LY62L205016A 32M Bits ( 2Mx16 / 4Mx8 Switchable) LOW POWER CMOS SRAM

Similar documents
LY62L102516A 1024K x 16 BIT LOW POWER CMOS SRAM

LY62L409716A 4M X 16 BIT LOW POWER CMOS SRAM

LY62W K X 16 BIT LOW POWER CMOS SRAM

LY62L K X 16 BIT LOW POWER CMOS SRAM

LY62L K X 16 BIT LOW POWER CMOS SRAM

AS6C TINL 16M Bits LOW POWER CMOS SRAM

LY61L102416A 1024K X 16 BIT HIGH SPEED CMOS SRAM

AS7C34098A-8TIN 256K X 16 BIT HIGH SPEED CMOS SRAM

FEBRUARY/2008, V 1.c Alliance Memory Inc. Page 1 of 13

AS6C K X 8 BIT LOW POWER CMOS SRAM

MARCH/2008, V 1.0 Alliance Memory Inc. Page 1 of 12

8K X 8 BIT LOW POWER CMOS SRAM

AS6C6264 8K X 8 BIT LOW POWER CMOS SRAM REVISION HISTORY. Feb

LP621024E-I Series 128K X 8 BIT CMOS SRAM. Document Title 128K X 8 BIT CMOS SRAM. Revision History. AMIC Technology, Corp.

4Mb Async. FAST SRAM Specification

4Mb Async. FAST SRAM A-die Specification

16Mb(1M x 16 bit) Low Power SRAM

256K x 16 4Mb Asynchronous SRAM

LP62S16256G-I Series. Document Title 256K X 16 BIT LOW VOLTAGE CMOS SRAM. Revision History. Rev. No. History Issue Date Remark

CMOS SRAM. K6T4008C1B Family. Document Title. Revision History. 512Kx8 bit Low Power CMOS Static RAM. Revision No. History. Remark. Draft Date 0.

64K x 16 1Mb Asynchronous SRAM

IDT71016S/NS. CMOS Static RAM 1 Meg (64K x 16-Bit)

Rev. No. History Issue Date Remark

CMOS Static RAM 1 Meg (128K x 8-Bit) Revolutionary Pinout

MOS INTEGRATED CIRCUIT

IDT71V124SA/HSA. 3.3V CMOS Static RAM 1 Meg (128K x 8-Bit) Center Power & Ground Pinout

LY68L M Bits Serial Pseudo-SRAM with SPI and QPI

AT28C16. 16K (2K x 8) CMOS E 2 PROM. Features. Description. Pin Configurations

512K x 8 4Mb Asynchronous SRAM

3.3V CMOS Static RAM for Automotive Applications 4 Meg (256K x 16-Bit)

IS62WV12816DALL/DBLL IS65WV12816DALL/DBLL

2-Megabit (256K x 8) 5-volt Only CMOS Flash Memory AT29C020. Features. Description. Pin Configurations

HIGH-SPEED 4K x 8 FourPort TM STATIC RAM

HM628128BI Series. 131,072-word 8-bit High speed CMOS Static RAM

Rev. No. History Issue Date Remark

Low Power Pseudo SRAM

CAT22C Bit Nonvolatile CMOS Static RAM

AT28C K (32K x 8) Paged CMOS E 2 PROM. Features. Description. Pin Configurations

MOS INTEGRATED CIRCUIT

IDT7134SA/LA. HIGH-SPEED 4K x 8 DUAL-PORT STATIC SRAM

AT24C01A/02/04/08/16. 2-Wire Serial CMOS E 2 PROM. Features. Description. Pin Configurations. 1K (128 x 8) 2K (256 x 8) 4K (512 x 8) 8K (1024 x 8)

Product Change Notification (PCN)

AT29C K (32K x 8) 5-volt Only CMOS Flash Memory. Features. Description. Pin Configurations

MOS INTEGRATED CIRCUIT

128Kx8 CMOS MONOLITHIC EEPROM SMD

White Electronic Designs

4M X 4 CMOS DYNAMIC RAM WITH EDO PAGE MODE. Rev. No. History Issue Date Remark

HIGH SPEED 64K (4K X 16 BIT) IDT70824S/L SEQUENTIAL ACCESS RANDOM ACCESS MEMORY (SARAM )

16Mbit, 512KX32 CMOS S-RAM MODULE

HT CMOS 2K 8-Bit SRAM

Since a 32-pin plastic SSOP package is used, the display unit size can be reduced.

