DATA SHEET. GaAs MMIC SP8T SWITCH FOR MOBILE COMMUNICATIONS

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1 GaAs INTEGRATED CIRCUIT upg2193t6e GaAs MMIC SP8T SWITCH FOR MOBILE COMMUNICATIONS DESCRIPTION The upg2193t6e is a GaAs MMIC SP8T Switch with SPI control function, which was developed for GSM triple band and W-CDMA triple band applications. The upg2193t6e can operate with voltages from 2.5V-3.0V, with low insertion loss, high isolation, and high linearity. This device is housed in a 20-pin TQFN (Thin Quad Flat Non-leaded) package, and is suitable for high-density surface mounting. FEATURES Supply Voltage : Vdd = 2.5 to 3.0V 2.775V TYP. Serial Peripheral Interface SPI Supply Voltage : AUX SPI_VDD(H) = 1.5 to 3.0V 1.8V TYP. : AUX SPI_VDD(L) = -0.3 to 0.3V 0V TYP. Low Insertion Loss : = 0.4dB : = 0.6dB Harmonics : 2f0 = -80dBc TYP.@ GSM_LB / HB_TX, 50ohm : 3f0 = -80dBc TYP.@ GSM_LB / HB_TX, 50ohm : 2f0 = -70dBc TYP.@, 34.5dBm, VSWR=4:1 : 3f0 = -70dBc TYP.@, 34.5dBm, VSWR=4:1 High-density surface mounting : 20-pin TQFN package mm APPLICATION Antenna switch for Mobile Communications ORDERING INFORMATION DATA SHEET Part Number Order Number Package Marking Supplying Form upg2193t6e E2 upg2193t6e E2 A 20-pin plastic TQFN Pb-Free Remark To order evaluation samples, contact your nearby sales office. Part number for sample order : upg2193t6e-a G2193 Embossed tape 12 mm wide Pin 16 to 20 face the perforation side of the tape Qty 5 kpcs/reel CAUTION: Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. The irmation in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Document No. PG*****EJW2V0DS ( 2nd edition) Date Published January 2009 C NEC Electronics Corporation 2008

2 PIN CONNECTIONS (Top View) MARKING (Top View) 2193 K806 Pin No. Pin Name Pin No. Pin Name 1 ANT 11 WCDMA_1 2 GND 12 GND 3 GSM_RX_ GSM_RX_2 14 GND 5 GSM_RX_ GND 16 AUX_SPI_VDD 7 WCDMA_3 17 SPI_DATA 8 GND 18 SPI_CLK 9 WCDMA_2 19 SPI_CS 10 GND 20 Pin No. 21; EXPOSED PAD : GND 2 Data Sheet

3 Truth Table ( SPI Address Definition ) Bit Function Set Description 29 Read/Write mode 1 Not used for front end switch 0 Write to the switch 28 Address used for front end switches 27 (Slave Type) Address =FE switch module for single antenna radios. 24 (Slave Identifier) Address 0 Only one SPI register will be used on the front end switch 19 (Slave SPI register) DCDC converter enable 1/0 A logic high enables the DCDC converter (if applicable) FE Select 4 = MSB FE Select 3 FE Select 2 FE Select 1 = LSB 0000 Switch Disabled (low current mode) 0001 enable 0010 enable 0011 Not Used / Reserved 0100 GSM_RX_1 enable 0101 GSM_RX_2 enable 0110 GSM_RX_3 enable 0111 Not Used / Reserved 1000 WCDMA_1 enable 1001 WCDMA_2 enable 1010 WCDMA_3 enable Not Used / Reserved 10 Not Used X Not Used / Reserved 9 Not Used X Not Used / Reserved 8 Not Used X Not Used / Reserved 7 Not Used X Not Used / Reserved 6 Not Used X Not Used / Reserved 5 Not Used X Not Used / Reserved 4 Not Used X Not Used / Reserved 3 Not Used X Not Used / Reserved 2 Not Used X Not Used / Reserved 1 Not Used X Not Used / Reserved 0 Not Used X Not Used / Reserved Data Sheet 3

