The ASIC Company. Mixed-Signal ASICs Digital ASICs Standard ICs (ASSPs) Custom IC Design

Transcription

1 The ASIC Company

2 Leading Edge Silicon Proven IP Innovation & Quality Industrial Automotive Medical Consumer Key Facts ASIC CCE4170 Digital Analog 8/16/32-Bit Microcontroller Cores (ARM, ARC, MSP430, 8051) NVM solutions (OTP, MTP, EEPROM, FLASH) Industrial Ethernet, 3 DES Crypto Core, DSRC Communication Core Low Noise TIA 3 GHz GBW, R2R Low Power OPA, Fast Comparator Voltage Controlled Amplifier 60 db / 40 MHz Bandgap References < 10 ppm / K Switching DC / DC Converters (Boost & Buck Type) / 2.5 V / CMOS Linear Low Drop Regulators Embedded Sensors (Opto, Hall and others) Mixed-Signal Inductive position sensor ASIC designed for Bernstein AG 36 V IO-Link compliant switching unit for resistive and inductive loads Integrated 16-bit microcontroller running fully featured IO-Link device stack Temperature compensation of detection point Reverse polarity protection Short circuit protected Measurement principle configurable (ping mode or oscillator mode) 167 MS/s 10-Bit Pipeline ADC 1 MS/s 12-Bit SAR ADC 500 MS/s 6 Bit Flash ADC (time continuous & SC type) Ultra Low Power 32 khz XTAL High CMRR LVDS Interface, RS485 Interface Fast Settling 12 MHz DCO, 1GHz CMOS PLL Foundry Partners Process Foundry Process Node Core I/O CLN65LP 65 nm CMOS 1.0 V 1.8 / CLN90LP CEN90FS XP/XH018 CL018G μm BCD MM25 SMIC 0.25 μm CMOS 2.5 V HL18GFL MagnaChip HV Option History 2016 Opening of new office CREATIVE CHIPS Japan Branch and representative office in USA and Korea 52 employees by the end of the year 2014 Host of 1. CCASIC Symposium Honoured with the ISB Success Technology Award 41 employees by the end of the year 2013 Foundation of CREATIVE CHIPS Dresden GmbH Opening of new office CREATIVE CHIPS Asia Moving into the company s new headquarters building in Bingen am Rhein 2012 Laying of the foundation stone for a new building with 14,000 sqf office and 8,000 sqf testing area 35 employees by the end of the year Portfolio of more than 60 finished ASIC/ASSP designs employees by the end of the year Portfolio of more than 40 finished ASIC/ASSP designs 2004 Start of series production for first automotive project Expansion of test and office capacity 2001 Start of series production for first customer project 1999 Foundation of CREATIVE CHIPS GmbH in Bingen am Rhein 7 employees by the end of the year XH035 XO035 C05/T μm CMOS XB μm BiCMOS C036 EPISIL 1.2 μm Bipolar 0.7 V 36 V CCE4170 typical application circuit With integrated μc & IO-Link ASIC Turnkey Solutions CMOS, BiCMOS, Bipolar and BCD Wafer Production Off-the-Shelf ICs (ASSPs) End-of-Life IC Replacements IC Packaging Service Inhouse Wafer Probing (CP) and Final Test (FT)

3 Reference Examples Consumer ASICs Motor driver Intelligent battery charging LED drivers Medical ASICs Hearing aid controller Wireless charging Multimedia / LCD ASICs Dot Matrix LED Driver Broadband optical data transmission system (IR) ComCoil inductive coupled Power/Data link Industrial ASICs Fast bus interface controller with embedded μc Opto ICs IO-Link ICs Automotive ASICs Water-in-diesel sensor Glow plug controller CAN transceiver Toll collection IC (DSRC) Standard ICs (ASSPs) Sensor ASICs CCG 1401 Transimpedance Amplifier for photo diodes LED/LCD Drivers CLC 2622 LCD Matrix Driver CCE 7000 White LED Driver CCA 4100 LED Flasher IC Power Converters CCF 7000 Buck-Boost Converter CCF ma Synchronous Buck Converter IO-Link ICs CCE 4502 IO-Link System IC Device CCE 4510 IO-Link System IC Master Receiver Transceiver CCA 1224 Automotive Bus Interface CCA 9100 Double CAN Transceiver CCG MHz ASK Receiver Motor Drivers CCU 2350 PWM Speed Control for permanent excited DC Motors CCA 1200 Hall Motor Driver ASIC Turnkey Solutions CMOS, BiCMOS, Bipolar and BCD Wafer Production Off-the-Shelf ICs (ASSPs)

