Engineering Leadership. Computer-On-Modules

Transcription

1 Engineering Leadership Computer-On-Modules

2 MSC Technologies at a Glance Our aim is to deliver the best engineering performance to provide our customers with a leadership position in their markets. youtube.com/mscembedded Silvano Geissler, Vice President Board Solutions, MSC Technologies 2 3

3 Computer on Module Product Range ARM Technology X86 Technology MSC has the complete portfolio of COM Express modules. From low end Intel Atom to high end Core i7 and Xeon processors, from Mini to Basic format. MSC s widespread Qseven portfolio is one of the widest in the industry. From Single-Core ARM to Quad-Core x86, Cortex-A9 to latest x86. The SMARC 2.0 product range is steadily growing and spans ARM Cortex-A9 to latest x86 Atom SOCs. The nanorisc module family combines compact size with low power and low cost. With ARM Cortex-A8 and A9 processors

4 Vertical Markets Industrial Medical Gaming Transportation POS/POI Building Automation Security Scalability of COMs Scalability of Performance describes the capability of COMs to allow alternative modules of different performance and feature levels to be used in the module socket of the same carrier board. Other Advantages of COMs Reduced complexity Focuses core competence on system design Faster development cycles shorter Time to Market Lower cost-of-ownership Minimizes development risk High flexibility Extended lifecycle concept Second source availability due to standardization 6 7

5 Fitness Center Smart Grid Factory Automation Smart Store Intelligent Digital Signage CLOUD & SERVICE Renewable Energy Medical Devices Hospital Information Network Optimization Home Automation MSC - The Standards Innovator SMART CITY INTELLIGENT HOSPITAL SMART LIVING INDUSTRY 4.0 Since 2005 MSC is an executive member of the PCI Computer Manufacturer Group (PICMG), and has been driving the development of new versions of the popular COM Express standard. MSC was one of the founders of the Standardization Group for Embedded Technologies (SGeT), focusing on the development of specifications for embedded computer products. As a prominent member of SGeT, MSC has been driving the standardization process for the Qseven and the SMARC 2.0 specifications. MSC - The Technology Leader Premier Partners MSC is a premier partner of Intel and AMD, and has early access to all new microprocessor generations. Processors We are using the best ARM processors from NXP and Texas Instruments on our Qseven, SMARC 2.0 and nanorisc modules. Traffic Optimization Internet of Things Traffic Camera Microsoft Azure Cloud In the course of the next industrial revolution, billions of intelligent devices, systems and machines are going to be interconnected by the Internet of Things. All of MSC s Computer-on-Modules are ready for application in IoT devices, network concentrators and the cloud. Cloud Services are available from Microsoft for a wide range of requirements. Microsoft Azure is a growing collection of integrated cloud services implemented through Microsoft s global network of data centers. MSC is providing an On-Board Tool which allows connecting to IoT nodes consisting of Computer-on-Modules and/or Computer Boards effectively reading out status information and application results. Security BIOS Partnership Our BIOS partnership with AMI ensures that our software engineering capabilities in the BIOS/ UEFI development includes customization of the source code. All current Computer-on-Modules from MSC are certified for the Microsoft Azure Cloud and can be employed for IoT-related applications

6 MSC - Research & Development MSC - Production Best-in-class Engineering since 1987 MSC has more than 30 years of experience in complex and high-speed circuit design, development and production. Our skilled design engineers have many years of experience designing boards with high-end x86 and ARM CPUs as well as with fast memory technology and programmable devices (CPLD, FPGA). Ultra-fast system signal design and layout has always been one of our specialties. Leading-Edge Manufacturing MSC runs three state-of-the art manufacturing sites in Germany and in Malta. Latest production equipment and a high degree of automation allows us to achieve best-in-class throughput at very low manufacturing cost and highest quality. Best-in-Class Quality The MSC product engineering, test development and production engineers are working hand in hand to achieve optimized product quality. Certificate of Registration This is to certify that the Quality Management System of MSC Technologies GmbH Industriestraße 16 D Stutensee has been assessed and registered by Intertek Certification GmbH as conforming to the requirements of DIN EN ISO 9001:2015 The Quality Management System is applicable to Development, production and sales of customer specific and own electronic systems, boards, components and display solutions as well as distribution of electronic components and display products at the sites listed in the annex. Certificate Reg. No.: Validity Date: till Initial Certification on: Issue Date: The appendix is part of this certificate and consists of 1 page. x86 CPU Architecure ARM Cortex-Ax Architecture FPGA / FPGA SOC Design High Speed Designs (DDRx DRAM, PCIe, USB 3.0, Frontside Buses, Graphics,.) Simulation (Thermal, Signal Integrity, Functional) Operating System support (Windows / Windows Embedded / Linux Embedded) BIOS and software development Our sophisticated SAP-integrated MES and quality system ensures full traceability of our products, and includes strict version control for each product made. Christina Weiglein, Certification Body Intertek Certification GmbH - Hanns-Martin-Schleyer-Straße 2, D Moenchengladbach, Germany In the issuance of this certificate, Intertek assumes no liability to any party other than to the Client, and then only in accordance with the agreed upon Certification Agreement. This certificate s validity is subject to the organization maintaining their system in accordance with Intertek s requirements for systems certification. Validity may be confirmed via at certificate.validation@intertek.com or by scanning the code to the right with a smartphone. Certificate The certificate remains the property of Intertek, to whom it must be returned upon request. It is hereby confirmed that company MSC Technologies GmbH including the sites of the companies: U-A scope of application: MSC Technologies GmbH Development and production of electronic Industriestrasse 16 devices and systems as well as distribution D Stutensee of electronic components and devices U-B scope of application: Avnet Logistics Stutensee GmbH Services in logistics division Industriestrasse 18 D Stutensee U-C scope of application: Avnet Logistics PMC Stutensee GmbH Programming of electronic components Industriestrasse 16 D Stutensee has fully implemented a management system in accordance with the standard DIN EN ISO 14001:2009 for the above-named scope of application. Date of initial certification: 12/12/2011 Certificate registration no.: U This certificate is valid until: 11/12/2017 Chemnitz, 12/12/2014 ICG Zertifizierung GmbH, Wildparkstraße 3, D Chemnitz / Germany Certifying Body

7 BIOS / Software UEFI BIOS SECURED Operating Systems For all x86 modules MSC is using the advanced AMI Aptio V BIOS which MSC is supporting all popular and important operating systems, i.e. Windows 10, Windows 7 and implements the UEFI architecture with Secure Boot enhancements. Linux. Older modules are supporting Windows 7 and/or Windows 8. For most recent modules, MSC ontinuously improves its BIOS solutions with new functions and Linux support is based on the Yocto Project which is the standard for up-to-date embedded sys- technologies such as Advanced Boot Device Configuration. tems controlled by Linux. MSC is offering to adapt the BIOS for customers, but is also offering the MSC BIOS Configuration Tool which enables users to easily modify BIOS Distributed/ Network Apps MSC-On-Board Controller binary images and set configuration defaults, add splash screen images, pre-define passwords etc. MSC is maintaining user-friendly interfaces Apps MSC implements a powerful microcontroller (EC) on all advanced modules which helps to control correct operation of the module and takes over most of the house holding functions: it controls such as EAPI (Embedded Application Programming Interface) to allow low-level control of non-volatile memory, I2C bus access, backlight set- OS Drivers the fan speed, monitors temperatures and voltage levels and controls power on/off of the board. Besides health monitoring and logging, the EC has implemented a power-on and boot watchdog tings, watchdog timer etc. and display backlight control. The optional smart battery support makes it easy to design full OS Kernel battery powered systems. Security The AMI Aptio V BIOS as used by MSC supports the Chain of Trust according to the TCG (Trusted Computing Group): From power-on every step is monitored CRTM (Core root of trust for measurement) is essential Hash values in TPM are compared to actual values of SW modules Boot process stops if integrity of one chain link is doubtful SecureFlash update tool allows signed update files only Root of Trust cannot be modified Boot Loader Option ROMs BIOS (POST Phase) Boot Block TPM Chain of Trust Monitoring Fan Control Power Sequencing Watchdog Display Backlight Control Smart Battery Support Health Data EDID Emulation Customized Functions Runtime Metering Root of Trust (CRTM)

