Specification. Revision

Transcription

1 Midas Components Limited Electra House 32 Southtown Road Great Yarmouth Norfolk NR31 0DU England Telephone +44 (0) Fax +44 (0) Website Part Number: Version: Date: Specification Revision

2 Contents 1. Revision History Page 3 2. General Specification 4 3. Module Coding System 5 4. Interface Pin Function 6 5. Outline dimension 7 6. Function Description Instruction Description Optical Characteristics Absolute Maximum Ratings Electrical Characteristics Backlight Information Reliability Inspection specification Precautions in use of LCD Modules Material List of Components for RoHs Recommendable storage 39

3 2. General Specification The Features of the Module is description as follow: Module dimension: 51.2x 20.7 x6.3 (max.) mm3 View area: 40.0 x 10.0 mm2 Active area: 38.0 x 8.0 mm2 Number of Characters: 16 characters x 2 Lines Dot size: 0.36 x 0.43 mm2 Dot pitch: 0.41 x 0.48 mm2 Character size: 2.00 x 3.79 mm2 Character pitch: 2.40 x 4.19 mm2 LCD type: STN Positive, Yellow Green Transflective Duty: 1/16, 1/5 Bias View direction: 6 o clock Backlight Type: LED, Yellow Green

4 Midas LCD Part Number System MC COG A * 6 W * * - S N T L W * * = MC: Midas Components 2 = Blank: COB (chip on board) COG: chip on glass 3 = No of dots (e.g = 240 x 64 dots) (e.g = 2 x 16 5mm C.H.) 4 = Series 5 = Series Variant: A to Z see addendum 6 = 3: 3 o clock 6: 6 o clock 9: 9 o clock 12: 12 o clock 7 = S: Normal (0 to + 50 deg C) W: Wide temp. (-20 to + 70 deg C) X: Extended temp ( Deg C) 8 = Character Set Blank: Standard (English/Japanese) C: Chinese Simplified (Graphic Displays only) CB: Chinese Big 5 (Graphic Displays only) H: Hebrew K: European (std) (English/German/French/Greek) L: English/Japanese (special) M: European (English/Scandinavian) R: Cyrillic W: European (English/Greek) U: European (English/Scandinavian/Icelandic) J: Asian/Arabic 9 = Bezel Height (where applicable / available) Top of Bezel to Top of PCB Common (via pins 1 and 2) Array or Edge Lit Blank 9.5mm / not applicable Common Array mm Common Array mm Separate Array mm Common Array mm Separate Array 6 7 mm Common Array 7 7 mm Separate Array mm Common Edge mm Separate Edge A 5.5 mm Common Edge B 5.5 mm Separate Edge D 6.0mm Separate Edge E 5.0mm Separate Edge F 4.7mm Common Edge G 3.7mm Separate EL 10 = T: TN S: STN B: STN Blue G: STN Grey F: FSTN F2: FFSTN Z: Zero Power (Bi-Stable) 11 = P: Positive N: Negative 12 = R: Reflective M: Transmissive T: Transflective 13 = Backlight: Blank: Reflective L: LED 14 = Backlight Colour: Y: Yellow-Green W: White B: Blue R: Red A: Amber O: Orange G: Green RGB: R.G.B. If Z (Zero Power): WB: White on blue GB: Green on black YB: Yellow on black YPB: Yellow on pink and/or blue 15 = Driver Chip: Blank: Standard I: I2C T: Toshiba T6963C A: Avant SAP1024B R: Raio RA = Voltage Variant: e.g. 3 = 3v F/Displays/Midas Brand/Midas LCD Part Number System 2 March 2011.doc

5 4. Interface Pin Function Pin No. Symbol Level Description 1 VOUT 2 CAP1N 3 CAP1P 4 VDD 3.0/5.0V DC/DC voltage converter. Connect a capacitor between this terminal and VIN when the built-in booster is used. For voltage booster circuit(vdd-vss) External capacitor about 0.1u~4.7uf Power supply 5 VSS GND 6 SDA (In I2C interface DB7 (SDA) is input data. SDA and SCL must connect to I2C bus (I2C bus is t o connect a resister between SDA/SCL and the power o f I2C bus ). SCL (In I2C interface DB6 (SCL) is clock input. 7 SDA and SCL must connect to I2C bus (I2C bus is to connect a resister between SDA/SCL and the power of I2C bus ). 8 RST RESET

