DDR4 3DS SDRAM RDIMM MTA72ASS8G72PSZ 64GB. Features. 64GB (x72, ECC, 3DS 2H Stack, 2 Package Ranks x 2 Logic Ranks) 288-Pin DDR4 RDIMM.

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1 DDR4 3D DRA RDI TA72A8G72PZ 64GB Features Features DDR4 functionality and operations supported as defined in the component data sheet 288-pin, registered dual in-line memory module (RDI) Fast data transfer rates: PC4-3200, PC4-2933, or PC GB (8 Gig x 72) V DD = 1.20V (NO) V PP = 2.5V (NO) V DDPD = 2.5V (NO) upports ECC error detection and correction Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals Low-power auto self refresh (LPAR) On-die V REFDQ generation and calibration Two package ranks x two logic ranks On-board I 2 C temperature sensor with integrated serial presence-detect (PD) EEPRO 16Gb, 3D 2-high die stack x4 package, aster/lave control logic. Each die with16 internal banks; 4 groups of 4 banks each Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (R) electable BC4 or BL8 on-the-fly (OTF) Gold edge contacts Halogen-free Fly-by topology Terminated control, command, and address bus Figure 1: 288-Pin RDI (O-309, R/C-B2) odule height: 31.25mm (1.23in) Options arking Operating temperature Commercial (0 C T OPER 95 C) None Package 288-pin DI (halogen-free) Z Frequency/CA latency CL = 26 (DDR4-3200) -32 CL = 24 (DDR4-2933) -29 CL = 22 (DDR4-2666) -26 Table 1: Key Timing Parameters peed Grade PC4- Data Rate (T/s) CL = t RCD (ns) t RP (ns) t RC (ns) 1 Products and specifications discussed herein are subject to change by icron without notice.

2 Features Table 2: Addressing Parameter Row address Column address Device bank group address Device bank address per group Device configuration Logic rank address Package rank address 64GB 128K A[16:0] 1K A[9:0] 4 BG[1:0] 4 BA[1:0] 16Gb (128 eg x 4 x 16 banks x2 ranks) 1 C0 2 C_n[1:0] Table 3: Part s and Timing Parameters 64GB odules Base device: T40A4G4, 1 16Gb DDR4 2H 3D / DRA DDR4 DRA Part 2 odule Density Configuration odule Bandwidth emory Clock/ Data Rate Clock Cycles (CL- t RCD- t RP) TA72A8G72PZ-32 64GB 8 Gig x GB/s 0.62ns/3200 T/s TA72A8G72PZ-29 64GB 8 Gig x GB/s 0.682ns/2933 T/s TA72A8G72PZ-26 64GB 8 Gig x GB/s 0.75ns/2666 T/s Notes: 1. The data sheet for the base device can be found at micron.com. 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Consult factory for current revision codes. Example: TA72A8G72PZ-32E1. 2

3 Important Notes and Warnings Important Notes and Warnings icron Technology, Inc. ("icron") reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions. This document supersedes and replaces all information supplied prior to the publication hereof. You may not rely on any information set forth in this document if you obtain the product described herein from any unauthorized distributor or other source not authorized by icron. Automotive Applications. Products are not designed or intended for use in automotive applications unless specifically designated by icron as automotive-grade by their respective data sheets. Distributor and customer/distributor shall assume the sole risk and liability for and shall indemnify and hold icron harmless against all claims, costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage resulting directly or indirectly from any use of nonautomotive-grade products in automotive applications. Customer/distributor shall ensure that the terms and conditions of sale between customer/distributor and any customer of distributor/customer (1) state that icron products are not designed or intended for use in automotive applications unless specifically designated by icron as automotive-grade by their respective data sheets and (2) require such customer of distributor/customer to indemnify and hold icron harmless against all claims, costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product liability, personal injury, death, or property damage resulting from any use of non-automotive-grade products in automotive applications. Critical Applications. Products are not authorized for use in applications in which failure of the icron component could result, directly or indirectly in death, personal injury, or severe property or environmental damage ("Critical Applications"). Customer must protect against death, personal injury, and severe property and environmental damage by incorporating safety design measures into customer's applications to ensure that failure of the icron component will not result in such harms. hould customer or distributor purchase, use, or sell any icron component for any critical application, customer and distributor shall indemnify and hold harmless icron and its subsidiaries, subcontractors, and affiliates and the directors, officers, and employees of each against all claims, costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of product liability, personal injury, or death arising in any way out of such critical application, whether or not icron or its subsidiaries, subcontractors, or affiliates were negligent in the design, manufacture, or warning of the icron product. Customer Responsibility. Customers are responsible for the design, manufacture, and operation of their systems, applications, and products using icron products. ALL EICONDUCTOR PRODUCT HAVE INHERENT FAIL- URE RATE AND LIITED UEFUL LIVE. IT I THE CUTOER' OLE REPONIBILITY TO DETERINE WHETHER THE ICRON PRODUCT I UITABLE AND FIT FOR THE CUTOER' YTE, APPLICATION, OR PRODUCT. Customers must ensure that adequate design, manufacturing, and operating safeguards are included in customer's applications and products to eliminate the risk that personal injury, death, or severe property or environmental damages will result from failure of any semiconductor component. Limited Warranty. In no event shall icron be liable for any indirect, incidental, punitive, special or consequential damages (including without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort, warranty, breach of contract or other legal theory, unless explicitly stated in a written agreement executed by icron's duly authorized representative. 3