4 Timing Chart (SPI Control) On a write command to the device with address bots A15 through A0 set to all 1 s, the device shall revert to the default state. The default state of this device is the deep sleep mode. Bit Function Set Description 29 Read/Write mode 0 Logic low command puts device in read mode 28 Address used for global write 27 (Slave Type) Address used for global write 24 (Slave Identifier) Command 1/0 A transmission of "11111" must put the switch into standby mode 19 1/0 18 1/0 17 1/0 16 1/0 15 DCDC converter enable 1/0 A logic high enables the DCDC converter (if applicable). 14 Not Used X Data bit must be ignored during Global Command Write 13 Not Used X Data bit must be ignored during Global Command Write 12 Not Used X Data bit must be ignored during Global Command Write 11 Not Used X Data bit must be ignored during Global Command Write 10 Not Used X Data bit must be ignored during Global Command Write 9 Not Used X Data bit must be ignored during Global Command Write 8 Not Used X Data bit must be ignored during Global Command Write 7 Not Used X Data bit must be ignored during Global Command Write 6 Not Used X Data bit must be ignored during Global Command Write 5 Not Used X Data bit must be ignored during Global Command Write 4 Not Used X Data bit must be ignored during Global Command Write 3 Not Used X Data bit must be ignored during Global Command Write 2 Not Used X Data bit must be ignored during Global Command Write 1 Not Used X Data bit must be ignored during Global Command Write 0 Not Used X Data bit must be ignored during Global Command Write DISABLING THE SWITCH: The switch can be disabled in two ways. Either the appropriate SPI command can be sent, or AUX_SPI_VDD can be sent low. POWER ON RESET: Assuming the V supply is already on when AUX_SPI_VDD is powered up, the switch should revert to the default state, which is the deep sleep mode. If the deep sleep mode corresponds to a port being connected to the antenna, it should be Rx1. If a DCDC converter is used, it should be shut off. If AUX_SPI_VDD comes up before the V supply, the POR should occur as soon as both signals are high. In any case, where the AUX_SPI_VDD is low, the chip should be powered off. (NOTE: Deep sleep mode, powered off, low current mode, and standby mode all mean the same thing) 4 Data Sheet

5 ASOLUTE MAXIMUM RATINGS Unless otherwise specified, TA = +25 Parameter Symbol Ratings Unit Supply Voltage VDD 3.2 V Switch Control Voltage AUX_SPI_VDD VC 3.2 V Input Power1 Pin TX +36 dbm Input Power2 Pin RX +23 dbm Operating Ambient Temperature TA -30 to +85 Storage Temperature Tstg -55 to +150 RECOMMENDED OPERATING RANGE Unless otherwise specified, TA = +25 Parameter Pin Symbol MIN. TYP. MAX. Unit Switch Supply Voltage VDD VDD V SPI Supply Voltage (High) SPI Supply Voltage (Low) SPI Control Input Voltage High SPI Control Input Voltage Low SPI Control Enable CLK frequency AUX_SPI_VDD SPI_CS SPI_CLK SPI_DATA AUX_SPI_VDD AUX_SPI_VDD VC_HI VC_LO SPI_en SPI_CLK V V AUX_SPI_VDD x80% 1.8 AUX_SPI_VDD AUX_SPI_VDD x20% us MHz V V Data Sheet 5

6 ELECTRICAL CHARACTERISTICS TA = +25, VDD = 2.5 to 3.0V, Zo=50ohms, DC blocking capacitor = 22pF, with ESD protection circuit, Unless otherwise specified Parameter Symbol Frequency MHz Insertion Loss WCDMA_1 WCDMA_2 WCDMA_3 GSM_RX1 GSM_RX2 GSM_RX3 Parameter Symbol Frequency MHz Insertion Loss WCDMA_1 WCDMA_2 WCDMA_3 Pin dbm Measured Path MIN. TYP. MAX. UNIT 824 to (Pin15) db 1710 to (Pin13) db 824 to WCDMA_1 (Pin11) or db 1710 to WCDMA_2 (Pin9) or WCDMA_3 (Pin7) db 1920 to db 869 to GSM_RX1 (Pin5) or GSM_RX2 (Pin4) or GSM_RX3 (Pin3) db 1805 to GSM_RX1 (Pin5) db 1805 to GSM_RX2 (Pin4) db 1805 to GSM_RX3 (Pin3) db ELECTRICAL CHARACTERISTICS TA = -30 to +85, VDD = 2.5 to 3.0V, Zo=50ohms, DC blocking capacitor = 22pF, with ESD protection circuit, Unless otherwise specified GSM_RX1 GSM_RX2 GSM_RX3 Pin dbm Measured Path MIN. TYP. MAX. UNIT 824 to (Pin15) db 1710 to (Pin13) db 824 to WCDMA_1 (Pin11) or db 1710 to WCDMA_2 (Pin9) or WCDMA_3 (Pin7) db 1920 to db 869 to GSM_RX1 (Pin5) or GSM_RX2 (Pin4) or GSM_RX3 (Pin3) db 1805 to GSM_RX1 (Pin5) db 1805 to GSM_RX2 (Pin4) db 1805 to GSM_RX3 (Pin3) db 6 Data Sheet

7 ELECTRICAL CHARACTERISTICS TA = +25, DC blocking capacitor = 22pF, with ESD protection circuit, Unless otherwise specified Parameter Symbol Frequency MHz Condition Harmonics (50ohms) Harmonics (VSWR= 4:1 on ANT port) Transient Harmonics (50ohms) WCDMA_1,2,3 3fo WCDMA_1,2,3 3fo WCDMA_1,2,3 3fo WCDMA_1,2,3 824 to 1980 VDD=2.775V 824 to 833 VDD=2.775V 1710 to to to to 1980 VDD=2.775V 824 to 833 VDD=2.775V 1710 to to to to to 833 Pin dbm WCDMA_1 (Pin11) or WCDMA_2 (Pin9) or WCDMA_3 (Pin7) WCDMA_1 (Pin11) or WCDMA_2 (Pin9) or WCDMA_3 (Pin7) Measured Path MIN. TYP. MAX. UNIT dbc dbc (Pin13) dbc (Pin15) dbc (Pin15) dbc WCDMA_1 (Pin11) or WCDMA_2 (Pin9) or WCDMA_3 (Pin7) WCDMA_1 (Pin11) or WCDMA_2 (Pin9) or WCDMA_3 (Pin7) dbc dbc (Pin13) dbc (Pin15) dbc +0 (Pin13) dbc +0 (Pin15) dbc +0 (Pin15) dbc Data Sheet 7