6 5.Outline dimension VA AA VA40.0 AA38.0 ST7 032 i MAX A K VOUT CAP1N CAP1P VDD VSS SDA 7 SCL 8 RST P1.2 7*7 = The n on-specified tolerance of d imension is 0.2mm ±5 DOT SIZE SCALE 5/1

7 Application schematic

8 INITIALIZE: (3V) MOV I2C_CONTROL,#00H ;WRITE COMMAND MOV I2C_DATA,#38H ;Function Set LCALL WRITE_CODE MOV I2C_CONTROL,#00H ;WRITE COMMAND MOV I2C_DATA,#39H ;Function Set LCALL WRITE_CODE MOV I2C_DATA,#14H ;Internal OSC frequency LCALL WRITE_CODE MOV I2C_DATA,#74H ;Contrast set LCALL WRITE_CODE MOV I2C_DATA,#54H ;Power/ICON control/contrast set LCALL WRITE_CODE MOV I2C_DATA,#6FH ;Follower control LCALL WRITE_CODE MOV I2C_DATA,#0CH ;Display ON/OFF LCALL WRITE_CODE MOV I2C_DATA,#01H ;Clear Display LCALL WRITE_CODE

9 INITIALIZE: (5V) MOV I2C_CONTROL,#00H ;WRITE COMMAND MOV I2C_DATA,#38H ;Function Set LCALL MOV WRITE_CODE I2C_CONTROL,#00H ;WRITE COMMAND MOV I2C_DATA,#39H ;Function Set LCALL WRITE_CODE MOV I2C_DATA,#14H ;Internal OSC frequency LCALL WRITE_CODE MOV I2C_DATA,#79H ;Contrast set LCALL WRITE_CODE MOV I2C_DATA,#50H ;Power/ICON control/contrast set LCALL WRITE_CODE MOV I2C_DATA,#6CH ;Follower control LCALL WRITE_CODE MOV I2C_DATA,#0CH ;Display ON/OFF LCALL WRITE_CODE MOV I2C_DATA,#01H ;Clear Display LCALL WRITE_CODE

10 6. Function Description System Interface This chip has all four kinds of interface type with MPU: 4-bit bus, 8-bit bus. 4-bit bus or 8-bit bus is selected by DL bit in the instruction register. During read or w rite operation, tw o 8-bit registers are used. One is data register (DR); the other is instruction register (IR). The data register (DR) is used as temporary data storage place for being w ritten into or read from DDRAM/CGRAM/ICON RAM, target RAM is selected by RAM address setting instruction. Each internal operation, reading from or writing into RA M, is done automatically. So to speak, after MPU reads DR data, the data in the next DDRAM/CGRAM/ICON RA M address is transferred into DR automatically. Also after MPU w rites data to DR, the data in DR is transferred into DDRAM/CGRAM/ICON RAM automatically. The Instruction register (IR) is used only to store instruction code transferred from MPU. MPU cannot use it to read instruction data. Using RS input pin to select command or data in 4-bit/8-bit bus mode. I2C interface It just only could w rite Data or Instruction to ST7032 by the IIC Interface. It could not read Data or Instruction from ST7032 (except Acknow ledge signal). SCL: serial clock input SDA: serial data input Slaver address could only set to , no other slaver address could be set The I2C interface send RAM data and executes the commands sent via the I2C Interface. It could send data bit to the RAM. The I2C Interface is two-line communication betw een different ICs or modules. The tw o lines are a Serial Data line (SDA) and a Ser ial Clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor. Data transfer may be initiated only w hen the bus is not busy. BIT TRANSFER One data bit is transferred during each clock pulse. The data on the SDA line must remain stable dur ing the HIGH period of the clock pulse because changes in the data line at this time w ill be interpreted as a control signal. Bit transfer is illustrated in Fig.1.