4 Pin Assignments Pin Assignments The pin assignment table below is a comprehensive list of all possible pin assignments for DDR4 RDI modules. ee the Functional Block Diagram for pins specific to this module. Table 4: Pin Assignments 288-Pin DDR4 RDI Front 288-Pin DDR4 RDI Back Pin ymbol Pin ymbol Pin ymbol Pin ymbol Pin ymbol Pin ymbol Pin ymbol Pin ymbol 1 NC 37 V 73 V DD 109 V 145 NC 181 DQ V DD 253 DQ41 2 V 38 DQ24 74 CK0_t 110 DQ14_t/ TDQ14_t 3 DQ4 39 V 75 CK0_c 111 DQ14_c/ TDQ14_c 4 V 40 DQ12_t/ TDQ12_t 5 DQ0 41 DQ12_c/ TDQ12_c 146 V REFCA 182 V 218 CK1_t 254 V 147 V 183 DQ CK1_c 255 DQ5_c 76 V DD 112 V 148 DQ5 184 V 220 V DD 256 DQ5_t 77 V TT 113 DQ V 185 DQ3_c 221 V TT 257 V 6 V 42 V 78 EVENT_n 114 V 150 DQ1 186 DQ3_t 222 PARITY 258 DQ47 7 DQ9_t/ TDQ9_t 8 DQ09_c/ TDQ9_c 43 DQ30 79 A0 115 DQ V 187 V 223 V DD 259 V 44 V 80 V DD 116 V 152 DQ0_c 188 DQ BA1 260 DQ43 9 V 45 DQ26 81 BA0 117 DQ DQ0_t 189 V 225 A10/ AP 10 DQ6 46 V 82 RA_n/ A V 118 V 154 V 190 DQ V DD 262 DQ53 11 V 47 CB4 83 V DD 119 DQ DQ7 191 V 227 NC 263 V 12 DQ2 48 V 84 C0_n 120 V 156 V 192 CB5 228 WE_n/ 264 DQ49 A14 13 V 49 CB0 85 V DD 121 DQ15_t/ TDQ15_t 14 DQ12 50 V 86 CA_n/ A15 15 V 51 DQ17_t/ TDQ17_t 16 DQ8 52 DQ17_c/ TDQ17_c 17 V 53 V 89 C1_n/ NC 18 DQ10_t/ TDQ10_t 19 DQ10_c/ TDQ10_c 122 DQ15_c/ TDQ15_c 157 DQ3 193 V 229 V DD 265 V 158 V 194 CB1 230 NC 266 DQ6_c 87 ODT0 123 V 159 DQ V 231 V DD 267 DQ6_t 88 V DD 124 DQ V 196 DQ8_c 232 A V 125 V 161 DQ9 197 DQ8_t 233 V DD 269 DQ55 54 CB6 90 V DD 126 DQ V 198 V 234 A V 55 V 91 ODT1/ NC 127 V 163 DQ1_c 199 CB7 235 NC/ C2 271 DQ51 20 V 56 CB2 92 V DD 128 DQ DQ1_t 200 V 236 V DD 272 V 21 DQ14 57 V 93 C2_n/ 129 V 165 V 201 CB3 237 C3_n/ 273 DQ61 C0 C1, NC 22 V 58 REET_n 94 V 130 DQ DQ V 238 A2 274 V 23 DQ10 59 V DD 95 DQ V 167 V 203 CKE1/ 239 V 275 DQ57 NC 24 V 60 CKE0 96 V 132 DQ16_t/ TDQ16_t 168 DQ V DD 240 DQ V 4

5 Pin Assignments Table 4: Pin Assignments (Continued) 288-Pin DDR4 RDI Front 288-Pin DDR4 RDI Back Pin ymbol Pin ymbol Pin ymbol Pin ymbol Pin ymbol Pin ymbol Pin ymbol Pin ymbol 25 DQ20 61 V DD 97 DQ DQ16_c/ TDQ16_c 169 V 205 NC 241 V 277 DQ7_c 26 V 62 ACT_n 98 V 134 V 170 DQ V DD 242 DQ DQ7_t 27 DQ16 63 BG0 99 DQ13_t/ TDQ13_t 28 V 64 V DD 100 DQ13_c/ TDQ13_c 29 DQ11_t/ TDQ11_t 30 DQ11_c/ TDQ11_c 135 DQ V 207 BG1 243 V 279 V 136 V 172 DQ ALERT_n 244 DQ4_c 280 DQ63 65 A12/BC_n 101 V 137 DQ V 209 V DD 245 DQ4_t 281 V 66 A9 102 DQ V 174 DQ2_c 210 A V 282 DQ59 31 V 67 V DD 103 V 139 A0 175 DQ2_t 211 A7 247 DQ V 32 DQ22 68 A8 104 DQ A1 176 V 212 V DD 248 V 284 V DDPD 33 V 69 A6 105 V 141 CL 177 DQ A5 249 DQ DA 34 DQ18 70 V DD 106 DQ V PP 178 V 214 A4 250 V 286 V PP 35 V 71 A3 107 V 143 V PP 179 DQ V DD 251 DQ V PP 36 DQ28 72 A1 108 DQ NC 180 V 216 A2 252 V 288 V PP 5

