MV8895 CPU Module Product Specifications

Transcription

1 MV8895 CPU Module Product Specifications January

2 Contents 1. Product Name 2. Product Features 3. Product Specifications 3.1. H/W Size 3.2. H/W Specifications 3.3. S/W Specifications 4. External expansion pin 4.1. KCN KCN KCN KCN KCN8 Microvision Co.,Ltd Room1004 Hanshin IT tower,235 Guro3dong, Gurogu, Seoul, Korea Phone: Fax: Homepage: (1 / 13) page

3 1. Product Name The MV8895 CPU module is a high-performance, low-power 64-bit RISCbased microprocessor solution module. This module is suitable for a variety of application functions and small devices. It has an ARM custom core 2.3GHz / Cortex-A53 1.7GHz quad core and has an internal LPDDR4X 4GB (1866MHz) large memory. Exynos8895 Octa Core (LPDDR4X 4GB) Audio codec PMIC UFS GB & 64GB [Figure 1] MV8895 CPU Module Front Connector [Figure 2] MV8895 CPU Module Rear (2 / 13) page

4 [Figure 3] MV8895 CPU Module Block Diagram (3 / 13) page

5 2. Product Features [Figure4] MV8895 CPU Module application Ⅰ. This product is the main CPU module based on Arm core processor and it considered for the mass production. It provided the extended PINs for all PINs (Function) which CPU have, and also can have a program test and Hardware test. This main CPU module finished all enough test already. Ⅱ. Developers can design and manufacture for applied part on Base board (New target board) by the request from users. Main CPU module can equip and use for the test and manufacture with various products. Ⅲ. In this case you can reduce the working time to half so also can reduce the development and mass production working time. Ⅳ. Our CPU module minimized the CPU manufacture cost and size by considering the mass production. So it is really demonstrate to the consumer that the CPU module can apply on industry market as you can see the below pictures. (4 / 13) page

6 3. Product Specifications 3.1. H/W Size TOP Side Image Bottom Side Image 45.4mm 60.4mm [Figure 5] MV8895 CPU Module horizontal and vertical dimensions [Figure 6] MV8895 CPU Height dimension when connecting module (5 / 13) page

7 3.2. H/W Specifications ITEM Specification Description CPU Exynos Bit Octa Core Exynos Bit Octa Core (Custom 2.3GHz Quad Core / Cortex -A53 1.7GHz Quad Core) [ARM Custom Quad CPU] 64/32KB I/D Cache, 2MB L2 Cache [ARM Cotex-A53 Quad CPU] 32/32KB I/D Cache, 256KB L2 Cache Internal LPDDR4 RAM LPDDR4X LPDDR4X Internal 4GByte (1866MHz) UFS Memory PMIC Audio Ver 2.1 KLUCG4J1ED-B0C1 S2MPS17 WM GB 0.5mm Ball Pitch, 153 Ball 11.5 x 13 x 1.0 mm *Specifications subject to change* Step down buck Converter 12ports Back Booster Converter 1port, LDO 43 ports Input Voltage: 2.7~5.0V BGA 208WLCSP 5.99mmx4.94mm 0.35 Pitch package Low Power Audio Codec Small W-CSP package, 0.4mm pitch Connector A AXK700147G x 5 Dimension (L x W x T) 500 Pin (0.4mm Pitch 100 Pin x 5) PCB: 45.4mm x 60.4mm x 0.8mm (B to B height when joined: 1.5 mm) PCB 사양 PCB 12 Layer Build up(all via) [Table 1] MV8895 CPU Module H / W Specification (6 / 13) page

8 3.3. S/W Specifications 개발환경PC OS (Development environment) Ubuntu x86_64 S_Scan3 BOOT (Bootloader) U-boot S_Scan3 OS (Kernel) Kernel 4.4.x S_Scan3 ROOTFS (File System) Android 7.0 [Table 2] MV8895 CPU Module S/W specification (7 / 13) page

9 4. External expansion pin 4.1. KCN3 (8 / 13) page

10 4.2. KCN5 (9 / 13) page

11 4.3. KCN9 (10 / 13) page

12 4.4. KCN7 (11 / 13) page

13 4.5. KCN8 (12 / 13) page