11 START AND STOP CONDITIONS line, w hile the clock is HIGH is defined as the START condition (S). A LOW-to-HIGH transition of the data line w hile the clock is HIGH is defined as the STOP condition ( P). The START and STOP conditions are illustrated in Fig.2. SYST EM CONFIGURATION The system configuration is illustrated in Fig.3. Transmitter: the device, w hich sends the data to the bus Master: the device, w hich initiates a transfer, generates clock signals and terminates a transfer Slave: the device addressed by a master Multi- Master: more than one master can attempt to control the bus at the same time w ithout corrupting the message Arbitration: procedure to ensure that, if more than one master simultaneously tries to control the bus, only one is allow ed to do so and the message is not corrupted Synchronization: procedure to synchronize the clock signals of two or more devices. ACKNOWLEDGE Acknowledge is not Busy Flag in I2C interface. Each byte of eight bits is follow ed by an acknow ledge bit. The acknow ledge bit is a HIGH signal put on the bus by the transmitter dur ing w hich time the master generates an extra acknow ledge related clock pulse. A slave receiver which is addressed must generate an acknow ledge after the reception of each byte. A master receiver must also generate an acknow ledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknow ledges must pull-dow n the SDA line during the acknow ledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknow ledge related clock pulse (set-up and hold times must be taken into consideration). A master receiver must signal an end-of-data to the trans mitter by not generating an acknow ledge on the last byte that has been clocked out of the slave. In this event the transmitter must leave the data line HIGH to enable the master to generate a STOP condition. Acknow ledgement on the I2C Interface is illustrated in Fig.4.

12 I2C Interface protocol The ST7032 supports command, data write addressed slaves on the bus. Before any data is transmitted on the I2C Interface, the device, w hich should respond, is addressed first. Only one 7-bit slave addresses ( ) is reserved for the ST7032. The R/W is assigned to 0 for Write only. The I2C Interface protocol is illustrated in Fig.5. The sequence is initiated w ith a START condition (S) from the I2C Interface master, w hich is follow ed by the slave address. All slaves w ith the corresponding address acknow ledge in parallel, all the others w ill ignore the I2C Interface transfer. After acknow ledgement, one or more command w ords follow which define the status of the addressed slaves. A command w ord consists of a control byte, w hich defines Co and RS, plus a data byte. The last control byte is tagged w ith a cleared most significant bit (i.e. the continuation bit Co). After a control byte w ith a cleared Co bit, only data bytes w ill follow. The state of the RS bit defines w hether the data byte is interpreted as a command or as RAM data. All addressed slaves on the bus also acknow ledge the control and data bytes. After the last control byte, depending on the RS bit setting; either a series of display data bytes or command data bytes may follow. If the RS bit is set to logic 1, these display bytes are stored in the display RA M at the address specified by the data pointer. The data pointer is automatically updated and the data is directed to the intended ST7032i device. If the RS bit of the last control byte is set to logic 0, these command bytes w ill be decoded and the setting of the device will be changed according to the received commands. Only the addressed slave makes the acknow ledgement after each byte. At the end of the transmission the I2C INTERFA CE-bus master issues a STOP condition ( P).

13 During w rite operation, tw o 8-bit registers are used. One is data register (DR), the other is instruction register (IR). The data register (DR) is used as temporary data storage place for being w ritten into DDRAM/CGRAM/ICON RAM, target RAM is selected by RAM address setting instruction. Each internal operation, w riting into RAM, is done automatically. So to speak, after MPU writes data to DR, the data in DR is transferred into DDRAM/CGRAM/ICON RAM automatically. The Instruction register (IR) is used only to store instruction code transferred from MPU. MPU cannot use it to read instruction data. To select register, use RS input in I2C interface. Busy Flag (BF) When BF = "High, it indicates that the internal operation is being processed. So during this time the next instruction cannot be accepted. BF can be read, w hen RS = Low and R/W = High ( Read Instruction Operation), through DB7 port. Before executing the next instruction, be sure that BF is not High.

