INDEX. Legend. Qseven ETX. Single Board Computer. Modular HMI & Boxed Solutions SMARC. COM Express

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3 PRODUCT GUIDE

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5 INDEX Qseven ETX Q7-B03 p.12 Q7-974 p.13 Q7-A36 p.14 Q7-928 p.16 Q7-922 p.17 μqseven μq7-a76-j p.18 μq7-962 p.19 μq7-a75-j p.20 Carrier Board CQ7-A42 p.21 Development Kit Q7 DEV KIT 2.0 p.22 Q7 STARTER KIT 2.0 p.23 SMARC SM-B69 p.26 SM-B71 p.27 ETX-A61 p.40 Single Board Computer SBC-B68-eNUC p.44 SBC-A80-eNUC p.45 SBC-B47-eNUC p.46 SBC-A44-pITX p.47 SBC-949-pITX p.48 SBC-992-pITX p.49 SBC-A62-J p.50 SBC-B08 p.51 Modular HMI & Boxed Solutions SYS-A62-10 p.53 SYS-B08-7 p.54 SYS-A62-GW p.55 COM Express Type6 COMe-B09-BT6 p.30 COMe-A98-CT6 p.31 COMe-A41-CT6 p.32 COMe-A81-CT6 p.33 COMe-953-BT6 p.34 Carrier Board CCOMe-B76 p.35 CCOMe-965 p.36 Development Kit COM EXP T6 DEV KIT p.37 Legend All components qualified for industrial temperature range (-40 C +85 C) Ready-to-use and ready-to-market cost effective products which exclusively support SoC native features Cross-compatible platform with x86 and ARM solutions

6 ABOUT SECO SECO is a world-leader in electronic embedded solutions Spanning its 38+ years of experience, SECO has shown the ability to adapt its know-how to new, challenging customers needs, and to provide cutting edge solutions to its partners. Creativity and innovation with a strong R&D area Partnership with the most important technological players Collaboration with important research institutes In house manufacturing and System Integration Plants Worldwide presence Manufacturing Unit Reliable and safe embedded solutions SECO s in-house manufacturing process is 100% compliant to ROHS regulations and not only: the high quality and reliability of SECO s products are guaranteed by each manufacturing unit through standard industry certifications, including UNI EN ISO 9001:2008 and UNI EN ISO 13485:2012. Certified UNI EN ISO 9001:2008 Quality management systems UNI EN ISO 13485:2012 Quality management systems in the field of medical equipment UNI EN ISO (in progress) Dodd-Frank Act

7 Standard products Design, development and implementation of CUSTOM EMBEDDED SYSTEMS When the customer needs require customization, SECO develops end-to-end tailored solutions. In addition to the creation of an embedded system in compliance with the latest technological standards, SECO supports its customers with a range of solutions that allow to configure certain aspects ad hoc, in order to tailor and integrate it to their products. Thanks to a team of highly qualified collaborators and the presence within the company of R&D departments specializing in different areas, SECO is thus able to provide its customers with timely assistance and support in: - Hardware Engineering & Development - BIOS Engineering & Development - Drivers Engineering & Development - Software Development - Firmware Development - Mechanical Engineering & Development

8 Our Partners Over the years, SECO has established and consolidated relationships with major international companies in the electronics industry as well as centers of excellence, universities and research institutes that support the company s direct and dynamic vision for continued research regarding new technologies to be integrated into increasingly complex projects. Technological Partners Intel NXP AMD NVIDIA Qualcomm Xilinx Supported OS Microsoft Windows Linux Yocto Android Main fields of application Innovation, creativity and constant awareness of the needs of a constantly evolving market stimulate SECO to develop state of the art solutions and products tailored to best satisfy its customers needs in a multitude of different fields of application. Turning ideas into solutions and products capable of improving the efficiency and performance of the technologies all around us: this is the challenge that SECO has taken on for over thirty-eight years and which makes it a benchmark in the embedded sector. Automation Automotive Avionics Biomedical/Medical devices Digital signage - Infotainment E - health Telecare Energy Fitness Equipment Gaming HMI Home Automation Home Entertainment Industrial Automation and Control Info Kiosks Internet of Things In-Vehicle Infotainment Systems Measuring instruments Mobile devices Multimedia devices PDA Electronics Point of Sales Portable devices Robotics Surveillance Telco Thin clients Transportation Vending Visual Computing Wireless Technologies

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10 Qseven

11 Computer-On-Module approach Consolidated Standard form factors ARM and x86 cross compatibility Scalable and future proof Highly configurable Design investment limited to the carrier board Multi-vendor solution Accelerated time-to-market Long term availability Innovative and upgradable Qseven Standard advantages Cost effective solution for high volume projects Low power consumption Compact form factor Low profile design Excellent for IoT projects High speed MXM edge connector Qseven 70 x 70 mm μqseven 40 x 70 mm SECO is one of the founding members of SGET and a co-founder of the Qseven standard

12 Qseven Features Overview 70 mm - 2,76 Qseven 70 mm - 2,76 x86 Also available in Industrial temperature range, -40 C +85 C μqseven 40 mm - 1,57 GBE Qseven Rev. 2.1 Supported Features The Qseven mandatory and optional features. The table shows the minimum and maximum required configuration of the feature set. System I/O Interface ARM/RISC Based Min Config. X86 Based Min Config. Max Config. PCI Express lanes 0 1 (x1 link) 4 Serial ATA channels ports ports LVDS channels 0 0 Embedded DisplayPort Dual Channel 24 bits DisplayPort, TMDS High Definition / I2S Ethernet 10/100 Mbit/Gigabit (Gigabit Ethernet) UART Low Pin Count bus Secure Digital I/O 4-bit for SD/MMC cards System Management Bus System I/O Interface ARM/RISC Based Min Config. X86 Based Min Config. Max Config. I²C Bus SPI Bus CAN Bus Watchdog Trigger Button Good Reset Button LID Button Sleep Button Suspend To RAM (S3 mode) Wake Battery low alarm Thermal control FAN control 0 0 1

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14 Qseven Q7-B03 Qseven Rel. 2.1 compliant module with the Intel Atom E39xx family, Intel Celeron N3350 and Intel Pentium N4200 (formerly code name Apollo Lake) SoCs High graphics performance and extreme temperature for low power designs HIGHLIGHTS Compliant to the most recent Qseven rel. 2.1 specs 4K HW decoding and encoding of HEVC(H.265), H.264, VP8, SVC, MVC Extreme graphics for low power embedded applications Industrial grade and connectivity capable Support for the most popular operating systems MAIN FIELDS OF APPLICATION FEATURES Processor Max Cores 4 Max Thread 4 Memory Graphics Resolution Mass Storage Internet of Things Biomedical/ Medical devices Intel Atom x5-e3930 Dual GHz (Burst 1.8GHz), 2MB L2 Cache, 5.5W TDP Intel Atom x5-e3940 Quad GHz (Burst 1.8GHz), 2MB L2 Cache, 9W TDP Intel Atom x7-e3950 Quad GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP Intel Pentium N4200 Quad (burst 2.5GHz), 2MB L2 Cache, 6W TDP Intel Celeron N3350 Dual (burst 2.4GHz), 2MB L2 Cache, 6W TDP Dual Channel Soldered Down DDR3L-1866 memory, up to 8GB Integrated Gen9-LP Graphics controller, with 18 Execution Units 4K HW decoding and encoding of HEVC(H.265), H.264, VP8, SVC, MVC edp interface or Single/Dual Channel 18/24bit LVDS interface through edp-to-lvds bridge HDMI or DP++ interface HDMI, edp: DP++: LVDS: Digital Signage - Infotainment Up to 3840 x 2160 (4K) Up to 4096 x 2160 Up to 1920 x x external S-ATA Gen3 Channel SD interface Optional emmc drive soldered onboard Gigabit Ethernet interface Intel I210 or I211 Controller (MAC + PHY) 6 x 2.0 Host Ports 2 x 3.0 Host Ports (*) (*) Second 3.0 Host port can be exploited only using Qseven Rel. 2.1 compliant Carrier boards HMI Automotive Gaming Industrial Visual Computing PCI-e Serial Ports System Temperature* 4 x PCI-e Root Ports (including the PCI-e port used for Gigabit Ethernet controller) HD interface 1 x UART, TTL interface I2C Bus LPC Bus SM Bus SPI interface Watch Dog Timer Thermal / FAN management Management Signals +5V DC and +5V SB (optional) Microsoft Windows 10 Enterprise (64 bit) Microsoft Windows 10 IoT Core Linux (64 bit) Yocto (64 bit) Android (planning) 0 C +60 C (Commercial version) -40 C +85 C (Industrial version) Dimensions 70 x 70 mm (2.76 x 2.76 ) Mobile devices Multimedia devices *Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet 12

15 Qseven Qseven Q7-974 Qseven standard module with the Intel Atom E3800 and Celeron families ( Bay Trail ) SoC x86 performance on a low-power module Moon Island platform - Intel IoT gateway solution HIGHLIGHTS SATA Flash Drive soldered on-board Security enhancement and content protection Available in Industrial temperature range Integrated 64-bit memory controller Low power solution MAIN FIELDS OF APPLICATION FEATURES Processor Max Cores 4 Max Thread 4 Memory Graphics Resolution Mass Storage Intel Atom E3845, Quad 2MB Cache, 10W TDP Intel Atom E3827, Dual 1MB Cache, 8W TDP Intel Atom E3826, Dual 1MB Cache, 7W TDP Intel Atom E3825, Dual 1MB Cache, 6W TDP Intel Atom E3815, Single 512KB Cache, 5W TDP Intel Celeron J1900, Quad 2MB Cache, 10W TDP Intel Celeron N2930, Quad 2MB Cache, 7.5W TDP Intel Celeron N2807, Dual 1MB Cache, 4.3W TDP Soldered on-board DDR3L memory E3845, E3827, J1900, N2930: up to 8GB Dual-Channel 1333MHz E3826: up to 8GB Dual-Channel 1066MHz N2807: up to 4GB Single-Channel 1333MHz E3825, E3815: up to 4GB Single-Channel 1066MHz Integrated Intel HD Graphics 4000 series controller Dual independent display support HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats HW encoding of H.264, MPEG2 and MVC formats HDMI or Multimode Display Port interface Embedded Display Port or 18 / 24 bit dual channel LVDS interface Additional VGA interface (optional external adapter is required) HDMI: Display Port, edp, CRT: Optional LVDS interface: Up to 1920x1080p@60Hz Up to 2560x1600@60Hz Up to 1920x1200@60Hz Up to 2 x external SATA channels SD interface Optional SATA Flash Drive soldered on-board Gigabit Ethernet interface HMI Industrial Automation and Control 1 x 3.0 Host port 6 x 2.0 Host ports (one shared with 3.0 interface) Biomedical/ Medical devices PCI-e Serial Ports System Measuring Instruments 3 x PCI-e x1 lanes HD interface 1 x Serial port (TTL interface) I2C Bus LPC Bus SM Bus Thermal / FAN management SPI interface Management Signals +5V DC ± 5% Microsoft Windows 7 (32 / 64 bit) Microsoft Windows 8.1 (32 / 64 bit) Microsoft Windows 10 (32 / 64 bit) Microsoft Windows 10 IoT Microsoft Windows Embedded Standard 7 (32 / 64 bit) Microsoft Windows Embedded Standard 8 (32 / 64 bit) Microsoft Windows Embedded Compact 7 Linux (32 / 64 bit) Yocto 0 C +60 C (Commercial version) Temperature* -40 C +85 C (Industrial version) Dimensions 70 x 70 mm (2.76 x 2.76 ) *Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet 13

