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1 Midas Components Limited Electra House 32 Southtown Road Great Yarmouth Norfolk NR31 0DU England Telephone +44 (0) Fax +44 (0) Website Specification Part Number: Version: Date: Revision No. Date Description Item Page

2 Contents Page 2. General Specification 4 3. Module Coding System 5 4. Interface Pin Function 6 5. Outline dimension & Block Diagram 8 6. AC Characteristics 9 7. Optical Characteristics Absolute Maximum Ratings Electrical Characteristics Backlight Information Inspection specification Precautions in use of LCD Modules Material List of Components for RoHs 22

3 2. General Specification This technical specification applies to 7 TFT-LCD module with a LED Backlight unit and a 40-pin TTL interface. This module supports 800*R.G.B x 480 WVGA mode and can display 262,144 colors. Dot Matrix: 800xRGBx 480 Module dimension: 165.0x x 5.7(max.) mm 3 Active Area : 152.4x mm 2 Pixel Size:190.5 x um LCD type: TFT, Negative, Transmissive View direction: 6 o clock Backlight Type: LED, Normally White

4 Midas Active Matrix Display Part Number System MC T 057 A 6 * W L M L * * * * * = MC: Midas Components 2 = T: TFT A: Active Matrix OLED 3 = Size 4 = Series 5 = Viewing Angle: 6: 6 O clock 12: 12 O clock O: All round 6 = Blank: No Touch T: Resistive Touchscreen C: Capacitive Touchscreen 7 = Operating Temp Range: S: 0 to 50Deg C B: Deg C W: Deg C E: Deg C 8 = No of Pixels 9 = Orientation: P: Portrait L: Landscape 10 = Mode: R: Reflective M: Transmissive T: Transflective S: Sunlight Readable (transmissive) W: White on Black (Monochrome) 11 = Backlight: Blank: None L: LED C: CCFL 12 = Blank: No Module/board C: Controller board module 13 = Blank: None V: Video 14 = Blank: None B: Bracket 15 = Blank: None H: Host Cable 16 = Blank: None K: Keyboard F/Displays/Midas Brand/Midas Active Matrix Display Part Number System 09 Nov 2011.doc

5 4. Interface Pin Function 4.1 LCM PIN Definition Pin Symbol Description Remark 1 GND Power ground 2 GND Power ground 3 NC Not connect 4 VCC Power supply for Digital Circuit 5 VCC Power supply for Digital Circuit 6 VCC Power supply for Digital Circuit 7 VCC Power supply for Digital Circuit 8 NC Not connect 9 DE Data enable signal 10 GND Power ground 11 GND Power ground 12 GND Power ground 13 B5 Blue Data 5 (MSB) 14 B4 Blue Data 4 15 B3 Blue Data 4 16 GND Power g round 17 B2 Blue Data 2 18 B1 Blue Data 1 19 B0 Blue Data 0 (LSB) 20 GND Power ground 21 G5 Green Data 5 (MSB) 22 G4 Green Data 4 23 G3 Green Data 4 24 GND Power ground 25 G2 Green Data 2 26 G1 Green Data 1 27 G0 Green Data 0 (LSB) 28 GND Power ground 29 R5 Red Data 5 (MSB) 30 R4 Red Data 4 31 R3 Red Data 4 32 GND Power ground 33 R2 Red Data 2 34 R1 Red Data 1 35 R0 Red Data 0 (LSB) 36 GND Power ground 37 GND Power ground 38 DCLK Clock Signals; Latch Data at the falling edge 39 GND Power ground 40 GND Power ground Note: User s connector part number is PF050-40ZSG-F09-S manufactured by UJU or equivalent

6 4.2 Backlight Driving Part Pin No. Symbol Description 1 VLED+ Red, LED_ Anode 2 VLED- White, LED_ Cathode Note: The backlight interface connector is a model BHSR-02VS-1manufactured by JST or equivalent. The matching connector part number is SM02B-BHSS-1-TB manufactured by JST or equivalent.

7 5. Outline Dimension & Block Diagram Page 8, Total 24 Pages

8 6. AC Characteristics 6.1 AC Electrical CHARATERISTICS Frame rate range:60hz~65hz Parameter Symbol Rating Min TYP max Unit Data setup time Data hold time DE setup time Tdsu 6 ns Tdhd 6 ns Tesu 6 ns CLK frequency CLK period FCPH TCPH MHz ns CLK pulse duty TCWH % CLK pulse duty Tcwl % DE period TDEH+TDEL TCPH DE pulse width TDEH 800 TCPH DE frame blanking TDEB TDEH+TDEL DE frame width TDE 480 TDEH+TDEL Note:We suggest using the typical value, so it can have better performance.

