Integrated Circuits. Package Information. Tape and Reel Information A separate 'Tape and Reel' document is also available from the CML website

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Candice Woods
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1 Integrated ircuits ackage Information ape and Reel Information separate 'ape and Reel' document is also available from the M website ublication No: //astardly/publications/gs/acks.indd - Issue 20 - March

2 M Microcircuits ackage Information M ackage wg. No. No. of ins in itch (mm) in Style 1 28 (1.27mm) GU 2 24 (1.27mm) GU 3 20 (1.27mm) GU 4 16 (1.27mm) GU ackage idth (mm) 0.3 Inch (7.62mm) 0.3 Inch (7.62mm) 0.3 Inch (7.62mm) 0.3 Inch (7.62mm) ackage ype ackage Style (yp) Offboard eight (mm) Old U roduct Suffix New roduct Suffix SOI I SOI I SOI I SOI I GU 5.3 SSO I GU 5.3 SSO I GU 4.4. SSO I GU 4.4. SSO I GU 4.4. SSO I GU 4.4. SSO I (1.27mm) GU 0.4 inch (10.16mm) QU 2.5 G (1.27mm) OO 0.4 inch (10.16mm) QU 3.5 S GU 7 /Q QU (1.27mm) OO 0.65 inch (16.51mm) QU GU 10 Q QU GU 14 Q QU GU 10 Q QU inch (2.54mm) ROUG O 0.3 inch (7.62mm) I I inch (2.54mm) ROUG O inch (2.54mm) ROUG O 0.3 inch (7.62mm) 0.6 inch (15.24mm) I I I I Q (12.7mm) SS 9 VQN QU Q1 Q (12.7mm) SS 7 VQN QU Q3 Q (12.7mm) SS 6 VQN QU Q4 Q (12.7mm) SS 5 VQN QU Q5 Q (12.7mm) SS 4 VQN QU Q6 Q (12.51mm) SS 4 VQN QU Q7 Q (12.7mm) SS 5 QN QU Q8 I - dual-in-line Q - low-profile quad flat pack I - plastic dual-in-line - plastic leaded chip carrier SSO - shrunk small-outline SOI - small-outline integrated circuit Q - thin quad flat pack SSO - thin shrunk small-outline VQN - very-thin quad flat pack QN - very, very thin. Note: or the purposes of this document, the physical I connection descriptions of 'lead', 'leadless' and 'pin', etc. are represented by the single term of 'pin'. 2

3 28-in SOI, (1) RNIV IN OION MRING IN M (17.70) (18.06) (7.26) (7.59) (2.24) (2.67) (9.90) (10.64) (16.51) (0.08) (0.51) (0.33) (0.46) (1.04) (1.04) (0.41) 0 (1.27) 0 (1.27) (0.23) (0.32) 45 1 NO : &are reference datum's and do ll dimensions in inches (mm.) ngles are in degrees o-lanarity of leads within (0.1mm) 24-in SOI, (2) RNIV IN OION MRING IN NO :. M (15.16) (15.57) (7.26) (7.59) (2.36) (2.67) (9.90) (10.64) (14.1) (0.08) (0.51) (0.33) (0.51) (1.04) (1.04) (0.41) 0 (1.27) 0 (1.27) (0.23) (0.32) 45 1 & are reference datum's and do ll dimensions in inches (mm.) ngles are in degrees o-lanarity of leads within (0.1mm) 3

4 20-in SOI, (3) RNIV IN OION MRING IN 1 1. M (12.57) (7.26) (2.24) (9.90) (12.95) (7.59) (2.67) (10.64) (11.43) (0.08) (0.51) (0.33) (0.51) (1.04) (1.04) (0.41) 0 (1.27) 0 (1.27) (0.23) (0.32) 45 1 NO : & are reference datum's and do ll dimensions in inches (mm.) ngles are in degrees o-lanarity of leads within (0.1mm) 16-in SOI, (4) RNIV IN OION MRING IN NO :. M (10.03) (10.49) (7.26) (7.59) (2.24) (2.67) (9.90) (10.64) (8.89) (0.08) (0.51) (0.33) (0.51) (1.04) (1.04) (0.41) 0 (1.27) 0 (1.27) (0.23) (0.32) 45 1 & are reference datum's and do ll dimensions in inches (mm.) ngles are in degrees o-lanarity of leads within (0.1mm) 4

5 24-in SSO (5) IN 1 Z Z NO :. M & are reference data and do ll dimensions in mm ngles are in degrees o-lanarity of leads within 0.1mm 28-in SSO (6) RNIV IN OION MRING IN 1 Z Z NO :. M & are reference data and do ll dimensions in mm ngles are in degrees o-lanarity of leads within 0.1mm 5

6 28-in SSO (1) IN 1. M NO : &are reference data and do not include mold deflash or protrusions. ll dimensions in mm ngles are in degrees 24-in SSO (2) IN 1. M NO : &are reference data and do not include mold deflash or protrusions. ll dimensions in mm ngles are in degrees 6

7 20-in SSO (3) IN 1. M NO : &are reference data and do not include mold deflash or protrusions. ll dimensions in mm ngles are in degrees 16-in SSO (4) IN 1. M NO : &are reference data and do not include mold deflash or protrusions. ll dimensions in mm ngles are in degrees 7