6 Pin Descriptions Table 5: Pin Descriptions The pin description table below is a comprehensive list of all possible pins for DDR4 modules. All pins listed may not be supported on this module. ee Functional Block Diagram for pins specific to this module. ymbol Type Description Ax Input Address inputs: Provide the row address for ACTIVATE commands and the column address for READ/WRITE commands in order to select one location out of the memory array in the respective bank (A10/AP, A12/BC_n, WE_n/A14, CA_n/A15, and RA_n/A16 have additional functions; see individual entries in this table). The address inputs also provide the op-code during the ODE REGITER ET command. A17 is only defined for x4 DRA. A10/AP Input Auto precharge: A10 is sampled during READ and WRITE commands to determine whether an auto precharge should be performed on the accessed bank after a READ or WRITE operation (HIGH = auto precharge; LOW = no auto precharge). A10 is sampled during a PRECHARGE command to determine whether the precharge applies to one bank (A10 LOW) or all banks (A10 HIGH). If only one bank is to be precharged, the bank is selected by the bank group and bank addresses. A12/BC_n Input Burst chop: A12/BC_n is sampled during READ and WRITE commands to determine if burst chop (on-the-fly) will be performed (HIGH = no burst chop; LOW = burst chopped). ee Command Truth Table in the DDR4 component data sheet. ACT_n Input Command input: ACT_n defines the ACTIVATE command being entered along with C_n. The input into RA_n/A16, CA_n/A15, and WE_n/A14 are considered as row address A16, A15, and A14. ee Command Truth Table. BAx Input Bank address inputs: Define the bank (with a bank group) to which an ACTIVATE, READ, WRITE, or PRECHARGE command is being applied. Also determine which mode register is to be accessed during a ODE REGITER ET command. BGx Input Bank group address inputs: Define the bank group to which a REFREH, ACTIVATE, READ, WRITE, or PRECHARGE command is being applied. Also determine which mode register is to be accessed during a ODE REGITER ET command. BG[1:0] are used in the x4 and x8 configurations. x16-based DRA only has BG0. C0, C1, C2 (RDI/LRDI only) CKx_t CKx_c Input Input Pin Descriptions Chip ID: These inputs are used only when devices are stacked; that is, 2H, 4H, and 8H stacks for x4 and x8 configurations using through-silicon vias (TVs). These pins are not used in the x16 configuration. ome DDR4 modules support a traditional DDP package, which uses C1_n, CKE1, and ODT1 to control the second die. All other stack configurations, such as a 4H or 8H, are assumed to be single-load (master/slave) type configurations where C0, C1, and C2 are used as chip ID selects in conjunction with a single C_n, CKE, and ODT. Chip ID is considered part of the command code. Clock: Differential clock inputs. All address, command, and control input signals are sampled on the crossing of the positive edge of CK_t and the negative edge of CK_c. CKEx Input Clock enable: CKE HIGH activates and CKE LOW deactivates the internal clock signals, device input buffers, and output drivers. Taking CKE LOW provides PRECHARGE POWER-DOWN and ELF REFREH operations (all banks idle), or active power-down (row active in any bank). CKE is asynchronous for self refresh exit. After V REFCA has become stable during the power-on and initialization sequence, it must be maintained during all operations (including ELF REFREH). CKE must be maintained HIGH throughout read and write accesses. Input buffers (excluding CK_t, CK_c, ODT, REET_n, and CKE) are disabled during power-down. Input buffers (excluding CKE and REET_n) are disabled during self refresh. Cx_n Input Chip select: All commands are masked when C_n is registered HIGH. C_n provides external rank selection on systems with multiple ranks. C_n is considered part of the command code (C2_n and C3_n are not used on UDIs). 6

7 Pin Descriptions Table 5: Pin Descriptions (Continued) ymbol Type Description ODTx Input On-die termination: ODT (registered HIGH) enables termination resistance internal to the DDR4 DRA. When enabled, ODT (R TT ) is applied only to each DQ, DQ_t, DQ_c, D_n/ DBI_n/TDQ_t, and TDQ_c signal for x4 and x8 configurations (when the TDQ function is enabled via the mode register). For the x16 configuration, R TT is applied to each DQ, DQU_t, DQU_c, DQL_t, DQL_c, UD_n, and LD_n signal. The ODT pin will be ignored if the mode registers are programmed to disable R TT. PARITY Input Parity for command and address: This function can be enabled or disabled via the mode register. When enabled in R5, the DRA calculates parity with ACT_n, RA_n/A16, CA_n/A15, WE_n/A14, BG[1:0], BA[1:0], A[16:0]. Input parity should be maintained at the rising edge of the clock and at the same time as command and address with C_n LOW. RA_n/A16 CA_n/A15 WE_n/A14 Input Command inputs: RA_n/A16, CA_n/A15, and WE_n/A14 (along with C_n) define the command and/or address being entered and have multiple functions. For example, for activation with ACT_n LOW, these are addresses like A16, A15, and A14, but for a non-activation command with ACT_n HIGH, these are command pins for READ, WRITE, and other commands defined in Command Truth Table. REET_n CO Input Active LOW asynchronous reset: Reset is active when REET_n is LOW and inactive when RE- ET_n is HIGH. REET_n must be HIGH during normal operation. Ax CL Input Input erial address inputs: Used to configure the temperature sensor/pd EEPRO address range on the I 2 C bus. erial clock for temperature sensor/pd EEPRO: Used to synchronize communication to and from the temperature sensor/pd EEPRO on the I 2 C bus. DQx, CBx I/O Data input/output and check bit input/output: Bidirectional data bus. DQ represents DQ[3:0], DQ[7:0], and DQ[15:0] for the x4, x8, and x16 configurations, respectively. If cyclic redundancy checksum (CRC) is enabled via the mode register, the CRC code is added at the end of the data burst. Any one or all of DQ0, DQ1, DQ2, or DQ3 may be used for monitoring of internal V REF level during test via mode register setting R[4] A[4] = HIGH; training times change when enabled. D_n/DBI_n/ TDQ_t (DU_n, DBIU_n), (DL_n/ DBIl_n) I/O Input data mask and data bus inversion: D_n is an input mask signal for write data. Input data is masked when D_n is sampled LOW coincident with that input data during a write access. D_n is sampled on both edges of DQ. D is multiplexed with the DBI function by the mode register A10, A11, and A12 settings in R5. For a x8 device, the function of D or TDQ is enabled by the mode register A11 setting in R1. DBI_n is an input/output identifying whether to store/output the true or inverted data. If DBI_n is LOW, the data will be stored/ output after inversion inside the DDR4 device and not inverted if DBI_n is HIGH. TDQ is only supported in x8 DRA configurations (TDQ is not valid for UDIs). DA I/O erial Data: Bidirectional signal used to transfer data in or out of the EEPRO or EEPRO/T combo device. DQ_t DQ_c DQU_t DQU_c DQL_t DQL_c I/O Data strobe: Output with read data, input with write data. Edge-aligned with read data, centered-aligned with write data. For x16 configurations, DQL corresponds to the data on DQ[7:0], and DQU corresponds to the data on DQ[15:8]. For the x4 and x8 configurations, DQ corresponds to the data on DQ[3:0] and DQ[7:0], respectively. DDR4 DRA supports a differential data strobe only and does not support a single-ended data strobe. ALERT_n Output Alert output: Possesses functions such as CRC error flag and command and address parity error flag as output signal. If a CRC error occurs, ALERT_n goes LOW for the period time interval and returns HIGH. If an error occurs during a command address parity check, ALERT_n goes LOW until the on-going DRA internal recovery transaction is complete. During connectivity test mode, this pin functions as an input. Use of this signal is system-dependent. If not connected as signal, ALERT_n pin must be connected to V DD on DIs. EVENT_n Output Temperature event: The EVENT_n pin is asserted by the temperature sensor when critical temperature thresholds have been exceeded. This pin has no function (NF) on modules without temperature sensors. 7

