Datasheet ADVAPIX TPX3. Version Datasheet. Model No.: APXMD3-Xxx170704
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1 Datasheet ADVAPIX TPX3 Version Datasheet Model No.: APXMD3-Xxx170704
2 Datasheet Device Parameters The ADVAPIX TPX3 modules were designed with special emphasis to performance and versatility which is often required in a scientific experimental work. They contain latest CERN detector Timepix3 for particle tracking and imaging. The fast modules with Si or CdTe pixel detectors Timepix3 can be used in different configurations such as stack of several layers or tiling to cover larger area. Each module contains single Timepix3 device with ultra-fast sparse data readout to acquire up to 40 Mhits per second. A separate USB 3.0 channel for each device assures fast read-out of the whole modular system. The sensor type and thickness is of customer s choice. The ADVAPIX TPX3 can be used in a variety of applications such as energy resolved radiography (X-rays, neutrons, ions), particle tracking, time-of-flight imaging, multilayer Compton camera and many other. The sensors can be adapted for neutron imaging by deposition of converter layers 1. Recording individual hits together with advanced data processing allows increasing the spatial resolution in some applications to units of microns or even submicrometric level (for ions). Compared to the older Timepix chip the Timepix3 detector offers 6 times better time resolution, 2 times better energy resolution, 2 times lower minimum energy threshold, zero dead time and 10x faster data transfer. Illustration of single particle sensitivity of Timepix3 device. The tracks of different particles of radiation background (mostly muons and few protons) were recorded in 5 minutes on board of airplane. No noise (clean zero) is seen in dark regions. Inset shows the time profile along one muon track. Main Features: Readout chip type... Timepix3 Pixel size...55 x 55 μm Sensor resolution x 256 pixels Time resolution ,6 ns Power... External or via second USB 3.0 Interface...USB 3.0 (Super-Speed) Maximum readout speed million pixels / s Dimensions x 79 x 25.5 mm Weight g 1 Convertors based on 6LiF or 10B4C for slow neutrons (efficiency up to 4%) or PE for fast neutrons. page 1
3 Datasheet Device Parameters Device Parameters Operating Conditions Symbol Parameter Min Typ Max Units Comment TA Temperature Range C Φ Humidity 60 % Not condensing Electrical Specification TA = 25 C, USB voltage VCC = 4.8V Symbol Parameter Min Typ Max Units Comment VCC Supply Voltage V ICC Supply Current ICC1 Chip disabled ma P1 Power Dissipation 2.5 W I/O Conn. Input CMOS (pin 4,6,8,10) VINL Voltage Low V VINH Voltage High V I/O Conn. Input LVDS (pin 3,5,7,9) VIN Voltage Range V VINDIFF Differential Voltage ma Bias Voltage Source for Sensor Diode VBIAS Bias Voltage 0 ±450 V Polarity is sensor dependent Performance Characteristics for Timepix3 Symbol Parameter Min Typ Max Units Comment f Hit-rate 40 MPixels/s with USB 3.0 cable Data rate 2.4 Gbit/s with USB 3.0 cable TREAD Frame Readout Time 33 ms with USB 3.0 cable dt Time resolution 1.56 ns FREAD Read-out frequency 320 MHz ½ of maximum ROC freq page 2
4 Datasheet Device Parameters Sensor parameters TA = 25 C Symbol Parameter Si CdTe Units Comment Thickness µm σ σ σ σ Energy resolution of energy discrimination threshold 23 kev) Energy resolution of energy discrimination threshold 60 kev) Energy resolution in full spectral mode 23 kev) Energy resolution in full spectral mode 60 kev) kev kev kev kev Typical detectable energy range for X-rays to 600 Pixel size µm kev See chart below 2 The maximum detectable energy is limited only by sensitivity of the selected sensor for the given radiation type. The maximum measured energy can reach several MeV in case of heavy charged particles page 3
5 Datasheet Mechanical Dimensions Protection cover +5V Power I/O Digital USB VDC connector Main power supply (via standard 2.1 mm connector). Connect after plugging USB connector. USB connector USB type micro B, Standard USB 3.0 Super-Speed. I/O Digital connector Connector is not used in this version of the product. 1 GND 2 Max 3 Reserved LVDS0P (2.5V) 4 Reserved CMOS 0-5V 5 Reserved LVDS0N (2.5V) 6 Reserved CMOS 0-5V 7 Reserved LVDS1P (2.5V) 8 Reserved CMOS 0-5V 9 Reserved LVDS1N (2.5V) 10 Reserved CMOS 0-5V page 4
6 Datasheet Mechanical Dimensions Mechanical Dimensions Without protecting cover All dimensions are in mm. Extreme care must be taken when removing protecting cover and handling the ADVAPIX TPX3 without the protecting cover. Warranty does not apply to mechanical damage of the sensor and wirebonds. page 5
7 Datasheet Configuration Examples With protecting cover All dimensions are in mm. Page 6
8 Datasheet Model number codes Model number codes Example: APX MD3 - X P Device name: APX AdvaPIX Device modification: MD3 Timepix3 module Sensor type: P Planar silicon E Edgless silicon C CdTe Sensor thickness: µm µm µm Release history Date Changes 17/11/02 Model number codes added, datasheet version page 7
9 Warning Do not touch sensor surface! Instructions for safe use. To avoid malfunction or damage to your ADVAPIX TPX3 please observe the following: Do not expose to water, moisture. Do not disassemble. Wire-bonding connection may be irreversibly damaged. Do not insert any object into the sensor window. Copyright page 8
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