16Mbit, 512KX32 CMOS S-RAM MODULE

A24C08. AiT Semiconductor Inc. ORDERING INFORMATION

4M X 4 CMOS DYNAMIC RAM WITH EDO PAGE MODE. Rev. No. History Issue Date Remark

Am27C128. Advanced Micro Devices. 128 Kilobit (16,384 x 8-Bit) CMOS EPROM DISTINCTIVE CHARACTERISTICS GENERAL DESCRIPTION BLOCK DIAGRAM FINAL

512KX8 CMOS S-RAM (Monolithic)

2Mb Ultra-Low Power Asynchronous CMOS SRAM. Features. Power Supply (Vcc)

512Kx8 Monolithic SRAM, SMD

Am27C512. Advanced Micro Devices. 512 Kilobit (65,536 x 8-Bit) CMOS EPROM DISTINCTIVE CHARACTERISTICS GENERAL DESCRIPTION BLOCK DIAGRAM FINAL

Am27C020. Advanced Micro Devices. 2 Megabit (262,144 x 8-Bit) CMOS EPROM DISTINCTIVE CHARACTERISTICS GENERAL DESCRIPTION BLOCK DIAGRAM FINAL

A23W8308. Document Title 262,144 X 8 BIT CMOS MASK ROM. Revision History. Rev. No. History Issue Date Remark

512K bitstwo-wire Serial EEPROM

DS1225Y 64k Nonvolatile SRAM

White Electronic Designs

4-Megabit (512K x 8) 5-volt Only CMOS Flash Memory AT49F040 AT49F040T AT49F040/040T AT49F040/040T. Features. Description. Pin Configurations

My-MS. MM27C ,072 x 8 CMOS EPROM PRELIMINARY INFORMATION ISSI IS27C010 FEATURES DESCRIPTION FUNCTIONAL BLOCK DIAGRAM

VERY LOW POWER 1.8V 16K/8K/4K x 16 DUAL-PORT STATIC RAM

MB85R M Bit (128 K 8) Memory FRAM CMOS DS E DESCRIPTIONS FEATURES FUJITSU SEMICONDUCTOR DATA SHEET

M8M644S3V9 M16M648S3V9. 8M, 16M x 64 SODIMM

IS41C16257C IS41LV16257C

A24C64. AiT Semiconductor Inc. ORDERING INFORMATION

ACT S512K32 High Speed 16 Megabit SRAM Multichip Module

A24C02. AiT Semiconductor Inc. ORDERING INFORMATION

CAT28C17A 16K-Bit CMOS PARALLEL EEPROM

High Performance 4Kx4 Static RAM MIL-STD-883C

OPTIONS. Low Power Data Retention Mode. PIN ASSIGNMENT (Top View) I/O 16 I/O 17 I/O 18 I/O 19 I/O17 I/O18 I/O19. Vss I/O20 I/O21 I/O22 I/O23

Industrial Temperature Range: -40 o C to +85 o C Lead-free available KEY TIMING PARAMETERS. Max. CAS Access Time (tcac) ns

4Mbit, 512KX8 5V Flash Memory (Monolithic)

1Mx16 16Mb DRAM WITH FAST PAGE MODE SEPTEMBER 2018

MB85R K (32 K 8) Bit. Memory FRAM DS E CMOS DESCRIPTIONS FEATURES PACKAGES FUJITSU SEMICONDUCTOR DATA SHEET

Am27C Megabit (131,072 x 8-Bit) CMOS EPROM DISTINCTIVE CHARACTERISTICS GENERAL DESCRIPTION BLOCK DIAGRAM

CAT28C K-Bit Parallel EEPROM

HIGH SPEED 4K X 8 DUAL-PORT STATIC RAM WITH SEMAPHORE

P2M648YL, P4M6416YL. PIN ASSIGNMENT (Front View) 168-PIN DIMM. 8-2Mx8 SDRAM TSOP P2M648YL-XX 16-2Mx8 SDRAM TSOP P4M6416YL-XX