16 Qseven Q7-A36 Qseven standard module with the Intel Atom E3800 and Celeron families ( Bay Trail ) SoC, with emmc and Camera Interface Mobile-oriented with emmc and Camera Interface Moon Island platform - Intel IoT gateway solution HIGHLIGHTS emmc drive on-board Available in Industrial temperature range Low power solution Camera Interface Integrated 64-bit memory controller MAIN FIELDS OF APPLICATION FEATURES Processor Max Cores 4 Max Thread 4 Memory Graphics Resolution Mass Storage Intel Atom E3845, Quad 2MB Cache, 10W TDP Intel Atom E3827, Dual 1MB Cache, 8W TDP Intel Atom E3826, Dual 1MB Cache, 7W TDP Intel Atom E3825, Dual 1MB Cache, 6W TDP Intel Atom E3815, Single 512KB Cache, 5W TDP Intel Celeron J1900, Quad 2MB Cache, 10W TDP Intel Celeron N2930, Quad 2MB Cache, 7.5W TDP Intel Celeron N2807, Dual 1MB Cache, 4.3W TDP Soldered on-board DDR3L memory E3845, E3827, J1900, N2930: up to 8GB Dual-Channel DDR3L 1333MHz E3826: up to 8GB Dual-Channel DDR3L 1066MHz N2807: up to 4GB Single-Channel DDR3L 1333MHz E3825, E3815: up to 4GB Single-Channel DDR3L 1066MHz Integrated Intel HD Graphics 4000 series controller Dual independent display support HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats HW encoding of H.264, MPEG2 and MVC formats HDMI or Multimode Display Port interface Embedded Display Port or 18 / 24 bit dual channel LVDS interface Optional Camera interface HDMI: Display Port, edp: Optional LVDS interface: 2 x external SATA channels SD interface Optional emmc Drive soldered on-board Gigabit Ethernet interface HMI Industrial Automation and Control Up to 1920x1080p@60Hz Up to 2560x1600@60Hz Up to 1920x1200@60Hz 1 x 3.0 Host port 6 x 2.0 Host ports (one shared with 3.0 interface) Portable Devices PCI-e Serial Ports System In-vehicle infotainment systems 3 x PCI-e x1 lanes HD interface 1 x Serial port (TTL interface) I2C Bus LPC Bus SM Bus Thermal / FAN management SPI interface Management Signals +5V DC ± 5% Microsoft Windows 7 (32 / 64 bit) Microsoft Windows 8.1 (32 / 64 bit) Microsoft Windows 10 (32 / 64 bit) Microsoft Windows 10 IoT Microsoft Windows Embedded Standard 7 (32 / 64 bit) Microsoft Windows Embedded Standard 8 (32 / 64 bit) Microsoft Windows Embedded Compact 7 Linux (32 / 64 bit) Yocto 0 C +60 C (Commercial version) Temperature* -40 C +85 C (Industrial version) Dimensions 70 x 70 mm (2.76 x 2.76 ) *Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet 14

17 Qseven Qseven Q7-928 Qseven standard module with NXP i.mx6 Processor Optimal balance of performance and power HIGHLIGHTS NXP i.mx6 DualPlus NOW AVAILABLE A scalable multi-core ARM Cortex -A9 architecture in Qseven standard modular form factor Combines high-graphics performance with power-efficient processing capabilities OpenGL (FULL) and OpenGL ES 2.0 3D Graphics supporting up to 3 independent displays (only up to 2 displays with i.mx6dl and i.mx6s) Flexible solution: from multi-display platforms to mobile fanless applications Enhanced 2D and 3D graphics with i.mx6dp MAIN FIELDS OF APPLICATION Industrial Automation and Control FEATURES Processor Max Cores 4 Memory Graphics Resolution Mass Storage PCI-e Digital Signage - Infotainment NXP i.mx6 Family, based on ARM CORTEX-A9 processors - i.mx6s Solo - Single core up to 1GHz - i.mx6dl Dual Lite - Dual core up to 1GHz per core - i.mx6d Dual - Dual core up to 1GHz per core - i.mx6dp DualPlus - Dual core up to 1GHz per core - i.mx6q Quad - Quad core up to 1GHz per core Up to 4GB DDR3L on-board (up to 2GB with i.mx6s) Dedicated 2D Hardware accelerator Dedicated 3D Hardware accelerator, supports OpenGL ES 2.0 3D Dedicated Vector Graphics accelerator supports OpenVG (only i.mx6d, i.mx6dp and i.mx6q) Enhanced 2D and 3D graphics with i.mx6dp Supports up to 3 independent displays with i.mx6d, i.mx6dp and i.mx6q Supports 2 independent displays with i.mx6dl and i.mx6s 1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface HDMI Interface 1.4 Input Port / Camera Connector LVDS, up to 1920x1200 HDMI, up to 1080p On-board emmc drive, up to 32 GB SD / MMC / SDIO interface 1 x μsd Card Slot on-board 1 x External SATA Channel (only available with i.mx6d and i.mx6q) Gigabit Ethernet interface 1 x OTG interface 4 x 2.0 Host interfaces Automotive Avionics 1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported) Energy Serial Ports System Surveillance AC 97 interface I2S 2 x Serial ports (TTL interface) CAN port interface I2C Bus LPC Bus SM Bus Management Signals +5V DC ± 5% Linux Yocto Microsoft Windows Embedded Compact 7 0 C +60 C (Commercial version) Temperature* -40 C +85 C (Industrial version) Dimensions 70 x 70 mm (2.76 x 2.76 ) Transportation Robotics *Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet 15

18 Qseven Q7-922 Qseven standard module with NVIDIA Tegra T30 Processor High performance graphics, low power solution HIGHLIGHTS A Quad-Core ARM Cortex -A9 Low CPU for powerful graphics and Extreme Multitasking Graphics engine powered by the 12 cores-ulp GeForce GPU with dedicated Processors for 1080p Playback Capable of reproducing High Resolution 3D s MAIN FIELDS OF APPLICATION FEATURES Processor Max Cores 4 Memory Graphics Resolution Mass Storage NVIDIA Tegra T30 with Quad ARM CORTEX-A9 MPCore CPU, 1.3GHz per Core Up to 2 GB DDR3 on-board soldered memory Embedded NVIDIA ULP GeForce GPU Integrated High Definition - Processor Dual independent display support LVDS Single / Dual Channel 18 / 24 Bit interface HDMI 1.4a Interface Input Port / Camera Connector HDMI: LVDS: up to 1920 x 1080p up to 2048 x 1536 Up to 16 GB on-board soldered emmc drive 1 x SATA Channel microsd Slot on-board 4-bit SD / MMC interface Gigabit Ethernet interface Gaming Digital Signage - Infotainment Thin client I2C, SM Bus, LPC, SPI One Wire Interface Thermal Cooling Interface management signals +5V DC ± 5% System Linux Temperature* 0 C +60 C (Commercial version) -20 C +70 C (Extended version) Dimensions 70 x 70 mm (2.76 x 2.76 ) *Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet PCI-e Serial Ports 6 x 2.0 Host ports 1 x PCI-e x4 lane, or 2 x PCI-e x2 lanes (with support for 2 x PCI-e x1 devices) HD Interface 2 serial ports (Tx, Rx signals) CAN Bus Interface 16

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20 μqseven μq7-a76-j μqseven standard module with the Intel Atom E3800 and Celeron families ( Bay Trail ) Smallest x86 standard module at proprietary costs HIGHLIGHTS Ready-to-use and ready-to-market cost-effective product which exclusively supports SoC native features The smallest Intel 64-bit SoC based standard module on the market High performance-power ratio for compact or portable devices Industrial Internet of Things (IIoT) basic building block Cost-effective solution for low budget designs Moon Island platform - Intel IoT gateway solution MAIN FIELDS OF APPLICATION FEATURES Processor Max Cores 2 Max Thread 2 Memory Graphics Resolution Mass Storage PCI-e Industrial Automation and Control Intel Celeron N2807, Dual 1MB Cache, 4.3W TDP Intel Atom E3815, Single 512KB Cache, 5W TDP Intel Atom E3825, Dual 1MB Cache, 6W TDP Soldered on-board DDR3L memory E3825, E3815: up to 4GB Single-Channel 1066MHz N2807: up to 4GB Single-Channel 1333MHz Integrated Intel HD Graphics 4000 series controller Dual independent display support HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats HW encoding of H.264, MPEG2 and MVC formats Multimode Display Port interface 18 / 24 bit dual channel LVDS interface DP++ (HDMI compatible): LVDS interface: 2 x external SATA channels SD interface Optional emmc drive soldered on-board Gigabit Ethernet interface Up to 2560x1600@60Hz Up to 1920x1200@60Hz 1 x 3.0 Host port 4 x 2.0 Host ports (one shared with 3.0 interface) 3 x PCI-e x1 lanes Gen2 Internet of Things PDA Electronics Biomedical/Medical devices System Surveillance I2C Bus LPC Bus SM Bus Thermal / FAN management Management Signals +5V DC ± 5% 0 C +60 C Temperature* Transportation Microsoft Windows 7 Microsoft Windows 8.1 Microsoft Windows 10 Microsoft Windows 10 IoT Microsoft Windows Embedded Standard 7 Microsoft Windows Embedded Standard 8 Microsoft Windows Embedded Compact 7 Linux Yocto Dimensions 40 x 70 mm (1.57 x 2.76 ) Robotics *Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet Serial Ports HD interface 1 x Serial port (TTL interface, Tx / Rx only) 18

21 μqseven μqseven μq7-962 μqseven standard module with NXP i.mx6 Processor Optimal balance of performance and size HIGHLIGHTS µqseven module based on the ARM Cortex -A9 i.mx6 SoC, a fully scalable solution from a high performance Quad Core CPU to an energy-efficient and cost-effective Solo Core solution OpenGL / ES 2.0 3D Graphics and up to 3 independent displays A flexible solution, suitable for high end, multi display solutions as well as energy-saving smart portable devices Available in Industrial Temperature range MAIN FIELDS OF APPLICATION FEATURES Processor Max Cores 4 Memory Graphics Resolution Mass Storage PCI-e NXP i.mx6 Family, based on ARM CORTEX-A9 processors - i.mx6s Solo - Single core up to 1GHz - i.mx6dl Dual Lite - Dual core up to 1GHz per core - i.mx6d Dual - Dual core up to 1GHz per core - i.mx6q Quad - Quad core up to 1GHz per core Up to 2GB DDR3L on-board (up to 1GB with i.mx6s) Dedicated 2D Hardware accelerator Dedicated 3D Hardware accelerator, supports OpenGL ES2.0 3D Dedicated Vector Graphics accelerator supports OpenVG (only i.mx6d and i.mx6q) Supports up to 3 independent displays with i.mx6d and i.mx6q Supports 2 independent displays with i.mx6dl and i.mx6s 1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface HDMI Interface 1.4 LVDS HDMI HMI up to 1920x1200 up to 1080p Up to 8 GB emmc drive soldered on-board SD / MMC / SDIO interface 1 x External SATA Channel (only available with i.mx6d and i.mx6q) Gigabit Ethernet interface 1 x OTG interface 4 x 2.0 Host interfaces Automation 1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported) PDA Electronics Biomedical/Medical devices System I2C Bus SM Bus Management Signals +5V DC ± 5% Linux Yocto Wireless Technologies 0 C +60 C (Commercial version) Temperature* -40 C +85 C (Industrial version) Dimensions 40 x 70 mm (1.57 x 2.76 ) *Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet Serial Ports I2S / AC 97 interface 2 x Serial ports (TTL interface) CAN port interface 19

22 μqseven μq7-a75-j μqseven standard module with NXP i.mx6 Processor Small, flexibile OTS module at proprietary costs HIGHLIGHTS Ready-to-use and ready-to-market cost-effective product which exclusively supports SoC native features Excellent price-performance ratio The best combination of low power consumption, size and price Complete BSP, easy migration between the entire i.mx6 product family MAIN FIELDS OF APPLICATION FEATURES Processor Max Cores 2 Memory Graphics Resolution Mass Storage PCI-e NXP i.mx6 Family, based on ARM CORTEX-A9 processors - i.mx6s Solo - Single core up to 1GHz - i.mx6dl Dual Lite - Dual core up to 1GHz per core Up to 1GB DDR3L on-board (up to 512MB with i.mx6s Solo) Dedicated 2D Hardware accelerator Dedicated 3D Hardware accelerator, supports OpenGL ES2.0 3D Supports 2 independent displays 1 x LVDS Dual Channel or 2 x LVDS Single Channel 18 / 24 bit interface HDMI Interface LVDS, resolution up to 1920x1200 HDMI, resolution up to 1080p On-board emmc drive, up to 8 GB SD / MMC / SDIO interface Internal SPI Flash for booting FastEthernet (10 / 100 Mbps) interface 1 x OTG interface 1 x 2.0 Host interface 1 x PCI-e x1 lane (only PCI-e 1.1 and Gen2 are supported) I2S / AC 97 interface HMI Internet of Things PDA Electronics System Wireless Technologies On the card edge connector, many pins can be used as General Purpose I / Os or to implement some(*) of the following extra functionalities: - Additional SD interface - Up to 4 UARTs - CAN interface - Watchdog(s) - I2C interfaces - PWM outputs - SPI interface - Additional interface (*) not all the combinations are allowed simultaneously Management Signals +5V DC ± 5% Optional Low RTC Linux Yocto 0 C +60 C (Commercial temp.) Temperature* For Industrial temp. (-40 C +85 C) please contact us Dimensions 40 x 70 mm (1.57 x 2.76 ) *Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet 20