8 Cooling Solutions Thermal Simulations MSC is offering a large number of different cooling devices for its Computer-on-Modules portfolio. Among these are various heatspreaders, heatsinks and a selection of heatsinks with fans for active cooling. All coolers can be customized by MSC to optimize functionality, efficiency and cost. For high-volume applications, MSC offers to design custom cooling solutions optimized for specific purposes. MSC performs thermal simulations prior to producing cooling solutions in hardware. This ensures that all requirements will be considered and that the result will perform near the theoretical optimium. MSC provides thermal consulting as a service to its customers helping to ensure that the resulting cooling solutions will be adequate on the system basis

9 Environmental Testing & Certification Thermal Characteristics of Standard Products Compliance Test MSC is offering most products in standard temperature and Pre & Post Layout Signal Simulations in industrial temperature variants. This temperature rating EMC, ESD in Reference Environment (CE) is tested on a sample basis since all components used for Signal Compliance of High-Speed Interfaces these products are specified accordingly. Product Screening and Ruggedization For boards which are only specified in the standard temperature range, MSC is offering a screening service resulting in the same products available in an extended temperature range to be specified by the customers. Environmental Test Temperature Tests Shock Vibration Certification Support for applications specific certifications Collaboration with external certification agencies RUGGED Built to Fit MSC offers customization of its standard modules according to the requirements of the customers. This will help to achieve required price points for volume projects by not populating components which are not required, i.e. less memory or less controllers of unnecessary functionality. In addition, MSC offers to assemble Computer-on-Modules on carrier boards, optionally with suitable cooling and with memory modules inserted. Customized Assembly Individual Solutions Mounted and tested (memory, cooling, baseboard) Individual test profile Pre-configured BIOS Baseboard Electronic Manufacturing Service (EMS)

10 < Standard Qseven Module Customization Service From Standard to Full-Custom A complete Computer-on-Module can be treated as a functional macro and inserted into a full-custom board design. That will shorten the development time of customer-specific board designs dramatically, and help to achieve the shortest possible time-to-market because the functional macro is already proven to work, and comes with full software and firmware support. Custom Development Carrier board Single-Board Computer Add-on boards Non-standard modules < Standard Qseven Module on Baseboard FPGA Capabilities MSC has been designing FPGA-based boards and systems for several decades. For very many application areas, we have successfully designed cutting-edge high-speed and high-complexity boards providing ultimate performance and functionality. < Qseven Technology into full-custom design

11 Global Leadership Worldwide Support No matter where in the world you are, the next Avnet regional sales office is only a phone call away. MSC Technologies is Avnet s own brand of embedded boards and systems, and is supported by the entire Avnet sales force around the planet. Regional sales engineers are supported by local FAEs and Business Development Managers, who all have direct access to MSC s Product Marketing and Technical Support groups. Avnet Headquarters Phoenix / Arizona MSC Headquarters and Boards Manufacturing Plant Stutensee MSC Systems Manufacturing Plant Freiburg MSC Boards Manufacturing Plant Malta Design-in Services Technical Support Pre- and Post-Sales Support Experience sharing OEM baseboard design reviews and debugging Baseboard Design Guidelines and Trainings Benchmark performance comparisons Customized starter kits 900 Employees 120 Engineers in R&D Support Website Drivers, BSPs, BIOS updates Software APIs (EAPI) and other Software Tools User Manuals, App Notes, Mechanical infos, etc. 4 Design Centers 3 Manufacturing Sites More than 500,000 Boards per year

12 COM Express Properties Common for all Form Factors Extended only Basic only Compact only Compact and Basic only Mini only The COM Express Standard supports four sizes: Mini, Compact, Basic and Extended. All sizes utilize two high-speed, 220-pin connectors except for the Mini format which only supports one connector. Signal distribution of this connector is similar to the other formats but by no means identical. Common for all Form Factors Extended only Basic only Compact only Compact and Basic only Mini only Extended Compact Basic Mini COM Express COM Express, the widely spread COM standard in the embedded world, has been defined by the as high-end computing and graphics intensive solutions. It is designed for the latest chipsets PICMG (PCI Industrial Computer Manufacturers Group) in Since that time and after a few and serial signaling protocols, including PCI Express Gen 3, SATA, USB 3.0, and high resolution COM Express Extended COM Express Compact updates, COM Express has become the most versatile and most scalable COM standard support- video interfaces. COM Express provides the highest performance of the many small form factor For special applications only All dimensions are shown in millimeters. Not commonly used Preferred format for entry and mid level solutions Highly integrated, fully featured and space saving solution ing small and cost-sensitive applications as well standards and products available. 155 mm x 110 mm 95 mm x 95 mm COM Express Basic Standard COM Express format for high level solutions 125 mm x 95 mm COM Express Mini Entry level format for small and rugged solutions Reduced feature set (uses only one connector) 84 mm x 55 mm

13 COM Express - Basic COM Express - Basic MSC C6B-KLH Intel Core - 7th Generation Type 6 NEW MSC C6B-8SB Intel Core - 5th Generation Type 6 95 x /55 W The MSC C6B-KLH module is based on Intel s 7th generation Core processor family. The Intel two-chip solution allows highest performance in graphics and computing on a COM Express module in basic form factor. 95 x W This module is based on Intel's 5th generation Core processors produced in 14nm technology. It supports triple independent displays, DirectX 11.1, fast low-power DDR3L-1600 memory and USB 3.0 on a COM Express Type 6 module. Intel Core i7-7820eq (quad-core, 3.0/3.7GHz), Four SATA 6Gb/s mass storage interfaces Intel Core i5-7440eq (quad-core, 2.9/3.6GHz), Three DisplayPort/HDMI/DVI interfaces Intel Core i7-5850eq (quad-core, 2.7/3.4GHz) LVDS (24 Bit, dual channel) and CRT interface Intel Core i5-7442eq (quad-core, 2.1/2.9GHz), Embedded DisplayPort / LVDS (24 Bit, Intel Core i7-5700eq (quad-core, 2.6/3.4GHz) Triple independent display support Intel Core i3-7100e (dual-core, 2.9GHz), dual channel) interface Intel HD Graphics GT2 or GT3e DirectX 11.1, OpenGL 3.2, OpenCL 1.2 Intel Core i3-7102e (dual-core, 2.1GHz), Triple independent display support Intel 8-Series chipset Resolution up to 4096 x 2304 Intel Xeon E3-1505Mv6 (quad-core, 3.0/4.0GHz), DirectX 12, OpenGL 4.4, OpenCL 2.x Up to 16GB DDR3L-1600 SDRAM, dual channel Seven PCI Express x1 lanes Intel Xeon E3-1505Lv6 (quad-core, 2.2/3.0GHz) Resolution up to 4096 x 2304 Four SATA mass storage interfaces, up to 6Gb/s Four USB 3.0/2.0 and four USB 2.0 interfaces Intel HD Graphics 630, P630 Eight PCI Express x1 lanes; PEG x16 Three DisplayPort/HDMI/DVI interfaces Trusted Platform Module Intel chipsets QM175, HM175 or CM238 Four USB 3.0/2.0 and four USB 2.0 interfaces Two embedded DisplayPort interfaces Up to 32GB DDR SDRAM, dual channel Trusted Platform Module (ECC optional) UEFI Firmware MSC C6B-SLH Intel Core - 6th Generation MSC C6B-8S / CXB-8S Intel Core - 4th Generation Type 6 Type 6 / Type 2 95 x / 55 W The MSC C6B-SLU module is based on Intel s 6th generation Core processor family with a new processor architecture based on 14 nm process technology. The Intel two-chip solution allows highest performance in graphics and computing on a COM Express module in basic form factor. 95 x / 55 W Based on Intel's 4th generation Core processors this COM Express family supports the latest digital display interfaces like DisplayPort, HDMI and DVI and controls up to three independent displays. USB 3.0 interfaces connect to the fastest peripheral devices available. Intel Core i7-6820eq (quad-core, 2.8/3.5GHz) Intel HD Graphics 530, P530 Intel Core i7-4700eq (quad-core, 2.4/3.4GHz) Three DisplayPort/HDMI/DVI interfaces Intel Core i7-6822eq (quad-core, 2.0/2.8GHz) Intel chipsets QM170, HM170 or CM236 Intel Core i5-4400e (dual-core, 2.7/3.3GHz) Two embedded DisplayPort interfaces Intel Core i5-6440eq (quad-core, 2.7/3.4GHz) Up to 32GB DDR4 SDRAM, dual ch. (ECC opt.) Intel Core i5-4402e (dual-core, 1.6/2.7GHz) LVDS (24 Bit, dual channel) and CRT interface Intel Core i5-6442eq (quad-core, 1.9/2.7GHz) Three DisplayPort/HDMI/DVI interfaces Intel Core i3-4100e (dual-core, 2.4GHz) Triple independent display support Intel Core i3-6100e (dual-core, 2.7GHz) LVDS (24 Bit, dual channel) or edp interface Intel Core i3-4102e (dual-core, 1.6GHz) DirectX 11.1, OpenGL 3.2, OpenCL 1.2 Intel Core i3-6102e (dual-core, 1.9GHz) Triple independent display support (4K) Intel Celeron 2000E (dual-core, 2.2GHz) Resolution up to 3800 x 2400 Intel Celeron G3900E (dual-core, 2.4GHz) DirectX 12, OpenGL 4.4, OpenCL 2.x Intel Celeron 2002E (dual-core, 1.5GHz) Seven PCI Express x1 lanes Intel Celeron G3902E (dual-core, 1.6GHz) Four SATA 6Gb/s; Trusted Platform Module Intel HD Graphics GT1/GT2 Four USB 3.0 and four USB 2.0 interfaces Intel Xeon E3-1505Mv5 (quad-core, 2.8/3.7GHz) Eight PCI Express x1 lanes; PEG x16 Intel 8-Series chipset Trusted Platform Module Intel Xeon E3-1505Lv5 (quad-core, 2.0/2.8GHz) Four USB 3.0/2.0 and four USB 2.0 interfaces Up to 16GB DDR3L-1600 SDRAM, dual-channel Also available in Type 2 pin-out Four SATA mass storage interfaces, up to 6Gb/s

