The Internet of Things - Opportunities for the Secondary Equipment Market Gareth Bignell Director, Front End Equipment Procurement, STMicroelectronics
Introduction What technologies are needed for the IOT? Which technology nodes are required? Which wafer sizes? What will be the role for Secondary Equipment Conclusions
IoT = New Things to Augment Life 3 Smart City Reduce traffic congestion Better use of resources Improve security Healthcare Empower patients Help physicians monitor and diagnose remotely Smart Car Reduce emissions Increase safety Save fuel Wellness Help to lead healthier lives Optimize sports performance Early warning of illness Smart Home Make entertainment more interactive and immersive Increase comfort Save energy Smart Industrial & Smart Services Productivity gains Efficiency, agility
The Business Opportunity 4 50 Billion Units Installed Base 2015 21 Billion 2020 45 Billion 40 30 Smart Things ( Nodes ) THING Sense Process 20 Connect 10 0 Hubs and Gateways Translate Power Source: ABI Research
Making Things Smarter Examples in wearables 5 It used to tell you the time Now it tells you what to do And how you are doing They used to keep your feet warm Now they help you keep you and your feet fit It used to remind you of someone close to your heart Now it reminds you to take care of your heart And exactly what you doing They used to help you see clearly Now they help you to see more
Evolution of the Trackers 6 Late 90 s 2009 2012 2014 2015 Self Contained Web connected Web/Smartphone connected Web/Smartphone connected Pedometer Simple tracker Smart Tracker Advanced tracker STEPS CALORIES STEPS CALORIES STEPS CALORIES STEPS CALORIES CALL NOTIF. HEART RATE + Fitness Watch POSITION DISTANCE MUSIC CONTROL DISTANCE DISTANCE DISTANCE DISTANCE EXERCISE TYPE? SLEEP QUALITY FLOORS CLIMBED SLEEP QUALITY FLOORS CLIMBED?
How do smart things link together? Smart Sensing Audio Display User interface Motion MEMS Environmental MEMS Amplifiers LED & OLED power mgnt Touch sensing Signal conditioning Bluetooth Low Energy NFC Connectivity MEMS Microphone Sub-GHz SPIRIT1 Secure NFC Processing unit Microcontrollers for mobility Power management Protections Protections & filtering Thin-film battery Battery management Energy harvesting DC/DC converters & LDOs
The Building Blocks 8 Sensors & Actuators Microcontrollers & NFC Motion Sensors Environmental Sensors MEMS microphones Low-power microcontrollers Secure microcontrollers EEPRO M Ranging & ambient light sensor FingerTip Touch Sensor MEMS mirrors Dynamic NFC tags EEPROM Power Management Connectivity, Audio and Interfaces AMOLED power supply Backlight driver Power conversion Audio processors Audio amplifiers Ultra-low power connectivity Wireless charging Energy harvesting Thin film batteries Analog ICs Protection & EMIfiltering devices
So what does the IOT mean for fab equipment? Leading edge or trailing edge? 300mm or 200mm? Economic realities Cost advantages of depreciated fab? Productivity advantage of newer fabs? Compatibility of 300mm for most advanced devices?
Example: Smart Street Lighting Remote activation and dimming control for energy saving Lamp failure monitoring 200mm dedicated MEMS fabs Smart Sensing Connected monitoring station for air quality, security and traffic Processing Motion MEMS Connectivity Acoustic MEMS Environmental sensors (Light, Temperature, Humidity, UV) STM32 32-bit MCU Energy management Digital power management Leading edge 300mm Wi-Fi module Bluetooth module STarGRID PLC Sub-GHz SPIRIT1 Energy harvesting ICs Power MOSFET Advanced and mature 200mm fabs Both 200 and 300mm
Wafer size evolution What do the market researchers say? The number of fabs running 200mm wafers will continue to be profitable for many more years and be used to fabricate numerous types of ICs including specialty memories, display drivers, microcontrollers, analog products, and MEMS-based devices. Devices like these are practical to make in fully depreciated 200mm fabs that were used to produce devices now made on 300mm wafers. - IC Insights
Are there tools available? How is the availability of high end, mature and trailing edge tools evolving? Can tools be found to support 200mm fabs Will tools soon become available to support higher end 300mm secondary equipment projects?
Evolution of WW fab capacity and used tools availability Market Research from Gartner MSI 3 500 Worldwide Year-End Fab Capacity by Linewidth (MSI*/Quarter) 3 500.0 3 000 3 000.0 2 500 New only 2 500.0 2 000 2 000.0 1 500 300mm Potential used 1 500.0 1 000 300mm Existing used 1 000.0 500 200mm used 500.0 0 1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 Note: Capacity shown is for the fourth quarter of each year. Source: Gartner (December 2014) 0.5 Micron 0.35 Micron 0.25 Micron 0.18 Micron 130 nm 90 nm 65 nm 45 nm 32 nm 22 nm 14 nm 10 nm Opportunity Opportunity 0.0 MSI*: Million square inches Mixed 200 & 300mm fabs for products on 90nm to 65nm (Source: Gartner Report) CY15 and beyond, majority of 300mm used tool opportunity between 65nm to 45nm
What can we conclude so far? The IOT requires a very diverse range of devices from leading edge to trailing edge The lifetime of older fabs will continue. Good match between 8inch mature fabs and the requirements of the main IOT building blocks Equipment for re-use available to meet the needs, but 300mm tools less easily available than 200mm 200mm availability very challenging in 2015 Proving the take up and re-use for IOT type projects Availability cycles, fab closures and fab upgrades Some tools, such as 248nm litho are always hard to find
The ideal Fab scenario (not leading edge) Mature fab with well trained competent workforce Re-use, re-cycle and re-purpose the existing toolset Add the missing tools from the secondary tool market Preferably second hand (economic advantage) Tools should be adaptable and flexible Install, start-up and qualify very quickly Consumer markets are often short term Products needed very fast Triggered by sports and news events, celebrity, films TV and social media Windows of opportunity arrive (and disappear!) quickly Toolset will have to be flexible for next generations and derivatives
Used Equipment Sources C O S T Source Refurbished 'As New' OEM supplied Turn Key solution Refurbisher/Broker As is Where is Broker with 3rd party Upgrade/modify/install As is Where is Install by Fab engineers Challenges Not low cost Lead times Equipment 'too good' Availability of donor tool Cost close to OEM? Donor tool quality can refurbisher source parts? Internal skill set Tool compatibility Number of failed parts unknown R I S K
Conclusions, How to succeed? The successful IDMs will be those who best manage: Quality, costs and speed to market for their IOT products Long term planning optimising existing fabs, re-purpose, re-use Additional equipment strategy based on pragmatic mix of new, refurbished and broker tools..in partnership with The successful secondary equipment suppliers, those who best manage: Core tool inventory Configuration flexibility Shortest leadtimes Win Win pricing proposals Installation support CE marking and software
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