Welcome Joe Civello ADS Product Manager Agilent Technologies Agilent Technologies 2011
Agenda RF & microwave market trends & how Agilent EEsof is investing its R&D Multi-technology design with ADS 2011 - demo New capabilities for all RF & microwave engineers Circuit design & simulation - demo EM modeling (Momentum and FEM) - demo Load Pull for improved PA matching network design - demo Layout - demo And more Page 2
Complete MMIC/Module ADS Desktop Design Page 3
RF & Microwave Market Trends Increasing Complexity & Integration Commercial wireless and Aerospace/Defense Industries are rapidly moving from single packaged MMICs, to larger, more complex ICs in multi-chip RF modules Today s flows combine multiple, poorly integrated tools, which are not able to address multiple technology design and verification The IC, laminate, package, and PCB system need to be designed together, interactively Electro-magnetic interactions between substrates need to be modeled Page 4
ADS 2011: The IC/Module/Package/PCB Design Solution Realizing the Multi-Technology Vision Multi-Technology Circuit Design Multiple die (IC and IPD) Multiple substrates (die, laminate, LTCC, package, PCB) Multiple process design kits (PDKs) GaAs (HBT, phemt), GaN, SiGe, Si Multiple ICs Multiple Technologies Integrated Electro-Magnetic Solvers Multi-Technology EM simulation Full 3D EM Simulation Finite Element Simulator Parameterized Solid Models of Components Multi-layer 3D Planar EM simulation Easy EM simulation for the every engineer On Laminate & Packaged Mounted on Board Page 5
Page 6 Designing Across Multiple Technologies
The Multi-Technology Challenge Single Technology Space LNA GaAs AEL Cust Mixer SiGe Traditional Design Tools Designed to handle one type of design IC, Module, or PCB Have a single technology definition space Layer Defs RF Module Laminate Page 7
True Multi-Technology Management ADS 2011 Multi-technology Environment GaAs:Components SiGe:Components GaAs:Layer Defs SiGe:Layer Defs LNA GaAs GaAs:Material Prop GaAs:AEL Cust SiGe:Material Prop SiGe:AEL Cust Mixer SiGe Lam:Components Lam:Layer Defs Lam:AEL Cust Lam:Material Prop RF Module Laminate New Library construct maintains separate technology definition areas No namespace collisions No layer mapping needed No PDK conflicts Page 8
Multi-Technology Design & Library Management Page 9
Multi-Technology Circuit Simulation Mixer SiGe LNA GaAs Module Laminate Simulate critical circuits across multiple technologies Design closer to the margins Detect and solve issues before manufacturing Page 10
Native Physical Multi-Substrate Support Easily add one or more pre-defined substrates IC in a package, IC in a module, module on a board, etc. Unlimited levels of technology stacking i.e. IC on a module on a PCB Supports flip chips, wire bonding, and backside mounting No modification of layers required Directly modify any of the designs No flattening required Works with all the ADS tools Layout, 3D Visualization, Momentum and FEM, etc. Easy to combine multiple substrates New graphical substrate editor Page 11
ADS Integrated 3D EM Flow Momentum & FEM in ADS, 3D EM Components & EMPro/FDTD link ADS Platform EMPro Platform Parameterized 3D EM Components Layout CAD Data Momentum Simulator FEM Simulator FDTD Simulator Page 12
Multi-Technology EM Simulation Capabilities & Vision Package IC IC Multi-technology EM Simulation + + = Discover coupling effects prior to fabrication 3D view Momentum FEM More effectively optimize design elements for final packaging More easily make design trade-offs Help diagnose and solve performance problems Page 13
Page 14 Improved RF Circuit Design and Simulation
Views Easily Manage Models & Design Representations Cells represent a single design object Cell Views provide multiple representations of that design object Different schematic variants, behavioral, measured, layout, EM data views, etc. User defined Simplifies schematics Easily select simulation model Explore design variants Cell name Views Page 15