14 COM Express - Basic / Compact COM Express - Compact MSC C6B-7S / CXB-6SI MSC C6C-SLU Intel Core - 3rd Generation Intel Core - 6th Generation Type 6 / Type 2 Type 6 95 x 125 Based on Intel s 3rd generation Core processors this COM Express module supports the latest 95 x 95 The MSC C6C-SLU module is based on Intel s 6th generation Core processor family with a new 25 / 65 W digital display interfaces, up to three independent displays and USB 3.0. Ultra low-power variants with only 17W CPU power dissipation allow passively cooled system designs. 17 / 19 W processor architecture based on 14 nm process technology. The multi-chip-package includes processor, graphics and chipset on one carrier and allows extremely compact high-performance designs. Intel Core i7-3612qe (quad-core, 2.1GHz) Three DisplayPort/HDMI/DVI interfaces Intel Core i7-6600u dual-core 2.6/3.4GHz, Three SATA 6Gb/s mass storage interfaces Intel Core i7-3615qe (quad-core, 2.3GHz) Two embedded DisplayPort interfaces 4MB L2, 15W TDP, 7.5/25W ctdp MicroSD card socket Intel Core i7-3555le (quad-core, 2.5GHz) LVDS (24 Bit, dual channel) and CRT interface Intel Core i5-6300u dual-core 2.4/3.0GHz, DisplayPort/HDMI/DVI interface Intel Core i7-3517ue (dual-core, 1.7GHz) Triple independent display support 3MB L2, 15W TDP, 7.5/25W ctdp LVDS/embedded DisplayPort interface Intel Core i5-3610me (dual-core, 2.7GHz) DirectX 11, OpenGL 3.1, OpenCL 1.1 Intel Core i3-6100u dual-core 2.3GHz, 3MB Three independent displays supported Intel Core i3-3120me (dual-core, 2.4GHz) Resolution up to 2560 x 1600 L2, 15W TDP, 7.5 ctdp DirectX 12, OpenGL 4.4, OpenCL 2.x Intel Core i3-3217ue (dual-core, 1.6GHz) Seven PCI Express x1 lanes, four SATA-300 Intel Celeron 3955U dual-core 2.0GHz, 2MB Four USB 3.0/2.0 and four USB 2.0 interfaces Intel Celeron 1020E (dual-core, 2.2GHz) Four USB 3.0 and four USB 2.0 interfaces L2, 15W TDP, 10W ctdp Eight PCI Express x1 lanes Intel Celeron 1047UE (dual-core, 1.4GHz) Trusted Platform Module Integrated Intel Gen. 9 HD graphics Trusted Platform Module Intel Celeron 927UE (single-core, 1.5GHz) Also available in Type 2 pin-out Up to 32GB DDR4 SDRAM, dual-channel Up to 16GB DDR SDRAM, dual channel MSC C6C-KLU Intel Core - 7th Generation NEW MSC C6C-AL Intel Atom /Pentium /Celeron SOC NEW Type 6 Type 6 95 x 95 The MSC C6C-KLU module is based on Intel s 7th generation Core processor family. The Intel 95 x 95 The MSC C6C-AL module is based on Intel s latest multi-core system-on-chip (SOC) Atom generation 17 / 19 W multi-chip-package in 14 nm technology includes processor, graphics and chipset on one carrier and allows extremely compact high-performance designs. 7/14 W C that integrates next generation Intel processor core, graphics, memory, and I/O interfaces into one solution. The modules with Intel Atom processors are also available in extended temperature versions. Intel Core i7-7600u dual-core 2.8/3.9GHz, MicroSD card socket Intel Atom E3950 quad-core 1.6/2.0GHz, 12W LVDS/embedded DisplayPort interface 4MB L2, 15W TDP Two DisplayPort/HDMI/DVI interfaces Intel Atom E3940 quad-core 1.6/1.8GHz, 9.5W Three independent displays supported Intel Core i5-7300u dual-core 2.6/3.5GHz, Embedded DisplayPort / LVDS Intel Atom E3930 dual -core 1.3/1.8GHz, 6.5W DirectX 12, OpenGL 4.3, OpenCL 2.0 3MB L2, 15W TDP (24 Bit, dual channel) interface Intel Pentium N4200 quad-core 1.1/2.5GHz, 6W Four USB 3.0/2.0 and four USB 2.0 interfaces Intel Core i3-7100u dual-core 2.4GHz, Three independent displays supported Intel Celeron N3350 dual-core 1.1/2.4GHz, 6W Two high-speed UARTs 3MB L2, 15W TDP DirectX 12, OpenGL 4.4, OpenCL 2.x Integrated Intel Gen. 9 HD graphics emmc option Intel Celeron 3965U dual-core 2.2GHz, Resolution up to 4096 x 2304 Up to 16GB DDR3L SDRAM, dual-channel Up to five PCI Express x1 lanes 2MB L2, 15W TDP Four USB 3.0/2.0 and four USB 2.0 interfaces Two SATA 6Gb/s mass storage interfaces UEFI Firmware Integrated Intel Gen. 9 HD graphics Eight PCI Express x1 lanes MicroSD card socket Trusted Platform Module Up to 32GB DDR4 SDRAM, dual-channel Trusted Platform Module emmc option Extended temperature variants Three SATA 6Gb/s mass storage interfaces UEFI Firmware DisplayPort/HDMI/DVI interface