14 Address Counter (AC) Address Counter (AC) stores DDRA M/CGRA M/ICON RA M address, transferred from IR. After writing into (reading from) DDRAM/CGRAM/ICON RAM, AC is automatically increased (decreased) by 1. When RS = "Low " and R/W = "High", AC can be read through DB0 ~ DB6 ports. Display Data RAM (DDRAM) Display data RAM ( DDRAM) stores display data represented in 8-bit character codes. Its extended capacity is 80 x 8 bits, or 80 characters. The area in display data RAM (DDRAM) that is not used for display can be used as general data RA M. See Figure 7 for the relationships betw een DDRA M addresses and positions on the liquid crystal display. The DDRAM address (ADD ) is set in the address counter (AC)as hexadecimal. Ø 1-line display (N = 0) (Figure 8) When there are few er than 80 display characters, the display begins at the head position. For example, if using only the ST7032, 16 characters are displayed. See Figure 8. When the display shift operation is performed, the DDRAM address shifts. See Figure 9.

15 Ø 2-line display (N = 1) (Figure 10) Case 1: When the number of display characters is less than 40 2 lines, the tw o lines are displayed from the head. Note that the first line end address and the second line start address are not consecutive. See Figure 10. Case 2: For a 16-character 2-line display See Figure 11. When display shift operation is performed, the DDRAM address shifts. See Figure 11.

16 Character Generator ROM (CGROM) The character generator ROM generates 5 x 8 dot character patterns from 8-bit character codes. It can generate 240/250/248/256 5 x 8 dot character patterns (select by OPR1/2 ITO pin). User-defined character patterns are also available by mask-programmed ROM. Character Generator RAM (CGRAM) In the character generator RAM, the user can rewrite character patterns by program. For 5 x 8 dots, eight character patterns can be written. Write into DDRA M the character codes at the addresses show n as the left column of Table 3 to show the character patterns stored in CGRA M. See Table 4 for the relationship betw een CGRAM addresses and data and display patterns. Areas that are not used for display can be used as general data RA M. ICON RAM In the ICON RAM, the user can rewrite icon pattern by program. There are totally 80 dots for icon can be written. See Table 5 for the relationship between ICON RAM address and data and the display patterns. Timing Generation Circuit The timing generation circuit generates timing signals for the operation of internal circuits such as DDRAM, CGROM and CGRAM. RA M read timing for display and internal operation timing by MPU access are generated separately to avoid interfering w ith each other. Therefore, w hen writing data to DDRAM, for example, there w ill be no undesirable interference, such as flickering, in areas other than the display area.(in I2C interface the reading function is invalid.) LCD Driver Circuit LCD Driver circuit has 17 common and 80 segment signals for LCD driving. Data from CGRA M/CGROM/ICON is transferred to 80 bit segment latch serially, and then it is stored to 80 bit shift latch. When each common is selected by 17 bit common register, segment data also output through segment driver from 80 bit segment latch. Cursor/Blink Control Circuit It can generate the cursor or blink in the cursor/blink control circuit. The cursor or the blink appears in the digit at the display data RAM address set in the address counter.

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18 Notes: 1. Character code bits 0 to 2 correspond to CGRAM address bits 3 to 5 (3 bits: 8 types). 2. CGRAM address bits 0 to 2 designate the character pattern line position. The 8th line is the cursor position and its display is formed by a logical OR w ith the cursor. Maintain the 8th line data, corresponding to the cursor display position, at 0 as the cursor display. If the 8th line data is 1, 1 bit w ill light up the 8th line regardless of the cursor presence. 3. Character pattern row positions correspond to CGRAM data bits 0 to 4 (bit 4 being at the left). 4. As shown Table 4, CGRA M character patterns are selected w hen character code bits 4 to 7 are all 0. How ever, since character code bit 3 has no effect, the R display example above can be selected by either character code 00H or 08H for CGRA M data corresponds to display selection and 0 to non-selection, - Indicates no effect. 6. Different OPR1/2 ITO option can select different CGRA M size.