23 Qseven Carrier Board CQ7-A42 Qseven Carrier Board Carrier Board for Qseven Rev. 2.0 Compliant modules on 3.5 Form factor Feature rich for fast Time-to-market HIGHLIGHTS 3.5 Form Factor Carrier Board for Qseven Modules Multiport Connectivity oriented Embedded industrial interfaces Industrial temperature range FEATURES Mass Storage PCI-e LVDS Dual Channel 24-bit + backlight connectors or 2 x edp connectors Multimode Display Port or HDMI Connector 1 x SATA connector with HDD connector 1 x msata Slot microsd Slot on combo microsd + SIM connector Up to 2 x Gigabit Ethernet connectors 1 x 3.0 Host port on type-a socket 2 x 2.0 Host ports on double Type-A sockets 2 x 2.0 Host ports on internal pin header 1 x 2.0 OTG port on micro-ab socket ( port shared with minipci-e slot) minipci-e slot Full / Half Size, combined with SIM card slot +12V DC Mini-fit Standard ATX power connector Coin cell battery Holder for CMOS and RTC -40 C +85 C (Industrial temperature range) Temperature* Dimensions 146 x 102 mm (5.75 x 4.02 ) *All carrier board components must remain within the operating temperature at any and all times, including start-up; carrier operating temperature is independent of the module installed. Please refer to the specific module for more details. Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet Serial Ports interface on internal pin header 4-wire RS-232 / RS-422 / RS-485 configurable serial port on DB9 male connector 2 x RS-232 Full-modem serial ports on internal header (need LPC interface from Qseven module) CAN interface on PCB terminal block SPI internal pin header LPC Bus internal pin header SM Bus / I2C GPIO expander, makes available 16 x GPIOs on internal pin header Front Panel Header 1 x 28 pin connector for additional features (I2C, ACPI signals, SM Bus, Watch Dog, Thermal Management) +12V Tachometric FAN connector Optional Debug port on minib socket Optional MFG connector for JTAG programming of Qseven module 21

24 Qseven Development Kit Q7 DEV KIT 2.0 Cross Platform Development Kit for Qseven philosophy, compatible with both x86 and ARM Rev. 2.0 Qseven modules Everything you need for flexible development DEVELOPMENT KIT CONTENTS The Development kit contains the following material: Cross Platform Carrier Board CQ7-A30 LVDS optional Display One 12V DC Notebook Adapter Add-on modules for LVDS / edp and HDMI / DP Cable kit Module not included. Must be purchased separately FEATURES OF CQ7-A30 Mass Storage PCI-e Serial Ports HDMI / Display Port interface on PCI-e x16 slot LVDS / edp interface on PCI-e x8 slot SATA Female 7p connector with dedicated connector, interface shared with msata Slot SATA Male 7+15p connector SD / MMC Card Slot SPI Flash Socket I2C EEPROM Socket Gigabit Ethernet connector 1 x 3.0 Host Type-A socket 1 x 3.0 OTG micro-ab socket 2 x 2.0 Host ports on internal pin header (alternative to 3.0 port #0) Up to 4 x 2.0 Host ports on quad Type-A socket PCI-e x4 interface on dedicated PCI-e x16 slot shared with 3 x PCI-e x1 slots + minipci-e slot (selection via jumper) Embedded HD Codec, Realtek ALC888 2 x Triple HD jacks 2 S / PDIF connectors (In & Out) Expansion Slot CAN Bus (both TTL interface and with CAN transceiver) 3 x RS-232 only ports 2 x RS-232 / RS-422 / RS-485 configurable serial ports Feature Connector, with I2C, SM Bus, Watchdog, Thermal and Management Signals LPC Bus Header SPI Pin Header SIM Card slot 4 x 7-segment LCD displays for POST codes PS / 2 Mouse / keyboard pin header 2 x tachometric FAN connectors Debug Port on mini-b connector, Reset, LID and Sleep Buttons 0 C 60 C Temperature* SCHEMATICS PUBLICLY AVAILABLE +12V DC Coin cell battery Holder for CMOS and RTC Dimensions 345 x 170 mm (13.58 x 6.69 ) *All carrier board components must remain within the operating temperature at any and all times, including start-up; carrier operating temperature is independent of the module installed. Please refer to the specific module for more details. Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet 22

25 Qseven Development Kit Qseven Development Kit Q7 STARTER KIT 2.0 Cross Platform Starter Kit compatible with both x86 and ARM Rev. 2.0 Qseven modules: a complete package including the basic components necessary to start developing Quickly start prototyping for short Time-to-market STARTER KIT CONTENTS FEATURES OF CQ7-A42 Mass Storage PCI-e LVDS Dual Channel 24-bit + backlight connectors or 2 x edp connectors Multimode Display Port or HDMI Connector 1 x SATA connector with HDD connector 1 x msata Slot microsd Slot on combo microsd + SIM connector Up to 2 x Gigabit Ethernet connectors 1 x 3.0 Host port on type-a socket 2 x 2.0 Host ports on double Type-A sockets 2 x 2.0 Host ports on internal pin header 1 x 2.0 OTG port on micro-ab socket ( port shared with minipci-e slot) minipci-e slot Full / Half Size, combined with SIM card slot Carrier board for Qseven Rev. 2.0 compliant modules CQ7-A42 (DP or HDMI version) 7 LVDS optional Display (800x480) UMSH-8596MD-20T LVDS display adapter + connection cable to CQ7-A42 carrier board HD module I2S module One 12V DC Notebook Adapter Cable kit Module not included. Must be purchased separately SCHEMATICS PUBLICLY AVAILABLE +12V DC Mini-fit Standard ATX power connector Coin cell battery Holder for CMOS and RTC -40 C +85 C (Industrial temperature range) Temperature* Dimensions 146 x 102 mm (5.75 x 4.02 ) *All carrier board components must remain within the operating temperature at any and all times, including start-up; carrier operating temperature is independent of the module installed. Please refer to the specific module for more details. Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet Serial Ports interface on internal pin header 4-wires RS-232 / RS-422 / RS-485 configurable serial port on DB9 male connector 2 x RS-232 Full-modem serial ports on internal header (need LPC interface from Qseven module) CAN interface on PCB terminal block SPI internal pin header LPC Bus internal pin header SM Bus / I2C GPIO expander, makes available 16 x GPIOs on internal pin header Front Panel Header 1 x 28 pin connector for additional features (I2C, ACPI signals, SM Bus, Watch Dog, Thermal Management) +12V Tachometric FAN connector Optional Debug port on minib socket Optional MFG connector for JTAG programming of Qseven module 23

26 SMARC

27 Computer-On-Module approach Consolidated Standard form factors ARM and x86 cross compatibility Scalable and future proof Highly configurable Design investment limited to the carrier board Multi-vendor solution Accelerated time-to-market Long term availability Innovative and upgradable SMARC Standard advantages Extreme low power design Low profile design Dedicated battery management signals Up to four display interfaces Dual Ethernet SMARC Compact 82 mm 50 mm SMARC Supported Features System I/O interface # of interfaces System I/O interface # of interfaces PCI Express lanes 4 Serial ATA channels ports ports 2 LVDS channels embedded DisplayPort 2 DP++ / HDMI 1 dedicated DP++ 1 shared DP++ / HDMI Camera interfaces 2 MIPI CSI High Definition / I2S 1 I2S + 1 shared I2S / HD Ethernet 10/100/1000 Mbps 2 UARTs 2 x 4-Wire + 2 x 2-Wire Secure Digital I/O 4-bit 1 I²C Bus 5 SPI Bus 2 CAN Bus 2 Watchdog Timer 1 Boot selection signals 3 GPIOs 12 (some with alternate functions) System and management signals Reset out and Reset in button in source status Module power state status System management pins Battery and battery charger management pins Carrier On control SECO is one of the founding members of SGET

28 SMARC SM-B69 SMARC Rel. 2.0 compliant module with the Intel Atom E39xx family, Intel Celeron N3350 and Intel Pentium N4200 (formerly code name Apollo Lake) SoCs High performance, low power and feature-rich HIGHLIGHTS Up to 3 independent displays 4K HW decoding and encoding of HEVC(H.265), H.264, VP8, SVC, MVC Quad Channel Soldered Down LPDDR memory, up to 8GB Up to 2 x Gigabit Ethernet interfaces 2 x MIPI CSI interfaces MAIN FIELDS OF APPLICATION Robotics FEATURES Processor Max Cores 4 Max Thread 4 Memory Graphics Resolution Mass Storage Internet of Things Intel Atom x7-e3950 Quad GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP Intel Atom x5-e3940 Quad GHz (Burst 1.8GHz), 2MB L2 Cache, 9.5W TDP Intel Atom x5-e3930 Dual GHz (Burst 1.8GHz), 2MB L2 Cache, 5.5W TDP Intel Pentium N4200 Quad (Burst 2.5GHz), 2MB L2 Cache, 6W TDP Intel Celeron N3350 Dual (Burst 2.4GHz), 2MB L2 Cache, 6W TDP Quad Channel Soldered Down LPDDR memory, up to 8GB Three independent display support Integrated Gen9-LP HD Graphics controller, with 18 Execution Units 4K HW decoding and encoding of HEVC(H.265), H.264, VP8, SVC, MVC edp + MIPI-DSI interfaces or Dual Channel 18/24bit LVDS interface HDMI 1.4b or DP interface DP interface 2 x CSI interfaces HDMI, edp: DP++: MIPI-DSI, LVDS: Biomedical/ Medical devices Digital Signage - Infotainment Up to 3840 x 2160 (4K) Up to 4096 x 2160 Up to 1920 x x external S-ATA Gen3 Channel SD interface Optional emmc 5.0 drive soldered on-board Up to 2 x Gigabit Ethernet interfaces Intel I210 or I211 Controller (MAC + PHY) 6 x 2.0 Host Ports 2 x 3.0 Host Ports HMI Automotive Gaming Industrial Visual Computing PCI-e Serial Ports System Temperature* 4 x PCI-e Root Ports HD interface I2S interface 2 x HS-UART Tx/Rx/RTS/CTS, TTL interfaces 1 x HS-UART Tx/Rx, TTL interfaces I2C Bus SM Bus SPI interface LPC Bus FAN management Management Signals Watch Dog Timer +5V DC and +3.3V_RTC Microsoft Windows 10 Enterprise (64 bit) Microsoft Windows 10 IoT Core Linux (64 bit) Yocto (64 bit) Android (planning) 0 C +60 C (Commercial version) -40 C +85 C (Industrial version) Dimensions 50 x 82 mm (1.97 x 3.23 ) Mobile devices Multimedia devices *Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet 26