8 Pin Descriptions Table 5: Pin Descriptions (Continued) ymbol Type Description TDQ_t TDQ_c (x8 DRA-based RDI only) Output Termination data strobe: When enabled via the mode register, the DRA device enables the same R TT termination resistance on TDQ_t and TDQ_c that is applied to DQ_t and DQ_c. When the TDQ function is disabled via the mode register, the D/TDQ_t pin provides the data mask (D) function, and the TDQ_c pin is not used. The TDQ function must be disabled in the mode register for both the x4 and x16 configurations. The D function is supported only in x8 and x16 configurations. D, DBI, and TDQ are a shared pin and are enabled/disabled by mode register settings. For more information about TDQ, see the DDR4 DRA component data sheet (TDQ_t and TDQ_c are not valid for UDIs). V DD upply odule power supply: 1.2V (). V PP upply DRA activating power supply: 2.5V 0.125V / V. V REFCA upply Reference voltage for control, command, and address pins. V upply Ground. V TT upply Power supply for termination of address, command, and control V DD /2. V DDPD upply Power supply used to power the I 2 C bus for PD. RFU Reserved for future use. NC No connect: No internal electrical connection is present. NF No function: ay have internal connection present, but has no function. 8

9 DQ ap DQ ap Table 6: -to-odule DQ ap Front Reference DQ odule DQ odule Pin Reference DQ odule DQ odule Pin U U U U U6 0 CB7 199 U CB CB CB U U U U U U U U16 0 CB CB CB CB3 201 U U

10 DQ ap Table 6: -to-odule DQ ap Front (Continued) Reference DQ odule DQ odule Pin Reference DQ odule DQ odule Pin U U Table 7: -to-odule DQ ap Back Reference DQ odule DQ odule Pin Reference DQ odule DQ odule Pin U U U U U25 0 CB5 192 U CB CB CB U U U U U U

11 DQ ap Table 7: -to-odule DQ ap Back (Continued) Reference DQ odule DQ odule Pin Reference DQ odule DQ odule Pin U U34 0 CB CB CB CB1 194 U U U U

12 3D Device Functional Block Diagram 3D Device Functional Block Diagram Figure 2: 2-high 3D Device Functional Block Diagram lave Die ode Registers Local Control Logic Core emory Array aster Die CAL ODT ODT Control R V Q REET# CKE CK, CK# aster Control Logic DLL C0 C# RA# CA# WE# Command Decode ode Registers Local Control Logic Core emory Array READ Drivers WRITE Drivers and input Logic ODT ODT DQ[n-0] DQ, DQ# A[15: 0] BG[1:0] BA[1:0] Address Registers D 12

