Application Development for Flexible Hybrid Printed Electronics

Transcription

1 Application Development for Flexible Hybrid Printed Electronics Lok Boon Keng, Yusoff Bin Ismail, Joseph Chen Sihan, Cheng Ge, Ronnie Teo Large Area Processing Programme Emerging Application Division

2 Outline Overview of Flexible Hybrid Printed Electronics Opportunities Application Market Challenges Cost Technology Approach Design Manufacturing Testing Product Summary

3 Overview of Flexible Hybrid Printed Electronics Printed Functions on Flexible substrate Flexible Hybrid Printed Electronics

4 Uniqueness of the Technologies Silicon Electronics Excellent functionalities High functionalities per unit area Flexible Printed Electronics Flexible form factor Light weight Large area function Roll-to-Roll manufacturing

5 Flexible Hybrid Printed Electronics Hybrid Functions Printed Electronics Area functions Lighting Sensing Energy harvesting Silicon Electronics Drivers Microcontrollers High precision passive components Hybrid Processes Additive depositions Printing Dispensing ALD (Atomic layer deposition) Vapour deposition Structuring Thermoforming Embossing Digital subtraction process Laser ablation Inkjet printing Photonic curing Discrete component assembly

6 Conventional Electronics Copper Laminate Etched copper printed circuit board Process Flow Automotive Control Panels Flexible Hybrid Printed Electronics Printing of circuitry & touch pads PET, PEN, PC conductive ink Solder Printing of Interconnect Printing of Interconnect Conductive adhesive or low temp solder Molded Casing Assemble of comp SMT comp Assemble of comp Part 1 Part 2 Module Assembly Thermoforming Part 20 Injection molding

7 Flexible Hybrid Printed Electronics Stretchable Electronics Structural Electronics Key features Flexible & stretchable fabric, TPU Repeatable stretchable conductive traces Sensors Assembly of control module Key features Flexible PC, a-pet One time stretched and formed conductive traces Form & structure Assembly of components Integrated circuit in molded plastic

8 Flexible Hybrid Printed Electronics Stretchable Electronics Structural Electronics 3D Printing of Antenna, conductive traces and interconnects In Mold Electronics (IME) for Formable Electronics Molded Interconnect Device (MID)

9 Flexible Hybrid Printed Electronics Stretchable Electronics Structural Electronics Exoskeleton Key features Flexible & stretchable fabric, TPU Repeatable stretchable conductive traces Sensors Assembly of control module Key features Flexible PC, a-pet One time stretched and formed conductive traces Form & structure Assembly of components Integrated circuit in molded plastic

10 Application Market Wearable Technology

11 Application Market Health Care Health monitoring Blood pressure, heart beat, breath, glucose Wearable Gait analysis Wearable illumination Baby activities Glucose monitoring Force impact Bluetooth module Source: Google, PERC, Rest Devices, Altria

12 Application Market Seemless Human Machine Interface Design Automotive Customizable controls integrated into the dashboard materials and decoration. Controls Can be engineered into the dash, door panels and elsewhere. Faurecia First Inch DeCo Control Medical Buttonless easy clean, hygiene Jaguar Concept

13 Application Market Smart Packaging Consumer Monitoring Food freshness Content residual Anti-counterfeiting Printed Memory for security Food monitoring Source: Thin Film, PARC

14 Application Market Advertising Mobile Signage Banner Point of Sales RFID/iBeacon Bus advertisement Wireless communication Banner P.O.S display Signage Source: SIMTech, KPP, Nestle/Honsen

15 Building Safety/guide path Interior/exterior Decorative lighting Roofing Application Market Lighting strip Decorative lighting Source: SIMTech

16 Application Market Automotives Touch sensor Interior lighting Display Sensor Heating Touch Sensor Display Interior lighting Heating film Source: GSI, SIMTech, Continental

17 Discrete Functions Challenges Design Lack of design guidelines Multi-disciplinary approach Cost System cost Component, product and system level Supply chain Yield Printed electronics SMT passives and IC assembly Integration Product testing and assembly Repair Printed Functions

18 Challenges Technology Technology adoption Functions: level of integration Types of components Product integration Needs of integrated production systems Printing SMT mounting, assembly, packaging Readiness of Value chain Forward integration Backward integration Cooperative and partnership Flexible Hybrid Printed Electronics

19 Discrete Manufacturing Printer SMT Mounter Injection Molding Oven Thermoforming

20 Roll-to-Roll Manufacturing Web direction Unwinder Web guide Surface treatment Printing Curing Surface mount Curing Molding Winder Inspection / Testing SIMTech 1m Roll-to-Roll System SIMTech 0.3m Roll-to-Roll System

21 Challenges Interconnection On-film and Inter-film On-film Conventional packaging Bare dies Thin silicon SMT Passives and packaged IC Flip chip Ultra thin silicon die Encapsulation Source: SIMTech, Virginia Semiconductor, T.Someya

22 Challenges Interconnection on-film and inter-film Inter-film film Connector Conductive adhesives Berg Nicomatic ZIF Connector Conductive adhesives Source: Matstern

23 Approach of Integration Integrated Design Functions Control circuit Power Communication Manufacturing Flow of processes Single, multiple substrate Lighting Control board Touch Pad Interconnection- on film and inter-film Electrical Interconnects and Encapsulation Techniques Cost Effectiveness Testing Product integration

24 Manufacturing Flow Design, Model & Simulation Device & Product Electrical Thermomechanical Form factor Structure Materials Substrate Inks Circuit printing Interconnect Components Types IC

25 Manufacturing Flow Processes Printing of circuit Printing of interconnect Assembly of components Thermoforming Molding Squeegee Circuit Printing Screen Defects of Printed Interconnect

26 Manufacturing Flow Processes Printing of circuit Printing of interconnect Assembly of components Thermoforming Molding Pick & Place Process

27 Manufacturing Flow Processes Printing of circuit Printing of interconnect Assembly of components Thermoforming Molding Optimized Process Non Optimized Process

28 Manufacturing Flow Processes Printing of circuit Printing of interconnect Assembly of components Thermoforming Molding Printed Light off Light on with defects Light on with defects Light on with optimum process Non Optimized Process

29 Manufacturing Flow Characterization & Testing Electrical Sheet Resistance Thermal Resistance Device Junction Temperature I-V Characteristics Optical (Intensity & Colour) Electrical Cth (Ws/K) Junction Temperature Rise ( O C) h 1,000 h Thermal Rth (K/W) 0 h 1,000 h 1µ 10µ 100µ 1m 10m 100m Time (s) Optical Functional

30 Testing Standards Manufacturing Flow Joint Integrity Die Shear Test Die Pull Test Drop Test Circuit Integrity Stretch Test Fold Test Bend Test Strain measurement

31 Reliability Manufacturing Flow Mechanical Bend Fatigue Stretch Fatigue Climatic High/Low Temperature Storage Temp.-Humidity Aging Temperature Cycle Test HALT/HASS Operating Life High Temperature Operating Life Wet Temperature Operating Life Temperature Shock Life Test

32 Summary Game Changing approach Applicable to low power, low density applications Open up opportunities for various applications Interfacial technologies to be developed Alignment of value chain required for mass adoption Cooperation and form partnerships

33 THANK YOU