Dynamic Simulation Model Selection Easily select the model to use for simulation Tradeoff speed vs. accuracy Works on one or more selected components Current active model is shown on the schematic Easily create a model priority list to work on entire design hierarchy Design, by its nature, is evolutionary. Selecting model type and accuracy is key to this. This makes it simple and virtually instantaneous. Page 16
Major Improvements to Load Pull From load pull to design in a few clicks New load pull data controller Handles Maury load pull data Direct, instant loading of load pull data Handles multiple files Easier review of data Fast, Easy, Intuitive Immediately simulate matching network Easier design optimization, including improved discrete optimization Automatic interpolation of scattered measurement data Automatically display performance parameters Page 17
Page 18 Making EM Simulation Part of Everyone s Design Flow
New Graphical Layer Definition Graphical, unified entry of layer and stackup data Defines layers and properties for Layout, Momentum, and FEM Easy drag and drop operations Easily select and modify properties Simpler, faster, and less error prone Page 19
New Streamlined EM Setup Making EM Work for Everyone Previous EM Setup ADS 2011 Single dialog replaces 8 Easily navigate & review the setup options Same setup for Momentum, Momentum RF, & FEM Easy to try different solvers on the same design Setup is automatically saved and can be reused for other EM simulations Page 20
Reusing Saved EM Setup Configurations Making EM Work for Everyone Foundry PDK Design Engineer Packaged With ADS EM Expert Makes it possible for non-experts to create accurate EM models Big productivity improvement for all users Easier to experiment with different setup options Page 21 Designer s own setups Use saved setups on new work Saves Mouse Clicks (30 down to 3)
New Integrated EM Port Viewer/Editor Multi-port Editor Auto Combined Multi-port Viewer & Editor Features of new Port Editor Copy a value and paste to multiple ports New filtering Quickly find ports by attributes Filter on one or multiple attributes Automatic port generation Automatic port resequencing Single port Editor Page 22
New Momentum 2 nd Generation Mesher Preprocessor Mesher (2 nd generation ) Solver OLD NEW triangle rectangle NEW quadrilateral Increased accuracy, robustness and performance Fast floating-point interval arithmetic Improved mesh quality Avoids slivers Improved handling of small and wide shapes New algorithm for edge mesh and overlap extraction Reduced mesh complexity New quadrangles Page 23
Momentum Solver 5 years of (R)evolution Release Load Solve Storage 2003A dense (N 2 ) direct (N 3 ) dense (N 2 ) 2005A dense (N 2 ) iterative (N p N 2 ) dense (N 2 ) 2008U1 dense (N 2 ) direct (NlogN) 1.5 sparse (NlogN) 2011 sparse (NlogN) direct (NlogN) 1.5 sparse(nlogn) solve time solve time load time load time load time Example: PDN impedance Freq sweep 0-3 GHz Matrix size: 17.501 2003 2005 2008 2010 * Performance will vary dependent on complexity, frequency and other factors Page 24
Expanded Bondwire Support New, fast analysis of bondwires in Momentum Automatically modeled as part of Momentum simulation Calculates self and mutual inductance FEM provides the most accurate analysis Bondwires work for both Momentum and FEM Easily create the bondwire in Layout Full parametric control of bondwire profile Jedec Bondwire Follows the JEDEC standard parameters Shape Bondwire More flexible control of the bondwire profile Bondwires now have edit handles Set parameters Create and edit in 2D Render in 3D Page 25
Page 26 Layout
Layout Usability: Object Handles Directly work on objects quick & efficient Objects with handles Arcs, Circles, Polylines, Polygons, Rectangles, Text Transmission Lines, Paths, Wires, Traces, Annotations, Wire Labels, Rulers, Dimension Lines Infrastructure available for end user customization Add handles to pdk components and design kits Customizable behavior Page 27
Layout Command Line & Toolbar Command line provides efficient keyboard entry for common functions User can add their own functions to the command line The toolbar provides single click operations for frequently used features Set vertex selection on/off, control pin-number display and align shapes Page 28
Layout Command Line - Current Functions Page 29