13 odule Functional Block Diagram odule Functional Block Diagram Figure 3: Functional Block Diagram, R/C-B2 A/BC0_n A/BC1_n A/BC0 DQ0_t DQ0_c DQ9_t DQ9_c DQ0 U12 U38 DQ4 U2 U29 DQ1 DQ5 DQ2 DQ3 DQ6 DQ7 DQ1_t DQ1_c V V DQ10_t DQ10_c V V U7 DQ8 DQ9 DQ10 DQ11 DQ2_t DQ2_c DQ16 DQ17 DQ18 DQ19 DQ3_t DQ3_c DQ24 U13 V U14 V U15 U37 V U36 V U35 DQ12 DQ13 DQ14 DQ15 DQ11_t DQ11_c DQ20 DQ21 DQ22 DQ23 DQ12_t DQ12_c DQ28 U3 V U4 V U5 U28 V U27 V U26 C0_n C1_n BA[1:0] BG[1:0] ACT_n A[17, 13:0] RA_n/A16 CA_n/A15 WE_n/A14 CKE0 CKE1 ODT0 ODT1 PAR_IN C[2:0] ALERT_CONN A0 A1 A2 CL DA CK0_t CK0_c REET_CONN A/BC0_n: Rank 0 A/BC1_n: Rank 1 R A/BBA[1:0]: DDR4 DRA E A/BBG[1:0]: DDR4 DRA A/BACT_n: DDR4 DRA G A/BA[17,13:0]: DDR4 DRA A/B-RA_n/A16: DDR4 DRA I A/B-CA_n/A15: DDR4 DRA A/B-WE_n/A14: DDR4 DRA A/BCKE0: Rank 0 T A/BCKE1: Rank 1 A/BODT0: Rank 0 E A/BODT1: Rank 1 A/BPAR: DDR4 DRA R C[2:0]: DDR4 DRA & ALERT_DRA: DDR4 DRA P L L CK[3:0]_t DDR4 DRA CK[3:0]_c REET_DRA: DDR4 DRA DQ25 DQ26 DQ27 DQ29 DQ30 DQ31 CK1_t V CK1_c Rank 0: U2 U6, U8 U20 Rank 1: U21 38 DQ8_t DQ8_c V V DQ17_t DQ17_c V V Command, control, address, and clock line terminations: CB0 CB1 U16 U34 CB4 CB5 U6 U25 A/BC_n[1:0], A/BBA[1:0]A/BBG[1:0], A/BACT_n, A/BA[17, 13:0], A/B-RA_n/A16, A/B-CA_n/A15, A/B-WE_n/A14, DDR4 DRA VTT CB2 CB3 CB6 CB7 A/BCKE[1:0], A/BODT[1:0] DDR4 DRA CK[3:0]_t CK[3:0]_c VDD DQ4_t DQ4_c DQ32 DQ33 DQ34 DQ35 U17 V U33 V DQ13_t DQ13_c DQ36 DQ37 DQ38 DQ39 U8 V U24 V CL U1 PD EEPRO/ Temperature sensor EVT A0 A1 A2 A0 A1 A2 EVENT# DA DQ5_t DQ5_c DQ40 DQ41 DQ42 DQ43 U18 V U32 V DQ14_t DQ14_c DQ44 DQ45 DQ46 DQ47 U9 V U23 V VDDPD VDD VTT VREFCA VPP PD EEPRO/Temp ensor, Register DDR4 DRA, Register Control, command and address termination DDR4 DRA, Register DDR4 DRA V DDR4 DRA, Register DQ6_t DQ6_c V V DQ15_t DQ15_c V V DQ48 U19 U31 DQ52 U10 U22 DQ49 DQ53 DQ50 DQ51 DQ54 DQ55 DQ7_t DQ7_c V V DQ16_t DQ16_c V V DQ56 U20 U30 DQ60 U11 U21 DQ57 DQ61 DQ58 DQ59 DQ62 DQ63 V V V V Note: 1. The ball on each DDR4 component is connected to an external 240Ω ±1% resistor that is tied to ground. It is used for the calibration of the component s ODT and output driver. 13

14 General Description General Description High-speed DDR4 DRA modules use DDR4 DRA devices with two or four internal memory bank groups. DDR4 DRA modules utilizing 4- and 8-bit-wide DDR4 DRA devices have four internal bank groups consisting of four memory banks each, providing a total of 16 banks. 16-bit-wide DDR4 DRA devices have two internal bank groups consisting of four memory banks each, providing a total of eight banks. DDR4 DRA modules benefit from DDR4 DRA's use of an 8n-prefetch architecture with an interface designed to transfer two data words per clock cycle at the I/O pins. A single READ or WRITE operation for the DDR4 DRA effectively consists of a single 8n-bitwide, four-clock data transfer at the internal DRA core and eight corresponding n-bitwide, one-half-clock-cycle data transfers at the I/O pins. DDR4 modules use two sets of differential signals: DQ_t and DQ_c to capture data and CK_t and CK_c to capture commands, addresses, and control signals. Differential clocks and data strobes ensure exceptional noise immunity for these signals and provide precise crossing points to capture input signals. Fly-By Topology DDR4 modules use faster clock speeds than earlier DDR technologies, making signal quality more important than ever. For improved signal quality, the clock, control, command, and address buses have been routed in a fly-by topology, where each clock, control, command, and address pin on each DRA is connected to a single trace and terminated (rather than a tree structure, where the termination is off the module near the connector). Inherent to fly-by topology, the timing skew between the clock and DQ signals can be easily accounted for by using the write-leveling feature of DDR4. odule anufacturing Location icron Technology manufactures modules at sites world-wide. Customers may receive modules from any of the following manufacturing locations: Table 8: DRA odule anufacturing Locations anufacturing ite Location Boise, UA Aguadilla, Puerto Rico Xian, China ingapore Country of Origin pecified on Label UA Puerto Rico China ingapore 14

15 Address apping to DRA Address apping to DRA Address irroring To achieve optimum routing of the address bus on DDR4 multi rank modules, the address bus will be wired as shown in the table below, or mirrored. For quad rank modules, ranks 1 and 3 are mirrored and ranks 0 and 2 are non-mirrored. Highlighted address pins have no secondary functions allowing for normal operation when crosswired. Data is still read from the same address it was written. However, Load ode operations require a specific address. This requires the controller to accommodate for a rank that is "mirrored." ystems may reference DDR4 PD to determine if the module has mirroring implemented or not. ee the JEDEC DDR4 PD specification for more details. Table 9: Address irroring Edge Connector Pin DRA Pin, Non-mirrored DRA Pin, irrored A0 A0 A0 A1 A1 A1 A2 A2 A2 A3 A3 A4 A4 A4 A3 A5 A5 A6 A6 A6 A5 A7 A7 A8 A8 A8 A7 A9 A9 A9 A10 A10 A10 A11 A11 A13 A13 A13 A11 A12 A12 A12 A14 A14 A14 A15 A15 A15 A16 A16 A16 A17 A17 A17 BA0 BA0 BA1 BA1 BA1 BA0 BG0 BG0 BG1 BG1 BG1 BG0 15