4 Leading Edge Silicon Proven IP Innovation & Quality Industrial Automotive Medical Consumer Key Facts ASIC CCE4170 Digital Analog 8/16/32-Bit Microcontroller Cores (ARM, ARC, MSP430, 8051) NVM solutions (OTP, MTP, EEPROM, FLASH) Industrial Ethernet, 3 DES Crypto Core, DSRC Communication Core Low Noise TIA 3 GHz GBW, R2R Low Power OPA, Fast Comparator Voltage Controlled Amplifier 60 db / 40 MHz Bandgap References < 10 ppm / K Switching DC / DC Converters (Boost & Buck Type) / 2.5 V / CMOS Linear Low Drop Regulators Embedded Sensors (Opto, Hall and others) Mixed-Signal Inductive position sensor ASIC designed for Bernstein AG 36 V IO-Link compliant switching unit for resistive and inductive loads Integrated 16-bit microcontroller running fully featured IO-Link device stack Temperature compensation of detection point Reverse polarity protection Short circuit protected Measurement principle configurable (ping mode or oscillator mode) 167 MS/s 10-Bit Pipeline ADC 1 MS/s 12-Bit SAR ADC 500 MS/s 6 Bit Flash ADC (time continuous & SC type) Ultra Low Power 32 khz XTAL High CMRR LVDS Interface, RS485 Interface Fast Settling 12 MHz DCO, 1GHz CMOS PLL Foundry Partners Process Foundry Process Node Core I/O CLN65LP 65 nm CMOS 1.0 V 1.8 / CLN90LP CEN90FS XP/XH018 CL018G μm BCD MM25 SMIC 0.25 μm CMOS 2.5 V HL18GFL MagnaChip HV Option History 2016 Opening of new office CREATIVE CHIPS Japan Branch and representative office in USA and Korea 52 employees by the end of the year 2014 Host of 1. CCASIC Symposium Honoured with the ISB Success Technology Award 41 employees by the end of the year 2013 Foundation of CREATIVE CHIPS Dresden GmbH Opening of new office CREATIVE CHIPS Asia Moving into the company s new headquarters building in Bingen am Rhein 2012 Laying of the foundation stone for a new building with 14,000 sqf office and 8,000 sqf testing area 35 employees by the end of the year Portfolio of more than 60 finished ASIC/ASSP designs employees by the end of the year Portfolio of more than 40 finished ASIC/ASSP designs 2004 Start of series production for first automotive project Expansion of test and office capacity 2001 Start of series production for first customer project 1999 Foundation of CREATIVE CHIPS GmbH in Bingen am Rhein 7 employees by the end of the year XH035 XO035 C05/T μm CMOS XB μm BiCMOS C036 EPISIL 1.2 μm Bipolar 0.7 V 36 V CCE4170 typical application circuit With integrated μc & IO-Link ASIC Turnkey Solutions CMOS, BiCMOS, Bipolar and BCD Wafer Production Off-the-Shelf ICs (ASSPs) End-of-Life IC Replacements IC Packaging Service Inhouse Wafer Probing (CP) and Final Test (FT)

5 Leading Edge Silicon Proven IP Innovation & Quality Industrial Automotive Medical Consumer Key Facts ASIC CCE4170 Digital Analog 8/16/32-Bit Microcontroller Cores (ARM, ARC, MSP430, 8051) NVM solutions (OTP, MTP, EEPROM, FLASH) Industrial Ethernet, 3 DES Crypto Core, DSRC Communication Core Low Noise TIA 3 GHz GBW, R2R Low Power OPA, Fast Comparator Voltage Controlled Amplifier 60 db / 40 MHz Bandgap References < 10 ppm / K Switching DC / DC Converters (Boost & Buck Type) / 2.5 V / CMOS Linear Low Drop Regulators Embedded Sensors (Opto, Hall and others) Mixed-Signal Inductive position sensor ASIC designed for Bernstein AG 36 V IO-Link compliant switching unit for resistive and inductive loads Integrated 16-bit microcontroller running fully featured IO-Link device stack Temperature compensation of detection point Reverse polarity protection Short circuit protected Measurement principle configurable (ping mode or oscillator mode) 167 MS/s 10-Bit Pipeline ADC 1 MS/s 12-Bit SAR ADC 500 MS/s 6 Bit Flash ADC (time continuous & SC type) Ultra Low Power 32 khz XTAL High CMRR LVDS Interface, RS485 Interface Fast Settling 12 MHz DCO, 1GHz CMOS PLL Foundry Partners Process Foundry Process Node Core I/O CLN65LP 65 nm CMOS 1.0 V 1.8 / CLN90LP CEN90FS XP/XH018 CL018G μm BCD MM25 SMIC 0.25 μm CMOS 2.5 V HL18GFL MagnaChip HV Option History 2016 Opening of new office CREATIVE CHIPS Japan Branch and representative office in USA and Korea 52 employees by the end of the year 2014 Host of 1. CCASIC Symposium Honoured with the ISB Success Technology Award 41 employees by the end of the year 2013 Foundation of CREATIVE CHIPS Dresden GmbH Opening of new office CREATIVE CHIPS Asia Moving into the company s new headquarters building in Bingen am Rhein 2012 Laying of the foundation stone for a new building with 14,000 sqf office and 8,000 sqf testing area 35 employees by the end of the year Portfolio of more than 60 finished ASIC/ASSP designs employees by the end of the year Portfolio of more than 40 finished ASIC/ASSP designs 2004 Start of series production for first automotive project Expansion of test and office capacity 2001 Start of series production for first customer project 1999 Foundation of CREATIVE CHIPS GmbH in Bingen am Rhein 7 employees by the end of the year XH035 XO035 C05/T μm CMOS XB μm BiCMOS C036 EPISIL 1.2 μm Bipolar 0.7 V 36 V CCE4170 typical application circuit With integrated μc & IO-Link ASIC Turnkey Solutions CMOS, BiCMOS, Bipolar and BCD Wafer Production Off-the-Shelf ICs (ASSPs) End-of-Life IC Replacements IC Packaging Service Inhouse Wafer Probing (CP) and Final Test (FT)

6 Company headquarters in Bingen, Germany CREATIVE CHIPS GmbH Im Bubenstück Bingen am Rhein Germany Phone: +49 (0) info@creativechips.com CREATIVE CHIPS Dresden GmbH Altstrehlen Dresden Germany Phone: +49 (0) Sales Contact Semisource Corporation 1116 Arthur s Court, Pinckney, MI 48169, USA Phone: michael.head@creativechips.com CREATIVE CHIPS Japan Branch 5F Roppongi Mikawadai Building Roppongi, Minato-ku Tokyo, Japan Phone: +81 (0) sales.japan@creativechips.com artpool.de / A10729 / / 500 End-of-Life IC Replacements IC Packaging Service Inhouse Wafer Probing (CP) and Final Test (FT)