9 6.2Timing Controller Timing Chart Clock and Data input waveforms Data input format

10 Power ON/OFF sequence

11 7. OPTICAL CHARATERISTIC Note 1: Definition of viewing angle range Definition of viewing angle Note 2: Test equipment setup: After stabilizing and leaving the panel alone at a driven temperature for 10 minutes, the measurement should be executed. Measurement should be executed in a stable, windless, and dark room. Optical specifications are measured by Topcon BM-7 luminance meter 1.0 field of view at a distance of 50cm and normal direction.

12 Optical measurement system setup Note 3: Definition of Response time: The response time is defined as the LCD optical switching time interval between White state and Black state. Rise time, Tr, is the time between photo detector output intensity changed from 90 % to 10 %. And fall time, Tf, is the time between photo detector output Intensity changed from10 % to 90 %. Note 4: Definition of contrast ratio: The contrast ratio is defined as the following expression.

13 Note 5: White Vi = Vi50 ± 1.5V Black Vi = Vi50 ± 2.0V ± means that the analog input signal swings in phase with VCOM signal. ± means that the analog input signal swings out of phase with VCOM signal. The 100% transmission is defined as the transmission of LCD panel when all the input terminals of module are electrically opened. Note 6: Definition of color chromaticity (CIE 1931) Color coordinates measured at the center point of LCD Note 7: Measured at the center area of the panel when all the input terminals of LCD panel are electrically opened.

14 8. Absolute Maximum Ratings Item Symbol Min Typ Max Unit Operating Temperature T OP Storage Temperature T ST Item Symbol Condition Min. Max. Unit Remark Power Voltage Vcc GND= V - Input logic Vi GND=0-0.3 Vcc+0.3 V Note 1 Note 1: DCLK, DE, R0~ R5, G0~ G5, B0~ B5. 9. Electrical Characteristics Recommended Operation condition (GND=0 Ta=25_) Rating Parameter Symbol Min TYP max Unit Condition Power Supply VCC V Input logic High level Vih 0.7Vcc vcc V Note1 voltage Low level vil 0 0.3vcc V Note1 Note 1: DCLK, DE, R0~ R5, G0~ G5, B0~ B5.

15 10. Backlight Information Specification Parameter Symbol Min. Typ. Max. Unit Remark LED current ILED ma Note 1 LED voltage VLED V LED Life Time - 10,000 20,000 - Hr Note 2 Note 1 : There are 8 Groups LED shown as below, VLED=9.9V, ILED=160mA. Note 2 : Brightess to be decreased to 50% of the initial value. TFT-LCD current consumption Rating Parameter Symbol Min TYP max Unit Condition LCD power current Icc ma black pattern LED power current ILED ma

16 11. Inspection specification NO Item Criterion AQL 1.1 Missing vertical, horizontal segment, segment contrast defect. 1.2 Missing character, dot or icon. 1.3 Display malfunction LCD viewing angle defect. 1.7 Mixed product types. 1.8 Contrast defect. Electrical 1.4 No function or no display. Testing 1.5 Current consumption exceeds product specifications. 02 Black or white spots on LCD (display only) 2.1 White and black spots on display 0.25mm, no more than three white or black spots present. 2.2 Densely spaced: No more than two spots or lines within 3mm 3.1 Round type : As following drawing Φ=( x + y ) / 2 03 LCD black spots, white spots, contaminatio n (non-display) 3.2 Line type : (As following drawing) Length Width Acceptable Q TY --- W 0.02 Accept no dense L <W 0.03 L 0.03<W <W As round type 04 Polarizer bubbles If bubbles are visible, judge using black spot specifications, not easy to find, must check in specify direction. Size Φ Acceptable Q TY Φ 0.20 Accept no dense 0.20<Φ <Φ <Φ 0 Total Q TY 3

17 NO Item Criterion AQL 05 Scratche s Follow NO.3 black spots, bright spots, contamination Symbols Define: x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: OLED side length L: Electrode pad length: 6.1 General glass chip : Chip on panel surface and crack between panels: 06 Chipped glass z: Chip y: Chip width x: Chip length thickness Z 1/2t Not over x 1/8a viewing area 1/2t<z 2t Not exceed 1/3k x 1/8a If there are 2 or more chips, x is total length of each chip Corner crack: z: Chip y: Chip width x: Chip length thickness Z 1/2t Not over x 1/8a viewing area 1/2t<z 2t Not exceed 1/3k x 1/8a If there are 2 or more chips, x is the total length of each chip.

