ADVANCED ELECTRONIC SOLUTIONS AVIATION SERVICES COMMUNICATIONS AND CONNECTIVITY MISSION SYSTEMS

Similar documents
Advanced Computing, Memory and Networking Solutions for Space

GR712RC A MULTI-PROCESSOR DEVICE WITH SPACEWIRE INTERFACES

LEON4: Fourth Generation of the LEON Processor

Processor and Peripheral IP Cores for Microcontrollers in Embedded Space Applications

APPENDIX Summary of Benchmarks

Migrating from the UT699 to the UT699E

LEON3-Fault Tolerant Design Against Radiation Effects ASIC

COMPARISON BETWEEN GR740, LEON4-N2X AND NGMP

Which is the best? Measuring & Improving Performance (if planes were computers...) An architecture example

GR740 Technical Note on Benchmarking and Validation

Mixed-Signal. From ICs to Systems. Mixed-Signal solutions from Aeroflex Colorado Springs. Standard products. Custom ASICs. Mixed-Signal modules

GR740 Technical Note on Benchmarking and Validation

Computer System. Performance

Rad-Hard Microcontroller For Space Applications

Next Generation Multi-Purpose Microprocessor

ESA Contract 18533/04/NL/JD

ATMEL ATF280E Rad Hard SRAM Based FPGA. Bernard BANCELIN ATMEL Nantes SAS, Aerospace Business Unit

LEON- PCI- UMC Development Board

CS61C : Machine Structures

ATMEL SPACEWIRE PRODUCTS FAMILY

Microarchitecture Overview. Performance

Advanced Concepts and Components for adaptive Avionics

Microarchitecture Overview. Performance

Performance, Cost and Amdahl s s Law. Arquitectura de Computadoras

EMC2. Prototyping and Benchmarking of PikeOS-based and XTRATUM-based systems on LEON4x4

DEVELOPING RTEMS SMP FOR LEON3/LEON4 MULTI-PROCESSOR DEVICES. Flight Software Workshop /12/2013

Multi-DSP/Micro-Processor Architecture (MDPA)

Introduction to LEON3, GRLIB

SoC Platforms and CPU Cores

SCS750. Super Computer for Space. Overview of Specifications

SINGLE BOARD COMPUTER FOR SPACE

Impact of Cache Coherence Protocols on the Processing of Network Traffic

16th Microelectronics Workshop Oct 22-24, 2003 (MEWS-16) Tsukuba Space Center JAXA

PowerPC- based Processor Modules for Space Applications

GR740 Processor development

Technical Note on NGMP Verification. Next Generation Multipurpose Microprocessor. Contract: 22279/09/NL/JK

V8uC: Sparc V8 micro-controller derived from LEON2-FT

Page 1 SPACEWIRE SEMINAR 4/5 NOVEMBER 2003 JF COLDEFY / C HONVAULT

Field Programmable Gate Array (FPGA) Devices

High temperature / radiation hardened capable ARM Cortex -M0 microcontrollers

Zynq-7000 All Programmable SoC Product Overview

RISECREEK: From RISC-V Spec to 22FFL Silicon

SEE Tolerant Self-Calibrating Simple Fractional-N PLL

Koji Inoue Department of Informatics, Kyushu University Japan Science and Technology Agency

Current status of SOI / MPU and ASIC development for space

MultiChipSat: an Innovative Spacecraft Bus Architecture. Alvar Saenz-Otero

15-740/ Computer Architecture Lecture 10: Runahead and MLP. Prof. Onur Mutlu Carnegie Mellon University

Design of Next Generation CPU Card for State of the Art Satellite Control Application

Computer Science 246. Computer Architecture

Microelectronics Presentation Days March 2010

LEON 3FT Processor Based Design for Spacecraft Applications - Frequency Based Performance Analysis

Smallest RISC-V Device for Next-Generation Edge Computing

ProASIC3/E SSO and Pin Placement Guidelines

Aeroflex Colorado Springs RadHard Eclipse FPGA Frequently Asked Questions

Executive Summary. Functional and Performance Validation of the 80S32 µc. Deliverable D5.2 - Report Workpackage 5 Evaluation Kit

RAD6000 Space Computers

Executive Summary Next Generation Microprocessor (NGMP) Engineering Models Product code: GR740

The CoreConnect Bus Architecture

MIL-STD-1553 (T4240/T4160/T4080) 12/8/4 2 PMC/XMC 2.0 WWDT, ETR, RTC, 4 GB DDR3

David Merodio Codinachs Filomena Decuzzi (Until Dec 2010), Javier Galindo Guarch TEC EDM

ECE 471 Embedded Systems Lecture 2

IBM "Broadway" 512Mb GDDR3 Qimonda

AT697E LEON2-FT Final Presentation

OPERATIONAL UP TO. 300 c. Microcontrollers Memories Logic

Cache Optimization by Fully-Replacement Policy

8. Migrating Stratix II Device Resources to HardCopy II Devices

New STM32 F7 Series. World s 1 st to market, ARM Cortex -M7 based 32-bit MCU

COL862 - Low Power Computing

A Closer Look at the Epiphany IV 28nm 64 core Coprocessor. Andreas Olofsson PEGPUM 2013