15 COM Express - Compact COM Express - Compact MSC C6C-BW MSC C6C-GX Intel Pentium / Celeron AMD Embedded G-Series SOC Type 6 Type 6 95 x 95 The MSC C6C-BW module is based on Intel s next generation Atom processors in14nm techno- 95 Embedded x 95 This compact COM Express Opteron Type 6 module is based on AMD s Embedded G-Series SOC platform, 8 / 14 W logy. These multi-core systems-on-chip provide outstanding computing and graphics power and are more power efficient compared to their predecessors. The new module brings triple independent display support, DirectX 11.1, fast DDR3L memory and USB 3.0 on a compact, power saving and cost-efficient module. Dual- and quad-core processors are supported by this design. 12 / 30 W C a high-performance, low-power System-on-Chip solution with outstanding HD graphics and multimedia capabilities. The power saving and cost-efficient module offers dual independent display support, DirectX Opteron 11.1, Family fast DDR3 Opteron Xmemory and Opteron AUSB B 53118B (showcase specific Opteron X86 technology platform) 53119B (For future use) AMD GX-420CA quad-core 2.0GHz, 25W TDP, Up to 16GB DDR3 SDRAM, dual-channel Intel Pentium N3700 quad-core 2.40GHz, 6W TDP DisplayPort/HDMI/DVI interface Radeon HD 8400E Two SATA 3Gb/s mass storage interfaces Intel Celeron N3150 quad-core 2.08GHz, 6W TDP LVDS/embedded DisplayPort interface AMD GX-415GA quad-core 1.5GHz, 15W TDP, MicroSD card socket Intel Celeron N3050 dual -core 2.16GHz, 6W TDP Three independent displays supported Radeon HD 8330E DisplayPort/HDMI/DVI interface Intel Celeron N3000 dual -core 2.08GHz, 4W TDP DirectX 11.1, OpenGL 4.2, OpenCL 1.2 AMD GX-217GA dual-core 1.65GHz, 15W TDP, LVDS/embedded DisplayPort interface Integrated Intel Gen. 8 HD graphics Four USB 3.0 and four USB 2.0 interfaces Radeon HD 8280E VGA interface Up to 8GB DDR3L SDRAM, dual-channel Up to five PCI Express x1 lanes AMD GX-210HA dual-core 1.0GHz, 9W TDP, Two independent displays supported Two SATA 6Gb/s mass storage interfaces Trusted Platform Module (option) Radeon HD 8310E DirectX 11.1, OpenGL 4.2, OpenCL 1.2 MicroSD card socket Integrated AMD HD 8000E graphics Two USB 3.0 and six USB 2.0 interfaces MSC C6C-BT / CXC-BT MSC C6C-A7 Intel Atom / Celeron SOC AMD Embedded R-Series Type 6 / Type 2 Type 6 95 x 95 Based on Intel s multi-core system-on-chip (SOC) Atom generation this COM Express module 95 x 95 Based on AMD s Embedded R-Series platform this compact COM Express Type 6 module offers 8 / 14 W C brings display interfaces like DisplayPort, HDMI 1.4a and DVI, supports dual independent displays, USB 3.0 and fast DDR3L memory on a compact, power saving and cost-efficient module. 25 / 35 W Segments: Embedded and Server Embedded unprecedented integrated graphics and multi-display capabilities. It brings quad independent display support, DirectX 11 and USB 3.0. Turbo overclocking and accelerated video encoding / decoding support graphics- and video-centric applications. Opteron Intel Atom E3845 quad-core 1.91GHz, 10W TDP Two SATA 3Gb/s mass storage interfaces Intel Atom E3827 dual-core 1.75GHz, 8W TDP Intel Atom E3826 dual -core 1.46GHz, 7W TDP Intel Atom E3825 dual -core 1.33GHz, 6W TDP MicroSD card socket DisplayPort/HDMI/DVI interface LVDS/embedded DisplayPort interface Embedded Solutions 53120B Embedded Solutions R Series X 53057B Embedded Solutions R Series A AMD R-460L quad-core 2.0/2.8GHz, 25W TDP, Opteron Family Opteron X Radeon HD 53117B 7620G 53118B (showcase specific Opteron X86 technology platform) AMD R-252F dual-core 1.7/2.3GHz, 17W TDP, Opteron A 53119B (For future use) Four SATA 3Gb/s mass storage interfaces MicroSD card socket, bootable Three DisplayPort/HDMI/DVI interfaces Intel Atom E3815 single-core 1.46GHz, 5W TDP VGA interface Radeon HD 7400G LVDS/embedded DisplayPort interface Intel Celeron N2920 quad-core 1.86/2.00GHz, 7.5W TDP Two independent displays supported DirectX 11.1, OpenGL 3.2, OpenCL 1.1 Embedded Solutions G Series X 53058B Embedded Solutions G SeriesB Embedded Solutions Geode AMD R-452L quad-core 1.6/2.4GHz, 19W TDP, Radeon HD 7600G VGA interface Four independent displays supported Intel Celeron J1900 One USB 3.0 and up to seven USB 2.0 interface AMD R-260H dual-core 2.1/2.6GHz, 17W TDP, DirectX 11, OpenGL 4.2, OpenCL 1.1 quad-core 2.00/2.42GHz, 10W TDP Trusted Platform Module (option) Radeon HD 7500G Resolution up to 4000 x 30 Hz Integrated Intel Gen. 7 HD graphics Up to 8GB DDR3L SDRAM, dual-channel Also available in Type 2 pin-out Embedded Solutions Radeon Graphics 53121B Embedded Solutions Opteron X 53116B Embedded Solutions Opteron A (For future use) Integrated AMD HD 7000G graphics Up to 16GB DDR SDRAM, dual-channel Six PCI Express x1 lanes Four USB 3.0 and four USB 2.0 interfaces

16 COM Express - Mini COM Express - Accessories MSC C10M-AL Intel Atom /Pentium /Celeron SOC Type 10 NEW MSC C6-MB-EV Evaluation Motherboard Type 6 55 x 84 The MSC C10M-AL module is based on Intel s latest multi-core system-on-chip (SOC) Atom generation 170 x 170 This evaluation board in the popular Mini-ITX format provides the interface infrastructure for 7/14 W C that integrates next generation Intel processor core, graphics, memory, and I/O interfaces. The rugged design with soldered memory, optional ECC support and extended temperature range combined with a long-term availability commitment make it perfectly suited for modern IoT solutions. COM Express Type 6 modules and offers various PC type connectors for external access. Socket for COM Express Type 6 modules GbE interface PCI Express x16 slot (useable as PEG or x4) SD Card slot Intel Atom E3950 quad-core 1.6/2.0GHz, 12W LVDS/embedded DisplayPort interface PCI Express Mini Card slot HD audio codec Intel Atom E3940 quad-core 1.6/1.8GHz, 9.5W Two independent displays supported Four SATA connectors Super I/O Intel Atom E3930 dual -core 1.3/1.8GHz, 6.5W DirectX 12, OpenGL 4.3, OpenCL 2.0 Four USB 3.0 interfaces Various additional COM Express specific interfaces Intel Pentium N4200 quad-core 1.1/2.5GHz, 6W Two USB 3.0/2.0 and six USB 2.0 interfaces Up to four USB 2.0 ports Power supply via ATX-style power connector or Intel Celeron N3350 dual-core 1.1/2.4GHz, 6W Two high-speed UARTs Three DisplayPort connectors 12V-only power jack Integrated Intel Gen. 9 HD graphics Up to four PCI Express x1 lanes LVDS and edp connectors Wide power input range Up to 8GB DDR3L SDRAM (ECC option) UEFI Firmware Two SATA 6Gb/s mass storage interfaces Trusted Platform Module (option) emmc option Extended temperature variants DisplayPort/HDMI/DVI interface MSC C10M-BT / C10M-BTC MSC C6-MB-EVA Intel Atom / Celeron SOC Evaluation Motherboard Type 10 Type 6 55 x 84 8 /14 W C Based on Intel s multi-core system-on-chip (SOC) Atom generation this COM Express Type 10 module brings dual independent display support, DirectX 11.1 and fast DDR3L memory on a very compact, power saving and cost-efficient COM Express Mini module. The rugged design with soldered memory, optional ECC support and extended temperature range opens new application areas. Intel Atom E3845 quad-core 1.91GHz, 10W TDP emmc option Intel Atom E3827 dual-core 1.75GHz, 8W TDP DisplayPort/HDMI/DVI interface Intel Atom E3826 dual-core 1.46GHz, 7W TDP LVDS/embedded DisplayPort interface Intel Atom E3825 dual-core 1.33GHz, 6W TDP Two independent displays supported Intel Atom E3815 single-core 1.46GHz, 5W TDP DirectX 11.1, OpenGL 3.2, OpenCL 1.1 Intel Celeron N2930 quad-core 1.83/2.16GHz, 7.5W TDP One USB 3.0 and up to seven USB 2.0 interfaces Intel Celeron J1900 quad-core 2.00/2.42GHz, 10W TDP Trusted Platform Module (option) Integrated Intel Gen. 7 HD graphics Extended temperature variants Up to 8GB DDR3L SDRAM (ECC option) Also available with USB client support Two SATA 3Gb/s mass storage interfaces 305 x 244 This versatile carrier board was designed for evaluation, prototyping and software development. It provides the interface infrastructure for COM Express Type 6 modules and offers various PC type connectors for external access. Socket for COM Express Type 6 modules in LVDS interface Basic or Compact form factor Embedded DisplayPort connector One PCI Express x4 slot HD audio codec; six audio jacks and SPDIF Four PCI Express x1 slots LAN interface One PCI Express x16 PEG slot msata and Mini PCI Express sockets Four SATA connectors Various additional COM Express specific interfaces Four USB 3.0, four USB 2.0 interfaces ATX-style power connector Two DisplayPort/HDMI connectors POST code LED display VGA/DVI connector ATX form factor