29 SMARC SMARC SM-B71 SMARC Rel. 2.0 compliant module with the Xilinx Zynq Ultrascale+ MPSoC Flexibile ARM + FPGA Heterogeneous Processing in a Standard Form Factor HIGHLIGHTS Wide scalability from cost effective Dual-Core to high performance Quad-Core ARM Cortex -A53 MPSoCs with GPU/VCU Dedicated Real-Time ARM Cortex -R5 processors Extreme flexibility: up to 256k FPGA logic cells LVDS and DP video interfaces up to 4K resolution High-speed interfaces MAIN FIELDS OF APPLICATION FEATURES Processor Memory Graphics Resolution Mass Storage PCI-e Internet of Things Xilinx Ultrascale+ ZU2CG, ZU3CG, ZU4CG or ZU5CG MPSoCs: Dual-core ARM Cortex -A53 MPCore Application Processing Unit + Dual-core ARM Cortex -R5 Real-Time Processing Unit Xilinx Ultrascale+ ZU2EG, ZU3EG, ZU4EG, ZU5EG, ZU4EV or ZU5EV MPSoCs: Quad-core ARM Cortex -A53 MPCore Application Processing Unit + Dual-core ARM Cortex -R5 Real-Time Processing Unit Soldered Down DDR memory Up to 8GB for Processing System Unit + up to 2GB for Programmable Logic Only on EG and EV MPSOcs: Integrated ARM Mali-400 MP2 Graphics Processing Unit Multicore 2D/3D acceleration at 667MHz OpenGL ES 1.1 / 2.0, OpenVG 1.0 / 1.1 On EV MPSoCs only, H.264/H.265 integrated video codec 18- / 24-bit Dual Channel LVDS interface DP interface 2 x CSI interfaces DP: LVDS: Industrial Automation and Control Up to 4096 x 2160 Dependent on the IP implemented in the programmable logic 1 x external S-ATA Gen3 Channel SD interface QSPI Flash soldered-onboard Optional emmc 4.51 drive soldered on-board Up to 2 x Gigabit Ethernet interfaces 4 x 2.0 Host Ports 1 x 3.0 Host Ports PCI-e x2 interface Biomedical/ Medical devices Visual Computing Robotics Serial Ports System Temperature* Telco Automotive 1 x HS-UART Tx/Rx/RTS/CTS 1 x HS-UART Tx/Rx 2 x CAN Bus I2C Bus SM Bus 2 x SPI interfaces 12 x GPI/Os Boot select signals Management Signals V DC +3.3V_RTC Linux Android 0 C +60 C (Commercial version) -40 C +85 C (Industrial version) Dimensions 50 x 82 mm (1.97 x 3.23 ) Avionics *Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet Dependent on the IP implemented in the programmable logic 27

30 COM Express

31 Computer-On-Module approach Consolidated Standard form factors ARM and x86 cross compatibility Scalable and future proof Highly configurable Design investment limited to the carrier board Multi-vendor solution Accelerated time-to-market Long term availability Innovative and upgradable COM Express Standard advantages For high-end designs and markets High graphics computing Extremely feature-rich For high performance project requirements Basic 125 x 95 mm Compact 95 x 95 mm COM Express Interface Type 2 Min / Max Type 6 Min / Max PCI Express Lanes 1* / 6 1* / 8 PCI Express Graphics (PEG) 0 / 1 0 / 1 SDVO Channels on PEG 0 / 2 N.A. PCI Bus - 32 Bit 1* N.A. LVDS 0 / 1 0 / 1 edp on LVDS 1st channel N.A. 0 / 1 VGA Port 0 / 1 0 / 1 Digital Display N.A. 0 / 3 Serial Ports N.A. 0 / 2 CAN interface N.A. 0 / 1 SATA ports N.A. 1* / 4 PATA Port 1* N.A. AC 97 / HDA Digital Interface 0 / 1 0 / 1 *Mandatory interface Interface Type 2 Min / Max Type 6 Min / Max 2.0 Ports 4 / 8 4 / 8 Client 0 / 1 0 / Ports N.A. 0 / 4 LAN Ports 1* 1* Express Card 1 / 2 1 / 2 LPC Bus 1* 1* SPI 1 / 2 1 / 2 GPIO 8* 8* SDIO Muxed on GPIO N.A. 0 / 1 SM Bus 1* 1* I2C 1* 1* Watchdog Timer 0 / 1 0 / 1 Speaker Out 1* 1*

32 COM Express Type 6 COMe-B09-BT6 COM Express Basic Type 6 with Intel 6th and 7th generation Core / Xeon ( Skylake and Kaby Lake ) CPUs When high graphics and Hyper-threading matter Skylake Kaby Lake HIGHLIGHTS Intel 6th / 7th generation Core / Xeon (H-Series Skylake and Kaby Lake ) Platforms Up to 4 Cores + HD Graphics 530 / P530 / 630 / P630 DDR4 RAM TECHNOLOGY H.265 / HEVC HW Transcoder Up to 3 independent displays supported Resolution up to 24bpp MAIN FIELDS OF APPLICATION Biomedical/ Medical devices FEATURES Processor Max Cores 4 Max Thread Platform Controller Hub (PCH) Memory Gaming Digital Signage - Infotainment HMI Intel Core i7-6820eq, Quad 2.8GHz (3.5GHz in Turbo Boost), 8MB Cache, 45W TDP Intel Core i7-6822eq, Quad 2GHz (2.8GHz in Turbo Boost), 8MB Cache, 25W TDP Intel Core i5-6440eq, Quad 2.7GHz (3.4GHz in Turbo Boost), 6MB Cache, 45W TDP Intel Core i5-6442eq, Quad 1.9GHz (2.7GHz in Turbo Boost), 6MB Cache, 25W TDP Intel Core i3-6100e, Dual 2.7GHz, 3MB Cache, 35W TDP Intel Core i3-6102e, Dual 1.9GHz, 3MB Cache, 25W TDP Intel Xeon E3-1505M V5, Quad 2.8GHz (3.7GHz in Turbo Boost), 8MB Cache, 45W TDP Intel Xeon E3-1535M V5, Quad 2.9GHz (3.8GHz in Turbo Boost), 8MB Cache, 45W TDP Intel Core i7-7820eq, Quad 3.0GHz (3.7GHz in Turbo Boost), 8MB Cache, 45W TDP Intel Core i5-7440eq, Quad 2.9GHz (3.6GHz in Turbo Boost), 6MB Cache, 45W TDP Intel Core i3-7100e, Dual 2.9GHz, 3MB Cache, 35W TDP Intel Xeon E3-1505M V6, Quad 3.0GHz (4.0GHz in Turbo Boost), 8MB Cache, 45W TDP 8 (HT not available with 6th Generation Core i5 and 7th Generation Core i3/i5 Processors) SkyLake Platform: Intel QM170, HM170 or CM236 PCH Kabylake Platform: Intel QM175 or CM238 PCH Telco Up to two DDR4 SO-DIMM Slots supporting DDR (DDR for 7th Generation processors) Memory ECC DDR4 memory modules supported only with Xeon and Core i3 processors combined with CM236 / CM238 PCH Graphics Resolution Intel HD Graphics 530 (6th Generation Core processors), P530 (6th Generation Xeon processors) Intel HD Graphics 630 (7th Generation Core processors), P630 (7th Generation Xeon processors) Up to 3 independent displays supported DirectX 12.1, OpenGL 4.4, and OpenCL 2.0 support HW accelerated video decode MPEG2, VC1 / WMV9, AVC / H.264, VP8, JPEG / MJPEG, HEVC / H.265, VP9 HW accelerated video encode MPEG2, AVC / H.264, VP8, JPEG / MJPEG, HEVC / H.265, VP9 Up to 3 x Digital Display (DDIs), supporting DP 1.2, DVI and HDMI 1.4 edp or Single / Dual-Channel 18- / 24- bit LVDS interface or LVDS + VGA interface PCI-express Graphics (PEG) Gen3 x16 edp, DP: HDMI: LVDS, VGA: Mass Storage 4 x SATA Gen3 Channels PCI-e Serial Ports System Gigabit Ethernet interface Intel I219-LM GbE Controller 4 x 3.0 Host ports 8 x 2.0 Host ports 8 x PCI-e x1 Gen3 lanes HD Interface up to 24bpp up to 24bpp up to 1920 x 2 x UARTs 2 x SPI, I2C, SM Bus, LPC Bus, 2 x Express Card, FAN management Optional TPM 1.2 LID# / SLEEP# / PWRBTN#, Watchdog 4x GPI, 4 x GPO +12V DC ± 10% and +5V SB (optional) Microsoft Windows 7 Microsoft Windows 8.1 Microsoft Windows 10 Microsoft Windows 10 IoT Microsoft Windows Embedded Standard 7 Microsoft Windows Embedded Standard 8 Linux 0 C +60 C (Commercial version) Temperature* Dimensions 125 x 95 mm (Com Express Basic Form factor, Type 6 pinout) Information subject to change. Please visit to find the latest version of this datasheet *Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. 30

33 COM Express Type 6 COM Express Type 6 COMe-A98-CT6 COM Express Compact Type 6 with the AMD Embedded 3rd generation R-Series SOC ( Merlin Falcon ) or G-Series SOC-I ( Brown Falcon ) When scalable graphics performance makes the difference Merlin Falcon Brown Falcon HIGHLIGHTS Up to 4 Excavator x86 CPU cores with the latest Radeon graphics and I / O Controller on a single Chip Configurable TDP Available in Industrial Temperature Range MAIN FIELDS OF APPLICATION FEATURES Processor Max Cores 4 Memory Graphics Resolution Mass Storage AMD RX-421BD, Quad 2.1 GHz (3.4 GHz Max), TDP 35W AMD RX-418GD, Quad 1.8 GHz (3.2 GHz Max), TDP 35W AMD RX-216GD, Dual 1.6GHz (3.0 GHz Max), TDP 15W AMD RX-416GD, Quad 1.6 GHz (2.0GHz Max), TDP 15W, Industrial Temperature range AMD GX-217GI, Dual (2.0GHz Max), TDP 15W Two SO-DIMM slots supporting DDR4 ECC / non-ecc modules up to 2133MHz (up to 1600MHz with GX217GI) AMD Radeon 3rd -Generation Graphics Core Next (GCN) AMD RX-421BD - Radeon R7 AMD RX-418GD, RX-416GD - Radeon R6 AMD GX-217GI - Radeon R6E Up to 3 independent displays supported (up to 2 with GX217GI) DirectX 12 supported UVD 6 (4K H.265 and H.264 decode) and VCE 3.1 (4K H.264 encode) supported Up to 3 x Digital Display (DDIs), supporting edp 1.4, DP 1.2, DVI and HDMI 1.4b/2.0 Optional VGA interface (excludes one DDI Port) Optional edp or Single / Dual-Channel 18- / 24- bit LVDS interface (R-Series SOCs only, excludes one DDI Port) PCI-express Graphics (PEG) x 8 (x4 with GX217GI) DDIs: LVDS, VGA: up to 4K up to 1920 x x SATA Gen3 Channels SD interface shared with GPI/Os Gigabit Ethernet interface Intel I210 / I211 GbE Controller Medical Gaming Digital Signage - Infotainment PCI-e Serial Ports System Temperature* Dimensions 4 x 3.0 Host ports 8 x 2.0 Host ports 3 x PCI-e x1 Gen3 lanes HD Interface 2 x HS UART interfaces SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN management LID# / SLEEP# / PWRBTN#, Watchdog 4 x GPI, 4 x GPO (multiplexed with SD interface) +12V DC ± 10% and +5V SB (optional) Microsoft Windows 7 Microsoft Windows 8.1 Microsoft Windows 10 Microsoft Windows 10 IoT Microsoft Windows Embedded Standard 7 Microsoft Windows Embedded Standard 8 Linux 0 C +60 C (Commercial version) -40 C +85 C (Industrial version) 95 x 95 mm (Com Express Compact Form factor, Type 6 pinout) *Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet 31