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20 Instructions There are four categories of instructions that: Designate ST7032 functions, such as display format, data length, etc. Set internal RAM addresses Perform data transfer with internal RAM Others

21 instruction table at Normal mode Ø instruction table at Extension mode (w hen EXT option pin connect to VSS, the instruction set follow below table)

22 7.Instruction Description Clear all the display data by w riting "20H" (space code) to all DDRAM address, and set DDRAM address to "00H" into AC (address counter). Return cursor to the original status, namely, bring the cursor to the left edge on first line of the display. Make entry mode increment ( I/D = "1"). Return Home is cursor return home instruction. Set DDRA M address to "00H" into the address counter. Return cursor to its original site and return display to its original status, if shifted. Contents of DDRAM do not change. Set the moving direction of cursor and display. Ø I/D : Increment / decrement of DDRAM address (cursor or blink) When I/D = "High", cursor/blink moves to right and DDRAM address is increased by 1. When I/D = "Low ", cursor/blink moves to left and DDRA M address is decreased by 1. * CGRAM operates the same as DDRAM, w hen read from or w rite to CGRAM. Ø S: Shift of entire display When DDRAM read ( CGRA M read/w rite) operation or S = "Low ", shift of entire display is not performed. If S = "High" and DDRAM w rite operation, shift of entire display is performed according to I/D value ( I/D = "1": shift left, I/D = "0" : shift right).

23 Control display/cursor/blink ON/OFF 1 bit register. Ø D : Display ON/OFF control bit When D = "High", entire display is turned on. When D = "Low ", display is turned off, but display data is remained in DDRAM. Ø C : Cursor ON/OFF control bit When C = "High", cursor is turned on. When C = "Low ", cursor is disappeared in current display, but I/D register remains its data. Ø B : Cursor Blink ON/OFF control bit When B = "High", cursor blink is on, that performs alternate betw een all the high data and display character at the cursor position. When B = "Low ", blink is off. Ø S/C: Screen/Cursor select bit When S/C= High, Screen is controlled by R/L bit. When S/C= Low, Cursor is controlled by R/L bit.

24 Ø R/L: Right/Left When R/L= High, set direction to right. When R/L= Low, set direction to left. Without w riting or reading of display data, shift right/left cursor position or display. This instruction is used to correct or search display data. During 2-line mode display, cursor moves to the 2nd line after 40th digit of 1st line. Note that display shift is performed simultaneously in all the line. When displayed data is shifted repeatedly, each line shifted individually. When display shift is performed, the contents of address counter are not changed. Ø DL : Interface data length control bit When DL = "High", it means 8-bit bus mode w ith MPU. When DL = "Low ", it means 4-bit bus mode w ith MPU. So to speak, DL is a signal to select 8-bit or 4-bit bus mode. When in 4-bit bus mode, it needs to transfer 4-bit data by tw o times. Ø N : Display line number control bit When N = "High", 2-line display mode is set. When N = "Low ", it means 1-line display mode. Ø DH : Double height font type control bit When DH = " High " and N= Low, display font is selected to double height mode(5x16 dot),ra M address can only use 00H~27H. When DH= High and N= High, it is forbidden. When DH = " Low ", display font is normal (5x8 dot).

25 Ø IS : normal/extension instruction select When IS= High, extension instruction be selected (refer extension instruction table) When IS= Low, normal instruction be selected (refer normal instruction table) Set CGRA M address to AC. This instruction makes CGRAM data available from MPU. Set DDRA M address to AC. This instruction makes DDRA M data available from MPU. When 1-line display mode (N = 0), DDRA M address is from "00H" to "4FH". In 2-line display mode ( N = 1), DDRAM address in the 1st line is from "00H" to "27H", and DDRAM address in the 2nd line is from "40H" to "67H".