Serializer Deserializer POSSIBILITIES OF COMMUNICATION. MADE EASY. For extremely high communications reliability in radiation environments

Accurate Model for Application Failure due to Transient Faults in Cache

A 45nm 1.3GHz 16.7 Double-Precision GFLOPS/W RISC-V Processor with Vector Accelerators"

FABRICATION TECHNOLOGIES

Development Status for JAXA Critical Parts, 2008

FPGA Programming Technology

Aries: Transparent Execution of PA-RISC/HP-UX Applications on IPF/HP-UX

Design Trade-off Between Performance and Fault-Tolerance of Space Onboard Computers

DE2 Board & Quartus II Software

ASICs Digital and Mixed-Signal

VORAGO TECHNOLOGIES. Radiation-Hardened Solutions for CubeSats Ross Bannatyne, VORAGO Technologies

Evaluation of Soft-Core Processors on a Xilinx Virtex-5 Field Programmable Gate Array

UT8MR8M8-EVB 64Megabit Non- Volatile MRAM Evaluation Board User Manual July

ATF280E A Rad-Hard reprogrammable FPGA

Performance Characterization of SPEC CPU Benchmarks on Intel's Core Microarchitecture based processor

Multi-DSP/Micro-Processor Architecture (MDPA) Paul Rastetter Astrium GmbH

Research Challenges for FPGAs

VORAGO TECHNOLOGIES. Solutions for Selective Radiation-Hardened Components in CubeSats Ross Bannatyne, VORAGO Technologies

1.6 Computer Performance

Techniques for Optimizing Performance and Energy Consumption: Results of a Case Study on an ARM9 Platform

Clearspeed Embedded Apps and Architecture for Space

1. Microprocessor Architectures. 1.1 Intel 1.2 Motorola

CNES requirements w.r.t. Next Generation General Purpose Microprocessor

Actel s SX Family of FPGAs: A New Architecture for High-Performance Designs

Contents of this presentation: Some words about the ARM company

VORAGO TECHNOLOGIES. 6 th Interplanetary CubeSat Workshop Cambridge, May, 2017

eip-24/100 Embedded TCP/IP 10/100-BaseT Network Module Features Description Applications

ESA-CNES Deep Sub-Micron program ST 65nm. Laurent Dugoujon Remy Chevallier STMicroelectronics Grenoble, France.

FPGAs APPLICATIONS. 2012, Sept Copyright Atmel Corporation

The industrial technology is rapidly moving towards ARM based solutions. Keeping this in mind, we are providing a Embedded ARM Training Suite.

Simplify System Complexity

Transcription:

The most important thing we build is trust ADVANCED ELECTRONIC SOLUTIONS AVIATION SERVICES COMMUNICATIONS AND CONNECTIVITY MISSION SYSTEMS UT840 LEON Quad Core First Silicon Results Cobham Semiconductor Solutions Presented at Aerospace Corporation MRQW January 2015 Presenter:Rob Ciccariello

Thank You to our sponsors and supporters 1

Introduction Cobham Semiconductor Solutions (Cobham), formerly Aeroflex Microelectronics HiRel developed the UT840 quad core processor as a proof of concept of multiple new technologies: Gaisler LEON 4FT SOC IP IBM 9SF 90nm Process Technology Cobham UT90nHBD Library and ASIC Design Flow Flip Chip Package Technology for Space Applications Cobham has completed electrical characterization focusing on benchmark tests Data shows that all new technology implementations were successful, and that the UT840 meets performance goals 2

Background: Comparison UT840 is the third generation fault tolerant LEON processor from Cobham Semiconductor Solutions UT840 represents a significant improvement in performance and capability over previous designs LEON Family Key Feature Comparison UT699 (LEON 3FT) UT700 (LEON 3FT) UT840 (LEON 4FT) IEEE-1754 SPARC Compliant Cores 1 1 4 Process Technology 250nm TSMC 130nm TSMC 90nm IBM Operating Voltage 2.5/3.3 1.2/3.3 1.0/2.5 L1 Cache (Data/Instruction) kb 8/8 16/16 16/16/ per core L2 Cache (kb) NA NA 256 IEEE 754 FPU 1 1 1/core Max clock Frequency (MHz) 66 166 266 Supported Interfaces uart, 10/100 Ethernet, CAN, PCI, SpW uart, SPI, 10/100 Ethernet, CAN, PCI, SpW, 1553 uart, SPI, 10/100/1000 Ethernet, CAN, PCI, SpW, 1553 Package Technology 1mil Al Wire bond 1mil Al Wire bond Flip Chip 3

Background: Block Diagram Seven stage pipelined monolithic, high-performance, fault-tolerant SPARC TM V8/LEON 4FT Quad Core Processor 256KB L2 Cache SSRAM Support 1000 Mbit/s Ethernet 1553 Interface 4

