&D Environments Pilot runs and Prototype work Large Subcontractors - Auxiliary SMT line * High Volume Specialized Applications i Large Sub-contractors, OEMs - selective assembly of planned and un-planned missing components, automatic rework, SMT connector assembly, BGA assembly, Optical Component Soldering May 26,

23 Approximate Assembly Cycle Times Actual Time Will Depend on Boards & Components (Time in Seconds) Component type Removal dispense pick & place soldering cap res 0603, SOT SO SO TSOP QFP PLCC Small BGA 300 mils Medium BGA 700 mils Big BGA 1500 mils May 26,

24 Spark 400 Current Applications * Missing components ( Skips ) Components not arriving on time create a major quality and delivery problem for both OEMs and subcontractors since late components have to be either assembled by hand or the production is postponed waiting for arrival of missing components Spark 400 not only allows automated assembly of unplanned missing components but can be used to change production planning to allow use of planned missing components May 26,

25 Opto-Electronics Application (Get the solder hot but keep the package Cool) * Many components are temperature sensitive and require selective assembly without heating the package * Mostly done manually. Automation is required to reduce cost * Spark 400 is well suited to replace manual soldering with automated reflow for both through hole and SMT optoelectronics components Faster, cheaper process with consistent quality for Tx and Rx optical modules & other optical devices (not operator dependent) Dispense extra paste for gold plated leads to address brittle gold intermetallic problems Thinner intermetallic layer for improved reliability (< 1 micron) May 26,

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27 Wireless Applications i * For wireless applications minor customization is required to convert high volume generic assembly to custom assembly * With the trend toward Bluetooth, most boards will require RF shields that are added after the boards are assembled * Spark 400 is uniquely positioned to convert a high h volume generic assembly to custom assembly and to selectively assemble RF shields May 26,

28 Laser Vs Hot Air for Rework * No need for hot air nozzles * No melting of solder joints of neighboring components * No Baking (Except for BGAs) and No Popcorning * No need for mini-stencils * Rework in Tight hts Spaces (15 mils Vs 150 mils for hot air) * Automated removal and replacement (Dipping Process) * Much faster than Hot air CSP REWORK NOTE: CLICK ON VIDEO CLIPS TO PLAY May 26,

29 Reduce QFP Rework from 7 Steps to 4 Steps by Using Dipping Process 1. Apply heat to the QFP to be replaced 2. When the solder joints melt, remove QFP 3. Clean the site by removing solder on the QFP lands 4. Apply solder paste. Apply liquid flux 5. Place QFP 6. Apply heat to solder joints. Merge Steps 5 and 6 in one step by picking up QFP and letting it hover over QFP pads while melting solder below and then gently ypushing QFP in molten solder. Please see the attached video clip. 7. Clean and or brush off solder balls if present May 26,

30 Vision Award Winning Unique Rework Process for QFP: Reduce Time & Damage May 26,

31 Impact of Hot Air: Damage to Adjacent Damaged Caps By Hot Air Components May 26,

32 Impact of Hot Air: Shielding to Prevent ent Damage to Adjacent Components Kapton Tapes to Protect Neighboring Components from Hot Air takes time and needs Space May 26,

33 Laser Vs Hot tair for Rework * No need for hot air nozzles * No melting of solder joints of neighboring components * No Pop-corning & No Baking (Except for BGAs) * No need for mini-stencils * Rework in Tight Spaces (15 mils Vs 150 mils for hot air) * Automated removal and replacement * At least ten times faster than Hot air May 26,

34 BeamWorks Spark 400 All in One Assembly System GET THE SOLDER HOT KEEP THE BOARD COOL Spark 400 May 26,