26 When BF = High, indicates that the internal operation is being processed. So during this time the next instruction cannot be accepted. The address Counter (AC) stores DDRAM/CGRAM addresses, transferred from IR. After writing into (reading from) DDRAM/CGRAM, A C is automatically increased (decreased) by 1. Write binary 8-bit data to CGRAM, DDRAM or ICON RAM The selection of RAM from DDRA M, CGRA M or ICON RA M, is set by the previous address set instruction : DDRAM address set, CGRAM address set, ICON RAM address set. RAM set instruction can also determine the A C direction to RA M. After write operation, the address is automatically increased/decreased by 1, according to the entry mod e. Read binary 8-bit data from DDRA M/CGRA M/ICON RA M The selection of RAM is set by the previous address set instruction. If address set instruction of RAM is not performed before this instruction, the data that read first is invalid, because the direction of AC is not determined. If you read RA M data several times w ithout RAM address set instruction before read operation, you can get correct RAM data from the second, but the first data w ould be incorrect, because there is no time margin to transfer RAM data. Read data must be set address before this instruction. Ø BS: bias selection When BS= High, the bias w ill be 1/4 When BS= Low, the bias w ill be 1/5 BS w ill be invalid w hen external bias resistors are used (OPF1=1, OPF2=1) Ø F2,F1,F0 : Internal OSC frequency adjust When CLS connect to high, that instruction can adjust OSC and Frame frequency.

27 Set ICON RA M address to AC. This instruction makes ICON data available from MPU. When IS=1 at Extension mode, The ICON RAM address is from "00H" to "0FH". Ø Ion: set ICON display on/off When Ion = "High", ICON display on. When Ion = "Low ", ICON display off. Ø Bon: sw itch booster circuit Bon can only be set w hen internal follow er is used (OPF1=0, OPF2=0). When Bon = "High", booster circuit is turn on. When Bon = "Low ", booster circuit is turn off. Ø C5,C4 : Contrast set(high byte) C5,C4,C3,C2,C1,C0 can only be set w hen internal follow er is used (OPF1=0,OPF2=0).They can more precisely adjust the input reference voltage of V0 generator. The details please refer to the supply voltage for LCD driver.

28 Ø Fon: sw itch follower circuit Fon can only be set w hen internal follow er is used (OPF1=0,OPF2=0). When Fon = "High", internal follow er circuit is turn on. When Fon = "Low ", internal follow er circuit is turn off. Ø Rab2,Rab1,Rab0 : V0 generator amplified ratio Rab2,Rab1,Rab0 can only be set w hen internal follow er is used (OPF1=0,OPF2=0).They can adjust the amplified ratio of V0 generator. The details please refer to the supply voltage for LCD dr iver. Ø C3,C2,C1,C0:Contrast set(low byte) C5,C4,C3,C2,C1,C0 can only be set w hen internal follow er is used (OPF1=0,OPF2=0).They can more precisely adjust the input reference voltage of V0 generator. The details please refer to the supply voltage for LCD driver.

29 8. Optical Characteristics Item Symbol Condition Min Typ Max Unit View Angle (V)θ CR deg (H)φ CR deg Contrast Ratio CR Response Time T rise ms T fall ms Definition of Operation Voltage, Vop. Definition of Response Time, Tr and Tf. Intensity 100% Selected Wave Non-selected Wave Non -selected Conition Intensity Selected Conition Non-selected Conition Cr Max Cr = Lon / Loff 100% 90% 10% Vop Driving Voltage(V) Tr Tf [positive type] [positive type] Conditions: Operating Voltage : Vop Viewing Angle(θ,φ) : 0, 0 Frame Frequency: 64 HZ Driving Waveform: 1/N duty, 1/a bias Definition of viewing angle (CR 2) θf θl θb θr φ= 180 φ= 270 φ= 90 φ= 0

30 9. Absolute Maximum Ratings Item Symbol Min Typ Max Unit Operating Temperature T OP Storage Temperature T ST Supply voltage for Logic V DD V LCD Driver Voltage V LCD 7.0- V SS V SS V 10. Electrical Characteristics Item Symbol Condition Min Typ Max Unit 5 Supply Voltage For V DD -V SS (bon=1 V Logic max=3.5v) Supply Voltage For LCD V LCD Ta= V Ta= V Ta= V Input High Volt. V IH V DD - V DD V Input Low Volt. V IL V DD V Output High Volt. V OH V DD - V DD V Output Low Volt. V OL V DD V Supply Current(No include LED Backlight) I DD ma

