TEA10201V05A0 Specification Product Name Series Part No ESD Guard TM TEA Series (Thin Film Air Gap) TEA10201V05A0 Size EIA 0201
TEA10201V05A0 Engineering Specification 1. Scope This specification is applied to electrostatic discharge (ESD) protection. It is designed to protect the high-speed data lines against ESD transients. It has very low capacitance and fast turn on times makes it ideal for data and transmission lines with high data rates. For RoHS Compliance. Feature Protection against ESD voltages and currents (IEC61000-4-2 Level 4) Extremely quick response time (<1ns) present ideal ESD protection Extremely low capacitance (0.05pF typical) Bi-directional device SMD (Surface Mount Device) Zero signal distortion 2. Explanation of Part Number T E A 1 0 2 0 1 V 0 5 A 0 1 2 3 4 5 1:Thin Film ESD Protector 2:Single element 3:Chip size, EIA 0201 4:Max rated Voltage, VDC 5: A0 :Model Code TEA10201V05A0 Engineer Specification Version: A0 Page 1 of 9
3. Circuit symbol 4. Construction & Dimensions 4.1. Substrate : Ceramic (Alumina) 4.2. End termination: Ni/Sn 4.3. Construction & Dimension : W L H B Unit: mm L W H B 0.63±0.05 0.3±0.03 0.24±0.03 0.165±0.05 TEA10201V05A0 Engineer Specification Version: A0 Page 2 of 9
5. Performance Characteristics Symbol Unit Min. Typical Max. Rated voltage V DC V 5 Trigger voltage Vt V 300 Clamping voltage Vc V 20 Capacitance, @1MHz Cp pf 0.05 Response time ns 1 ESD voltage capability, Contact discharge mode ESD voltage capability, Air discharge mode kv 8 kv 15 ESD pulse withstand pulses 1,000 Vt measurement by using Transmission Line Pulse (TLP) Vc measurement by using Transmission Line Pulse (TLP) Cp Device capacitance measured with 1Vrms TEA10201V05A0 Engineer Specification Version: A0 Page 3 of 9
6. General specifications 6.1. Temperature Specifications Operating Temperature range : -55 to +125 Storage Temperature range : -55 to +125 6.2. Environmental Specifications Item Specifications Test condition Reference Thermal Shock I L 10 µa -40 to 85, 30 min. cycle, 5 cycles JIS C 0025 (1998)Test Na High Temperature load voltage I L 10 µa Rated voltage, 85, 1000 hrs MIL-STD-202G Method 108 Solder leach resistance I L 10 µa 260, 10s MIL-STD-202G Method 210F I L Leakage current at rated voltage, the maximum leakage current was measured after reliability test. TEA10201V05A0 Engineer Specification Version: A0 Page 4 of 9
7. Taping Package and Label Marking 7.1. Packaging method 7.1.1 Products shall be heat-sealed in the chip pocket, spacing pitch 2-mm of paper carrier tape with cover tape, and the carrier tape shall be reeled to the reel. 7.1.2 Tape material to be paper. Tape thickness to be 0.42 ± 0.03 mm. 7.1.3 Cover tape adhesion to be 40 ± 15 grams. 7.2. Carrier tape dimensions E F C L B A D W T 0201 A 8.00±0.30 B 3.50±0.05 C 1.75±0.10 D 2.00±0.05 E 4.00±0.10 F 1.50±0.10 L 0.69±0.03 W 0.39±0.03 T 0.42±0.03 TEA10201V05A0 Engineer Specification Version: A0 Page 5 of 9
7.3. Taping reel dimensions 7.4. Taping specifications There shall be the portion having no product in both the head and the end of taping, and there shall be the cover tape in the head of taping. 7.5. Label Marking The label specified as follows shall be put on the side of reel. (1) Part No. (2) Quantity (3) Lot No. * Part No. And Quantity shall be marked on outer packaging. 7.6. Quantity of products in the taping package (1) Standard quantity:15,000pcs/reel (2) Shipping quantity is a multiple of standard quantity. TEA10201V05A0 Engineer Specification Version: A0 Page 6 of 9
8. Precautions for Handling 8.1. Solder cream in reflow soldering Refer to the recommendable land pattern as printing mask pattern for solder cream. (1) Print solder in a thickness of 0.1 to 0.15 mm. A C B Unit : mm A 0.35±0.05 B 0.5±0.05 C 0.35±0.05 8.2. Precaution for handling of substrate Do not exceed to bend the board after soldering this product extremely. (reference examples) Mounting place must be as far as possible from the position, which is close to the break line of board, or on the line of large holes of board. Do not bend extremely the board, in mounting another components. If necessary, use back-up pin (support pin) to prevent from bending extremely. Do not break the board by hand. We recommend to use the machine or the jig to break it. TEA10201V05A0 Engineer Specification Version: A0 Page 7 of 9
8.3. Precaution for soldering Note that this product will be easily damaged by rapid heating, rapid cooling or local heating. Do not give heat shock over 100 C in the process of soldering. We recommend to take preheating and gradual cooling. 8.4. Recommendable reflow soldering Reference IPC-020c-5-1 Profile Feature Average Ramp Rate (Ts max to Tp) Preheat - Temperature Min (Ts min ) - Temperature Min (Ts max ) - Time(ts min to ts min ) Time maintained above: - Temperature (T L ) - Time (t L ) Pb free Assembly 3 /second max 150 200 60-180 seconds 217 60-150 seconds Peak Temperature (T p ) 260 +0/-5 Time within 5 of actual Peak Temperature (T p ) Ramp-Down Rate Time 25 to Peak Temperature 20-40 seconds 6 /second max. 8 minutes max TEA10201V05A0 Engineer Specification Version: A0 Page 8 of 9
8.5. Soldering gun procedure Note the follows, in case of using solder gun for replacement. (1) The tip temperature must be less than 280 C for the period within 3 seconds by using soldering gun under 30 W. (2) The soldering gun tip shall not touch this product directly. 8.6. Soldering volume Note that excess of soldering volume will easily get crack the body of this product. 8.7. Taping Package Storage Condition Storage Temperature: 5 to 40 Relative Humidity: < 65%RH Storage Time: 12 months max TEA10201V05A0 Engineer Specification Version: A0 Page 9 of 9