Report on the Activities of the Association in the 14

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1 Report on the Activities of the Association in the 14 th Term Presented by: Katherine Voss, Executive Director - ODVA Rich Harwell, Chief Technology Officer - ODVA General Session and Annual Meeting of Members 2011 ODVA Industry Conference & 14 th Annual Meeting page 7

2 EtherNet/IP Workshops North America (6X) Europe (4X) PlugFests held North America (2X) Europe (1X) Introductory Seminar Japan (3X) Design & Development Seminar Japan (8) General Session and Annual Meeting of Members 2011 ODVA Industry Conference & 14 th Annual Meeting page 8

3 Webinar in China More that 400 Persons Were Introduced to ODVA by Skylar General Session and Annual Meeting of Members 2011 ODVA Industry Conference & 14 th Annual Meeting page 9

4 EtherNet/IP Seminars The Proven & Complete Solution Chengdu (China) Minneapolis Chicago Copenhagen Dallas Detroit Frankfurt Kolding (Denmark) Paris Philadelphia Seoul (2X) Shanghai General Session and Annual Meeting of Members 2011 ODVA Industry Conference & 14 th Annual Meeting page 10

5 Tradeshows AIMEX Korea (2X) Hannover Fair Germany (2X) SPS/IPC/Drives Show Germany (1X) General Session and Annual Meeting of Members 2011 ODVA Industry Conference & 14 th Annual Meeting page 11

6 CIP Advantage Seminars CIP College on Tour in Japan Hiroshima (2X) Kyoto Kanazawa Kumamoto Nagoya (2X) Omiya Tokyo General Session and Annual Meeting of Members 2011 ODVA Industry Conference & 14 th Annual Meeting page 12

7 Forums in China Beijing The CIP Forum Shanghai The CIP Forum Shanghai Development and Existence Smart & Sustainable Manufacturing Representative ese e from the United Nations Environment Program (UNEP) - Institute for Environment and Sustainable Development at Tongji University General Session and Annual Meeting of Members 2011 ODVA Industry Conference & 14 th Annual Meeting page 13

8 TSP in China Opened General Session and Annual Meeting of Members 2011 ODVA Industry Conference & 14 th Annual Meeting page 14

9 The ODVA Specifications Four Publication Cycles More M than 100 Enhancements Publication Cycle 2X Per Year General Session and Annual Meeting of Members 2011 ODVA Industry Conference & 14 th Annual Meeting page 15

10 Report on the Technical Activities of ODVA Organization i i and Roles Key Activities The Challenges Ahead General Session and Annual Meeting of Members 2011 ODVA Industry Conference & 14 th Annual Meeting page 16

11 Introducing the TRB New principal member Bosch Rexroth TRB representative will be added Returning principal member representatives Rudy Belliardi (Schneider) Paul Didier (Cisco) Jeff Jurs (Omron) Dave VanGompel (Rockwell) Membership elected representatives Jörgen Palmhager (HMS) Damien Leterrier (Molex) ODVA / Conformance Authority Alain Grenier General Session and Annual Meeting of Members 2011 ODVA Industry Conference & 14 th Annual Meeting page 17

12 Special Interest Groups Added Two New Special Interest Groups : - Rail Transport SIG - Energy Applications SIG Other Active SIGs: - CIP System Architecture - EtherNet/IP System Arch. - EtherNet/IP Infrastructure - EtherNet/IP Physical Layer - DeviceNet Physical Layer - CompoNet - CIP Safety - Modbus Integration - Conformance - Distributed Motion - Semiconductor - Automotive EtherNet/IP Workshop General Session and Annual Meeting of Members 2011 ODVA Industry Conference & 14 th Annual Meeting page 18

13 TRB Organization and work flow Special Special Interest Special Interest Special Group Interest Group Interest Group Group EtherNet/IP Workshop Update Specifications Set Set SIG Work Plans Technical c Review Board Submit SE Or TDE Approved ODVA SE or TDE Staff Update (TRB review) (Conformance Authority) Update Conformance Tests Policies and Procedures General Session and Annual Meeting of Members 2011 ODVA Industry Conference & 14 th Annual Meeting page 19

