Scaling the Compute and High Speed Networking Needs of the Data Center with Silicon Photonics ECOC 2017 September 19, 2017 Robert Blum Director, Strategic Marketing and Business Development 1
Data Center Traffic Is doubling every 12 months Source: Estimates based on Facebook and Google publications 2
Emergence of Hyper Scale Data Centers Data center networks are struggling to keep up with exponential data growth Google Data Center Facebook Data Center Fort Worth, Texas Facebook Data Center Network Design 5 ZB >$1B 45%+ Worldwide Annual Data Center Traffic (~5X global internet traffic) >200K Servers 10K+ switches Optical Connectivity as % of Networking Spend Other names and brands may be claimed as the property of others Source: Estimates from Facebook, Google, Cisco publications, and Intel network model 3
Data center connectivity TAM Data Center 100G+ TAM $4.6B Between DC $2.5B Across DC Data Center total spend on 100G and 400G interconnects $0.7B Across Row Connected world, machine-tomachine traffic, data analytics & machine learning driving exponential data growth In Rack 2016 2018 2020 Continual innovation needed to support data growth Source: Intel 2016 Market Model based in part on Crehan and Dell Oro reports 4
Silicon Photonics FOR 100G DATA CENTER Upgrades Inter Data Center 10km-metro Spine-Core 500m-2km Leaf-Spine 300m-2km DEPLOYED TODAY 10G/40G/100G DWDM 40G SMF 40G MMF or SMF NEW DEPLOYMENTS 100/200/400G DWDM 100G SMF TOR-Leaf 100m-500m Server-Top of Rack (TOR) 1m-30m 40G MMF or SMF 10G Cu or AOC 25G Cu or AOC MMF = Multi mode fiber; SMF = Single mode fiber; AOC = active optical cable DWDM = Dense Wavelength Division Multiplexing 5
Intel Silicon Photonics Product Overview 100G PSM4 QSFP Up to 2 km reach on parallel single mode fiber Fully MSA compliant In volume production 100G CWDM4 QSFP 500m, 2 km and 10km reach on duplex single mode fiber Fully MSA compliant In volume production NOW 4 fibers for 100G Single fiber for 100G On-die hybrid lasers Single die CWDM4 transmitter
HYBRID SILICON LASER FABRICATION Silicon (device) wafer Indium phosphide die Wafer level bonding Plasma activation and bonding process: InP die are bonded & transferred in parallel to device wafer InP substrate removal: Only active epi layers remain on device wafer InP Laser fabrication through wafer level processing Silicon 7
HYBRID LASER: BENEFITS OF WAFER SCALE PROCESSING Lithographically defined laser No critical alignment steps Low coupling loss CMOS process Integratable with other silicon photonic components Bonded InP bulk EPI Large arrays of lasers w/ high density Scalable to multiple wavelengths Mach-Zehnder modulator Single die CWDM4 transmitter 8
4.8T Switch demo Cisco NCS 5502-SE Intel Silicon Photonics PSM4 and CWMD4 for 500m, 2km & 10km reach Other names and brands may be claimed as the property of others 9
Switch Si Core Capacity (Tbps) Ethernet Switch Bandwidth Transitions 25.6 Possible optics integration 12.8 256x 50G SERDES 6.4 256x 25G SERDES 3.2 128x 25G SERDES 2016 2017 2018 2019 2020 Projections based on vendor disclosures, public announcements, and Intel estimates 10
BEYOND 100G - NEXT GENERATION INTERFACES for 400G+ QSFP-DD FOUNDERS/PROMOTERS QSFP-DD Same faceplate density as QSFP (32/36 ports per 1RU) but with eight lane electrical interface and improved ability to dissipate power http://www.qsfp-dd.com/ http://osfpmsa.org/ COBO Consortium for On-Board Optics Developing specifications for interchangeable and interoperable optical modules that can be mounted onto printed circuit boards http://cobo.azurewebsites.net/ FOUNDING MEMBERS Intel Optical Engine QSFP-DD image from: http://www.qsfp-dd.com/. Intel Optical Engine photo is for representative purposes only. Other names and brands may be claimed as the property of others 11