31 11. Backlight Information Specification PARAMETER SYMBOL MIN TYP MAX UNIT TEST CONDITION Supply Current ILED ma V=3.5V Supply Voltage V V Reverse Voltage VR V - Luminous Intensity (Without LCD) IV CD/M 2 ILED=32mA Wave length λp nm ILED=32Ma LED Life Time Hr. ILED 32mA Color Yellow green Note: The LED of B/L is drive by current only;driving voltage is only for reference To make driving current in safety area (waste current between minimum and maximum). Note1 :50K hours is only an estimate for reference. LED B\L Drive Method Drive from A, K R A K B/L

32 12. Reliability Content of Reliability Test (wide temperature, -20 ~70 ) Environmental Test Test Item Content of Test Condition Note High Temperature storage Low Temperature storage High Temperature Operation Low Temperature Operation High Temperature/ Humidity Operation Thermal shock resistance Endurance test applying the high storage temperature for a long 80 2 time. 200hrs Endurance test applying the high storage temperature for a long -30 1,2 time. 200hrs Endurance test apply ing the electric stress (Voltage & Current) 70 - and the thermal stress to the element f or a long time. 200hrs Endurance test applying the electric stress under low temperature f or a long time. 200hrs The module should be allowed to stand at 60,90%RH max 60,90%RH For 96hrs under no-load condition excluding the polarizer, 1,2 96hrs Then taking it out and drying it at normal temperature. The sample should be allowed stand the f ollowing 10 cycles of operation /70-10 cycles Vibration test Static electricity test 30min 5min 30min 1 cycle fixed amplitude: 15mm Vibration. Frequency: Endurance test apply ing the v ibration during transportation and 10~55Hz. using. One cycle 60 3 seconds to 3 directions of X,Y,Z for Each 15 minutes VS=800V,RS= 1.5kΩ Endurance test apply ing the electric stress to the terminal. CS=100pF 1 time Note1: No dew condensation to be observed. Note2: The function test shall be conducted after 4 hours storage at the normal temperature and humidity after remove from the test chamber. Note3: Vibration test w ill be conducted to the product itself without putting it in a container.

33 13. Inspection specification NO Item Criterion AQL 01 Electrical Testing 1.1 Missing vertical, horizontal segment, segment contrast defect. 1.2 Missing character, dot or icon. 1.3 Display malfunction. 1.4 No function or no display. 1.5 Current consumption exceeds product specifications. 1.6 LCD viewing angle defect. 1.7 Mixed product types. 1.8 Contrast defect Black or white spots on LCD (display only) 2.1 White and black spots on display 0.25mm, no more than three white or black spots present. 2.2 Densely spaced: No more than two spots or lines within 3mm 3.1 Round type : As following drawing Φ=( x + y ) / 2 03 LCD black spots, white spots, contaminatio n (non-display) 3.2 Line type : (As following drawing) Length Width Acceptable Q TY --- W 0.02 Accept no dense L <W 0.03 L 0.03<W <W As round type 04 Polarizer bubbles If bubbles are visible, judge using black spot specifications, not easy to find, must check in specify direction. Size Φ Acceptable Q TY Φ 0.20 Accept no dense 0.20<Φ <Φ <Φ 0 Total Q TY 3

34 NO Item Criterion AQL 05 Scratches Follow NO.3 LCD black spots, white spots, contamination Symbols Define: x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length: 6.1 General glass chip : Chip on panel surface and crack between panels: 06 Chipped glass z: Chip thickness y: Chip width x: Chip length Z 1/2t Not over viewing x 1/8a area 1/2t<z 2t Not exceed 1/3k x 1/8a If there are 2 or more chips, x is total length of each chip Corner crack: z: Chip thickness y: Chip width x: Chip length Z 1/2t Not over viewing x 1/8a area 1/2t<z 2t Not exceed 1/3k x 1/8a If there are 2 or more chips, x is the total length of each chip.

