SMP3 Trisil for telecom equipment protection Features Bidirectional crowbar protection Voltage range from 62 V to 27 V Low capacitance from 1 pf to 2 pf typ.@ 5 V Low leakage current: I R = 2 µa max. Holding current: I H = 15 ma min. Repetitive peak pulse current: I PP = 3 A (1/ µs) Benefits Trisils are not subject to ageing and provide a fail safe mode in short circuit for a better protection. This device can be used to help equipment meet various standards such as UL195, IEC95 / CSA C22.2, UL1459 and FCC part 68. Trisils have UL94 V approved resin. SMA package is JEDEC registered (DO-214AC). Trisils are UL497B approved (file: E136224). Figure 1. SMA (JEDEC DO-214AC) Device configuration Applications Telecommunication equipment such as: Analog and digital line cards (xdsl, T1/E1, ISDN...). Terminals (phone, fax, modem...) and central office equipment. Description The SMP3 series has been designed to protect telecommunication equipment against lightning and transient induced by AC power lines. The package / die size ratio has been optimized by using the SMA package. TM: Trisil is a trademark of STMicroelectronics. July 21 Doc ID 563 Rev 7 1/9 www.st.com 9
Characteristics SMP3 1 Characteristics Table 1. Compliant with the following standards STANDARD Peak surge voltage (V) Waveform voltage Required peak current (A) Current waveform Minimum serial resistor to meet standard (Ω) GR-189 Core First level GR-189 Core Second level GR-189 Core Intra-building ITU-T-K2/K21 ITU-T-K2 (IEC6-4-2) VDE433 VDE878 IEC6-4-5 FCC Part 68, lightning surge type A FCC Part 68, lightning surge type B 25 2/1 µs 1/ µs 5 2/1 µs 1/ µs 5 2/1 µs 5 2/1 µs 4 15 2/1 µs 2/1 µs 6 15 8 15 4 2 4 2 4 4 15 8 1/7 µs 1/6 ns 1/7 µs 1.2/5 µs 1/7 µs 1.2/5 µs 1/16 µs 1/56 µs 15 37.5 5/31 µs ESD contact discharge ESD air discharge 5 5 2 5/31 µs 1/2 µs 5/31 µs 8/2 µs 1/16 µs 1/56 µs 9/72 µs 25 5/32 µs 2 24 11 6 1 18 6 18 26 15 2/9 Doc ID 563 Rev 7
SMP3 Characteristics Table 2. Absolute ratings (T amb = 25 C) Symbol Parameter Value Unit I PP Repetitive peak pulse current 1/ µs 8/2 µs 1/56 µs 5/31 µs 1/16 µs 1/2 µs 2/1 µs I FS Fail-safe mode : maximum current (1) 8/2 µs 2.5 ka I TSM I²t Non repetitive surge peak on-state current (sinusoidal) I²t value for using t =.2 s t = 1 s t = 2 s t = 15 mn t = 16.6 ms t = 2 ms 3 7 35 4 45 7 14 1.5 9 3 T stg Storage temperature range -55 to + 15 C Tj Maximum junction temperature 15 C T L Maximum lead temperature for soldering during 1 s. 26 C 1. In fail safe mode, the device acts as a short circuit. Table 3. Thermal resistances Symbol Parameter Value Unit R th(j-a) Junction to ambient (with recommended footprint) 12 C/W R th(j-l) Junction to leads 3 C/W 5.7 4.9 A A A²s Table 4. Symbol V RM V BR V BO I RM I PP I BO I H V R I R C Electrical characteristics - definitions (T amb = 25 C) Parameter Stand-off voltage Breakdown voltage Breakover voltage Leakage current Peak pulse current Breakover current Holding current Continuous reverse voltage Leakage current at V R Capacitance Doc ID 563 Rev 7 3/9
