Maintenance/ Discontinued

Transcription

1 ICs for Information Equipment AN8612NSB SCSI active terminator IC Overview The AN8612NSB is a terminator IC conformed to standard interface specification (SCSI-I/II) for personal computers, workstations and various types of information equipment. So far configured with a fixed resistor and a regulator, it has recently been integrated onto a single chip with built-in standby function. It is easy to satisfy 25 pf of the maximum pin capacitance in SCSI-II specification due to its small output pin capacitance. It can sapport 10 Mbyte/s of SCSI-II and 20 Mbyte/s of FAST-20. Features Active termination for 18-signal line Low power consumption due to its standby function (100 µa at standby). Small output pin capacitance: 3.8 pf (typ.) High precision regulator: 2.85 V±60 mv Applications SCSI interface board of PC SCSI-compatible equipment such as CD-ROM, MO, PD, MD drive and printer Package HSOP030-P-0300A includes following four Product lifecycle stage. Publication date: June 2006 SDF00007CEB 1

2 Block Diagram V TERMPWR 1 Band gap reference Thermal shut down 18 SG line1 17 SG line2 16 SG line3 15 SG line4 14 SG line5 11 SG line6 10 SG line7 9 SG line8 8 SG line9 7 SG line10 5 SG line11 4 SG line12 3 SG line13 2 SG line14 23 SG line15 22 SG line16 21 SG line17 20 SG line18 includes following four Product lifecycle stage SDF00007CEB

3 Pin Descriptions Pin No. 1 * 1 2 SG line14 3 SG line13 4 SG line12 5 SG line11 6 * 2 Fin * 2 7 SG line10 8 SG line9 9 SG line8 10 SG line7 11 SG line6 Description 12 (TERMPWR) * 3 Pin No. Description 13 (TERMPWR) * 3 14 SG line5 15 SG line4 16 SG line3 17 SG line2 18 SG line1 Fin * 2 19 *2 20 SG line18 21 SG line17 22 SG line16 23 SG line15 24 Note) *1: A standby pin input voltage becomes an active mode at V I < V TH and a standby mode at V I > V TH+. Likewise, a standby mode when standby pin is open. *2: Both ground pins of the pin 6 and pin 19 should be placed on the same pattern, and the pattern should be wide on the PCB. (We recommend that whole surface of one layer of a multi-layer PCB be.) *3: Connect the to SCSI termination resistor power supply (TERMPWR). Absolute Maximum Ratings Parameter Symbol Rating Unit Supply voltage 6.0 V Supply current I CC 550 ma Power dissipation *2 P D 412 mw Operating ambient temperature * 1 Storage temperature * 1 Recommended Operating Range T opr 20 to +75 C T stg 55 to +150 C Note) *1: Except for the power dissipation, operating ambient temperature and storage temperature, all ratings are for T a = 25 C. *2: T a = 75 C. For the independent IC without a heat sink. Refer to " Application Notes". includes following four Product lifecycle stage. Parameter Symbol Range Unit Supply voltage 4.0 to 5.5 V SDF00007CEB 3

4 Electrical Characteristics at = 5.0 V, T a = 25 C Parameter Symbol Conditions Min Typ Max Unit Supply current 1 I CC1 = low, all SG line = open ma Supply current 2 I CC2 = low, All SG line = 0.2 V ma Supply current 3 I CC3 = open µa pin low-level input I STBYL = 5.5 V, V I = 0 V µa current pin high-level input I STBYH = 5.5 V, V I = 5.5 V 1 µa current pin positive direction V TH V threshold voltage pin negative direction V TH V threshold voltage Maximum output current I SG V SG = 0.2 V ma Output leak current 1 I LK1 = 5.5 V 1 µa = open, V SG = 0 V Output leak current 2 I LK2 = 5.5 V, V SG = 2.85 V 1 1 µa = open put voltage 1 V REG1 = 4.0 V to 5.5 V, all SG line = open V put voltage 2 V REG2 = 3.2 V, all SG line = open 2.00 V Termination resistance value R SG I SG = 5 ma to 15 ma Ω High-level output voltage V SGH = 4.0 V to 5.5 V, all SG line = open V Design reference data Note) The characteristics listed below are theoretical values based on the IC design and are not guaranteed. Parameter Symbol Conditions Min Typ Max Unit pin hysteresis width V HYS 200 mv Output pin capacitance C SG pf Thermal shutdown temperature T TSD 170 C Terminal Equivalent Circuits Pin No. Symbol Equivalent circuit 1 includes following four Product lifecycle stage. 100 kω 1 4 SDF00007CEB

5 Terminal Equivalent Circuits (continued) Pin No. Symbol Equivalent circuit 2 Pin 2: SG line14 3 Pin 3: SG line13 4 Pin 4: SG line12 5 Pin 5: SG line11 6 Fin 7 Pin 7: SG line10 8 Pin 8: SG line9 9 Pin 9: SG line8 10 Pin 10: SG line7 11 Pin 11: SG line6 12 Pin 12: (TERMPWR) 13 Pin 13: (TERMPWR) 14 Pin 14: SG line5 15 Pin 15: SG line4 16 Pin 16: SG line3 17 Pin 17: SG line2 18 Pin 18: SG line Pin Pin includes following four Product lifecycle stage. Pin SDF00007CEB 5

6 Terminal Equivalent Circuits (continued) Pin No. Symbol Equivalent circuit Fin Pin 20: SG line18 21 Pin 21: SG line17 22 Pin 22: SG line16 23 Pin 23: SG line15 24 Application Notes P D T a curves of HSOP030-P-0300 Power dissipation P D (mw) P D T a R th(j-c) = 29.5 C/W Mounted on standard board (glass epoxy: 50 mm 50 mm t0.8 mm) Rth(j-a) = 93 C/W PD = mw (25 C) 20 kω Independent IC without a heat shink Rth(j-a) = 182 C/W PD = 686 mw (25 C) Pin includes following four Product lifecycle stage Ambient temperature T a ( C) 6 SDF00007CEB

7 Application Circuit Example SCSI equipment SCSI equipment SCSI equipment TERMPWR SCSI cable SG line1 AN8612NSB SG line18 TERMPWR SCSI cable SG line1 SG line18 AN8612NSB AN8612NSB TERMPWR SG line1 Terminator: Active Terminator: Terminator: Active SG line18 includes following four Product lifecycle stage. SDF00007CEB 7

8 Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. includes following four Product lifecycle stage.