17 COM Express - Accessories COM Express - Accessories MSC C10-MB-EV Evaluation Motherboard Type 10 MSC C10-SK Starterkits for COM Express Type x 170 This evaluation board in the popular Mini-ITX format provides the interface infrastructure for COM Express Type 10 modules and offers various PC type connectors for external access. Socket for COM Express Type 10 modules GbE interface PCI Express x4 slot SD Card slot PCI Express Mini Card slot HD audio codec Two SATA connectors Super I/O Two USB 3.0 interfaces Various additional COM Express specific interfaces Up to six USB 2.0 ports Power supply via ATX-style power connector or DisplayPort connectors 12V-only power jack LVDS and edp connectors Wide power input range The COM Express Starterkit for Type 10 modules is available for the whole range of Type 10 modules. The kit contains all necessary products to quickly enable the user to run and evaluate COM Express Type 10 modules. The kit does not include a COM Express module in order to give the user greater flexibility as to which particular module variant and CPU core and speed is desired. COM Express Type 10 Baseboard PCI-Express Mini Card Socket and SD Card Socket in Mini-ITX format 2x SATA Gen. 3.0 Connectors Suitable Heatspreader for COM Express 2x USB 3.0 and 8x USB 2.0 Connectors Mini Modules Type 10 DisplayPort Connector 12V Power Supply with suitable connector Embedded DisplayPort Connector for COM Express baseboard LVDS Single-Channel JILI30 Connector Getting Started Manual with download links Audio Codec with 1x3 Jacks and SPDIF In/Out for drivers and BSP Gigabit LAN Connector PCI-Express x4 Slot Baseboard Size 170 x 170 mm MSC C6-SK Starterkits for COM Express Type 6 COM Express Cooling Solutions The COM Express Starterkit for Type 6 modules is available for the whole range of Type 6 modules. The kit contains all necessary products to quickly enable the user to run and evaluate COM Express Type 6 modules. The kit does not include a COM Express module in order to give the user greater flexibility as to which particular module variant and CPU core and speed is desired. Depending on the computing performance, processor technology and system environment, COM Express modules require different cooling measures. MSC has developed various solutions that help the system designer to quickly solve the heat dissipation problems and ensure optimal environmental conditions for the module. COM Express Type 6 baseboard Up to three DisplayPort connectors 2x 4GB DDR3L SO-DIMM memory modules LVDS and edp connectors Heatsink for safe operation of module GbE Interface, SD Card slot Type 6 module socket HD audio codec, Super I/O PCI Express Mini Card slot Baseboard size 170 x 170 mm Heatspreaders Passive cooling Active cooling Up to four SATA connectors Getting Started Manual Standardized thermal interfaces for easy Optimized heatsinks for best cooling Heatsinks combined with a dedicated Up to four USB 3.0 interfaces Download link for drivers and BSPs integration in customers' cooling con- performance even in industrial envi- speed controlled fan. Off-the-shelf solu- Up to four USB 2.0 ports Optional display kits with cables cepts and full interchangeability. ronments. tions for demanding ambient conditions

18 Qseven Qseven Properties The most popular embedded Computer-On- The Qseven specification has been extended to The Qseven Standard uses the inexpensive Module standard for entry level performance include module architectures based on the ARM MXM-2 connector which provides 230 pin con- and low power applications with a very attractive processor which is renowned for its excellent nections. The connector is robust and proven, price performance ratio. Qseven is an open stan- performance to power ratio. Providing differ- and there are versions available which are certi- dard of the SGeT Standardization Group. Taking ent processor architectures and a wide range fied for automotive use. The edge contacts en- advantage of the ongoing development in processor technology towards smaller and more of modules for commercial and extended temperature together with matching baseboards, able a low-resistance high-speed contact which is usable even for advanced signal speed up to 70 mm power efficient CPUs, Qseven has in recent years the MSC Qseven family leads the way to feature Gigabit Ethernet, PCI-Express and SATA. become the most widely adopted new standard rich and small, low power modular systems. for small form factor modules. 70 mm

19 Qseven Qseven MSC Q7-AL Intel Atom /Pentium /Celeron SOC Qseven Rev. 2.1 NEW MSC Q7-BT Intel Atom E3800 SoC Qseven Rev x 70 The new MSC Q7-AL module features Intel's next-generation low-power System-on-Chip (SOC) 70 x 70 The MSC Q7-BT module is based on the Qseven Rev. 2.0 standard and uses Intel s multi-core 7/12 W C for the Internet of Things. The Intel Atom Processor E3900 series integrates processor core, graphics, memory, and I/O interfaces into one solution and provides considerably higher graphics and computing performance compared to its predecessors. 7/12 W C System-On-Chip (SOC) Atom E3800 generation based on Intel s 22nm processor technology. The quad-core, dual-core or single-core Atom processor provides outstanding computing and graphics power and is accompanied by a comprehensive set of peripherals. Intel Atom E3950 quad-core 1.6/2.0GHz, 12W LVDS/embedded DisplayPort interface Intel Atom E3845 quad-core 1.91GHz, 10W TDP Integrated Intel Gen. 7 HD Graphics Intel Atom E3940 quad-core 1.6/1.8GHz, 9.5W Triple Independent Display support Intel Atom E3827 dual-core 1.75GHz, 8W TDP HDMI up to 1920x1200 Intel Atom E3930 dual-core 1.3/1.8GHz, 6.5W DirectX 12, OpenGL 4.3, OpenCL 2.0 Intel Atom E3826 dual -core 1.46GHz, 7W TDP DisplayPort 1.1a up to 2560x1600 Intel Pentium N4200 quad-core 1.1/2.5GHz, 6W Up to 4x PCI Express x1 Gen. 2 Intel Atom E3825 dual -core 1.33GHz, 6W TDP Dual-Channel LVDS 24 or 18 bit up to 1920x1200 Intel Celeron N3350 dual-core 1.1/2.4GHz, 6W Up to 3x USB 3.0 Host interfaces Intel Atom E3815 single-core 1.46GHz, 5W TDP 3x PCI Express x1 Gen. 2.0 ports, GbE LAN Integrated Intel Gen. 9 HD graphics Up to 8x USB 2.0 Host interfaces Up to 8GB DDR3L SDRAM (opt. ECC) USB 3.0 Host, optional USB 3.0 Device Up to 8GB DDR3L SDRAM (ECC option) 1x USB 2.0 Host/Device support Up to 64GB SATA Flash Disk (optional) Up to 6x USB 2.0 Host, optional USB 2.0 Device Up to 64GB emmc Flash (optional) Trusted Platform Module (optional) Up to 32GB emmc Flash (optional) UART, LPC, I2S Audio, SPI, I2C, SMBus, SDIO, TPM Two SATA-III interfaces (6Gbps) Qseven Rev. 2.1 compliant 2x SATA interfaces (1 used for opt. Flash Disk) DisplayPort/HDMI/DVI interface UEFI Firmware MSC Q7-BW MSC Q7-IMX6PLUS Intel Atom / Pentium / Celeron SOC NXP i.mx6 ARM Cortex -A9 SoC Qseven Rev. 2.0 Qseven Rev x 70 The MSC Q7-BW module is based on Intel s next generation Atom processors in 14nm 70 x 70 The MSC Q7-IMX6PLUS module provides the NXP i.mx6 ARM Cortex-A9 CPU (quad, dual, du- 6/9 W technology. These multi-core systems-on-chip provide outstanding computing and graphics power and are more power efficient compared to their predecessors. The new module brings triple independent display support, DirectX 11.1, fast DDR3L memory and USB 3.0 on a compact, 4/6 W C al-lite or single core) as well as the new i.mx 6QuadPlus and 6DualPlus Processors with up to 1.2 GHz, up to 4GB DDR3 DRAM and up to 64GB emmc Flash memory as well as an extensive set of interface controllers. power saving and cost-efficient module. NXP i.mx6 ARM Cortex -A9 HDMI/DVI up to 1920 x Intel Pentium N3710 quad-core 2.56GHz, 6W TDP HDMI/DVI interface up to 3840x2160 quad-, dual-, dual-lite or single-core CPU Dual-Channel LVDS 18/24 bit up to 1920 x 1200 Intel Celeron N3160 quad-core 2.24GHz, 6W TDP DisplayPort 1.1a up to 3840x2160 Supports i.mx 6QuadPlus, i.mx 6DualPlus Triple independent display support Intel Celeron N3060 dual-core 2.48GHz, 6W TDP Dual-Channel LVDS 24 or 18 bit up to 1920x1200 Triple-Play Graphics and Video Subsystem SATA-II (3Gbps, quad-/dual-core only) Intel Celeron N3010 dual-core 2.24GHz, 4W TDP DirectX 11.1, OpenGL 4.2, OpenCL 1.2 Up to 4GB DDR3L SDRAM USB Host / Device + up to 4x USB 2.0 Intel Atom x5-e8000 quad-core 2.0GHz, 5W TDP Triple Independent Display support Up to 64GB emmc or 4GB NAND Flash MMC / SD / SDIO Interface Integrated Intel Gen. 8 HD Graphics 3x PCIe x1, GbE, SATA-III, UART, LPC, SPI, I2C, SMBus Gigabit Ethernet CAN Interface, I2S Audio Up to 8GB DDR3L SDRAM (dual-channel) USB 3.0, opt. USB 3.0 Device PCI Express x1 port MIPI CSI-2 Camera Interface Up to 64GB SATA Flash Disk (optional) Up to 7x USB 2.0, opt. USB 2.0 Device Up to 64GB emmc Flash (optional)