Characteristics SMP3 Table 5. Types SMP3-62 Electrical characteristics - values (T amb = 25 C) I RM @ V RM I R (1) @ V R Dynamic V BO Static V BO @ I BO I H C (2) C (3) max. max. max. max. max. min. typ. typ. µa V µa V V V ma ma pf pf 56 62 85 82 2 4 SMP3-68 61 68 93 9 2 4 SMP3-9 135 133 16 35 SMP3-12 18 12 16 16 16 3 SMP3-13 117 13 173 173 14 3 2 5 8 15 SMP3-18 162 18 235 24 12 25 SMP3-2 18 2 262 267 12 25 SMP3-22 198 22 285 293 1 2 SMP3-24 216 24 3 32 1 2 SMP3-27 243 27 35 36 1 2 1. I R measured at V R guarantee V BR min V R 2. V R = 5 V bias, V RMS = 1 V, F = 1 MHz 3. V R = 2 V bias, V RMS = 1 V, F = 1 MHz Figure 2. Pulse waveform Figure 3. Non repetitive surge peak on-state current versus overload duration 1 % I PP Repetitive peak pulse current t r = rise time (µs) t p = pulse duration time (µs) 25 2 15 I TSM(A) F=5Hz 5 1 5 t r t p t t(s) 1E-2 1E-1 1E+ 1E+1 1E+2 1E+3 4/9 Doc ID 563 Rev 7
SMP3 Characteristics Figure 4. 5 2 1 5 I (A) T On-state voltage versus on-state current (typical values) Tj=25 C 2 V T(V) 1 1 2 3 4 5 6 7 8 9 1 Figure 6. 1.1 Relative variation of breakover voltage versus junction temperature V [T ] / V [T =25 C] BO j BO j Figure 5. 2. 1.8 1.6 1.4 1.2 1..8.6.4 I [T ] / I [T =25 C] H j H j Relative variation of holding current versus junction temperature.2. T j( C) -4-2 2 4 6 8 12 Figure 7. 2 Relative variation of leakage current versus reverse voltage applied (typical values) I [T ] / I [T =25 C] RM j RM j V R=VRM 1.5 1. 27 V.95 62 V.9 T j( C) -4-2 2 4 6 8 1 T j( C) 1 25 5 75 125 Figure 8. 1E+2 Z th(j-a) ( C/W) Variation of thermal impedance junction to ambient versus pulse duration Printed circuit board FR4, copper thickness = 35 µm, recommended pad layout Figure 9. 2.5 2. C[V R] / C[V R=5V] Relative variation of junction capacitance versus reverse voltage applied (typical values) Tj=25 C F=1MHz VRMS=1V 1E+1 1.5 1E+ t p(s) 1E-1 1E-3 1E-2 1E-1 1E+ 1E+1 1E+2 5E+2 1..5 V R(V). 1 2 5 1 2 5 3 Doc ID 563 Rev 7 5/9
Ordering information scheme SMP3 2 Ordering information scheme Figure 1. Ordering information scheme SMP 3 - xxx Trisil surface mount Repetitive peak pulse current 3 = 3 A Voltage = V 6/9 Doc ID 563 Rev 7
SMP3 Package mechanical data 3 Package mechanical data Epoxy meets UL94, V Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. Table 6. SMA dimensions E1 Ref. Dimensions Millimeters Inches Min. Max. Min. Max. D A1 1.9 2.45.75.94 A2.5.2.2.8 b 1.25 1.65.49.65 E c.15.4.6.16 A1 D 2.25 2.9.89.114 C L A2 b E 4.8 5.35.189.211 E1 3.95 4.6.156.181 L.75 1.5.3.59 Figure 11. Footprint (dimensions in mm) 1.4 2.63 1.4 (.55) (.13) (.55) 1.64 (.64) 5.43 (.214) Doc ID 563 Rev 7 7/9
Ordering information SMP3 4 Ordering information Table 7. Ordering information Order code Marking Package Weight Base qty Delivery mode SMP3-62 SMP3-68 SMP3- SMP3-12 SMP3-13 SMP3-18 SMP3-2 SMP3-22 SMP3-24 SMP3-27 QAA QAB QAC QAD QAE QAF QAG QAH QAI QAJ SMA.6 g 5 Tape and reel 5 Revision history Table 8. Document revision history Date Revision Changes November-22 4B Last update. 1-Nov-24 5 13-Dec-24 6 1-Jul-21 7 SMA package dimensions update. Reference A1 max. changed from 2.7mm (.16 inch) to 2.3mm (.8 inch). Figure 7 text legend corrected from... reverse voltage applied to... junction capacitance. Added ECOPACK statement. Updated trademark statement. Removed section on test circuits. 8/9 Doc ID 563 Rev 7
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