14 Key Activities: Advancing Industrial Ethernet Extending The EtherNet/IP Specification EtherNet/IP QuickConnect (released) IP address conflict detection (released) Fiber optic sealed connectors (released) Profile for an EtherNet/IP infrastructure switch (underway) Providing Industry Thought Leadership EtherNet/IP performance testing Security white paper Device Level Ring white paper Updating planning and installation guide (in process) General Session and Annual Meeting of Members 2011 ODVA Industry Conference & 14 th Annual Meeting page 20

15 Key Activities: Advancing Integrated Safety Extending The CIP Safety Specification Analog safety device profile Supporting analog safety objects Introduced linkages to SERCOS III CIP functionality to implement CIP Safety in SERCOS devices SERCOS functionality to support I/O and message connections General Session and Annual Meeting of Members 2011 ODVA Industry Conference & 14 th Annual Meeting page 21

16 Key Activities: Advancing Integrated Motion Enhancing CIP Motion Objects Updated Time Sync Object (Released) Enhanced Axis object (Released) Enhanced Motion Device Profile (Released) Add Motion Controller object (Underway) CIP to SERCOS gateway for motion control (Underway) General Session and Annual Meeting of Members 2011 ODVA Industry Conference & 14 th Annual Meeting page 22

17 Energy management Key Activities: Extending Markets Improve Awareness (Energy Objects: Underway) Improve Efficiency (Phase 2) Enable Profitable Transactions (Phase 3) Railway Application Define applicable device profiles (Underway) Identify Infrastructure enhancements (Underway) General Session and Annual Meeting of Members 2011 ODVA Industry Conference & 14 th Annual Meeting page 23

18 Key Activities: Maintaining Gold Standard of Conformance Maintain Conformance Test suites Updates to EtherNet/IP t/ip conformance tests t (now at CT8) Updates to DeviceNet conformance tests (CT23) Developing test plan extensions DLR Test Plan Position Sensor Object Test Plan CIP Sync Test Plan QoS Test Plan CIP Motion Test Plan Multi-port Functionality Test Plan Connection Configuration Object Test plan Originator/Scanner Test Plan General Session and Annual Meeting of Members 2011 ODVA Industry Conference & 14 th Annual Meeting page 24

19 Challenges Ahead We face key challenges individually and collectively: Addressing new market opportunities Adjacent Market Spaces: Energy management / alternative energy Global shifts in manufacturing base ODVA is proactively working to make your investment in CIP technologies pay off Increasing user needs and expectations Increasing performance and scale of applications Rapid and robust deployment Latest technologies ODVA continuously enhances specification set, user white papers and conformance capabilities Keep pace with technology change Rapidly evolving internet technologies (infrastructure / wireless/ IPV6) ODVA provide a technical community and guidance to help you make your products better General Session and Annual Meeting of Members 2011 ODVA Industry Conference & 14 th Annual Meeting page 25

20 Press Releases February 7, 2011; March 3, 2011 The result of a lengthy investigation by ODVA and its leadership into the energy needs of industry, combined with the strong interest by ODVA members to support the sustainability objectives of manufacturers. General Session and Annual Meeting of Members 2011 ODVA Industry Conference & 14 th Annual Meeting page 26

21 Read More ODVA's energy approach will offer broad situational i awareness of energy consumption and enable control strategies to optimize energy usage throughout the industrial ecosystem from the plant floor to the grid. General Session and Annual Meeting of Members 2011 ODVA Industry Conference & 14 th Annual Meeting page 27

22 Start Investigating The OEU-enabled Asset General Session and Annual Meeting of Members 2011 ODVA Industry Conference & 14 th Annual Meeting page 28

23 Press Release February 24, 2011 Users will realize significant benefits in increased availability of ODVA-compliant products under the Rexroth brand, especially those implementing the EtherNet/IP network. General Session and Annual Meeting of Members 2011 ODVA Industry Conference & 14 th Annual Meeting page 29

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