20 Qseven - Accessories Qseven - Accessories MSC Q7-MB-EP5 Embedded Platform Qseven Rev. 2.0 MSC Q7-MB-EP6 Embedded Platform Qseven Rev x 102 The new Qseven Rev. 2.0 embedded platform MSC Q7-MB-EP5 offers a variety of interfaces 148 x 102 The Qseven Rev. 2.0 Embedded Platform MSC Q7-MB-EP6 offers a variety of embedded commonly used in embedded applications such as Gigabit LAN, USB 3.0, USB 2.0, RS232/485 interfaces such as dual Gigabit LAN, USB 3.0, USB 2.0, RS232/485 and CAN as well as HDMI, C and CAN as well as DisplayPort and LVDS display interfaces. By design the EP5 was optimized DisplayPort and LVDS display interfaces. In addition a mini PCI Express, an msata and an SD for low production cost and simple customization. MSC is offering to produce any customized Card socket are supported. Module slot on bottom side. variant of the MSC Q7-MB-EP5 for medium to high volume. MicroAB Host/Client 4-Wire Touch 5 Pin Header usd / SD Card Socket Feature Connector 2 20 Pin Header 4 Pin JST Conn 4 Pin JST Conn Feature Connector 1 20 Pin Header POWER IN System Signals Low-cost application board for any Qseven computer module (x86 and ARM based) Dual Gigabit Ethernet Up to 2x SATA-II connectors Mini PCI Express Card msata Card socket MMC/SD Card slot 1x USB 3.0, up to 3x USB 2.0 connectors 1x USB 2.0 Host/Client on µusb connector DisplayPort connector for output of graphics signals from Qseven module Note: can also be used as PCAP Touch I/F 4-Wire Res. USB Touch Controller Microchip AR1100 SATA Conn Intel msata Card Socket WLAN Module H&D Wireless SPB209A RS232 Driver RS485 Driver CAN Driver 12V Regulator Opto Coupler 3.3V and 5V Regulator Other Regulator USB1 USB2 SATA 0 SATA 1 SDIO UART QSeven Slot CAN SPI, I2C, GPIO Power RS-232, RS-485 or opt. CAN Dual-channel LVDS on JILI30 connector Backlight power 3.3V, 5V or 12V Adjustable Backlight intensity WLAN / Bluetooth / NFC with antenna (option) 4-wire touch controller (option) I2S or HD Audio codec (option) SPI / I2C / GPIO on Feature Connector Input voltage up to 36V Industrial temperature versions available USB0 USB6/7 USB3 USB5 USB4 PCIe 0 PCI 1 Q7 Eth LVDS/eDP HDMI/DP Audio Micro SIM card slot LAN Controller PCIe intel I210 Analog/PWM 3.3V/5V/12V HDMI-DP Converter I25 Codec HDA Codec Single USB 3.0 Type A Single USB 2.0 Type A Single USB 2.0 Type A PCI Mini Card Socket Gbit LAN RJ45 Gbit LAN RJ45 Backlight LVDS JILI 30 DisplayPort Audio Header 148 x 102 HDMI and DisplayPort connectors for direct output of TMDS signals from Qseven module Dual Gigabit Ethernet Mini PCI Express card slot MMC/SD card and msata card sockets 1x SATA connector RS-232 on DB9 connector RS-485 and RS-232 on pin header LPC / GPIO on pin header MSC Q7-MB-EP4 Embedded Platform DDI The Qseven Rev. 1.2 Embedded Platform MSC Q7-MB-EP4 offers many interfaces often used in embedded applications such as dual Gigabit LAN, USB 2.0, RS232, CAN and LVDS as well as DVI/HDMI. In addition a mini PCI Express and an msata slot as well as an SD-Card socket are supported. Module slot on bottom side. One DVI port up to 1920 x 1080 for Qseven modules with SDVO Dual Gigabit Ethernet Mini PCI Express slot MMC/SD Card socket Two SATA onboard connectors One RS-232 onboard pin header USB 3.0 host connector 2x USB 2.0 host connector 1x USB 2.0 on pin header 1x microusb 2.0 OTG connector LVDS / edp via Jili30 connector Backlight interface 3.3 / 5 / 12VDC SPI / I2C / SMBus, CAN bus, I2S audio Wide input range from 10-28VDC One CAN interface Six USB 2.0 interfaces, four external Touch screen controller on board LVDS display connection via Jili30 Backlight interface 3.3 / 5 / 12VDC Size 148 x 102 mm Wide input range from 10-28VDC