16 Registering Clock Driver Operation Registering Clock Driver Operation Registered DDR4 DRA modules use a registering clock driver device consisting of a register and a phase-lock loop (PLL). The device complies with the JEDEC DDR4 RCD specification. To reduce the electrical load on the host memory controller's command, address, and control bus, icron's RDIs utilize a DDR4 registering clock driver (RCD). The RCD presents a single load to the controller while redriving signals to the DDR4 DRA devices, which helps enable higher densities and increase signal integrity. The RCD also provides a low-jitter, low-skew PLL that redistributes a differential clock pair to multiple differential pairs of clock outputs. Control Words Parity Operations Rank Addressing The RCD device(s) used on DDR4 RDIs, LRDIs, and NVDIs contain configuration registers known as control words, which the host uses to configure the RCD based on criteria determined by the module design. Control words can be set by the host controller through either the DRA address and control bus or the I 2 C bus interface. The RCD I 2 C bus interface resides on the same I 2 C bus interface as the module temperature sensor and EEPRO. The RCD includes a parity-checking function that can be enabled or disabled in control word RC0E. The RCD receives a parity bit at the DPAR input from the memory controller and compares it with the data received on the qualified command and address inputs; it indicates on its open-drain ALERT_n pin whether a parity error has occurred. If parity checking is enabled, the RCD forwards commands to the DRA when no parity error has occurred. If the parity error function is disabled, the RCD forwards sampled commands to the DRA regardless of whether a parity error has occurred. Parity is also checked during control word WRITE operations unless parity checking is disabled. The chip select pins (C_n) on icron's modules are used to select a specific rank of DRA. The RDI is capable of selecting ranks in one of three different operating modes, dependant on setting DA[1:0] bits in the DI configuration control word located within the RCD. Direct DualC mode is utilized for single- or dual-rank modules. For quad-rank modules, either direct or encoded QuadC mode is used. 16

17 Temperature ensor with PD EEPRO Operation Thermal ensor Operations Temperature ensor with PD EEPRO Operation The integrated thermal sensor continuously monitors the temperature of the module PCB directly below the device and updates the temperature data register. Temperature data may be read from the bus host at any time, which provides the host real-time feedback of the module's temperature. ultiple programmable and read-only temperature registers can be used to create a custom temperature-sensing solution based on system requirements and JEDEC JC EVENT_n Pin The temperature sensor also adds the EVENT_n pin (open-drain), which requires a pullup to V DDPD. EVENT_n is a temperature sensor output used to flag critical events that can be set up in the sensor s configuration registers. EVENT_n is not used by the serial presence-detect (PD) EEPRO. EVENT_n has three defined modes of operation: interrupt, comparator, and TCRIT. In interrupt mode, the EVENT_n pin remains asserted until it is released by writing a 1 to the clear event bit in the status register. In comparator mode, the EVENT_n pin clears itself when the error condition is removed. Comparator mode is always used when the temperature is compared against the TCRIT limit. In TCRIT only mode, the EVENT_n pin is only asserted if the measured temperature exceeds the TCRIT limit; it then remains asserted until the temperature drops below the TCRIT limit minus the TCRIT hysteresis. PD EEPRO Operation DDR4 DRA modules incorporate PD. The PD data is stored in a 512-byte, JEDEC JC-42.4-compliant EEPRO that is segregated into four 128-byte, write-protectable blocks. The PD content is aligned with these blocks as shown in the table below. Block Range Description h 07Fh Configuration and DRA parameters h 0FFh odule parameters h 13Fh Reserved (all bytes coded as 00h) h 17Fh anufacturing information h 1FFh End-user programmable The first 384 bytes are programmed by icron to comply with JEDEC standard JC-45, "Appendix X: erial Presence Detect (PD) for DDR4 DRA odules." The remaining 128 bytes of storage are available for use by the customer. The EEPRO resides on a two-wire I 2 C serial interface and is not integrated with the memory bus in any manner. It operates as a slave device in the I 2 C bus protocol, with all operations synchronized by the serial clock. Transfer rates of up to 1 Hz are achievable at 2.5V (NO). icron implements reversible software write protection on DDR4 DRA-based modules. This prevents the lower 384 bytes (bytes 0 to 383) from being inadvertently programmed or corrupted. The upper 128 bytes remain available for customer use and are unprotected. 17