Background: RadHard Design UT840 designed using the UT90nHB ASIC RadHard flow 1:Library Characterization Prompt Dose\SEL TID Requirement FF SEU FF SET SRAM Reset SET Clock SET PLL Total Recoverable Error Rate (Error/device-day) 7.0E-04 3.2E-05 3.1E-05 1.9E-05 1.9E-07 3.4E-07 1.6E-05 9.8E-05 Data Integrity Error Rate (Error/device-day) 0.25 9.6E-05 9.2E-05 1.7E-04 1.9E-07 3.4E-07 1.6E-05 3.7E-04 2: UT840 Chip Level Analysis Adjust Drive strengths SEE\SET filter additions Clock\Reset Tree Hardening SRAM Bits 4,598,272 Control Data System Derating* Utilization Factor** SRAM 10% 90% 20% 100% PLL's 3 Logic 25% 75% 20% 100% Latches & FF's 155,045 DICE FF's 126,884 DICE Latches 28,161 MBIST FF's - Clock RE Derating DICE FF's or Latches w/o Data Filter 41,100 Clock Frequency (MHz) Control Derating System Derating Gates 1,157,450 266 25% 50% Gates/FF 7.47 * System Derating accounts for bits that are not accessed Reset SET Rate 1.93E-07 after upset or do not propagate to a detection point. Clock SET Rate 3.44E-07 ** In this case the utilization factor is 100% Composite SRAM Bit Error Rate 2.06E-10 Raw SRAM Bit Error Rate 1.84E-06 FF SET Bit Error Rate (44ps) 1.48E-08 Intel estimate 10% FF SET Bit Error Rate (280ps) 5.83E-14 IBM Server Estimate 40% FF SEU Bit Error Rate 4.56E-09 SDC estimate 50% 5

Background: Device Statistics Die Size: 135 mm 2 (11.6 x 11.6) Macros: 220 placements Package pins : 445 Signals; 229 Pwr/Gnd; 55 spare (2083 die bumps) Gate Count: 4.4M logic gates, 5Mbit Memory (~20M trans) SysClk : 300MHz (Nom) 6

Single Core Comparison Dhrystone benchmark was run at maximum frequency on single core and compared to maximum frequency results from UT699 and UT700 UT840 order of magnitude improvement in W/MHz over UT699 Indicates process technology impact UT840 max frequency exceeded simulation (300 vs. 266 MHz) Performed using BCC, with UT699 @ 100MHz, UT700 @ 220MHz, and UT840 @ 300MHz. All at 25ºC. Unused cores clock gated. 7

Power Tests Custom tests were run to gauge UT840 power consumption with multiple cores active. ~150mA/core at 100MHz ~400mA/core at 275MHz Static Current ~250mA Performed using Aeroflex developed CPU gate test. During this test all interfaces except the ETH0 are clock gated. Core at 1.0V, 25ºC. 8

Quad Core Efficiency Dhrystone benchmark run with 1 to 4 cores enabled, using LINUX operating system at 250MHz, 25ºC. Multicore efficiency ~85% with 4 CPUs active. Linux Operating System, using L2 cache only. No external SDRAM. 9

SPEC CPU2000 Benchmarks A sample of Standard Performance Evaluation Corporation (SPEC) CPU2000 benchmarks were run to evaluate integer and floating point performance across multiple applications Name 175.vpr 176.gcc 186.crafty 197.parser 252.eon 255.vortex Integer Benchmarks Description FPGA Circuit Placement and Routing C Programming Language Compiler Game Playing: Chess Word Processing (syntatic analysis) Computer Visualization Object-oriented Database Floating Point Benchmarks Name Description 172.mgrid Multi-grid Solver: 3D Potential Field 177.mesa 3-D graphics library 179.art Image Recognition 183.equake Seismic Wave Propagation Simulation 187.facerec Image Processing: Face Recognition 188.ammp Computational Chemistry 189.lucas Number Theory / Primality Testing 200.sixtrack Nuclear Physics Accelerator Design For multi-core operations, each core ran its own individual copy of the benchmark 10

SPEC CPU2000 Integer Benchmarks Testing performed with 100MHz system clock and 50 MHz memory clock at nominal conditions Reduced efficiency compared to Dhrystone testing expected due to increased IO and memory intensity of CPU2000 programs 11

SPEC CPU2000 Floating Point Benchmarks Testing performed with 100MHz system clock and 50 MHz memory clock at nominal conditions Extremely (>90% four CPUs) high efficiency on some benchmarks driven by FPU/core architecture 12

Voltage Temperature Dependence UT840 performance strongly affected by core voltage and operating temperature. 1.1V increased max frequency 27% over nominal at 25ºC. 125ºC overwhelmed this improvement at 1.1V. 13

Summary A next generation LEON 4FT processor has been developed and characterized UT840 Quad Core LEON 4FT is functional Device meets 300MHz clock frequency and 2.2W at nominal conditions Multicore efficiency is ~85% when all cores are active for Dhrystone bench mark, and has demonstrated over 90% efficiency for some floating point bench marks Thank You! 14