8 ELECTRICAL CHARACTERISTICS TA = -30 to +85, VDD = 2.5 to 3.0V, Zo=50ohm, DC blocking capacitor = 22pF, with ESD protection circuit, Unless otherwise specified Parameter Symbol Frequency MHz Condition Forward Return Loss Forward Forward WCDMA_1,2,3 WCDMA_1 WCDMA_2 WCDMA_3 Return Loss ANT to any port Return Loss WCDMA_1,2,3 To ANT Return Loss to ANT Return Loss to ANT Pin dbm 824 to Any RF port except 1710 to Any RF port except ON Path Measured Path MIN. TYP. MAX. UNIT (Pin15) to ANT (Pin1) (Pin13) to ANT (Pin1) db db 824 to WCDMA_1 or 2 or 3 WCDMA_1 or 2 or db 960 to 1980 to Any RX port db 1710 to (Pin13) to ANT (Pin1) 1710 to (Pin13) to ANT (Pin1) 824 to (Pin15) to ANT (Pin1) to Any RX port to WCDMA1 to WCDMA2 to WCDMA3 to Any RX port to Any WCDMA port db db db db db db 824 to WCDMA_1 WCDMA_1 to db WCDMA_2 960 to 1980 WCDMA_1 to WCDMA_ db 824 to WCDMA_2 WCDMA_2 to db WCDMA_3 960 to 1980 WCDMA_2 to WCDMA_ db 824 to WCDMA_3 WCDMA_3 to db WCDMA_1 960 to 1980 WCDMA_3 to WCDMA_ db 824 to ANT (Pin1) to any port db 824 to WCDMA_1 or WCDMA_2 or WCDMA_3 to ANT (Pin2) db 1710 to (Pin13) db 824 to (Pin15) db Return Loss ANT to any GSM_RX 869 to ANT (Pin1) to any GSM_RX db 8 Data Sheet

9 ELECTRICAL CHARACTERISTICS TA = -30 to +85, VDD = 2.5 to 3.0V, Zo=50ohm, DC blocking capacitor = 22pF, with ESD protection circuit, Unless otherwise specified Parameter Symbol Frequency MHz IIP2 IMD2_out IIP3 IMD3_out Spectrum Emissions Switching Speed IIP2 WCDMA1,2,3 IMD2 WCDMA1,2,3 IIP3 WCDMA1,2,3 IMD3 WCDMA1,2,3 Spectrum Emissions WCDMA1,2,3 Spectrum Emissions WCDMA1,2,3 Spectrum Emissions Spectrum Emissions Spectrum Emissions GSM_RX tsw Refer to Table1 Refer to Table1 Pin dbm Ptx= +20 Pint=-15 Ptx= +20 Pint= to (CW) 869 to 2170 RBW= 3.84MHz ON Path Measured Path MIN. TYP. MAX. UNIT WCDMA1 or WCDMA2 or WCDMA3 WCDMA1 or WCDMA2 or WCDMA3 WCDMA1 or WCDMA2 or WCDMA dbm dbm dbm dbm dbc ANT to WCDMA1 or 2 or dbm 1710 to to ANT dbc 824 to to ANT dbc 869 to 1990 RBW= 180 khz Any path transition Time from SPI frame low to RF turn on Turn on time Turn on time Any path From 10% to 90% of full DC/DC converter voltage Supply Current Standby Current SPI Control Current SPI Line Capacitance ANT to any GSM_RX dbm us us IDD1 Active mode, DC/DC converter on ua IDD2 Active mode, DC/DC converter off ua IDD_stb Standby mode ua SPI_IDD During SPI read (VDD<2.1V) ua SPI_IDD During SPI read (2.1V VDD 3.0V) ua SPI_C Capacitance on SPI data line pf Data Sheet 9

10 FUNCTIONAL BLOCK DIAGRAM TABLE1. FREQUENCY CONDITIONS FOR IMD TESTING IP2 Test TX RX Duplex RX/2 BAND FTX FTX FRX FRX FINT2 FINT2 FINT1 LOW HIGH LOW HIGH LOW HIGH B B B B B B IP3 Test TX RX Duplex RX/3 BAND FTX LOW FTX HIGH FRX LOW FRX HIGH FINT1 LOW FINT1 HIGH FINT2 LOW FINT2 HIGH B B B B B B Data Sheet

11 APPLICATION CIRCUIT DIAGRAM (Recommend) (Recommend) ESD protection circuit Note: 1000pF Vdd decoupling cap to be placed near Vdd pin of the antenna switch to improve spurious emissions. The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. Data Sheet 11

12 PACKAGE DIMENSIONS 20-PIN PLASTIC RQFN UNIT: mm Bottom View Side View Data Sheet

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