REPORT, SE16, EDV / EDV / EDV-00444, THERMAL, IN-HOUSE, , PASS

Transcription

1 REPORT, SE16, EDV / EDV / EDV-00444, THERMAL, IN-HOUSE, , PASS Documenting the evaluation of the: SE16 with new heat-sink & RAID cards EDV , EDV-00580, and EDV Document prepared for: Crystal Group Test date 10/14/13 REV. A C r y s t a l G r o u p I n c K a c e n a R d., H i a w a t h a, I A P h o n e : F a x : / 1 5 /

2 Contents Purpose... 3 Test Description... 3 System Configuration... 3 Test Results... 3 Pass/Fail Criteria... 5 Summary of Results... 5 Adaptec and LSI RAID Card Test Results... 6 Adaptec and LSI RAID Card Thermal Images... 7 : REPORT, SE16, EDV / EDV / EDV- 2 of 8

3 Crystal Group Engineering SE16 Thermal Testing Purpose This document has been created to provide an overview of the test results for the SE16 that Crystal Group completed Engineering hot thermal testing on. Test Description The test sample was placed in the Thermotron Industries Model S-16 (Serial # 698/15317RF). Supplementary equipment necessary to operate and/or monitor the test sample (e.g., computer monitor, keyboard, and mouse) was placed on a table near the test chamber and connected to the test sample. An Extech MN16A multi-meter was used to capture internal chassis temperature near the RAID card. Six tests were performed. LSI and Adaptec RAID cards were tested with and without following engineering hot thermal test procedures. Two overnight tests were performed (one with EDV and one with EDV-00444). The test sample was placed in the thermal chamber and the following tests were performed: Place EUT inside sealed box within thermal chamber. Soak EUT for 30 minutes at +55. Power on system then start Prime95, Furmark, Real Temp, Core Temp, Atto Disk Benchmark and HD Tune Pro Run tests for 30 minutes. Record all test tool report data. System Configuration CPU MODEL: MBS-00045, Intel Core i7-3612qe (Ivy Bridge) 2.1GHz GPU MODEL: N/A RAM SIZE/QTY: MEM Approved Memory 8GB/2 HARD DRIVE MODEL/SIZE: HDD Intel SSD 320 Series / 40GB Test Results Refer to Table 1 for detailed data. Operating EUT DID NOT experience obvious physical deformations (e.g., cracks, breaks, bent components, etc.) or operational issues observed during the performance of the Operating Temperature or upon the completion of the Operating Temperature Test. EUT DID experience obvious physical deformations (e.g., cracks, breaks, bent components, etc.) or operational issues observed during the performance of the Operating Temperature or upon the completion of the Operating Temperature Test. : REPORT, SE16, EDV / EDV / EDV- 3 of 8

4 NOTE: Non-Operating tests were not performed for the EUT. Non-Operating EUT DID NOT experience obvious physical deformations (e.g., cracks, breaks, bent components, etc.) prior to the performance of the Non-Operating Temperature or upon the completion of the Operating Temperature Test. EUT DID experience obvious physical deformations (e.g., cracks, breaks, bent components, etc.) prior to the performance of the Non-Operating Temperature or upon the completion of the Operating Temperature Test. Why did the system fail? What didn t work? N/A Pass Criteria is as follows: Unit performs without thermal throttling or degradation of performance due to temperature extremes. Video integrity maintained throughout testing profile. EUT remains fully operable throughout test profile. Failure Criteria is as follow: Unit does not perform without thermal throttling or degradation of performance due to temperature extremes. Video integrity is not maintained throughout testing profile. EUT does not remain fully operable throughout testing profile. : REPORT, SE16, EDV / EDV / EDV- 4 of 8

5 Pass/Fail Criteria Hot Thermal Test EUT remains operational after 1 hour total time in thermal chamber at +55. Summary of Results Procedure Requirement Result Hot Thermal Test Procedure Remain +55 after 1 hour total time in thermal chamber with stress test software running. Pass The EUT successfully passed the Pass/Fail Criteria for hot thermal testing. The EUT was tested using three different RAID cards: EDV (LSI), EDV (LSI) and EDV (Adaptec). EDV was tested with applied while EDV and EDV were tested with and without applied. Four data points were captured during tests. The data points included: Thermal chamber internal temperature, EUT internal chassis temperature, CPU maximum core temperature and CPU distance to TJMAX temperature. The Direct measurement of thermal chamber internal temperature was captured with a static thermocouple mounted inside the test chamber. Direct measurement of internal chassis temperature was captured with an Extech MN16A multi-meter thermocouple secured near the RAID card. CPU maximum core temperature and CPU distance to TJMAX temperatures were captured using Real Temp version See Table 1 on page 6 for details. Thermal images of the top and bottom chassis plates were captured for EDV and EDV using a Fluke Ti-10 thermal imaging camera. Table 2 on page 7 includes thermal images showing temperature differences between each card being tested. Thermal images contain three temperature readings; high, low, and where the imager cursor is pointed when the photo is taken. Keep in mind the imager retrieves temperature values based on the thermal snapshot at a given point in time. For example: In Figure 1 below, the hottest temperature captured in the image is 81.0, the coolest temperature captured in the image is 34.0 and the cursor point temperature captured in the image is By reviewing each RAID cards highest temperature in Table 2 on page 7, it is evident the Adaptec card operates several degrees cooler than the LSI card with and without applied. Figure 1: Thermal image temperature values : REPORT, SE16, EDV / EDV / EDV- 5 of 8

6 Adaptec and LSI RAID Card Test Results LSI with EDV LSI with EDV hr. 10 min. test 30 min. soak 30 min. test TJMax Max Core TJMax TJMax Max Core TJMax LSI w/o EDV min. soak 30 min. test TJMax Max Core TJMax Adaptec with EDV min. soak 30 min. test TJMax Max Core TJMax Adaptec w/o EDV Adaptec with EDV min. soak 30 min. test 14 hr. 22 min. test TJMax Max Core TJMax TJMax Max Core TJMax Table 1: Thermal test data results for LSI and Adaptec RAID card testing : REPORT, SE16, EDV / EDV / EDV- 6 of 8

7 Adaptec and LSI RAID Card Thermal Images EDV LSI RAID Card with Power Supply Side: Cursor temp (high temp 81.0) Lid and heat-sink mounting location: Cursor temp (high temp 80.0) EDV LSI RAID Card without Power Supply Side: Cursor Temp (high temp 80.0) Lid and heat-sink mounting location: Cursor Temp (high temp 79.0) EDV Adaptec RAID Card with Power Supply Side: Cursor Temp (high temp 78.0) Lid and heat-sink mounting location: Cursor Temp (high temp 78.0) EDV Adaptec RAID Card without Power Supply Side: Cursor Temp (high temp 72.0) Lid and heat-sink mounting location: Cursor Temp (high temp 70.0) Table 2: Images show the LSI and Adaptec RAID card thermal results with and without applied to the RAID cards. The chassis power supply side and chassis top lid including heat-sink mount location shown in all thermal images. : REPORT, SE16, EDV / EDV / EDV- 7 of 8

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