RESTRICTED WORLD TRADE G/IT/SPEC/8/Rev.1 23 February 1998 ORGANIZATION PROPOSED ADDITIONS TO PRODUCT COVERAGE. Submission by Australia.

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1 RESTRICTED WORLD TRADE G/IT/SPEC/8/Rev.1 23 February 1998 ORGANIZATION ( ) Committee of Participants on the Expansion of Trade in Information Technology Products Original: English PROPOSED ADDITIONS TO PRODUCT COVERAGE Submission by Australia Revision The following communication, dated 18 February 1998, has been received from the Permanent Mission of Australia. Please find attached a revised version of Australia's proposed product additions to the Information Technology Agreement, containing revisions and corrections to the information provided in submission G/IT/SPEC/8.

2 Page 2 ex Liquid photo-resist for use in the production of printed circuit boards or printed circuit ex Hole plugging and legend inks for use in the production of printed circuit boards or printed circuit ex Conductive adhesive used in the production of printed circuit boards or printed circuit ex Encapsulants and adhesives used in the production of and components ex Dry film photo-resist for use in the production of printed circuit boards or printed circuit ex Solder mask for use in the production of printer circuit boards or printed circuit ex Conformal coatings for use in the production of ex Solder powder suspended in a cream flux with additives to promote surface wetting and to control viscosity, drying rate for use in the production of ex Solder paste flux for use in the production of printed circuit boards or printed circuit ex D i s s i p a t i v e a n t i - f a t i g u e, d i s s i p a t i v e v i n y l homogeneous, dissipative vinyl three layer, matting used for the damage to printed circuit boards or printed circuit during manufacture ex Conductive polyurethane foam used for the prevention of static damage to printed circuit boards or printed circuit ex B-stage B or bonding plies for use in the production of ex Unreinforced laminates for use in the production of ex Static shielding bags used for the damage to printed circuit boards or printed circuit Substitute for solder or where soldering s cannot be used in assembly of PCB/PCA

3 Page 3 ex Electrostatic dissipative strips (dissipative rubber 2 layer [matting]) used for the damage to printed circuit boards or printed circuit ex Mass lamination panels for use in the production of ex Glass reinforced laminates for use in the production of ex Probe kit stainless steel tools used for manipulation of components in the assembly of printed circuit boards or printed circuit ex ex ex ex Apparatus and for heating by infrared radiation, ultraviolet and thermal energy during processing Apparatus for application of dry film photo-resist to one or two sides of printed circuit boards or printed wiring boards Apparatus for application, via a roller, liquid photosensitive s to printed circuit boards or printed wiring boards during processing Apparatus for cleaning printed circuit boards or printed wiring boards during the assembly process ex Apparatus to enclose or hermetically seal printed circuit board or printed wiring board ex Horizontal wet processing for the application of various chemical or electrochemical solutions during the processing of printed circuit boards or printed wiring boards ex ex Apparatus for provision of spot application of liquids, solder pastes, adhesives or sealants to selected components Apparatus for application of non-defined coasting via flooding during printed circuit boards or printed wiring boards during processing ex Vertical wet processing used in the production of printed circuit boards or printed wiring boards ex 8428 Automatic handling machines for the transport, handling of bare or assembled ex Apparatus for application of defined/non-defined liquids to printed circuit boards or printed wiring boards during processing Printed wiring assembly Printed wiring assembly PCB/PCA fabrication/assembly

4 Page 4 ex Laser hole formation used during printed circuit board or printed wiring board processing ex Batch processing used to generate plasma from gases under vacuum during printed circuit board or printed wiring board processing ex High-precision apparatus used to re-point carbide drills used in the processing of printed circuit boards or printed wiring boards ex Cutting or scoring apparatus used during printed circuit board or printed wiring board processing ex Drilling for the processing of printed circuit boards or printed wiring boards ex Temperature or pressure-controlled, lamination press used to bond layers into multilayer printed circuit boards or printed wiring boards ex Metering or mixing used to extend the life of solutions used during the processing of printed circuit boards or printed wiring boards ex Anti-static apparatus used in the removal of dust particles and electrostatic charge during printed circuit board or printed wiring board processing ex Registration Equipment to align printed circuit boards during photographic or mechanical processing ex Vacuum frames for holding one or more printed circuit boards or printed wiring boards during assembly ex Apparatus for placement of components or contact element on semiconductor s, printed circuit boards or printed wiring boards, ceramic substrates or other substrate s ex Routing used for internal and external profiling during printed circuit board or printed wiring board processing ex Apparatus for curing solder or adhesives during processing ex Wet processing apparatus used to clean, strip and plate the edge connectors during printed circuit board or printed wiring board processing ex Hot air solder levelling apparatus used to apply molten solder during printed circuit board or printed wiring board processing ex Reflow soldering apparatus used during printed circuit board or printed wiring board processing

5 Page 5 ex Apparatus used to bring molten solder into contact with assembled printed circuit boards or printed wiring boards ex Apparatus for application, coating or laminating of printed circuit boards or printed wiring boards during processing ex Static electricity eliminators (field service kits) used for the damage to printed circuit boards or printed circuit during manufacture ex Parts for static electricity eliminators (heel straps, ground cords) used for the damage to ex Cable and connectors over 80V (ground cord) used for the damage to printed circuit boards or printed circuit during manufacture ex Exposure used to form an image on a ex Direct image apparatus which forms an image without a mark during printed circuit board or printed wiring board processing ex Photo plotter for drawing or photo-tool for use in the production of printed circuit boards or printed circuit ex X-ray apparatus for physical inspection of concealed solder joints in printed circuit boards or printed wiring boards ex Apparatus for measuring or checking electrical quantities in printed circuit board or printed wiring board ex Electrical bare board test apparatus used to determine continuity or non-continuity of a finished printed circuit board or printed wiring board, known as a Flying Probe ex Electrical bare board test apparatus used to determine continuity or non-continuity of a finished printed circuit board or printed wiring board, known as a Fixture

6 Page 6 ex Wristraps used for the damage to ex static control and fixtures (testers) ex Ionizers used for the damage to ex ESD Workstation continuous monitor for testing static control and fixtures ex Apparatus for scanning the surface of printed circuit boards or printed wiring boards to compare the image with inputted data ex Apparatus for error verification and repair of printed circuit boards or printed wiring boards ex Snap kits, push and clinch snaps used for the damage to printed circuit boards or printed circuit and storage static control and fixtures static control and fixtures Inspection during PCB/PCA fabrication Inspection during PCB/PCA fabrication The above goods are used as inputs for, or used to manufacture, printed circuit boards or printed wiring boards and should therefore be included in the ITA. Australia is prepared to discuss the classification of these goods.

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