8 24-in ; G (1) 24-in ; S (2) 8

9 48-in Q (4) IN (IN 1). M NO : & are reference data and do ll dimensions in mm ngles are in degrees o-lanarity of leads within 0.1mm 44-in ; (6) N IN IN 1 M G 1 G 1 M N (16.51) (16.51) (17.40) (17.40). 0 (12.7) 0 (12.7) M (16.66) (16.66) (4.57) (17.65) (17.65) (0.51) (0.33) (0.53) (0.74) (1.78) (1.57) (1.57) 0 (1.27) (0.25) 0.30 (7.62) x 45 NO : &are reference datum's and do ll dimensions in inches (mm.) ngles are in degrees 9

10 44-in Q; (7). M. (IN 1) IN NO : &are reference data and do ll dimensions in mm ngles in degrees o-lanarity of leads within 0.1mm 100-in Q; (8) M. IN (IN 1) M M NOS : ll dimensions in mm ngles in degrees &are reference data and do ach lead centerline is located within 0.08 mm of its true position (..) at maximum material condition o-lanarity of leads within 0.1mm 10

11 64-in Q; (9). M. (IN 1) NO : & are reference data and do ll dimensions in mm ngles are in degrees o-lanarity of leads within 0.1mm 8-in I; (1) 11

12 16-in I; (3). M. IN 1 1 M 1 1 Z (18.80) (6.10) (3.23) (7.62) (7.37) 0.70 (17.78) (20.57) (6.65) (5.08) (9.91) (8.26) (0.38) (1.02) (0.38) (1.02) (0.58) (1.65) 1 6 (1.42) 6 (1.42) (1.63) (1.63) (3.07) 0 (3.81) M (0.71) (2.54) (0.20) (0.38) Z 5 NO : & are reference datum's and do ll dimensions in inches (mm.) ngles are in degrees 24-in I; (4). M (30.48) 0 (12.70) 0.142(3.61) (15.24) (32.26) (14.10) (5.59) (17.78) (14.99) (15.88) 1.10 (27.94) (0.38) (1.14) (0.38) (1.02) (0.58) (1.65) (1.68) (1.52) (1.88) (1.88) (3.07) (4.06) M (4.58) (2.54) (0.20) (0.38) Z 4 NO : & are reference datum's and do ll dimensions in inches (mm.) ngles are in degrees 12

13 64-in VQN (Q1) Index rea 1 op View. M S 9.00 S G xposed G Metal ad in1 ottom View Index rea 2 NO : &are reference data and do ll dimensions in mm ngles are in degrees Index rea 1 Index rea 2 ot ot hamfer Index rea 1is located directly above Index rea 2 epending on the method of lead termination at the edge of the package, pull back (1) may be present. minus 1 to be equal to, or greater than 0.3mm he underside of the package has an exposed metal pad which should ideally be soldered to the pcb to enhance the thermal conductivity and mechanical strength of the package fixing. here advised, an electrical connection to this metal pad may also be required 1 48-in VQN (Q3) Index rea 1 op View. M S 7.00 S G xposed Metal ad G NO : & are reference data and do ll dimensions in mm ngles are in degrees Index rea 1 Indexrea 2 1 in1 ot ot hamfer ottom View Index rea 2 Index rea 1is located directly above Index rea 2 epending on the method of lead termination at the edge of the package, pull back (1) may be present. minus 1 to be equal to, or greater than 0.3mm he underside of the package has an exposed metal pad which should ideally be soldered to the pcb to enhance the thermal conductivity and mechanical strength of the package fixing. here advised, an electrical connection to this metal pad may also be required 13

14 40-in VQN (Q4). M S 6.00 S G xposed Metal ad NO : & are reference data and do ll dimensions in mm ngles are in degrees Index rea 1 Index rea 2 ot ot hamfer Index rea 1 is located directly above Index rea 2 epending on the method of lead termination at the edge of the package, pull back (1) may be present. minus 1 to be equal to, or greater than 0.3mm he underside of the package has an exposed metal pad which should ideally be soldered to the pcb to enhance the thermal conductivity and mechanical strength of the package fixing. here advised, an electrical connection to this metal pad may also be required 32-in VQN (Q5) Index rea 1. M. op View in1 xposed Metal ad G S 5.00 S G NO : &are reference data and do ll dimensions in mm ngles are in degrees Index rea 1 Index rea 2 ot ot hamfer Index rea 2 ottom View Index rea 1is located directly above Index rea 2 epending on the method of lead termination at the edge of the package, pull back (1) may be present. minus 1 to be equal to, or greater than 0.3mm he underside of the package has an exposed metal pad which should ideally be soldered to the pcb to enhance the thermal conductivity and mechanical strength of the package fixing. here advised, an electrical connection to this metal pad may also be required 14

15 24-in VQN (Q6) Index rea 1. M. op View S 4.00 S G in1 xposed Metal ad G NO : & are reference data and do ll dimensions in mm ngles are in degrees 1 Index rea 1 Index rea 2 ot ot hamfer Index rea 2 ottom View Index rea 1 is located directly above Index rea 2 epending on the method of lead termination at the edge of the package, pull back (1) may be present. minus 1 to be equal to, or greater than 0.3mm he underside of the package has an exposed metal pad which should ideally be soldered to the pcb to enhance the thermal conductivity and mechanical strength of the package fixing. here advised, an electrical connection to this metal pad may also be required 16-in VQN (Q7) 15

16 28-in QN (Q8) 16 \\astardly\ublications\gs\packs.indd

S (surface mount) Issue date

S (surface mount) Issue date very thin quad flat package; no leads; 14 terminals; body 2.5 x 3 x 0.85 mm 8 February 2016 Package information 1. Package summary Table 1. Package summary Terminal position code Package type descriptive