400G CWDM8 Optical PMD Block diagram QSFP-DD/OSFP/OBO module Switch ASIC 400GAUI-8 Interface Tx1 Tx2 Tx3 Tx4 Tx5 Tx6 Tx7 Tx8 Rx8 Rx7 Rx6 Rx5 Rx4 Rx3 Rx2 Rx1 8x50G PAM4 to 8x50G NRZ CDR Optical transmitter 1 Optical transmitter 8 Optical receiver 8 Optical receiver 1 8:1 MUX 1:8 DEMUX l 1 8 l 1 8 Duplex LC connectors FOUNDING MEMBERS 8x50G NRZ optical transmission on CWDM grid Standard 8x50G PAM4 electrical interface 2km and 10km over standard single mode fiber https://www.cwdm8-msa.org/ Other names and brands may be claimed as the property of others 12
Power (mw) Pout (db) Demonstration of 8 lasers on a single die -10-20 -30-40 -50-60 -70 1260 1280 1300 1320 1340 1360 1380 1400 1420 Wavelength (nm) 25 20 15 80C output power C1 1291nm C3 1331nm C5 1371nm C7 1411nm 10 Possible 400G implementation Multicolor CWDM transmitter using 8 wavelengths Uniform performance from 1270nm to 1410nm Wafer bonding enables different lasers on the same chip 5 0 0 20 40 60 80 100 120 Current (ma) Engineering data only. See relevant product data sheet for complete performance specifications 13
Voltage (V) Output Power (mw) HYBRID LASER: Performance across temperature 1310nm 20C 80C 90C 100C 2.5 2.3 2.1 1.9 1.7 1.5 1.3 1.1 0.9 0.7 20C 150C 0 20 40 60 80 100 120 140 160 180 200 25 20 15 10 110C 120C 130C Current (ma) Excellent electro-optic performance of Intel III-V/Si wafer bonded hybrid laser Laser emission up to 150C 10mW at 80C for 60mA (100G applications) 25mW at 80C for 100mA (400G applications) Operating voltage less than 2Volts 5 0 0 20 40 60 80 100 120 140 160 180 Drive Current (ma) 140C 150C Engineering data only. See relevant product data sheet for complete performance specifications 14
10mW Ibias Change (%) Reliability of HYBRID III-V/Si wafer bonded laser 25 III-V/Si Hybrid Laser 80C, 150mA 30 parts 20 EOL limit 15 10 5 0-5 -10-15 -20 EOL limit -25 0 2000 4000 6000 8000 10000 12000 14000 Aging time (hrs) 15,000 hours at 80C and 2x typical operating current Excellent long-term stability Shows that III-V/Si hybrid laser can meet stringent reliability requirements See product data sheet for complete performance specifications 15
Examples of Disaggregation of resources High bandwidth low latency optical connectivity is key to enable resource disaggregation Source: M. Kumar, M. Nachimuthu, Intel, Next Generation Rack Scale Design, IDF 2016 Source: U. Hölzle, Ubiquitous cloud requires a revolution in optics, OFC 2017 plenary https://www.youtube.com/watch?v=n9zeigyvj-a Other names and brands may be claimed as the property of others 16
Possible network architecture evolution TODAY FUTURE Core Network / Inter Data Center Core Network / Inter Data Center Super Spine/Core Spine Leaf ToR Servers 17
Future of optical connectivity in Data centers form factor and Bandwidth evolution 2016/2017 100G MSA Pluggable 400G MSA Pluggable 2018/2019 400/800G embedded 2020+ High density integrated Enabling transition to 100G switch-to-switch connectivity with 25G I/O Supporting next-generation switches 12.8Tb/s and 50G I/O Embedded optics for density, signal integrity, and power Available/announced switch ASICs Address electrical I/O constraints Highest density Lowest system power 3.2/6.4 Tb/s 6.5Tb/s 12.8Tb/s 12.8Tb/s or 25.6Tb/s QSFP-DD image from: http://www.qsfp-dd.com. Intel Optical engine photo is for representative purposes only. Other names and brands may be claimed as the property of others 18
Thank you! Intel.com/siliconphotonics 19