18 Electrical pecifications Table 10: Absolute aximum Ratings Electrical pecifications tresses greater than those listed may cause permanent damage to the module. This is a stress rating only, and functional operation of the module at these or any other conditions outside those indicated in each device's data sheet is not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability. ymbol Parameter in ax Units Notes V DD V DD supply voltage relative to V V 1 V DDQ V DDQ supply voltage relative to V V 1 V PP Voltage on V PP pin relative to V V 2 V IN, V OUT Voltage on any pin relative to V V Table 11: Operating Conditions ymbol Parameter in Nom ax Units Notes V DD V DD supply voltage V 1 V PP DRA activating power supply V 2 V REFCA(DC) Input reference voltage command/address bus 0.49 V DD 0.5 V DD 0.51 V DD V 3 I VTT Termination reference current from V TT ma V TT Termination reference voltage (DC) command/address bus I IN Input leakage current; any input excluding ; 0V < V IN < 1.1V 0.49 V DD - 20mV 0.5 V DD 0.51 V DD + 20mV V µa 5 I Input leakage current; 3 3 µa 6, 7 I I/O DQ leakage; 0V < V IN < V DD 4 4 µa 7 I OZpd Output leakage current; V OUT = V DD ; DQ is disabled 5 µa I OZpu I VREFCA Output leakage current; V OUT = V ; DQ and ODT are disabled; ODT is disabled with ODT input HIGH V REFCA leakage; V REFCA = V DD /2 (after DRA is initialized) 50 µa 2 2 µa 7 Notes: 1. V DDQ balls on DRA are tied to V DD. 2. V PP must be greater than or equal to V DD at all times. 3. V REFCA must not be greater than 0.6 V DD. When V DD is less than 500mV, V REF may be less than or equal to 300mV. 4. V TT termination voltages in excess of specification limit adversely affect command and address signals' voltage margins and reduce timing margins. 5. Command and address inputs are terminated to V DD /2 in the registering clock driver. Input current is dependent on termination resistance set in the registering clock driver. 6. Tied to ground. Not connected to edge connector. 7. ultiply by number of DRA die on module. 18

19 Electrical pecifications Table 12: Thermal Characteristics ymbol Parameter/Condition Value Units Notes T C Commercial operating case temperature 0 to 85 C 1, 2, 3 T C >85 to 95 C 1, 2, 3, 4 T OPER Normal operating temperature range 0 to 85 C 5, 7 T OPER Extended temperature operating range (optional) >85 to 95 C 5, 7 T TG Non-operating storage temperature 55 to 100 C 6 RH TG Non-operating storage relative humidity (non-condensing) 5 to 95 % NA Change rate of storage temperature 20 C/hour Notes: 1. aximum operating case temperature; T C is measured in the center of the package. 2. A thermal solution must be designed to ensure the DRA device does not exceed the maximum T C during operation. 3. Device functionality is not guaranteed if the DRA device exceeds the maximum T C during operation. 4. If T C exceeds 85 C, the DRA must be refreshed externally at 2X refresh, which is a 3.9µs interval refresh rate. 5. The refresh rate must double when 85 C < T OPER 95 C. 6. torage temperature is defined as the temperature of the top/center of the DRA and does not reflect the storage temperatures of shipping trays. 7. For additional information, refer to technical note TN-00-08: "Thermal Applications" available at micron.com. 19

20 DRA Operating Conditions DRA Operating Conditions Recommended AC operating conditions are given in the DDR4 component data sheets. specifications are available at micron.com. odule speed grades correlate with component speed grades, as shown below. Table 13: odule and peed Grades DDR4 components may exceed the listed module speed grades; module may not be available in all listed speed grades odule peed Grade peed Grade H H H H H Design Considerations imulations icron memory modules are designed to optimize signal integrity through carefully designed terminations, controlled board impedances, routing topologies, trace length matching, and decoupling. However, good signal integrity starts at the system level. icron encourages designers to simulate the signal characteristics of the system's memory bus to ensure adequate signal integrity of the entire memory system. Power Operating voltages are specified at the edge connector of the module, not at the DRA. Designers must account for any system voltage drops at anticipated power levels to ensure the required supply voltage is maintained. 20

21 I DD pecifications I DD pecifications Table 14: DDR4 I DD pecifications and Conditions 64GB (Die Revision G) Values are for the T40A4G4 DDR4 2H 3D DRA only and are computed from values specified in the DDR4 3D (16 Gig x 4) component data sheet Parameter ymbol 2666 Units One bank ACTIVATE-PRECHARGE current I CDD ma One bank ACTIVATE-PRECHARGE, wordline boost, I PP current I CPP0 216 ma One bank ACTIVATE-READ-PRECHARGE current I CDD ma Precharge standby current I CDD2N 1980 ma Precharge standby ODT current I CDD2NT 2250 ma Precharge power-down current I CDD2P 1800 ma Precharge quite standby current I CDD2Q 1890 ma Active standby current I CDD3N 2178 ma Active standby I PP current I CPP3N 216 ma Active power-down current I CDD3P 1962 ma Burst read current I CDD4R 3582 ma Burst write current I CDD4W 3510 ma Burst refresh current (1x REF) I CDD5R 2448 ma Burst refresh I PP current (1x REF) I CPP5R 252 ma elf refresh current: Normal temperature range (0 C to 85 C) I CDD6N 2016 ma elf refresh current: Extended temperature range (0 C to 95 C) I CDD6E 2196 ma elf refresh current: Reduced temperature range (0 C to 45 C) I CDD6R 1656 ma Auto self refresh current (25 C) I CDD6A ma Auto self refresh current (45 C) I CDD6A 1656 ma Auto self refresh current (75 C) I CDD6A 2016 ma Auto self refresh I PP current I CPP6X 288 ma Bank interleave read current I CDD ma Bank interleave read I PP current I CPP7 486 ma aximum power-down current I CDD ma 21