MX27C K-BIT [32K x 8] CMOS EPROM FEATURES GENERAL DESCRIPTION BLOCK DIAGRAM PIN CONFIGURATIONS PIN DESCRIPTION

64Mbit, 2MX32 3V Flash Memory Module

HIGH SPEED 128K (8K X 16 BIT) IDT70825S/L SEQUENTIAL ACCESS RANDOM ACCESS MEMORY (SARAM )

P8M644YA9, 16M648YA9. PIN ASSIGNMENT (Front View) 168-PIN DIMM. 4-8Mx16 SDRAM TSOP P8M644YA9 8-8Mx16 SDRAM TSOP P16M648YA9

FEATURES. Single Power Supply Operation - Low voltage range: 2.70 V V

DS1249Y/AB 2048k Nonvolatile SRAM

1-Megabit (128K x 8) Low Voltage Paged Parallel EEPROMs AT28LV010

IDT7132SA/LA IDT7142SA/LA

IS41C16256C IS41LV16256C

1-megabit (64K x 16) 5-volt Only Flash Memory AT49F1024A Features Description Pin Configurations

DS1265Y/AB 8M Nonvolatile SRAM

IS41C16100C IS41LV16100C

P8M648YA4,P16M6416YA4 P8M648YB4, P8M6416YB4

I/O 0 I/O 7 WE CE 2 OE CE 1 A17 A18

HIGH-SPEED 3.3V 1K X 8 DUAL-PORT STATIC RAM

CMOS SyncFIFO 64 X 9, 256 x 9, 512 x 9, 1,024 X 9, 2,048 X 9, 4,096 x 9 and 8,192 x 9

Transcription:

Y62205016A 32M Bits ( 2Mx16 / 4Mx8 Switchable) OW POWER CMOS SRAM REVISION ISTORY Revision Description Issue Date Rev. 1.0 Initial Issue Sep.06.2012 Rev. 1.1 Add 25 & 40 spec for ISB1 & IDR on page 4 & page 9 Delete grade for ordering information on page 11 Correct typo error on the column UB#, B# of truth table for row Byte Read Byte Write and Output Disable at page 4: revised to be Nov.06.2012 July.08.2013 yontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. I, Science-Based Industrial Park, sinchu 300, Taiwan. TE: 886-3-6668838 FA: 886-3-6668836 0

Y62205016A 32M Bits ( 2Mx16 / 4Mx8 Switchable) OW POWER CMOS SRAM FEATURES GENERA DESCRIPTION Fast access time : 55/70ns ow power consumption: Operating current : 45/30mA (TYP.) Standby current : 10μA (TYP.) S-version Single 2.7V ~ 3.6V power supply All inputs and outputs TT compatible Fully static operation Tri-state output Data byte control : (i) BYTE# fixed to V CC B# controlled DQ0 ~ DQ7 UB# controlled DQ8 ~ DQ15 (ii) BYTE# fixed to V SS DQ15 used as address pin, while DQ8~DQ14 pins not used Data retention voltage : 1.2V (MIN.) Green package available Package : 48-pin 12mm x 20mm TSOP-I The Y62205016A is a 33,554,432-bit low power CMOS static random access memory organized as 2,097,152 words by 16 bits or 4,194,304 words by 8 bits. It is fabricated using very high performance, high reliability CMOS technology. Its standby current is stable within the range of operating temperature. The Y62205016A is well designed for low power application, and particularly well suited for battery back-up nonvolatile memory application. The Y62205016A operates from a single power supply of 2.7V ~ 3.6V and all inputs and outputs are fully TT compatible PRODUCT FAMIY Product Operating Power Dissipation Vcc Range Speed Family Temperature Standby(ISB1,TYP.) Operating(Icc,TYP.) Y62205016A 0 ~ 70 2.7 ~ 3.6V 55/70ns 10µA(S) 45/30mA Y62205016A(I) -40 ~ 85 2.7 ~ 3.6V 55/70ns 10µA(S) 45/30mA yontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. I, Science-Based Industrial Park, sinchu 300, Taiwan. TE: 886-3-6668838 FA: 886-3-6668836 1

