CREATIVE CHIPS GmbH Facts 2014 CREATIVE CHIPS GmbH Im Bubenstueck 1 55411 Bingen at Rhine Germany Phone: +49 6721 / 98722 0 Fax: + 49 6721 / 98722 70 E-Mail: info@creativechips.com Internet: www.creativechips.com 1
Creative Chips GmbH Business model: Fabless Semiconductor Company - ASIC & ASSP Vendor Established July 1999 Locations: Bingen /Rhine Headquarter (CCB) Dresden - Design Center (DDC) ASIA Sales Office 40 Employees ( March 2014) Design Center Dresden Revenue > 14 Mio US$ managing board: CEO Dr. L. Porombka COO R. Obst profitable company for 10 subsequent years R&D capacity: 6.. 12 design projects simultaneously Installed test capacity > 50 million ICs per year more than 75 successful ASIC projects 28 active IC products in volume production for: automotive electronics industrial automation Headquarter Bingen consumer electronics 2
Business model Fabless Vendor External Workbench Waferfoundry Complete Supply Chain Management Production Data Test Vectors Assembly/Test House Customer* Test* * To be setup later Wafer Designcenter Dresden Design QA Specification Production Test Fabless Semiconductor Vendor QA Design 100% assembled & tested ICs Assembled ICs Communication CREATIVE CHIPS ASIA Asian Customer Customer 3
Mixed-Signal ASIC Design Bipolar/CMOS analog IC design RF design 3 GHz Analog amplifier, TIA, VCO, PLL Bandgap references AD/DA converters Analog & SC filters Embedded sensors hall, optical, temperature High voltage & smart power Design Expertise Automotive Compliant Design TS16949 certified automotive supplier EMC & ESD compliant designs in unprotected car environment device engineering and characterisation (FMEA, PPAP) 10 Mio. devices in field (automotive only) AEC Q100 qualification mandatory Functional savety (ISO26262) optional Logic Design RTL coding, synthesis and P&R (ASTRO) Embedded µc and memory VHDL/VERILOG Support FPGA / ASIC mapping Low power Low voltage Production and Test Final (FT) & wafer (CP) test inhouse Test program & hardware engineering Test logistic, handling and quality management JIT, Canban, consignment stock 4
Abstract of Supported Wafer Technologies Process Foundry Size/Type Core Supply I/O Supply HV Option Features CLN65GPP 65nm CMOS 1.0V 1.8 / 3.3V 1 P/9M, Logic (Reference Flow 7) CEN90FS 90nm CMOS 1.2V 3.3 / 2.5V 1 P/8M, Logic (Reference Flow 7) CV018GII 0.18 µm BCD 1.8V 3.3 / 5V 70V 1 P/6M, Logic (DC, ASTRO), Analog Lib XP/XH018 0.18 µm CMOS 1.8V 3.3 / 5V 45/60V 1 P/6M, Logic (DC, ASTRO), Analog Lib CL018G 0.18 µm CMOS 1.8V 3.3 / 5V 5V 1 P/5M, Logic (DC, ASTRO), Analog Lib MM25 0.25 µm CMOS 2.6V 3.3 / 5V 2 P/5M, Logic (DC, ASTRO), Analog Lib XH035 0.35 µm CMOS 3.3V/5V 3.3 / 5V 120V 2 P/4M, Logic (DC, ASTRO), Analog Lib C05/T05 0.5 µm CMOS 3.3V/5V 3.3 / 5V 2 P/3M, Logic (DC, ASTRO), Analog Lib XB06 0.6 µm BiCMOS 5V 5V 2 P/3M, Logic (DC, ASTRO), Analog Lib BCD40/700 0.8 µm BCD 5V 5V/12V 700V 2 P/2M, Analog Lib C08018 0.8 µm CMOS 5V 18V X 2 P/2M, Logic (DC, ASTRO), Analog Lib C025 1.5 µm Bipolar 30 V 40 V X Bipolar, 2M, Logic (IIL), Analog Lib 5
Test department 10.000 sqf Testfloor at Bingen (Headquarter) Capacity > 50 Mio. pcs/year 15 Handling systems (RASCO, Multitest,Microhandling NorthWave) 19 Tester (LTXCredence, Dr. Eschke, SZ, Verigy) 3 Tape & Reel-Systems (STI) 1 Waferprober (TSK 5-8 ) 6
Technologie (1) Industrial Automation 7
Technology (2) Sensors 8
Technologie (3) Automotive 9
Technologie (4) Consumer 10
Qualification / Quality assurance TS16949, ISO14001 and DIN EN ISO 9001:2008 certified Reliability testing according to AEC-Q100 EMC & EMS compliant design Meets automotive and industrial standards 11
Customer Benefit High professional ASIC-Know-How analogue / digital 100% ASIC-design success - shortest design times by close cooperation between customer and our ASIC-designer Independent choice of the best fitting semiconductor technologies project lifetime guarantee of used semiconductor technologies ZERO failure production policy Certified Automotive supplier (TS16949, ISO14001) first priority is customer satisfaction Complete ASIC-Service from development to production and delivery of high volumes in one hand 12