QFN Designer Predict Packaged Performance in Minutes Configure QFN package Accurately predict real performance Quickly synthesize complex package, combine with IC & PCB data Performance w/ & w/o package Page 30
Page 31 And much more
Data Display Improvements Improved Smith Chart graphics Better display of chart values Better overall look and data granularity Set color for a group of traces Easier interpretation of sweeps Improved Data Display Template Browser Real time quick search Direct editing of template properties Save As and Delete from the Browser Page 32
Other 2011 Improvements Circuit Simulation Linear Simulation Speedup - up to 10X For fully-linear circuits with swept, tuned, or optimized simulations Improved Transmission line models (including multi-layer library) More accurate broad-band skin effect calculation New, advanced method of calculating surface roughness loss More accurate calculation of Power/Ground Plane loss Output simulator results in Matlab format New controller makes it possible to filter the output New models supported NXP SiMKit 3.4, PSP 102.3.4 and 103.1.1, Mextram 504.8, BSIMSOI 4.3.0, BSIM 4.6.5, HiSIM_HV 1.2.0, MOSVAR 1.1, R3, PSPICE diode Support for Verilog A now included as part of ADS Core for use with all simulators Page 33
Other 2011 Improvements Desktop LVS Viewer can now display Calibre errors Backside component support Allegro/ADS link (IFF for Allegro) now included in shipping product New entry mode for circles and rectangles Use CTRL key and first point will be the center of the shape New Array Reference (AREFs) objects to Layout Much more memory efficient way to create large arrays of objects Advanced Model Composer (AMC) models can now be created with FEM Layout connectivity engine is up to 40X faster than previous releases Layout layers can now have sub-layers (purposes) Can visually distinguish different objects drawn on a layer Page 34
Signal Integrity/Power Integrity Power Integrity with Momentum Unique capability for PI analysis on split power/ground plane PCBs Accurate modeling of multi-ghz effects Easy setup with SI/PI Analysis tool IBIS AMI simulation support Fast, accurate SERDES models for what if? channel simulation More accurate modeling of high frequency effects in PCB transmission lines (multi layer models library and Momentum) Surface roughness of copper traces MLM causal dielectric loss algorithm now added to Momentum also Page 35
Improved Accuracy for Conductor Models New Multi-level Hemispherical Model Available in Momentum and Circuit Simulation Closer correlation to measured data 0 Hammerstad Agilent 5500 Atomic Force Microscope -1-2 Hemispherical -3 Measured Data -4 NEW Multi-level -5-6 0 2 4 6 8 10 12 14 16 freq, GHz More accurately reflects conductor surface Can use AFM measurements to set params Page 36
Support for International Character Set Can create annotations / documentation with international characters Provided in schematic and data display Page 37
ADS 2011 Summary ADS 2011 new capabilities for multi-technology RF design ADS 2011 makes electromagnetic simulation easier for all designers New circuit and electromagnetic simulation technologies increase performance and usability New physical design capabilities to make ADS Layout more powerful IBIS-AMI simulation support & new Signal Integrity/Power Integrity wizard for split Power/Ground planes Agilent EEsof EDA Innovative Solutions, Breakthrough Results Page 38
Page 39 Questions?
For More Information Agilent ADS 2011 Web page (new feature details) www.agilent.com/find/eesof-ads2011 ADS 2011 on YouTube www.youtube.com/user/agilenteesof ADS 2011 Overview (Quick Start Video, Multi-technology Tutorials, ) www.agilent.com/find/eesof-ads2011-overview Page 40
You are invited You can find more webcasts www.agilent.com/find/eesof-innovations-in-eda www.agilent.com/find/eesof-webcasts-recorded Amolak Badesha Senior Application Expert Agilent Technologies Page 41
Innovations in EDA Webcast Series: Multi-Technology RF Design Using the New Advances in ADS 2011 ADS 2011: The IC/Module/Package/Board Design Solution Joe Civello ADS Product Manager Agilent EEsof EDA Page 42 Agilent EEsof EDA Overview July 2009