Y62205016A 32M Bits ( 2Mx16 / 4Mx8 Switchable) OW POWER CMOS SRAM FUNCTIONA BOCK DIAGRAM PIN DESCRIPTION Vcc Vss A0~A20 /A-1~A20 DQ0-DQ7 ower Byte DQ8-DQ15 Upper Byte DECODER I/O DATA CIRCUIT 2048Kx16/4096Kx8 MEMORY ARRAY COUMN I/O SYMBO DESCRIPTION A0 A20 Address Inputs(word mode) A-1 A20 Address Inputs(byte mode) DQ0 DQ15 Data Inputs/Outputs, Chip Enable Input WE# Write Enable Input OE# Output Enable Input B# ower Byte Control UB# Upper Byte Control BYTE# Byte Enable VCC VSS Power Supply Ground WE# OE# B# UB# BYTE# CONTRO CIRCUIT yontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. I, Science-Based Industrial Park, sinchu 300, Taiwan. TE: 886-3-6668838 FA: 886-3-6668836 2

Y62205016A 32M Bits ( 2Mx16 / 4Mx8 Switchable) OW POWER CMOS SRAM PIN CONFIGURATION A15 A14 A13 A12 A11 A10 A9 A8 A19 A20 WE# NC UB# B# A18 A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Y62205016A 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A16 BYTE# Vss DQ15/A-1 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 Vcc DQ11 DQ3 DQ10 DQ2 DQ9 DQ1 DQ8 DQ0 OE# Vss A0 TSOP-I ABSOUTE MAIMUN RATINGS* PARAMETER SYMBO RATING UNIT Voltage on VCC relative to VSS VT1-0.5 to 4.6 V Voltage on any other pin relative to VSS VT2-0.5 to VCC+0.5 V Operating Temperature TA 0 to 70(C grade) -40 to 85(I grade) Storage Temperature TSTG -65 to 150 Power Dissipation PD 1 W DC Output Current IOUT 50 ma *Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to the absolute maximum rating conditions for extended period may affect device reliability. yontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. I, Science-Based Industrial Park, sinchu 300, Taiwan. TE: 886-3-6668838 FA: 886-3-6668836 3

Y62205016A 32M Bits ( 2Mx16 / 4Mx8 Switchable) OW POWER CMOS SRAM TRUT TABE MODE BYTE# OE# WE# B# UB# Standby Output Disable Read Write I/O OPERATION DQ0-DQ7 DQ8-DQ14 DQ15 igh Z igh Z igh Z igh Z igh Z igh Z igh Z igh Z igh Z igh Z igh Z igh Z D OUT igh Z D OUT D IN igh Z D IN yontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. I, Science-Based Industrial Park, sinchu 300, Taiwan. TE: 886-3-6668838 FA: 886-3-6668836 4 igh Z igh Z igh Z igh Z D OUT D OUT igh Z D IN D IN igh Z igh Z A-1 igh Z D OUT D OUT igh Z D IN D IN SUPPY CURRENT ISB,ISB1 ICC,ICC1 ICC,ICC1 ICC,ICC1 Byte# Read Dout igh Z A-1 ICC,ICC1 Byte # Write Din igh Z A-1 ICC,ICC1 Note: = VI, = VI, = Don't care. DC EECTRICA CARACTERISTICS PARAMETER SYMBO TEST CONDITION MIN. TYP. *4 MA. UNIT Supply Voltage VCC 2.7 3.0 3.6 V Input igh Voltage VI *1 2.2 - VCC+0.3 V Input ow Voltage VI *2-0.2-0.6 V Input eakage Current II VCC VIN VSS - 1-1 µa Output eakage VCC VOUT VSS Current IO Output Disabled - 1-1 µa Output igh Voltage VO IO = -1mA 2.2 2.7 - V Output ow Voltage VO IO = 2mA - - 0.4 V ICC Cycle time = Min. = VI and = VI - 55-45 80 ma II/O = 0mA Other pins at VI or VI - 70-30 60 ma Average Operating Power supply Current Standby Power Supply Current ICC1 ISB ISB1 Cycle time = 1µs 0.2V and VCC-0.2V II/O = 0mA Other pins at 0.2V or VCC-0.2V = VI or = VI Other pins at VI or VI VCC-0.2V or 0.2V Other pins at 0.2V or VCC-0.2V - S - SI - 10 20 ma - 0.3 2 ma 25-10 18 µa 40-10 18 µa -S - 10 80 µa -SI - 10 120 µa Notes: 1. VI(max) = VCC + 2.0V for pulse width less than 6ns. 2. VI(min) = VSS - 2.0V for pulse width less than 6ns. 3. Over/Undershoot specifications are characterized on engineering evaluation stage, not for mass production test. 4. Typical values are included for reference only and are not guaranteed or tested. Typical valued are measured at VCC = VCC(TYP.) and TA = 25