21 Qseven - Accessories Qseven - Accessories MSC Q7-MB-RP3 Reference Platform Qseven 2.0 MSC Q7-SK-IMX6-EP4 Starterkit for ARM-based Qseven 2.0 Modules 435 x 170 The MSC Q7-MB-RP3 is the third generation reference platform provided to test and qualify Qseven Rev. 2.0 modules for compatibility with the specification. It offers a large variety of interfaces commonly used in industrial applications. It is a key instrument to shorten design cycles and to improve time to market of new Qseven based systems. The MSC Q7-SK-IMX6-EP4 Starterkit is based on the 3.5" carrier board MSC Q7-MB-EP4 and contains all necessary products to quickly enable the user to run and evaluate the Qseven range of ARM-based modules. The kit does not contain a Qseven module allowing the user to select the most suitable one from MSC s wide offerings. One PCI Express x16 slot and 3 x1 slots Two graphic card slots for HDMI / DP / edp / LVDS Mini PCI Express & msata slot SD Card socket and SIM Card slot Two SATA onboard connectors Winbond W83627DHG Super I/O MSC Q7-SK-AL-EP6 MSC Q7-SK-BT-EP6 Starterkits for x86-based Qseven 2.0 Modules EXAR X28V384 Super I/O 7x COM, HW monitor CAN Transceiver HD audio codec USB 3.0, 4x USB 2.0 Host and USB 2.0 Client interfaces The MSC SK-AL-EP6 is the new Starterkit for Qseven modules based on the Intel E3900 "Apollo Lake" processor family. The MSC SK-BT-EP6 is the Starterkit suitable for Qseven modules based on the Intel E3800 BayTrail" and the N3000 Braswell processors. Both kits are based on the 3.5" Qseven 2.0 carrier board MSC Q7-MB-EP6 and contain all necessary products to quickly enable the user to run and evaluate the Qseven module range. 3.5" Qseven carrier board with socket for Qseven module Heatspreader with heatsink for all module variants of the Q7-IMX6PLUS module family 12V power supply and cable kit included for immediate operation of the Starter Kit Resource USB Flash stick with drivers, manuals etc. DVI/HDMI graphics output Qseven Cooling Solutions For all its Qseven modules, MSC is offering tailored cooling solutions which perfectly fit the geometry of the COM product. LVDS graphics output on standard 30-pin connector; backlight connector includes adjustable backlight voltage and dimming 2x Ethernet (10/100/1000 LAN) connector SATA connector 4x USB 2.0, 1x microusb OTG UART/RS-232 on pin header MMC/SD-Card socket, msata slot I2C, CAN connectors Optional 7" WVGA (800 x 480) and 12.1" XGA (1024x768) TFT kit MSC is providing a heatspreader for each Qseven module, and a single-piece heatsink for the higher-performance modules. 3.5" Qseven carrier board with socket 2x Ethernet (10/100/1000 LAN) connector for Qseven 2.0 module Heatspreader with heatsink for all module SATA connector USB 3.0, 3x USB 2.0, 1x microusb OTG Heatspreaders Heatsinks variants of the respective Qseven family 2x UART 12V power supply and cable kit included for SD-Card socket immediate operation of the Starter Kit MiniPCIexpresss and msata slots A heatspreader offers a blank surface allowing to A heatsink is shaped like the heatspreader, Resource USB Flash stick with drivers, manuals etc. Optional 7" WVGA (800 x 480) and 12.1" XGA mount a cooling device or to contact the metal but shows cooling fins on the upper side so DP graphics output (1024x768) TFT kit housing of a system, while the underside provides as to maximize the surface used to dissipate LVDS graphics output on standard 30-pin con- contact areas for the heat generating parts of the heat into the surrounding air. nector; backlight connector includes adjust- module s geometry. able backlight voltage and dimming

22 SMARC 2.0 Properties SMARC 2.0 The SMARC 2.0 Standard uses the inexpensive MXM-3 connector which provides 314 pin connections. The connector is robust and proven, and there are versions available which are certified for automotive use. The edge contacts enable a low-resistance high-speed contact which is usable even for advanced signal speed up to Gigabit Ethernet, PCI-Express and SATA. The Standard defines two Module sizes: 82mm x 50mm (short size) and 82mm x 80mm (full size). The recent revision 2.0 of the SMARC module standard (Smart Mobility ARChitecture) has every ingredient to become the best and most future-proof standard for small form-factor embedded modules. With 314 pins available on its inexpensive and robust MXM3 connector, SMARC has ample space for proven and popular interfaces. In the new standard revision, PCIe now features 4 lanes instead of 3, USB now covers up to 2x USB 3.0 and up to 6x USB 2.0 interfaces, LVDS now supports two independent dual-channel connections which alternatively can be used for embedded DisplayPort (edp) or for DSI, two Gigabit Ethernet ports are now supported, Audio has independent HDA and I2S ports and up to 4 UARTs are available. In addition to SPI, also espi is supported for attachment of peripheral devices on the baseboard or the application hardware. And still there are a lot of reserved pins left for future upgrades. Never again has it been so easy and natural to use ARM-based and x86- based computer modules on a modern and upto-date module standard. 80 mm 82 mm 50 mm 82 mm

23 SMARC 2.0 SMARC 2.0 MSC SM2F-AL Intel Atom /Pentium /Celeron SOC SMARC 2.0 NEW MSC SM2S-IMX6 SMARC x 80 The MSC SM2F-AL module is based on Intel s multi-core system-on-chip (SOC) Atom generation that 82 x 50 The MSC SM2S-IMX6 module is fully compliant with the new SMARC 2.0 standard and is 7/14 W C integrates next generation Intel processor core, graphics, memory, and I/O interfaces into one solution. Fast DDR memory, emmc, SATA Flash, USB 3.0 and a on-board Wireless Module are integrated on this SMARC 2.0 Full Size module. 4/6 W C based on NXP's i.mx6 CPUs offering quad-, dual- and single-core ARM Cortex-A9 compute performance at very low power consumption and excellent graphics performance combined with a high dregree of functional integration. Intel Atom E3950 quad-core 1.6/2.0GHz, 12W DisplayPort++ / HDMI interface NXP i.mx6 ARM Cortex -A9 quad-, dual-, 10/100/1000 GbE LAN interface Intel Atom E3940 quad-core 1.6/1.8GHz, 9.5W LVDS / embedded DisplayPort interface dual-lite or single-core CPU 1x PCI Express x1 Intel Atom E3930 dual-core 1.3/1.8GHz, 6.5W Triple Independent Display support Supports i.mx 6QuadPlus, i.mx 6DualPlus 1x SATA-II (3Gbps, quad-/dual-core only) Intel Pentium N4200 quad-core 1.1/2.5GHz, 6W DirectX 12, OpenGL 4.3, OpenCL 2.0 MPEG-4 Video En-/Decoding 1080p, 1x USB Device/Host + up to 5x USB 2.0 Host Intel Celeron N3350 dual-core 1.1/2.4GHz, 6W Dual MIPI CSI-2 Camera Interface HDMI graphics 1920x1080x30fps, 1x MMC / SD / SDIO interface Integrated Intel Gen. 9 HD graphics Up to 4x PCI Express x1 Gen. 2 dual-channel LVDS 1920x1080x30fps 2x CAN interface Up to 8GB DDR3L SDRAM (ECC option) 2x USB 3.0 Host, 5x USB 2.0 Host interfaces Up to 4GB DDR3L DRAM I2S Audio interface Up to 64GB emmc Flash (optional) 1x USB 2.0 Host/Device interface Up to 64GB emmc Flash memory MIPI CSI-2 camera interface Up to 64GB SATA NAND Drive (optional) Gigabit Ethernet, Wireless Module (optional) SATA-III interface (6Gbps) Trusted Platform Module (optional) MSC SM2S-AL Intel Atom /Pentium /Celeron SOC NEW MSC SM2-MB-EP1 SMARC 2.0 SMARC x 50 The MSC SM2S-AL module is based on Intel s multi-core system-on-chip (SOC) Atom generation 170 x 170 The SMARC 2.0 Embedded Platform MSC SM2-MB-EP1 offers many embedded interfaces 7/14 W C that integrates next generation Intel processor core, graphics, memory, and I/O interfaces into one solution. Fast LPDDR4 memory, emmc and USB 3.0 are integrated on this SMARC 2.0 Short Size module. 2 W C such as dual Gigabit LAN, USB 3.0, USB 2.0, SATA, UART/RS232 and CAN as well as DVI/HDMI, embedded DisplayPort and LVDS display interfaces. In addition a PCI Express socket and an SD Card socket are supported. Intel Atom E3950 quad-core 1.6/2.0GHz, 12W DisplayPort++ interface Socket for SMARC 2.0 modules SATA connector Intel Atom E3940 quad-core 1.6/1.8GHz, 9.5W LVDS / embedded DisplayPort interface PCI Express x4 slot Two GbE interfaces Intel Atom E3930 dual-core 1.3/1.8GHz, 6.5W Triple Independent Display support SD Card slot Two CAN interfaces Intel Pentium N4200 quad-core 1.1/2.5GHz, 6W DirectX 12, OpenGL 4.3, OpenCL 2.0 Mini-PCI-Express Card slot I2S audio and HD audio codec Intel Celeron N3350 dual-core 1.1/2.4GHz, 6W Dual MIPI CSI-2 Camera Interface Two USB 3.0 interfaces Two UART interfaces Integrated Intel Gen. 9 HD graphics Up to 4x PCI Express x1 Gen. 2 USB 2.0 OTG, two USB 2.0 Host Various additional SMARC specific interfaces Up to 8GB LPDDR4 SDRAM 2x USB 3.0 Host, 5x USB 2.0 Host interfaces DVI/HDMI and DisplayPort connectors Power supply via ATX-style power connector Up to 64GB emmc Flash (optional) 1x USB 2.0 Host/Device interface LVDS and edp connectors Power jack for 12-24V input voltage SATA-III interface (6Gbps) Gigabit Ethernet Trusted Platform Module (optional)