35 NO Item Criterion AQL Symbols : x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: LCD side length L: Electrode pad length 6.2 Protrusion over terminal : Chip on electrode pad : y: Chip width x: Chip length z: Chip thickness y 0.5mm x 1/8a 0 < z t Non-conductive portion: 06 Glass crack y: Chip width x: Chip length z: Chip thickness y L x 1/8a 0 < z t If the chipped area touches the ITO terminal, over 2/3 of the ITO must remain and be inspected according to electrode terminal specifications. If the product will be heat sealed by the customer, the alignment mark not be damaged Substrate protuberance and internal crack. y: width x: length y 1/3L x a

36 NO Item Criterion AQL 07 Cracked The LCD with extensive crack is not acceptable. glass 08 Backlight elements 8.1 Illumination source flickers when lit. 8.2 Spots or scratched that appear when lit must be judged. Using LCD spot, lines and contamination standards. 8.3 Backlight doesn t light or color wrong Bezel 10 PCB COB 9.1 Bezel may not have rust, be deformed or have fingerprints, stains or other contamination. 9.2 Bezel must comply with job specifications COB seal may not have pinholes larger than 0.2mm or contamination COB seal surface may not have pinholes through to the IC The height of the COB should not exceed the height indicated in the assembly diagram There may not be more than 2mm of sealant outside the seal area on the PCB. And there should be no more than three places No oxidation or contamination PCB terminals Parts on PCB must be the same as on the production characteristic chart. There should be no wrong parts, missing parts or excess parts The jumper on the PCB should conform to the product characteristic chart If solder gets on bezel tab pads, LED pad, zebra pad or screw hold pad, make sure it is smoothed down The Scraping testing standard for Copper Coating of PCB Y X X * Y<=2mm 2 11 Soldering 11.1 No un-melted solder paste may be present on the PCB No cold solder joints, missing solder connections, oxidation or icicle No residue or solder balls on PCB No short circuits in components on PCB. 0.65

37 NO Item Criterion AQL 12 General appearance 12.1 No oxidation, contamination, curves or, bends on interface Pin (OLB) of TCP No cracks on interface pin (OLB) of TCP No contamination, solder residue or solder balls on product The IC on the TCP may not be damaged, circuits. 1 The uppermost edge of the protective strip on the interface pin must be present or look as if it causes the interface pin to sever The residual rosin or tin oil of soldering (component or chip component) is not burned into brown or black color Sealant on top of the ITO circuit has not hardened Pin type must match type in specification sheet LCD pin loose or missing pins Product packaging must the same as specified on packaging specification sheet Product dimension and structure must conform to product specification sheet Precautions in use of LCD Modules 1. Avoid applying excessive shocks to the module or making any alterations or modifications to it. 2. Don t make extra holes on the printed circuit board, modify its shape or change the components of LCD module. 3. Don t disassemble the LCM. 4. Don t operate it above the absolute maximum rating. 5. Don t drop, bend or twist LCM. 6. Soldering: only to the I/O terminals. 7. Storage: please storage in anti-static electricity container and clean environment. 8. have the right to change the passive components (Resistors,capacitors and other passive components will have different appearance and color caused by the different supplier.) 9. have the right to change the PCB Rev.

38 15. Material List of Components for RoHs 1. hereby declares that all of or part of products, including, but not limited to, the LCM, accessories or packages, manufactured and/or delivered to your company (including your subsidiaries and affiliated company) directly or indirectly by our company (including our subsidiaries or affiliated companies) do not intentionally contain any of the substances listed in all applicable EU directives and regulations, including the following substances. Exhibit A:The Harmful Material List Material (Cd) (Pb) (Hg) (Cr6+) PBBs PBDEs Limited Value ppm ppm ppm ppm ppm ppm Above limited value is set up according to RoHS. 2. Process for RoHS requirement: (1) Use the Sn/Ag/Cu soldering surface;the surface of Pb-free solder is rougher than we used before. (2) Heat-resistance temp.: Reflow:250, 30 seconds Max.; Connector soldering wave or hand soldering:320, 10 seconds max. (3) Temp. curve of reflow, max. Temp.:235±5 ; Recommended customer s soldering temp. of connector:280, 3 seconds. 16. Recommendable storage 1. Place the panel or module in the temperature 25 C±5 C and the humidity below 65% RH 2. Do not place the module near organics solvents or corrosive gases. 3. Do not crush, shake, or jolt the module