Financial Results for the 1 st Half of the Fiscal Year ending March 31, November 14, 2013

Transcription

1 Financial Results for the 1 st Half of the Fiscal Year ending March 31, 2014 November 14, 2013

2 Consolidated Financial Results for the 1 st Half of FY2013 1/22

3 Financial Results Highlights (million JPY) Six months ended September 30, 2012 Six months ended September 30, 2013 Comparison Comparison (%) N e t S a l e s 18,444 20,413 +1, % O p e r a t i n g I n c o m e % Net Income 300 1, % All segments mark increase both in sales and profit. Contract manufacturing increases sales significantly. Announcement of the revision of the financial results forecasts and additional recording of deferred tax assets. (October 24, 2013) Announcement of the elimination of the explanatory notes regarding material events related to going concern assumptions. (October 31, 2013) 2/22

4 Net Sales (YoY) (million JPY) 25,000 20,000 15,000 10,000 Semiconductors 15,991 18,444 1,119 1,333 2,807 1,182 3,114 Microwave Tubes and Radar Components Microwave Application Products 20,413 (+10.7%) 1,421 1,533 2, ,300 3,502 Semiconductors 17,458 (+9.2%) 5,000 Others SAW 8,883 9,243 Semiconductor Devices 0 MOS Ics Bip Ics Six months ended September 30, 2012 Six months ended September 30, /22

5 Trends in Quarterly Performance (million JPY) 12,000 Net Sales Microwave Tubes and Radar Compnents (million JPY) 900 Operating Income/Net Income Operating Income 10,000 Microwave Application Products Semiconductors Net Income 8, , , , Q 2Q 3Q 4Q 1Q 2Q 100 1Q 2Q 3Q 4Q 1Q 2Q FY2012 FY2013 FY2012 FY2013 4/22

6 Factors for Change in Operating Income Increase in Sales etc. +1,649 Payroll Cost 214 Depreciation Cost 190 Electric Power Cost 113 (million JPY) Others ,187 Six months ended September 30, 2012 分類 1 Six months ended September 30, /22

7 Outlook for Financial Results for FY2013 6/22

8 Outlook (Budget Comparison) 1 st Half 2 nd Half FY2013 (million JPY) Budget Actual Budget Expectation Budget Expectation N e t S a l e s 20,000 20,413 22,000 21,587 42,000 42,000 O p e r a t i n g I n c o m e ,650 1,574 2,500 2,500 Net Income 700 1,221 1,400 1,279 2,100 2,500 Announcement of the elimination of the explanatory notes regarding material events related to going concern assumptions. (October 31, 2013) 7/22

9 Net Sales Forecasts (YoY) (million JPY) ( 百万円 ) 42,000 (+15.3%) 40,000 Microwave-related 5,727 30,000 36,417 3,022 2,705 5, ,421 Microwave-related 6,500 (+13.5%) 20,000 Semiconductors 30,688 5,924 Microwave Tubes and Radar Components Microwave Application Products Semiconductors 35,500 (+15.7%) 10,000 16,802 Others SAW Semiconductor Devices MOS Ics 0 FY2012 Bip Ics FY2013 8/22

10 Growth Strategy 9/22

11 For Growth Expand the baseline products and launch new businesses New products, new technologies, new fields Expand in-vehicle and industrial Cost down, Retain our share Existing Product Line /22

12 DEFENSE 20 Expansion of THAI NJR Factory (Semiconductor Packaging Assembly) N THAI NJR Site Area: 54,566 m 2 New Factory Area: 3,528 m 2 63m Present Factory Area: 9,957 m 2 351m 56m 58m Groundbreaking: April, 2013 Completion : January, 2014 THAI NJR 170m 239m 11/22

13 DEFENSE 20 Overseas Production Ratio of Semiconductor Packaging Assembly (Overseas Production Ratio :%) 250, ,000 Thai Japan 80% 70% 60% 150,000 50% 40% 100,000 30% 50,000 20% 10% 0 0% 12/22

14 FORWARD 20 13/22

15 Analysis of Net Sales ( 百万円 ) (million JPY) 45,000 40,000 40,272 36,417 42,000 FORWARD 20 Yen Depreciation 35,000 Contract Manufacturing Contract Manufacturing Contract Manufacturing 30,000 Existing Microwave-related Existing Microwave-related Existing Microwave-related 25,000 20,000 Existing Semiconductors Existing Semiconductors Existing Semiconductors 15,000 10,000 5,000 0 FY2011 FY2012 FY2013 Expectation 14/22

16 Core Technologies and Business Expansion SAW Foundry (JRC+XX) MEMS GaAs New JRC Technologies Foundry service Thin film Technologies Microwave -related 15/22

17 SAW Business Structure and Use Application FORWARD 20 Ex-JRC Product Business Foundry Business PHS Communication Equipment Specific Low-Power Smartphone GPS Remote Keyless Entry Wi-Fi In-vehicle 16/22

18 FORWARD 20 MEMS Microphone Amplifier and Application Example Our Products Module Manufacturers Consumer-electronics Manufacurers NJD3002 NJU72082 MEMS Microphone Sensor Microphone Amplifier Smartphones Tablet PCs Peripherals 17/22

19 FORWARD 20 Collaboration with Electronics Component Manufacturers Active Components Semiconductors Module Collaboration Passive Components Resistor Capacitor Coil SAW TOTAL SOLUTION With our semiconductor technology, we achieve the consumer needs: small size, thinness, mass production, and low price Respond to Smartphone and Tablet PC markets. 18/22

20 For Further Growth Expand the baseline products and launch new businesses New products, new technologies, new fields Expand in-vehicle and industrial Cost down, Retain our share Existing Product Line /22

21 Growth Strategy FW2013 M&A? FW2016 FW2015 FW2014 FW2013 Existing Product Sales Existing Product Sales 20/22

22 Future Development Environment/ Energy NISSHINBO Group Synergies 21/22

23 Thank you for your kind attention.