34 COM Express Type 6 COMe-A41-CT6 Versatile and rugged COM Express Compact Type 6 with Intel Atom E3800 and Celeron families ( Bay Trail ) Moon Island platform - Intel IoT gateway solution HIGHLIGHTS Dual independent display support, with broad connectivity options (HDMI, DVI, DP, DP++, LVDS, CRT) Also available in Industrial temperature range Optional emmc drive soldered on-board MAIN FIELDS OF APPLICATION FEATURES Processor Max Cores 4 Memory Graphics Resolution Mass Storage Industrial Automation and Control Intel Atom E3845, Quad 2MB Cache, 10W TDP Intel Atom E3827, Dual 1MB Cache, 8W TDP Intel Atom E3826, Dual 1MB Cache, 7W TDP Intel Atom E3825, Dual 1MB Cache, 6W TDP Intel Atom E3815, Single 512KB Cache, 5W TDP Intel Celeron J1900, Quad 2MB Cache, 10W TDP Intel Celeron N2930, Quad 2MB Cache, 7.5W TDP DDRL non-ecc SO-DIMM slots, 4GB modules supported per each slot E3845, E3827, J1900, N2930: up to 8GB Dual-Channel DDR3L 1333MHz E3826: up to 8GB Dual-Channel DDR3L 1066MHz N2807: up to 4GB Single-Channel DDR3L 1333MHz E3825, E3815: up to 4GB Single-Channel DDR3L 1066MHz Integrated Intel HD Graphics 4000 series controller Dual independent display support HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats HW encoding of H.264, MPEG2 and MVC formats 1 x Digital Display Interface (DDI) able to drive HDMI / DVI / DP++ interface Additional DDI, can be switched to manage embedded Display Port or 18 / 24 bit single / dual channel LVDS interface CRT interface CRT Interface: HDMI: Display Port, edp: Optional LVDS interface: Up to 2560x1600@60Hz Up to 1920x1080p@60Hz Up to 2560x1600@60Hz Up to 1920x1200@60Hz Optional emmc drive soldered on-board 2 x external SATA channels SD Card interface (multiplexed with GPIO signals) Optional Gigabit Ethernet interface (uses one PCI-e lane) 7 x 2.0 Host ports 4 x 3.0 Host ports Biomedical/ Medical devices Gaming Digital Signage - Infotainment PCI-e Serial Ports System Automotive Avionics Transportation HD interface Up to 4 x PCI-e x1 Gen2 lanes 2 x Serial ports (TX / RX only, TTL interface) 2 x Express Card interfaces I2C Bus LPC Bus SM Bus 4 x GPI, 4 x GPO Thermal / FAN management Watch Dog timer Management Signals +12V DC ± 10% and + 5V SB (optional) Microsoft Windows 7 (32 / 64 bit) Microsoft Windows 8.1 (32 / 64 bit) Microsoft Windows 10 (32 / 64 bit) Microsoft Windows 10 IoT Microsoft Windows Embedded Standard 7 (32 / 64 bit) Microsoft Windows Embedded Standard 8 (32 / 64 bit) Microsoft Windows Embedded Compact 7 Linux (32 / 64 bit) Yocto 0 C +60 C (Commercial version) Temperature* -40 C +85 C (Industrial version) Dimensions 95 x 95 mm (Com Express Compact Form factor, Type 6 pinout, 3.74 x 3.74 ) *Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet 32

35 COM Express Type 6 COM Express Type 6 COMe-A81-CT6 COM Express Compact Type 6 based on NVIDIA Tegra K1 Mobile Processor SoC Supreme Visual computing with ARM efficiency HIGHLIGHTS Integrates 192 CUDA cores and a Low-power NVIDIA Kepler GPU for Extreme performance and powerful computing with extraordinary power efficiency Supports OpenGL ES 3.0, OpenGL 4.4, DirectX 11.1, CUDA 7; up to 2160p30 HW decoding; up to 2160p24 HW encoding COM Express Cross Platform compatible with all COM Express type 6 standard carrier boards MAIN FIELDS OF APPLICATION FEATURES Processor Max Cores 4 Memory Graphics Resolution Mass Storage PCI-e Automotive In-Vehicle Visual Surveillance Medical Gaming Digital Infotainment Computing Signage - Systems Infotainment NVIDIA Tegra K1 Mobile Processor Quad-core, 4-Plus-1 ARM Cortex A15 MPCore R3 processor Dual Channel Soldered Down DDR3L-1833 memory, up to 4GB Low-power NVIDIA Kepler -based GeForce graphics processor with 192 CUDA cores Supports OpenGL ES 3.0, OpenGL 4.4, DirectX 11.1, Tessellation CUDA 7 Up to 2160p30 HW decoding; up to 2160p24 HW encoding edp interface or native Single Channel 18 / 24 bit LVDS interface or Single / Dual Channel 18 / 24bit LVDS interface HDMI interface 2 x MIPI CSI Camera interfaces HDMI: edp: LVDS: up to 4096 x 2160 (4K) up to 3840 x 2160 up to 1920 x x external SATA Gen2 Channel Optional emmc drive soldered on-board, up to 32GB SD Card interface (multiplexed with GPIO signals) Gigabit Ethernet interface Realtek RTL8111G Controller (MAC + PHY) 8 x 2.0 Host ports 4 x 3.0 Host ports Up to four PCI-express x1 interfaces (factory options) System I2C Bus LPC Bus SM Bus 4 x GPI, 4 x GPO SPI Interface Watch Dog Timer Real Time Clock (optional, additional Low RTC) Management Signals Thermal / Fan Management On-board FAN connector +12V DC and +5V SB (optional) Linux for Tegra (L4T) provides flashing utilities, bootloader, Linux kernel, Tegra hardware acceleration libraries for graphics, multimedia and compute (EGL, OpenGL-ES, GLX, OpenGL), and a reference File System for evaluating Linux on the Tegra platform 0 C +60 C (Commercial version) Temperature* Measuring Instruments Dimensions 95 x 95 mm (COM Express Compact, 3.74 x 3.74 ) *Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet Serial Ports HD interface 2 x UARTS, TX / RX signals only, TTL interface 33

36 COM Express Type 6 COMe-953-BT6 COM Express Basic Type 6 Module with Intel Haswell family CPUs High performance for any design in a scalable form factor HIGHLIGHTS High performance computing and graphics Supports enhanced high-end media and graphics capabilities and performance Optional DDR3L ECC SO-DIMM module support (MB28 modules) MAIN FIELDS OF APPLICATION FEATURES Processor Max Cores 4 Chipset Memory Graphics Resolution Intel Core i3-4100e, Dual Core with 2.4GHz, 3MB Cache, 37W TDP Intel Core i3-4102e, Dual Core with 1.6GHz, 3MB Cache, 25W TDP Intel Core i5-4400e Dual Core with 2.7GHz, 3MB Cache, 37W TDP Intel Core i5-4402e Dual Core with 1.6GHz, 3MB Cache, 25W TDP Intel Core i7-4700eq Quad Core with 2.4GHz, 6MB Cache, 47W TDP Intel Celeron 2002E Dual 2MB Cache, 25W TDP Intel Celeron 2000E Dual 2MB Cache, 37W TDP Intel QM87 Chipset Up to 16GB 1.35V DDR3L-1600 on two SO-DIMM slots, supporting Dual-Channel M953 modules support non-ecc SO-DIMMs only, MB28 modules support ECC modules only Integrated Intel HD Graphics Up to 3 independent displays supported DirectX 11, OpenGL4.0 supported 3 x HDMI / DVI / Multimode Display Port interfaces embedded Display Port or 18 / 24 bit single / dual channel LVDS interface CRT interface PCI Express Graphics (PEG) x 16 interface CRT Interface: HDMI: DVI: Display Port: LVDS, edp: Mass Storage 4 x external SATA channels Biomedical/ Medical devices Gaming up to 1920 x 60Hz up to 24Hz / 60Hz up to 60Hz up to 3840 x 60Hz up to 1920 x 60Hz Gigabit Ethernet interface Supports remote management (Intel AMT Technology) Digital Signage - Infotainment 8 x 2.0 Host ports 4 x 3.0 Host ports PCI-e 7 x PCI-e x1 lanes (configurable as 1 PCI-e x4 + 3 PCI-e x1) Serial Ports System HMI HD interface 2 x serial ports (Tx/Rx only, TTL interface) (MB28 module only) 2 x Express Card interfaces I2C Bus LPC Bus SM Bus 4 x GPI, 4 x GPO Thermal / FAN management Watch Dog timer Optional TPM on-board (M953 modules only) Management Signals +12V DC ± 10% and + 5V SB (optional) Microsoft Windows 7 (32 / 64 bit) Microsoft Windows 8.1 (32 / 64 bit) Microsoft Windows 10 (32 / 64 bit) Microsoft Windows 10 IoT Microsoft Windows Embedded Standard 7 (32 / 64 bit) Microsoft Windows Embedded Standard 8 (32 / 64 bit) Microsoft Windows Embedded Compact 7 Linux 0 C +60 C (Commercial version) Temperature* Dimensions 125 x 95 mm (4.92 x 3.74 ) *Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet 34

37 COM Express Type 6 Carrier Board COM Express Type 6 Carrier Board CCOMe-B76 Carrier Board for COM Express Type 6 Modules on 3.5 form factor Most compact, I/O-rich COM Express Type 6 carrier board HIGHLIGHTS Specifically designed for digital signage Broad variety of connectivity possibilities in the compact 3.5 form factor Multi-display support Ultimate versatility Optional 30-bit Quad-Channel LVDS interface FEATURES Mass Storage Serial Ports 1 x DP++ connector 2 x minidp++ connectors LVDS 24-bit Single/Dual Channel or 30-bit Quad Channel (from on-board edp to LVDS bridge, factory alternatives) Backlight control + LCD selectable voltages dedicated connector LVDS External EDID connector (not for LVDS Quad Channel boards) S-ATA 7p M connector + 4 pins power connector M.2 Socket / 2260 Key B slot for SSD μsd Card slot (interface multiplexed with GPIO header) Dual RJ-45 connector (1 port managed by COM Express Gigabit Ethernet interface, 1 port managed by Carrier board s Intel I21x GbEthernet controller) M.2 Socket / 3042 Key B slot for WWAN modules (modem) M.2 Socket Key E slot for WiFi / BT modules 3 x 3.0 Host ports on Type-A sockets 2 x 2.0 Host ports on Type-A sockets 1 x 2.0 host ports on internal pin header On-board HD Codec (Realtek ALC262) Mic In + Line Out internal pin header 2 x RS-232 / RS-422 / RS-485 ports on internal pin header (from carrier board s SuperI/O) 2 x TTL UARTs on feature pin header (from module) microsim slot for M.2 modem 4 x GPI + 4 x GPO pin header (interface multiplexed with μsd slot) Button / LEDs front panel header 3-pin tachometric FAN connector I2C + SM Bus on feature Pin header 9-24 V DC Mega-Fit 2x1 Connector Cabled Coin-cell connector for RTC 0 C +60 C (Commercial version) Temperature* Dimensions 146x102mm (3.5 form factor, 5.75 x 4.02 ) *All carrier board components must remain within the operating temperature at any and all times, including start-up; carrier operating temperature is independent of the module installed. Please refer to the specific module for more details. Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet 35

38 COM Express Type 6 Carrier Board CCOMe-965 Carrier Board for COM-Express Type 6 modules on miniitx form factor Platform independent carrier board for quick prototyping HIGHLIGHTS COM Express Type 6 carrier board mini-itx form factor Broad choice of FEATURES Mass Storage PCI-e 1 x LVDS (18bit / 24bit, single / dual channel) 34 pin connector 1 x edp connector 1 x backlight connector 2 x combo DP / HDMI Connectors 1x multimode Display Port Connector 1 x VGA connector 8-pin socket for external DID EEPROM PCI Express Graphics x16 slot 2 x SATA connectors 1 x msata Slot 2 x Gigabit Ethernet ports 4 x 3.0 Host ports on type-a sockets 2 x 2.0 Host ports on internal pin header 1 x PCI-e x4 slot, Gen2 compatible 2 x minipci-e slot Full / Half Size, (one combined with SIM card slot), Gen2 compatible Internal HD Codec Triple jack S / P-DIF Out 3 pin header for digital Internal pin header for audio jacks remoting I2C EEPROM Socket LPC Bus internal pin header Front Panel Header 1 x 28 pin connector for additional features (I2C, ACPI signals, SM Bus, Watch Dog, Thermal Management) Internal pin header for GPIO / SDIO + 2 x RS-232 Serial ports (Tx / Rx signals) SIM Card slot Tachometric FAN connector, selectable +12V or +5V 0 C +60 C Temperature* ATX Standard power connector 24 poles (AT mode configurable) +12V auxiliary power connector Coin cell battery Holder for CMOS and RTC Dimensions 170 x 170 mm (6.69 x 6.69 ) *All carrier board components must remain within the operating temperature at any and all times, including start-up; carrier operating temperature is independent of the module installed. Please refer to the specific module for more details. Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet 36