18 NO Item Criterion AQL Symbols : x: Chip length y: Chip width z: Chip thickness k: Seal width t: Glass thickness a: OLED side length L: Electrode pad length 6.2 Protrusion over terminal : Chip on electrode pad : y: Chip width x: Chip length z: Chip thickness y 0.5mm x 1/8a 0 < z t Non-conductive portion: 06 Glass crack y: Chip width x: Chip length z: Chip thickness y L x 1/8a 0 < z t If the chipped area touches the ITO terminal, over 2/3 of the ITO must remain and be inspected according to electrode terminal specifications. If the product will be heat sealed by the customer, the alignment mark not be damaged Substrate protuberance and internal crack. y: width x: length y 1/3L x a

19 NO Item Criterion AQL 07 Cracked glass The OLED with extensive crack is not acceptable. 08 Bezel 9 PCB COB 8.1 Bezel may not have rust, be deformed or have fingerprints, stains or other contamination. 8.2 Bezel must comply with job specifications. 9.1 COB seal may not have pinholes larger than 0.2mm or contamination. 9.2 COB seal surface may not have pinholes through to the IC. 9.3 The height of the COB should not exceed the height indicated in the assembly diagram. 9.4 There may not be more than 2mm of sealant outside the seal area on the PCB. And there should be no more than three places. 9.5 No oxidation or contamination PCB terminals. 9.6 Parts on PCB must be the same as on the production characteristic chart. There should be no wrong parts, missing parts or excess parts. 9.7 The jumper on the PCB should conform to the product characteristic chart. 9.8 If solder gets on bezel tab pads, zebra pad or screw hold pad, make sure it is smoothed down. 9.9 The Scraping testing standard for Copper Coating of PCB Y X X * Y<=2mm 2 10 Soldering 10.1 No un-melted solder paste may be present on the PCB No cold solder joints, missing solder connections, oxidation or icicle No residue or solder balls on PCB No short circuits in components on PCB.

20 NO Item Criterion AQL 12 General appearance 12.1 No oxidation, contamination, curves or, bends on interface Pin (OLB) of TCP No cracks on interface pin (OLB) of TCP No contamination, solder residue or solder balls on product The IC on the TCP may not be damaged, circuits. 1 The uppermost edge of the protective strip on the interface pin must be present or look as if it causes the interface pin to sever The residual rosin or tin oil of soldering (component or chip component) is not burned into brown or black color Sealant on top of the ITO circuit has not hardened Pin type must match type in specification sheet LCD pin loose or missing pins Product packaging must the same as specified on packaging specification sheet Product dimension and structure must conform to product specification sheet. 12. Precautions in use of LCD Modules 1. Avoid applying excessive shocks to the module or making any alterations or modifications to it. 2. Don t make extra holes on the printed circuit board, modify its shape or change the components of LCD module. 3. Don t disassemble the LCM. 4. Don t operate it above the absolute maximum rating. 5. Don t drop, bend or twist LCM. 6. Soldering: only to the I/O terminals. 7. Storage: please storage in anti-static electricity container and clean environment.

21 13. Material List of Components for RoHs 1. Midas hereby declares that all of or part of products, including, but not limited to, the LCM, accessories or packages, manufactured and/or delivered to your company (including your subsidiaries and affiliated company) directly or indirectly by our company (including our subsidiaries or affiliated companies) do not intentionally contain any of the substances listed in all applicable EU directives and regulations, including the following substances. Exhibit A:The Harmful Material List Material (Cd) (Pb) (Hg) (Cr6+) PBBs PBDEs Limited Value ppm ppm ppm ppm ppm ppm Above limited value is set up according to RoHS. 2. Process for RoHS requirement: (1) Use the Sn/Ag/Cu soldering surface;the surface of Pb-free solder is rougher than we used before. (2) Heat-resistance temp.: Reflow:250, 30 seconds Max.; Connector soldering wave or hand soldering:320, 10 seconds max. (3) Temp. curve of reflow, max. Temp.:235±5 ; Recommended customer s soldering temp. of connector:280, 3 seconds.