22 I DD pecifications Table 15: DDR4 I DD pecifications and Conditions 64GB (Die Revision E) Values are for the T40A4G4 DDR4 2H 3D DRA only and are computed from values specified in the DDR4 3D (16 Gig x 4) component data sheet Parameter ymbol Units One bank ACTIVATE-PRECHARGE current I CDD ma One bank ACTIVATE-PRECHARGE, wordline boost, I PP current I CPP ma One bank ACTIVATE-READ-PRECHARGE current I CDD ma Precharge standby current I CDD2N ma Precharge standby ODT current I CDD2NT ma Precharge power-down current I CDD2P ma Precharge quite standby current I CDD2Q ma Active standby current I CDD3N ma Active standby I PP current I CPP3N ma Active power-down current I CDD3P ma Burst read current I CDD4R ma Burst write current I CDD4W ma Burst refresh current (1x REF) I CDD5R ma Burst refresh I PP current (1x REF) I CPP5R ma elf refresh current: Normal temperature range (0 C to 85 C) I CDD6N ma elf refresh current: Extended temperature range (0 C to 95 C) I CDD6E ma elf refresh current: Reduced temperature range (0 C to 45 C) I CDD6R ma Auto self refresh current (25 C) I CDD6A ma Auto self refresh current (45 C) I CDD6A ma Auto self refresh current (75 C) I CDD6A ma Auto self refresh I PP current I CPP6X ma Bank interleave read current I CDD ma Bank interleave read I PP current I CPP ma aximum power-down current I CDD ma 22

23 Registering Clock Driver pecifications Registering Clock Driver pecifications Table 16: Registering Clock Driver Electrical Characteristics DDR4 RCD01 devices or equivalent Parameter ymbol Pins in Nom ax Units DC supply voltage V DD V DC reference voltage V REF V REFCA 0.49 V DD 0.5 V DD 0.51 V DD V DC termination voltage High-level input voltage Low-level input voltage DRT_n pulse width AC high-level output voltage AC low-level output voltage AC differential output high measurement level (for output slew rate) AC differential output low measurement level (for output slew rate) V TT V REF - 40mV V REF V REF + 40mV V V IH. CO DRT_n 0.65 V DD V DD V V IL. CO V DD V t IN- IT_Power_stable V OH(AC) 1.0 µs All outputs except ALERT_n V TT + (0.15 V DD ) V V OL(AC) V TT + (0.15 V DD ) V V OHdiff(AC) Yn_t - Yn_c, BCK_t - BCK_c 0.3 V DD mv V OLdiff(AC) 0.3 V DD mv Note: 1. Timing and switching specifications for the register listed are critical for proper operation of DDR4 DRA RDIs. These are meant to be a subset of the parameters for the specific device used on the module. ee the JEDEC RCD01 specification for complete operating electrical characteristics. Registering clock driver parametric values are specified for device default control word settings, unless otherwise stated. The RC0A control word setting does not affect parametric values. 23

24 Temperature ensor with PD EEPRO Temperature ensor with PD EEPRO The temperature sensor continuously monitors the module's temperature and can be read back at any time over the I 2 C bus shared with the serial presence-detect (PD) EE- PRO. Refer to JEDEC JC-42.4 EE1004 and TE2004 device specifications for complete details. PD Data For the latest PD data, refer to icron's PD page: micron.com/pd. Table 17: Temperature ensor with PD EEPRO Operating Conditions Parameter/Condition ymbol in Nom ax Units upply voltage V DDPD 2.5 V Input low voltage: logic 0; all inputs V IL 0.5 V DDPD 0.3 V Input high voltage: logic 1; all inputs V IH V DDPD 0.7 V DDPD V Output low voltage: 3mA sink current V DDPD > 2V V OL 0.4 V Input leakage current: (CL, DA) V IN = V DDPD or V PD I LI ±5 µa Output leakage current: V OUT = V DDPD or V PD, DA in High-Z I LO ±5 µa Table 18: Temperature ensor and EEPRO erial Interface Timing Parameter/Condition ymbol in ax Units Clock frequency f CL khz Clock pulse width HIGH time t HIGH 260 ns Clock pulse width LOW time t LOW 500 ns Detect clock LOW timeout t TIEOUT ms DA rise time t R 120 ns DA fall time t F 120 ns Data-in setup time t U:DAT 50 ns Data-in hold time t HD:DI 0 ns Data out hold time t HD:DAT ns tart condition setup time t U:TA 260 ns tart condition hold time t HD:TA 260 ns top condition setup time t U:TO 260 ns Time the bus must be free before a new transition can start t BUF 500 ns Write time t W 5 ms Warm power cycle time off t POFF 1 ms Time from power-on to first command t INIT 10 ms 24

25 odule Dimensions odule Dimensions Figure 4: 288-Pin DDR4 RDI Front view (5.255) (5.244) 3.9 (0.153) AX U (0.03) R (8X) 2.50 (0.098) D (2X) 4.8 (0.189) 2.20 (0.087) 3.35 (0.132) (2X) U2 Pin 1 U3 U4 U5 U6 U8 U9 U10 U11 U7 U12 U13 U14 U15 U16 U17 U18 U19 U (2.84) 0.85 (0.033) 0.60 (0.0236) (4.99) 0.75 (0.030) R 16.1 (0.63) 9.5 (0.374) Pin (1.236) (1.224) 1.5 (0.059) 1.3 (0.051) Back view 1.25 (0.049) x 45 (2X) U21 U22 U23 U24 U25 U26 U27 U28 U (0.57) 8.0 (0.315) 3.15 (0.124) U30 U31 U32 U33 U34 U35 U36 U37 U38 Pin (0.90) 10.2 (0.4) 5.95 (0.234) (0.9) 25.5 (1.0) 10.2 (0.4) 28.9 (1.14) 3.0 (0.118) (4X) Pin (0.0197) (2.21) 64.6 (2.54) Notes: 1. All dimensions are in millimeters (inches); AX/IN or typical () where noted. 2. The dimensional diagram is for reference only Federal Way, P.O. Box 6, Boise, ID , Tel: ales inquiries: icron and the icron logo are trademarks of icron Technology, Inc. All other trademarks are the property of their respective owners. This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein. Although considered final, these specifications are subject to change, as further product development and data characterization sometimes occur. 25