MB86R12 Emerald-P. Delta Sheet Differences between ES2 and ES3. Fujitsu Semiconductor Europe GmbH
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1 Delta Sheet Differences between ES2 and ES3 Fujitsu Semiconductor Europe GmbH Rev0-01 June 20, 2012 Revised Jun. 20, 2012 dl-mb86r12-emerald-p-es2-es3-rev0-01
2 1.1 History Revision Date Author Description A. von Treuberg First release NOTE This document does not include errata corrections. Please refer to the Customer Information document on the Emerald-P website for these: (click on Support ). 2 dl-mb86r12-emerald-p-es2-es3-rev0-01 Revised Jun. 20, 2012
3 Fujitsu Semiconductor Europe GmbH Differences between Emerald-P ES2 and ES3 1.1 CHIPID CINFO Register CINFO (Chip INFOrmation) Register contains the product number and version information of the LSI. Address 3d10_0000(h) Bit Name Product number 1st_CODE[7:0] 2nd_CODE[7:0] R/W R R Initial 86(h) 52(h) Bit Name Product number VER[3:0] 3rd_CODE[11:0] R/W R R Initial 12F(h) ES2:2(h) ES3:3(h) Bit Field Explanation No Name 3-0 VER[3:0] This bitfield contains the device version information of the chip. The current version is the third edition. 2: ES2 3: ES rd_CODE[11:0] This bit is the 3rd_CODE information of the product number (MB86R12). 3rd_CODE = 0x nd_CODE[7:0] This bitfield contains the second part of the product number (MB86R12) after the 'MB'. 2nd_CODE = 0x52 (ASCII code of 'R') st_CODE[7:0] This bitfield contains the first part of the product number (MB86R12) after the 'MB'. 1st_CODE = 0x86. Product number Revised Jun. 20, 2012 dl-mb86r12-emerald-p-es2-es3-rev0-01 3
4 1.2 Serial Flash Boot When the ES3 boots from a Serial flash memory device via HS_SPI, it issues a reset command (FFh). ES2 does not issue this reset command. Background Information On a cold reset, the embedded application in internal BootROM sets Emerald-P s High-Speed SPI (HS-SPI) Flash Interface to Normal Read mode. Most SPI flash memories are set to Normal Read mode on a cold reset therefore there are no communication problems. At runtime, the Emerald-P embedded application may switch to Quad I/O High Performance Read mode. However, on a hot reset of Emerald-P, its HS-SPI Flash Interface is set back to Normal Read mode again - but the external flash memory remains in Quad I/O High Performance Read mode and the Emerald-P BootROM does not unlock this state, meaning that communication is not possible anymore. Change in ES3: The revised boot ROM solution depends on the external flash memory in use: Spansion S25FL129P: is reset to Normal Read mode when it receives 0xFF for 8 cycles. The latest Emerald-P boot program in the ROM issues this sequence, therefore the solution is in place. Winbond W25Q16BV: is reset when it receives 0xFF for 8 cycles when in Continuous Read Mode during Quad I/O operation, but 0xFFFF for 16 cycles when in Continuous Read Mode during Dual I/O operation. If you are not using Dual I/O operation mode, then the solution is in place. Do not use this device s Dual I/O operation mode with Emerald-P. NOTE A globally valid setup can not be implemented in Emerald-P. The system designer must ensure that the specific flash memory in use is returned to Normal Read mode on a hot reset of Emerald-P. SPI flash devices that support Spansion s Mode Reset Bit (MBR) instruction (two are listed above) can be used with Emerald-P (i.e. this has been validated). Please only use external SPI flash memories that either interpret the 8 cycles of 0xFF correctly (i.e. as an operation mode reset) or that ignore the instructions with no side-effects. 1.3 DDR Controller The ES3 allows the use of the self-refresh function for both DDR2 and DDR3 memory devices when the CRG is in STOP mode. 4 dl-mb86r12-emerald-p-es2-es3-rev0-01 Revised Jun. 20, 2012
5 WARRANTY AND DISCLAIMER The contents of this document are subject to change without notice. Customers are advised to consult with sales representatives before ordering. The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU SEMICONDUCTOR EUROPE GMBH device. FUJITSU SEMICONDUCTOR EUROPE GMBH does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. FUJITSU SEMICONDUCTOR EUROPE GMBH assumes no liability for any damages whatsoever arising out of the use of the information. Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU SEMICONDUCTOR EUROPE GMBH or any third party or does FUJITSU SEMICONDUCTOR EUROPE GMBH warrant non-infringement of any third-party's intellectual property right or other right by using such information. FUJITSU SEMICONDUCTOR EUROPE GMBH assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite). Please note that FUJITSU SEMICONDUCTOR EUROPE GMBH will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations of the Foreign Exchange and Foreign Trade Control Law of Japan and/ or US export control laws. The company names and brand names herein are the trademarks or registered trademarks of their respective owners. Fujitsu Semiconductor Europe GmbH - Graphics Competence Center Forstenrieder Str. 10, D Neuried Germany Tel: +49 (89) Fax: +49 (89)
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