24 SMARC Accessories SMARC Accessories MSC SM2F-SK-AL-EP1 MSC SM2S-SK-AL-EP1 Starterkits for x86-based SMARC 2.0 Modules SMARC 2.0 Cooling Solutions The SMARC 2.0 Starter Kits for SMARC modules with the Intel E3900 Apollo Lake processors are based on a Mini-ITX SMARC 2.0 carrier board MSC SM2-MB-EP1 and contain all necessary products to quickly enable the user to run and evaluate the SM2F-AL and SM2S-AL module families, respectively. The kits do not contain a SMARC 2.0 module allowing the user to select the most suitable one from MSC s offerings. SMARC 2.0 carrier board in Mini-ITX format with DisplayPort Connector socket for SMARC 2.0 modules LVDS graphics output on standard 30-pin connector; Heatspreader suitable for all module variants of backlight connector includes adjustable backlight the SM2F-AL or SM2S-AL module families voltage and dimming 12V power supply and cable kit included for Ethernet (10/100/1000 LAN) connector immediate operation of the Starterkit SATA, 4x USB 2.0 Host, USB Host/Client, Bootable Linux installation in Flash, ready-to-run UART, SD-Card socket DVI/HDMI graphics output Optional TFT Kits available MSC SM2-SK-IMX6-EP1 Starterkit for ARM-based SMARC 2.0 Modules For all its SMARC modules, MSC is offering tailored cooling solutions which perfectly fit the geometry of the COM product. Heatspreaders Full and Short Size A heatspreader offers a blank surface allowing to mount a cooling device or to contact the metal housing of a system, while the underside provides contact areas for the heat generating parts of the module s geometry. MSC is providing a heatspreader for each SMARC module, and a single-piece heatsink for the higher-performance modules. The SMARC 2.0 Starter Kit for SMARC modules with the NXP i.mx6 processors is based on a Mini-ITX SMARC 2.0 carrier board MSC SM2-MB-EP1 and contains all necessary products to quickly enable the user to run and evaluate the SM2S-IMX6 module range. The kit does not contain a SMARC 2.0 module allowing the user to select the most suitable one from MSC s offerings. Heatsinks Full and Short Size SMARC 2.0 carrier board in Mini-ITX format with socket for SMARC 2.0 modules Heatspreader suitable for all variants of the SM2S-IMX6 module family 12V power supply and cable kit included for immediate operation of the Starterkit Bootable Linux installation in Flash, ready-to-run DVI/HDMI graphics output LVDS graphics output on standard 30-pin connector; backlight connector includes adjustable backlight voltage and dimming Ethernet (10/100/1000 LAN) connector SATA, 4x USB 2.0 Host, USB Host/Client, UART, SD- Card socket Optional TFT Kits available A heatsink is shaped like the heatspreader, but shows cooling fins on the upper side so as to maximize the surface used to dissipate heat into the surrounding air

25 Module PCB Depending of socket used Carrier PCB 1.20±0.1 max. 6.00, typ (depending on module) 0±0.1 max ±0.1 nanorisc nanorisc Properties The nanorisc module standard has been created nanorisc modules can be used as a processing The nanorisc Standard uses a compact module for applications requiring a small form factor and supercomponent, while users only need to add size of 70mm x 50mm. The module PCBs have lowest power consumption. application-specific periphery. The 230-pin MXM 230 edge fingers that mate with a low profile 230 connector used as interface to the baseboard is pin 0.5mm pitch connector called MXM-2 which The nanorisc modules simplify the design of embedded systems by providing a processor inexpensive but robust and proven. A variety of easy-to-use interfaces are available. All popular is available in abundance, rugged and proven. 50 mm core with an extensive set of interfaces on a embedded interfaces are included, and addi- small form factor board. Boot loader and adap- tional interfaces can be provided by adding tations for popular Operating Systems will be suitable controllers on the baseboard and con- provided by MSC so that design times will be shortened dramatically. necting them to the processor bus available on the MXM connector. 70 mm

26 nanorisc nanorisc MSC NANORISC-IMX6 MSC NANORISC-MB2 NXP i.mx6 ARM MPU Embedded Platform 70 x 50 The MSC NANORISC-IMX6 module is based on the NXP Cortex -A9 processor i.mx6x which is 160 x 110 The Evaluation Platform MSC NANORISC MB2 offers dual LAN, USB, UARTs, audio and graphics 2.5 /4.5 W C available as quad-core, dual-core and single-core CPU. On the module it is combined with up to 4GB DDR3 SDRAM, up to 4GB SLC NAND Flash, optionally up to 64GB emmc Flash and Gigabit Ethernet LAN C RGB 18/24 Bit and extension connectors for graphics, SATA, PCIe, CAN (CPU I/O), Local Bus, I²C and SPI. In addition touch controllers for projected capacitive touches and for resistive touches are provided. An SD Card socket is supported. NXP i.mx6 Cortex -A9, 1/2/4 core(s) CPU Graphics Interfaces: HDMI/DVI, LVDS, RGB up to Socket for nanorisc compatible modules ITU656 video input interface on ext. connector clocked up to 1.2GHz 1920 x 1080, dual independent display support LCD panel interfaces with RGB TTL output 2x COM ports on 9pin Sub-D connector Up to 4GByte DDR3 SDRAM soldered Video decoder and scaler Backlight power 8..20VDC I2S audio codec with standard audio connectors Up to 4GByte SLC NAND Flash soldered CAN 2.0B, 3x UART, 2x SPI, 2x I²C Graphics extension connector for optional SD Card socket Up to 64Gbyte emmc Flash I²S audio interface graphics modules (LVDS, HDMI) PCIe, SATA, CAN, Local Bus, SPI, I2S Gigabit Ethernet interface SD V3.0 / SDIO V2.0 / MMC V4.3 2x 10/100 Base-T Ethernet interface or GbE on extension pad field USB 2.0 Host Parallel bus interface 2x USB Host, USB OTG Host/Client port Battery charger support (Lithium cell) USB 2.0 OTG Host/Client High Speed Camera interface ITU656 / CSI Touch Screen support (capacitive + resistive) 8..20V power supply input MSC NANORISC- AM335X MSC NANORISC-SK Texas Instruments AM335X Evaluation and Development Kit 70 x W C The MSC NANORISC-AM335X module is based on the Texas Instruments Cortex -A8 processor AM335x family which ranges from 300 to 800MHz. On the module it is combined with up to 512MB DDR3 SDRAM, up to 512MB SLC NAND Flash, optionally up to 64GB emmc Flash and 10/100 Ethernet LAN, optionally second LAN or GbE LAN. Texas Instruments Cortex -A8 CPU AM335x CAN 2.0B, 3x UART, 2x SPI, 2x I²C clocked up to 800MHz I²S audio interface Up to 512MB DDR3 SDRAM soldered SD V2.0 / SDIO V1.0 / MMC V4.2 Up to 512MB SLC NAND Flash soldered Optional SGX530 graphics acceleration Up to 64GB emmc Flash soldered Optional industrial (Realtime) Ethernet 10/100 Base-T Ethernet Interface Commercial and extended commercial Optional 2nd 10/100 LAN or GbE temperature range USB 2.0 HS Host, USB 2.0 HS OTG Support for Linux RGB 16/18/24 bit up to 1366 x 768 (Android, Windows EC7 on demand) The MSC NANORISC-SK is a complete, ready-to-run Starterkit for MSC s range of nanorisc processor modules. It consists of the nanorisc Embedded Platform board MB2, a 7-inch WVGA display with capacitive touch and a suitable power supply. Evaluation and Development Kit for all nanorisc CPU module not contained nanorisc modules - please order separately Includes 7" LCD panel 800 x 480 pixels with Complete range of usable interfaces all required interface cables GbE or 2x 10/100 Base-T (dep. on module) Power supply included 1 or 2 USB Host Port (dep. on module) Integrated Debug Adapter on-board USB OTG Port (dep. on module) SD Card with pre-installed Linux or Android CAN Bus, 2x COM Ports on 9-pin Sub-D Operating System to be ordered with CPU I2S or AC97 audio codec with standard module of choice audio connectors