Y62205016A 32M Bits ( 2Mx16 / 4Mx8 Switchable) OW POWER CMOS SRAM CAPACITANCE (TA = 25, f = 1.0Mz) PARAMETER SYMBO MIN. MA UNIT Input Capacitance CIN - 6 pf Input/Output Capacitance CI/O - 8 pf Note : These parameters are guaranteed by device characterization, but not production tested. AC TEST CONDITIONS Input Pulse evels 0.2V to VCC -0.2V Input Rise and Fall Times 3ns Input and Output Timing Reference evels 1.5V Output oad C = 30pF + 1TT, IO/IO = -1mA/2mA AC EECTRICA CARACTERISTICS (1) READ CYCE PARAMETER SYM. Y62205016A-55 Y62205016A-70 UNIT MIN. MA. MIN. MA. Read Cycle Time trc 55-70 - ns Address Access Time taa - 55-70 ns Chip Enable Access Time tace - 55-70 ns Output Enable Access Time toe - 30-35 ns Chip Enable to Output in ow-z tcz* 10-10 - ns Output Enable to Output in ow-z toz* 5-5 - ns Chip Disable to Output in igh-z tcz* - 20-25 ns Output Disable to Output in igh-z toz* - 20-25 ns Output old from Address Change to 10-10 - ns B#, UB# Access Time tba - 55-70 ns B#, UB# to igh-z Output tbz* - 25-30 ns B#, UB# to ow-z Output tbz* 10-10 - ns (2) WRITE CYCE PARAMETER SYM. Y62205016A-55 Y62205016A-70 UNIT MIN. MA. MIN. MA. Write Cycle Time twc 55-70 - ns Address Valid to End of Write taw 50-60 - ns Chip Enable to End of Write tcw 50-60 - ns Address Set-up Time tas 0-0 - ns Write Pulse Width twp 45-55 - ns Write Recovery Time twr 0-0 - ns Data to Write Time Overlap tdw 25-30 - ns Data old from End of Write Time td 0-0 - ns Output Active from End of Write tow* 5-5 - ns Write to Output in igh-z twz* - 20-25 ns B#, UB# Valid to End of Write tbw 45-60 - ns *These parameters are guaranteed by device characterization, but not production tested. yontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. I, Science-Based Industrial Park, sinchu 300, Taiwan. TE: 886-3-6668838 FA: 886-3-6668836 5

Y62205016A 32M Bits ( 2Mx16 / 4Mx8 Switchable) OW POWER CMOS SRAM TIMING WAVEFORMS READ CYCE 1 (Address Controlled) (1,2) Address trc taa to Dout Previous Data Valid Data Valid READ CYCE 2 ( and and OE# Controlled) (1,3,4,5) Address trc taa tace B#,UB# tba OE# tbz tcz toz toe to toz tbz tcz Dout igh-z Data Valid igh-z Notes : 1.WE#is high for read cycle. 2.Device is continuously selected OE# = low, = low, = high, B# or UB# = low. 3.Address must be valid prior to or coincident with = low, = high, B# or UB# = low transition; otherwise taa is the limiting parameter. 4.tCZ, tbz, toz, tcz, tbz and toz are specified with C = 5pF. Transition is measured ±500mV from steady state. 5.At any given temperature and voltage condition, tcz is less than tcz, tbz is less than tbz, toz is less than toz. yontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. I, Science-Based Industrial Park, sinchu 300, Taiwan. TE: 886-3-6668838 FA: 886-3-6668836 6

Y62205016A 32M Bits ( 2Mx16 / 4Mx8 Switchable) OW POWER CMOS SRAM WRITE CYCE 1 (WE# Controlled) (1,2,3,5,6) twc Address taw tcw tbw B#,UB# tas twp twr WE# twz TOW Dout (4) igh-z (4) tdw td Din Data Valid WRITE CYCE 2 ( and Controlled) (1,2,5,6) Address twc taw tas twr tcw tbw B#,UB# twp WE# Dout twz (4) igh-z tdw td Din Data Valid yontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. I, Science-Based Industrial Park, sinchu 300, Taiwan. TE: 886-3-6668838 FA: 886-3-6668836 7