39 COM Express Type 6 Development Kit COM Express Type 6 Development Kit COM EXP T6 DEV KIT Cross Platform Development Kit compatible with both x86 and ARM COM Express Type 6 modules Platform independent kit for fast Time-to-market DEVELOPMENT KIT CONTENTS The Development kit contains the following material: CCOMe-965 carrier board HDMI Cable High-Speed 19p to 19p 1m DP Cable 1m Module not included. Must be purchased separately FEATURES OF CCOMe-965 Mass Storage PCI-e 1 x LVDS (18bit / 24bit, single / dual channel) 34 pin connector 1 x edp connector 1 x backlight connector 2 x combo DP / HDMI Connectors 1x multimode Display Port Connector 1 x VGA connector 8-pin socket for external DID EEPROM PCI Express Graphics x16 slot 2 x SATA connectors 1 x msata Slot 2 x Gigabit Ethernet ports 4 x 3.0 Host ports on type-a sockets 2 x 2.0 Host ports on internal pin header 1 x PCI-e x4 slot, Gen2 compatible 2 x minipci-e slot Full / Half Size, (one combined with SIM card slot), Gen2 compatible Internal HD Codec Triple jack S / P-DIF Out 3 pin header for digital Internal pin header for audio jacks remoting I2C EEPROM Socket LPC Bus internal pin header Front Panel Header 1 x 28 pin connector for additional features (I2C, ACPI signals, SM Bus, Watch Dog, Thermal Management) Internal pin header for GPIO / SDIO + 2 x RS-232 Serial ports (Tx / Rx signals) SIM Card slot Tachometric FAN connector, selectable +12V or +5V 0 C +60 C Temperature* SCHEMATICS PUBLICLY AVAILABLE ATX Standard power connector 24 poles (AT mode configurable) +12V auxiliary power connector Coin cell battery Holder for CMOS and RTC Dimensions 170 x 170 mm (6.69 x 6.69 ) *All carrier board components must remain within the operating temperature at any and all times, including start-up; carrier operating temperature is independent of the module installed. Please refer to the specific module for more details. Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet 37

40 ETX

41 Computer-On-Module approach Consolidated Standard form factors Scalable and future proof Highly configurable Design investment limited to the carrier board Multi-vendor solution Accelerated time-to-market Long term availability Innovative and upgradable ETX Standard advantages For legacy designs X86 based CoM Extend the life of existing ETX-based projects Proven and established standard ISA bus support

42 ETX ETX-A61 ETX Module with the Intel Atom E3800 and Celeron families ( Bay Trail ) SoC Update your legacy design Moon Island platform - Intel IoT gateway solution HIGHLIGHTS Intel Atom E3800 and Celeron families ( Bay Trail ) Rugged design (DDR3L memory soldered on-board, exclusively ceramic capacitors, high quality AEC-Q200 grade inductors) State-of-the-art replacement solution for legacy projects in ETX form factor with dual channel memory On-board emmc for storage and operating system booting support MAIN FIELDS OF APPLICATION FEATURES Processor Max Cores 4 Max Thread 4 Memory Graphics Resolution Mass Storage Robotics Intel Atom E3845, Quad 2MB Cache, 10W TDP Intel Atom E3827, Dual 1MB Cache, 8W TDP Intel Atom E3826, Dual 1MB Cache, 7W TDP Intel Atom E3825, Dual 1MB Cache, 6W TDP Intel Atom E3815, Single 512KB Cache, 5W TDP Intel Celeron J1900, Quad 2MB Cache, 10W TDP Intel Celeron N2930, Quad 2MB Cache, 7.5W TDP Intel Celeron N2807, Dual 1MB Cache, 4.3W TDP DDR3L memory soldered on-board E3845, E3827, J1900, N2930: up to 8GB Dual-Channel DDR3L 1333MHz E3826: up to 8GB Dual-Channel DDR3L 1066MHz N2807: up to 4GB Single-Channel DDR3L 1333MHz E3825, E3815: up to 4GB Single-Channel DDR3L 1066MHz Integrated Intel HD Graphics 4000 series controller Dual independent display support HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats HW encoding of H.264, MPEG2 and MVC formats VGA standard analog video interface 18 / 24 bit single / dual channel LVDS interface (VESA and JEIDA color mapping compatible) CRT Interface: LVDS interface: Automotive Surveillance Up to 2560 x 60Hz Up to 1920 x 60Hz Biomedical/ Medical devices Optional emmc drive soldered on-board 2 x external SATA or 2 x PATA or 1 x PATA + 1 x SATA channels (factory options) μsd Card Slot Gigabit Ethernet controller, makes available a 10 / 100Mbps Ethernet interface Industrial Automation and Control Serial Ports System Automation HMI HD codec, Realtek ALC262 2 x Serial ports (TX / RX / RTS / CTS signals, TTL interface) PCI Bus rel. 2.3 compliant ISA Bus LPT interface shared with Floppy Drive interface PS / 2 mouse and keyboard interface I2C Bus SM Bus Watch Dog timer Management Signals +5V DC ± 5% and + 5V SB (optional) Microsoft Windows 7 (32 / 64 bit) Microsoft Windows 8.1 (32 / 64 bit) Microsoft Windows 10 (32 / 64 bit) Microsoft Windows 10 IoT Microsoft Windows Embedded Standard 7 (32 / 64 bit) Microsoft Windows Embedded Standard 8 (32 / 64 bit) Microsoft Windows Embedded Compact 7 Linux (32 / 64 bit) Yocto 0 C +60 C (Commercial version) Temperature* Dimensions 114 x 95 mm (4.49 x 3.74 ) Avionics *Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet 4 x 2.0 Host ports 40

43

44 Single Board Computer

45 Single Board Computer advantages Ready for systems integration Reduced time-to-market Best price point for low volume projects Very low engineering design investment Off-the-shelf solutions

46 Single Board Computer SBC-B68-eNUC SBC with the Intel Atom E39xx family, Intel Celeron N3350 and Intel Pentium N4200 (formerly code name Apollo Lake) SoCs in the embedded NUC form factor Flexible and expandable full industrial x86 enuc SBC HIGHLIGHTS Industrial temperature range Wide input voltage range Wide range of connectivity options through WLAN and WWAN M.2 slots Quad Channel Soldered Down LPDDR memory, up to 8GB Versatile expansion capabilities MAIN FIELDS OF APPLICATION FEATURES Processor Max Cores 4 Max Thread 4 Memory Graphics Resolution Mass Storage HMI Intel Atom x7-e3950 Quad GHz (Burst 2.0GHz), 2MB L2 Cache, 12W TDP Intel Atom x5-e3940 Quad GHz (Burst 1.8GHz), 2MB L2 Cache, 9W TDP Intel Atom x5-e3930 Dual GHz (Burst 1.8GHz), 2MB L2 Cache, 5.5W TDP Intel Pentium N4200 Quad (Burst 2.5GHz), 2MB L2 Cache, 6W TDP Intel Celeron N3350 Dual (Burst 2.4GHz), 2MB L2 Cache, 6W TDP Quad Channel soldered down LPDDR4 memory, up to 8GB Integrated Gen9-LP Graphics controller, with up to 18 Execution Units 4K HW decoding and encoding of HEVC(H.265), H.264, VP8, SVC, MVC Three independent display support Two DP interfaces on minidp connectors (supports HDMI displays through external adapter) Embedded Display Port (edp) internal connector LVDS through optional external adapter DP++: edp, HDMI: LVDS: Multimedia devices Industrial Internet of Things Up to 4096 x 2160 Up to 3840 x 2160 Up to 1920 x 1200 Industrial Automation and Control Optional emmc drive onboard M.2 SATA SSD slot (Socket 2 Key B Type 3042/2260 **) microsd Card slot SATA 7p M connector 2x Gbit LAN / Intel Gigabit Ethernet i21x family controller M.2 WWAN Slot for Modems (Socket 2 Key B Type 3042/2260 **) M.2 WLAN Connectivity Slot for WiFi/BT (Socket 1 Key E type 2230) Info Kiosks PCI-e Serial Ports System Digital Signage - Infotainment Point of Sales 2 x 3.0 Host ports on 3.0 Type-A sockets 2 x 2.0 Host ports on 2.0 Type-A sockets 2 x 2.0 Host ports on internal pin header 1 x 3.0 Host port on SSD/WWAN M.2 slot 1 x 2.0 Host port on WLAN M.2 Slot 1 x PCI-e x2 port on M.2 SSD/WWAN Slot 1 x PCI-e x1 port on WLAN M.2 Slot HD codec / Cirrus Logic CS4207 Mic In and Line Out jacks Amplified Speaker output on internal pin header 2 x RS-232/RS-422/RS-485 UARTS software configurable, on internal Pin Header 2 x I2C + 8 x GPI/Os on Feature connector Button / LED front panel header CIR (Consumer InfraRed) sensor microsim slot for M.2 WWAN Modem +18V DC +32 V DC recommended +15V DC +36 V DC absolute RTC battery Microsoft Windows 10 Enterprise (64 bit) Microsoft Windows 10 IoT Core Linux (64 bit) Yocto (64 bit) Android (planning) 0 C +60 C (Commercial version) Temperature* -40 C +85 C (Industrial version) Dimensions x mm (4 x 4 ) Automotive * Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. ** SATA SSD and WWAN functionalities share the same slot and are therefore mutually exclusive Information subject to change. Please visit to find the latest version of this datasheet 44

47 Single Board Computer Single Board Computer SBC-A80-eNUC SBC with the N-series Intel Pentium / Celeron and x5-series Atom SOCs in the embedded NUC form factor Multifunctional SBC on the enuc form factor HIGHLIGHTS embedded NUC Type 2 Connectivity module, x mm (4 x 4 ) Industrial range power supply Long lifetime HDMI, minidp++ and edp video connectors M.2 SSD and M.2 connectivity (PCI-e + ) slots Dual Gigabit Ethernet 3.0 Connectivity SBC-A80-eNUC is Microsoft Azure Certified for IoT MAIN FIELDS OF APPLICATION FEATURES Processor Max Cores 4 Max Thread 4 Memory Graphics Resolution Mass Storage HMI Multimedia devices Intel Pentium N3710, Quad 1.6GHz (Turbo Boost 2.56GHz), 2MB Cache, 6W TDP Intel Celeron N3160, Quad 1.6GHz (Turbo Boost 2.24GHz), 2MB Cache, 6W TDP Intel Celeron N3060, Dual 1.6GHz (Turbo Boost 2.48GHz), 2MB Cache, 6W TDP Intel Celeron N3010, Dual 1.04GHz (Turbo Boost 2.24GHz), 2MB Cache, 4W TDP Intel Atom x5-e8000, Quad 1.04GHz (Turbo Boost 2.00GHz), 2MB Cache, 5W TDP 2 x DDR3L SO-DIMM Slots with Dual Channel Support, up to 8GB DDR3L-1600 Integrated Graphics Three independent display support HW decoding of HEVC(H.265), H.264, MPEG2, MVC, VC-1, VP8, WMV9, JPEG/MJPEG formats HW encoding of H.264, MVC and JPEG/MPEG formats HDMI connector minidp++ connector embedded Display Port (edp) internal connector HDMI, DP: up to 3840x x1600 edp: up to 2560x1440 Optional emmc drive on-board M.2 SATA SSD slot (Socket 2 Key B Type 2242 or 2260) microsd Card slot SATA 7p M connector 2 x Gigabit Ethernet ports Industrial Internet of Things Industrial Automation and Control PCI-e Serial Ports System Info Kiosks 2 x 3.0 Host ports on Type-A sockets 2 x 2.0 Host ports on internal pin header 1 x 2.0 Host port on M.2 Connectivity Slot 1 x PCI-e x1 port on M.2 Connectivity Slot available on HDMI and minidp++ interfaces HD codec Combo TRSS connector with LineOut and MicIn support 2 x RS-232 / RS-422 / RS-485 UARTS, on internal Pin Header I2C Touch Panel connector Front Panel Pin Header CIR (Consumer InfraRed) sensor 8 x GPI/Os +18V DC +32V DC recommended +15V DC +36V DC absolute RTC Battery Microsoft Windows 7 (32 / 64 bit) Microsoft Windows 8.1 (32 / 64 bit) Microsoft Windows 10 (32 / 64 bit) Microsoft Windows 10 IoT Microsoft Windows Embedded Standard 7 (32 / 64 bit) Microsoft Windows Embedded Standard 8 (32 / 64 bit) Linux Yocto 0 C +60 C Temperature* Digital Signage - Infotainment Dimensions x mm (4 x 4 ) Point of Sales *Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet 45