Y62205016A 32M Bits ( 2Mx16 / 4Mx8 Switchable) OW POWER CMOS SRAM WRITE CYCE 3 (B#,UB# Controlled) (1,2,5,6) twc Address taw twr tas tcw tbw B#,UB# twp WE# Dout (4) twz igh-z tdw td Din Data Valid Notes : 1.WE#,, B#, UB# must be high or must be low during all address transitions. 2.A write occurs during the overlap of a low, high, low WE#, B# or UB# = low. 3.During a WE# controlled write cycle with OE# low, twp must be greater than twz + tdw to allow the drivers to turn off and data to be placed on the bus. 4.During this period, I/O pins are in the output state, and input signals must not be applied. 5.If the, B#, UB# low transition and high transition occurs simultaneously with or after WE# low transition, the outputs remain in a high impedance state. 6.tOW and twz are specified with C = 5pF. Transition is measured ±500mV from steady state. yontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. I, Science-Based Industrial Park, sinchu 300, Taiwan. TE: 886-3-6668838 FA: 886-3-6668836 8

Y62205016A 32M Bits ( 2Mx16 / 4Mx8 Switchable) OW POWER CMOS SRAM DATA RETENTION CARACTERISTICS PARAMETER SYMBO TEST CONDITION MIN. TYP. MA. UNIT VCC for Data Retention VDR VCC - 0.2V or 0.2V 1.2-3.6 V Data Retention Current IDR -S 25-8 16 µa VCC = 1.2V -SI 40-8 16 µa VCC-0.2V or 0.2V -S - 8 80 other pins at 0.2V or VCC-0.2V µa -SI - 8 120 µa Chip Disable to Data See Data Retention tcdr Retention Time Waveforms (below) 0 - - ns Recovery Time tr trc * - - ns trc * = Read Cycle Time DATA RETENTION WAVEFORM ow Vcc Data Retention Waveform (1) ( controlled) VDR 1.2V Vcc Vcc(min.) Vcc(min.) tcdr tr VI Vcc-0.2V VI ow Vcc Data Retention Waveform (2) ( controlled) VDR 1.2V Vcc Vcc(min.) Vcc(min.) tcdr tr VI 0.2V VI ow Vcc Data Retention Waveform (3) (B#, UB# controlled) VDR 1.2V Vcc Vcc(min.) Vcc(min.) tcdr tr B#,UB# VI B#,UB# Vcc-0.2V VI yontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. I, Science-Based Industrial Park, sinchu 300, Taiwan. TE: 886-3-6668838 FA: 886-3-6668836 9

Y62205016A 32M Bits ( 2Mx16 / 4Mx8 Switchable) OW POWER CMOS SRAM PACKAGE OUTINE DIMENSION 48-pin 12mm x 20mm TSOP-I Package Outline Dimension yontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. I, Science-Based Industrial Park, sinchu 300, Taiwan. TE: 886-3-6668838 FA: 886-3-6668836 10

Y62205016A 32M Bits ( 2Mx16 / 4Mx8 Switchable) OW POWER CMOS SRAM ORDERING INFORMATION Package Type 48-pin 12mm x 20mm TSOP-I Access Time (Speed)(ns) Power Type 55 Special Ultra ow Power 70 Special Ultra ow Power Temperature Range( ) Packing Type yontek Item No. 0 ~70 Tray Y62205016A-55S Tape Reel Y62205016A-55ST -40 ~85 Tray Y62205016A-55SI Tape Reel Y62205016A-55SIT 0 ~70 Tray Y62205016A-70S Tape Reel Y62205016A-70ST -40 ~85 Tray Y62205016A-70SI Tape Reel Y62205016A-70SIT yontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. I, Science-Based Industrial Park, sinchu 300, Taiwan. TE: 886-3-6668838 FA: 886-3-6668836 11

Y62205016A 32M Bits ( 2Mx16 / 4Mx8 Switchable) OW POWER CMOS SRAM TIS PAGE IS EFT BANK INTENTIONAY. yontek Inc. reserves the rights to change the specifications and products without notice. 5F, No. 2, Industry E. Rd. I, Science-Based Industrial Park, sinchu 300, Taiwan. TE: 886-3-6668838 FA: 886-3-6668836 12