48 Single Board Computer SBC-B47-eNUC SBC with the Qualcomm Snapdragon 410E processor in the embedded NUC form factor Connectivity oriented embedded NUC with Qualcomm Snapdragon 410E HIGHLIGHTS Ultra-low power solution Excellent as IoT gateway WiFi + BT LE 4.0 module on-board Li-Ion Battery connector MAIN FIELDS OF APPLICATION Home Automation FEATURES Processor Memory Graphics Resolution Mass Storage Robotics Qualcomm Snapdragon 410E Quad-core ARM Cortex -A53 at up to 1.2 GHz per core, 32- bit and 64-bit capable 512KB L2 cache Soldered down LP-DDR3 memory, up to 2GB Qualcomm Adreno 306 GPU; up to 400 MHz 3D graphics accelerator OpenGL ES 3.0, OpenCL, content security, decreased power consumption minidp or embedded Display Port connector LVDS connector 2-lane MIPI_CSI Camera interface 4-lane MIPI_CSI Camera interface Up to 1920 x 1080 Gaming Internet of Things Digital Signage - Info Kiosks PDA electronics HMI Point of Sales Infotainment Optional emmc drive on-board microsd Card slot WiFi only or WiFi + BT LE 4.0 module on-board (factory alternatives) Optional 10/100 Ethernet port Client port on 2.0 micro-ab connector 1x 2.0 Host port on 2.0 Type-A socket Optional: 2x 2.0 Host ports on 2.0 Type-A sockets + 1x 2.0 Host port on internal pin header (alternative to Arduino interface) Speaker + Microphone + Earphone interfaces on internal pin header Line Out + Mic In combo TRRS audio jack 1x I2S interfaces on dedicated pin header Serial Ports System RS-232 or RS-485 connector (factory alternatives) Optional debug UART on internal pin header 2 x I2C 2 x SPI Touch Screen dedicated connector 8 x GPI/Os Optional Arduino Interface Optional InfraRed receiver Watchdog +12V DC Li-Ion Battery connector Linux Android 0 C +60 C (Commercial version) Temperature* Dimensions x mm (4 x 4 ) Industrial Automation and Control *Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet 46

49 Single Board Computer Single Board Computer SBC-A44-pITX Pico-ITX SBC with Intel Atom E3800 family SOCs and ECC DDR3L memory Limitless Embedded applications Moon Island platform - Intel IoT gateway solution HIGHLIGHTS Born for the industrial market with native -40 to +85 C temperature range ECC memory support Broad range of video and native serial connectivity options Designed for harsh environments Ideal for critical applications For designs that require data coherence and security Also for headless applications and IIoT smart gateways MAIN FIELDS OF APPLICATION FEATURES Processor Max Cores 4 Max Thread 4 Memory Graphics Resolution Mass Storage Transportation Intel Atom E3845, Quad 2MB Cache, 10W TDP Intel Atom E3827, Dual 1MB Cache, 8W TDP Intel Atom E3826, Dual 1MB Cache, 7W TDP Intel Atom E3825, Dual 1MB Cache, 6W TDP Intel Atom E3815, Single 512KB Cache, 5W TDP Intel Atom E3805, Dual 1MB Cache, 3W TDP Up to 8GB on DDR3L-1333 ECC SO-DIMM Slot (DDR3L-1333 with E3845 and E3827, DDR3L-1067 the others) Integrated Intel HD Graphics 4000 series controller Dual independent display support HW decoding of H.264, MPEG2, MVC, VC1, VP8, MJPEG formats HW encoding of H.264, MPEG2 and MVC formats HDMI connector Single / Dual Channel 18- / 24-bit LVDS connector HDMI, resolution up to 60Hz LVDS, resolution up to 1920 x 1200 Optional emmc drive on-board 1 x standard SATA connector mini msata interface on minicard slot (shared with minipci-e) microsd Card slot Dual Gigabit Ethernet connector Telco Surveillance Internet of Things Serial Ports System Industrial Automation and Control Info Kiosks 8 x GPI/O FAN connector Switch / LED Front Header I2C connector with INT and RST# signals 2 x optional RS-232 / RS-422 / RS-485 Serial ports on internal pin Header 12V DC ± 5% RTC Battery with lead cable and connector Microsoft Windows 7 (32 / 64 bit) Microsoft Windows 8.1 (32 / 64 bit) Microsoft Windows 10 (32 / 64 bit) Microsoft Windows 10 IoT Microsoft Windows Embedded Standard 7 (32 / 64 bit) Microsoft Windows Embedded Standard 8 (32 / 64 bit) Microsoft Windows Embedded Compact 7 Linux (32 / 64 bit) Yocto 0 C +60 C (Commercial temperature) Temperature* C (Industrial temperature) Dimensions 72 x 100 mm (2.83 x 3.93 ) *Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet PCI-e 2 x 3.0 Host ports on Dual Type-A socket 2 x 2.0 Host ports on internal pin header 1 x 2.0 Host port on minipci-e slot Half minipci-e slot (shared with msata) Optional HD Codec Cirrus Logic CS4207 Mic In, Line out internal pin header connector 47

50 Single Board Computer SBC-949-pITX Pico-ITX SBC with Intel Atom Cedar View family Processors Low-cost x86 fanless solution HIGHLIGHTS Space and power saving SBC with long term support Based on the Intel Atom Cedar View dual core N2000 and D2000 CPU family 64-bit instruction set and Hyper Threading Impressive performance/power consumption ratio Suitable for fanless and low budget applications MAIN FIELDS OF APPLICATION FEATURES Processor Max Cores 2 Max Thread 4 Chipset Intel Atom 1MB Cache, 10W TDP Intel Atom 1MB Cache, 6.5W TDP Intel Atom 1MB Cache, 3.5W TDP Intel NM10 Express Chipset Memory Up to 4GB DDR3 1066MHz SO-DIMM (up to 2GB with N2600) Graphics Resolution Integrated Intel HD Graphics controller Dual independent display support Supports DirectX 9 Shader Model 3.0 and OpenGL rel. 3.0 HDMI connector LVDS connector VGA interface N2xx CPU D2550CPU HDMI, CRT: Up to 1920x1200 Up to 1920x1200 LVDS interface: Up to 1366x768 Up to 1440x900 Mass Storage 2 x SATA connectors HMI Energy Digital Signage - Infotainment Robotics System Point of Sales 0 C +60 C Temperature* Microsoft Windows XP Microsoft Windows 7 Microsoft Windows Embedded Standard 2009 Microsoft Windows Embedded Standard 7 Microsoft Windows Embedded Compact 7 Linux Dimensions 72 x 100 mm (2.83 x 3.94 ) *Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet Up to 2 x Gigabit Ethernet connector 2 x 2.0 Type A 4 x internal 2.0 ports HD Codec Realtek ALC886 Mic In, Line out internal pin header FAN connector Front Header Expansion connector +12V DC ± 10% RTC Battery with lead cable and connector 48

51 Single Board Computer Single Board Computer SBC-992-pITX SBC with AMD Embedded G-Series SoC in Pico-ITX form factor RADEON GPU and Multi-core processing HIGHLIGHTS Smallest standard SBC in the market Connectivity-oriented Dual LAN Multi-display support (LVDS - HDMI - edp - VGA) 3.0 support MAIN FIELDS OF APPLICATION FEATURES Processor Max Cores 4 Memory Graphics Resolution Mass Storage Gaming Digital Signage - Infotainment AMD GX-420CA, Quad 2.0GHz, 2MB L2 Cache, TDP 25W AMD GX-415GA, Quad 1.5GHz, 2MB L2 Cache, TDP 15W AMD GX-217GA, Dual 1.65GHz, 1MB L2 Cache, TDP 15W AMD GX-210HA, Dual 1.0GHz, 1MB L2 Cache, TDP 9W AMD GX-210JA, Dual 1.0GHz, 1MB L2 Cache, TDP 6W Up to 8GB on DDR3 1600MHz (DDR3-1333MHz with GX-210HA, DDR3-1066MHz with GX-210JA) Embedded AMD HD RADEON GPUs 600MHz (GX-420CA), 500MHz (GX-415GA) 450MHz (GX-217GA), 300MHz (GX-210HA) 225MHz (GX-210JA), Dual independent display support Supports DirectX 11.1, OpenGL rel. 4.2 and OpenCL rel. 1.2 HDMI connector Single Channel 18bit LVDS connector or embedded Display Port connector CRT interface (requires external Adapter) HDMI, resolution up to 1920 x 1200 LVDS, resolution up to 1600 x 900 (up to 1920 x 1200 through external adapter) edp, resolution up to 2560 x 1600 CRT, resolution up to 2048 x x standard SATA connectors microsd Card slot (combo connector) Thin Clients System Point of Sales minisim slot (combo connector) FAN connector Front Header Expansion connector 12V DC ± 10% RTC Battery with lead cable and connector Microsoft Windows 7 (32 / 64 bit) Microsoft Windows 8.1 (32 / 64 bit) Microsoft Windows 10 (32 / 64 bit) Microsoft Windows Embedded Standard 7 (32 / 64 bit) Microsoft Windows Embedded Standard 8 (32 / 64 bit) Linux (32 / 64 bit) 0 C +60 C Temperature* Dimensions 72 x 100 mm (2.83 x 3.94 ) *Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet PCI-e Up to 2 x Gigabit Ethernet connector 2 x standard 3.0 Type A 4 x internal 2.0 ports 2.0 interface on minipci-e Slot HD Codec Realtek ALC886 Mic In, Line out internal pin header connector Half minipci-e slot 49

52 Single Board Computer SBC-A62-J Single Board Computer with NXP i.mx6 Processor Flexible, Open-source, Industrial SBC HIGHLIGHTS Ready-to-use and ready-to-market cost-effective product which exclusively supports SoC native features NXP i.mx6 DualPlus NOW AVAILABLE From the successful DIY community board,, born for the Industrial market The first open source embedded board on the market Systems: Linux, Yocto, Android, WEC7 A flexible solution, with a configurable expansion connector Fully scalable solution from high performance Quad Core CPU to an energy-efficient Solo Core Cost-effective MAIN FIELDS OF APPLICATION FEATURES Processor Max Cores 4 Memory Graphics Resolution Mass Storage NXP i.mx6 Family, based on ARM Cortex-A9 processors: SBC-A62-J-SOLO: Single Core SBC-A62-J-LITE: Dual Core Lite SBC-A62-J-PLUS: Dual Core Plus SBC-A62-J-QUAD: Quad Core Soldered on-board DDR3L memory***: SBC-A62-J-SOLO: 512MB 32-bit interface SBC-A62-J-LITE: 1GB 64-bit interface SBC-A62-J-PLUS: 2GB 64-bit interface SBC-A62-J-QUAD: 1GB 64-bit interface Integrated Graphics, with up to 3 separate HW accelerators for 2D, OpenGL ES2.0 3D OpenVG accelerator (only SBC-A62-J-PLUS and SBC-A62- J-QUAD) HW encoding of MPEG-4, H.263 V2, H.264, MJPEG HW decoding of MPEG-2, VC1, MPEG-4 / XviD, H.263, H.264, DivX SBC-A62-J-SOLO and SBC-A62-J-LITE support up to 2 independent displays SBC-A62-J-PLUS and SBC-A62-J-QUAD support up to 3 independent displays 1 x Dual Channel or 2 x Single Channel 18 / 24 bit LVDS interface HDMI interface 1.4 HDMI: LVDS: Point of Sales Digital Signage - Infotainment up to 1920 x 1080p up to 1920 x 1200 Industrial Internet of Things 4GB emmc drive soldered on-board*** microsd Card slot SBC-A62-J-PLUS and SBC-A62-J-QUAD: SATA connector Gigabit Ethernet connector Internal connector for Wi-Fi Module 2 x 2.0 Type-A ports and 1 x 2.0 internal connector micro-b Client port SBC-A62-J-LITE, SBC-A62-J-PLUS and SBC-A62-J-QUAD: AC 97 Codec Realtek ALC655 with Mic-In, Line-Out audio Jacks Serial Ports System Debug UART interface, TTL voltage level. SBC-A62-J-LITE, SBC-A62-J-PLUS and SBC-A62-J-QUAD: dedicated CAN Bus connector (Transceiver CAN 3.3V) serial interfaces on the expansion connector: SBC-A62-J-SOLO: 1 x Serial (TTL level) - 2 x Serial (RS-232) - 2 x CAN (TTL level); SBC-A62-J-LITE: 1 x Serial (TTL level) - 2 x Serial (RS-232) - 1 x CAN (TTL level); SBC-A62-J-PLUS and SBC-A62-J-QUAD: 1 x Serial (RS-485) - 2 x Serial (RS-232) - 1 x CAN (TTL level) Dedicated connector (I2C, GPIO signals) for external Touch Screen controller; MIPI-CSI Camera connector; Configurable* expansion connector with: Up to 28 GPIO - SPI interface - SPDIF interface - CAN interface (TTL level) - SDIO interface - 3 x PWM - I2C - UARTs +12V DC ; Additional embedded Low RTC; SBC-A62-J-SOLO and SBC-A62-J-LITE: internal i.mx6 Real Time Clock (external battery required for time/date retention, not included) SBC-A62-J-PLUS and SBC-A62-J-QUAD: low power Real Time Clock with onboard battery Free Android and Linux community BSP available at UDOO.org SECO Android (under development) and Linux BSP / WEC7 on request. Yocto Guideline valid for SECO BSP 0 C +60 C (Commercial temp.) Temperature** For Industrial temp. (-40 C +85 C) please contact us Dimensions 110 x 86.5 mm (4.5 x 3.7 ) This board is available in 4 configurations: SBC-A62-J-SOLO SBC-A62-J-LITE SBC-A62-J-PLUS SBC-A62-J-QUAD * Please note that some of these interfaces are factory options, other configurations are made via SW. ** Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. *** For additional configurability please contact us Information subject to change. Please visit to find the latest version of this datasheet 50

53 Single Board Computer Single Board Computer SBC-B08 Single Board Computer with NXP i.mx 6SoloX Processor All-in-one IoT hybrid computing solution HIGHLIGHTS From the success of, the SBC born for NE O Industry The ideal building block for any IoT project Wireless connectivity Linux or Android running on the Cortex -A9 core Real-time OS on the Cortex -M4 core MAIN FIELDS OF APPLICATION FEATURES Processor Max Cores Memory Graphics Resolution Mass Storage Serial Ports Industrial Internet of Things Digital Signage - Infotainment NXP i.mx6sx SoloX Processor, Single core Cortex 1GHz + Cortex -M4 227MHz 32-bit DDR3L memory soldered on-board, up to 1GB Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported Single Channel 18- / 24- bit LVDS connector + Touch Screen (I2C signals) 24-bit Parallel RGB Connector ADC input (PAL and NTSC formats supported) LVDS: up to 24bpp RGB: up to 24bpp 16MB NOR Quad-SPI Flash soldered on-board emmc soldered on-board, up to 8GB μsd Card slot Up to two Fast Ethernet RJ-45 connectors WiFi ( b / g / n) +BT LE combo module + antenna on-board 1 x 2.0 OTG port 3 x 2.0 Host ports on standard Type-A socket 1 x 2.0 Host port on internal pin header I2S interface on programmable pin header S / PDIF interface (In and Out) on programmable pin header 1 x CAN Port with CAN transceiver on dedicated connector, optional 1 x CAN Port reconfigurable as GPIO 3 x UARTS on programmable pin header (optionally available with RS-232 or RS-485 interface) Home entertainment Integrated Sensors System Info Kiosks Multimedia devices 2 x I2C dedicated connectors (one reserved for Touch Screen) 6 analog inputs for A / D Conversion Programmable (*) expansion pin header connector, able to offer: Up to 26 GPIO SPI interface SPDIF interface I2S interface CAN interface (TTL level) 3 x PWM 2 x I2C 3 x UARTs (TTL, RS-232 or RS-485 interface) (*) Please note that some of these interfaces are factory options, other configurations are made via SW using the pin multiplexing possibilities of the i.mx6sx processor. Optional 9-Axis Motion Sensors (Accelerometer, Magnetometer and Digital Gyroscope) +12V DC nominal voltage Optional additional embedded Low RTC Android Linux 0 C +60 C (Commercial version) Temperature* Dimensions 89.5 x 87 mm (3.52 x 3.43 ) *Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet 51

54 Modular HMI & Boxed Solutions

55 Modular HMI SYS-A62-10 Embedded Panel with 10.1 LCD display based on the Multicore NXP i.mx6 SoC family Flexible, Open-source, Industrial system HIGHLIGHTS Flexible HMI solution Long-endurance display (30K hours) Easy to integrate MAIN FIELDS OF APPLICATION FEATURES Processor Memory Embedded Graphics Section Mass Storage Serial Ports Point of Sales Digital Signage - Infotainment Multicore NXP i.mx6 processor family SYS-A62-10/SOLO: i.mx6s Solo, 1 x ARM GHz Core SYS-A62-10/LITE: i.mx6dl Dual Lite, 2 x ARM GHz Cores SYS-A62-10/QUAD: i.mx6q Quad, 4 x ARM GHz Cores On-board DDR3L soldered memory; SYS-A62-10/SOLO: 512MB 32-bit SYS-A62-10/LITE: 1GB 64-bit SYS-A62-10/QUAD: 1GB 64-bit 2D, OpenGL ES2.0 3D HW accelerator OpenVG accelerator (SYS-A62/10/QUAD only) HW encoding of MPEG-4, H.263 V2, H.264, MJPEG HW decoding of MPEG-2, VC1, MPEG-4 / XviD, H.263, H.264, DivX 10,1 LVDS display, resolution 1280 x 800, 30K hours life P-Cap (Projected Capacitive touch screen), with 2mm glass cover Glass Hardness IK08, Surface Hardness 8H (450g) On-board 4GB emmc drive microsd Card Slot SATA Connector (SYS-A62-10/QUAD only) Gigabit Ethernet connector Optional WiFi pluggable module 2 x 2.0 Type-A ports and 1 x 2.0 internal connector micro-b Client port SYS-A62-10/LITE and SYS-A62-10/QUAD: Realtek ALC655 AC 97 Codec with Mic-In, Line-Out audio Jacks Dedicated Serial ports: SYS-A62-10/SOLO: 2 x RS-232 ports SYS-A62-10/LITE: 2 x RS-232 ports, 1 x CAN port SYS-A62-10/QUAD: 2 x RS-232 ports, 1 x RS-485 port, 1 x CAN port serial ports can be realised on expansion connector (see interfaces ) Industrial Internet of Things System Vending Temperature Dimensions MIPI-CSI Camera connector Programmable expansion connector with: SYS-A62-10/SOLO: up to 22 GPIOs, 2 x TTL CAN ports, 1 x UART TTL, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces SYS-A62-10/LITE: up to 20 GPIOs, 1 x TTL CAN port, 1 x UART TTL, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces SYS-A62-10/QUAD: up to 18 GPIOs, 1 x TTL CAN port, 3 x PWM, 2 x I2C, SD, SPI or S/PDIF interfaces +12V DC SYS-A62-10/SOLO and SYS-A62-10/LITE: internal i.mx6 RTC, require external battery for time/data retention SYS-A62-10/QUAD: low power RTC with on-board battery Linux Yocto Windows Embedded Compact 7 0 C 50 C HMI 269,60 x 189,20 x 17,17 mm Information subject to change. Please visit to find the latest version of this datasheet 53

56 Modular HMI SYS-B08-7 Embedded Panel with 7 LCD display based on the NXP i.mx 6SoloX Processor Smart, compact, industrial 7 touch system built for IoT HIGHLIGHTS 7 capacitive full-flat multi-touch screen Lightweight and easy installation with integrated HW accelerator, also suitable for 24-hr digital signage usage Low power consumption and fanless system Connectivity oriented Android and Linux ready for quick system deployment MAIN FIELDS OF APPLICATION FEATURES Processor Memory Graphics Section Mass Storage Serial Ports Industrial Automation Industrial Internet of Things Digital Signage - Infotainment NXP i.mx6sx SoloX Processor, Single core Cortex 1GHz + Cortex -M4 200MHz 32-bit DDR3L memory soldered on-board, up to 1GB Integrated Graphics Vivante GC400T, 2D and 3D HW accelerator OpenGL ES 2.0, OpenGL ES 1.1, OpenVG 1.1 supported 7 RGB display, resolution 800 x 480, 30K hours life 5-point multitouch Capacitive touch screen, with AsaHi tempered glass cover 16MB NOR Quad-SPI Flash soldered on-board emmc soldered on-board, up to 8GB μsd Card slot Up to two Fast Ethernet RJ-45 connectors WiFi ( b / g / n) +BT LE combo module + antenna on-board 1 x 2.0 OTG port 3 x 2.0 Host ports on standard Type-A socket 1 x 2.0 Host port on internal pin header I2S interface on programmable pin header S / PDIF interface (In and Out) on programmable pin header 1 x CAN Port with CAN transceiver on dedicated connector, optional 1 x CAN Port reconfigurable as GPIO 3 x UARTS on programmable pin header (optionally available with RS-232 or RS-485 interface) Home Automation System I2C dedicated connector 6 analog inputs for A / D Conversion Programmable (*) expansion pin header connector, able to offer: Up to 26 GPIO SPI interface SPDIF interface I2S interface CAN interface (TTL level) 3 x PWM 2 x I2C 3 x UARTs (TTL, RS-232 or RS-485 interface) (*) Please note that some of these interfaces are factory options, other configurations are made via SW using the pin multiplexing possibilities of the i.mx6sx processor. +12V DC nominal voltage Optional additional embedded Low RTC Android Linux 0 C +60 C (Commercial version) Temperature* Dimensions Info Kiosks Multimedia devices x x mm HMI *Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. Information subject to change. Please visit to find the latest version of this datasheet 54

57 Boxed Solutions SYS-A62-GW Gateway solution based on the NXP i.mx6 Single Core Processor Industrial IoT gateway solution MAIN FIELDS OF APPLICATION FEATURES Processor Memory Mass Storage Home Automation Serial Ports Telco Surveillance Internet of Industrial Energy Automation Things Automation and Control i.mx6s Solo - Single core up to 1GHz 512MB 32-bit interface DDR3L memory soldered on-board 4GB emmc drive soldered on-board microsd Card slot Gigabit Ethernet connector Wi-Fi Module with external antenna 2 x 2.0 Type-A ports micro-b Client port Internal debug UART interface, TTL voltage level Configuration type A 20 poles 3.81 mm terminal block with: 1 x UART RS-485 Half Duplex 1 x UART RS x UART CMOS 3.3V 2 x CAN Bus 1 x 2.0 Type-A connector or 1 x RJ-45 10/100 Ethernet connector (factory alternatives) Configuration type B 20 poles 3.81 mm terminal block with: 1 x UART RS-485 Half Duplex 1 x UART RS-232 (tx and rx) 8 x analog inputs (Vmax 12V Imax 80 ma) 4 x optoisolated digital inputs 1 x 2.0 Type-A connector System Temperature +12V DC ; Internal i.mx6 Real Time Clock (external battery required for time/date retention, not included) Linux IoT BSP 0 C +60 C (Commercial temp.) Dimensions x 95 x 41.8 mm (5.77 x 3.73 x 1.64 ) Wireless Technologies Information subject to change. Please visit to find the latest version of this datasheet For further configurations please contact us 55