BurnInTest results BurnInTest Version Date Logging level Licenced System summary System summary General CPU

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1 BurnInTest results BurnInTest Version V8.0 Std 1040 Date Thu Apr 23 12:56: Logging level rmal Licenced *** Unlicensed trial version *** System summary System summary Windows 8.1 Professional Edition build 9600 (64-bit), 1 x Intel(R) Core(TM) i7-4790k 4.00GHz, 16.0GB RAM, NVIDIA GeForce GTX 980, 238GB SSD, General System Name: System Model: Motherboard Manufacturer: Motherboard Name: JAMESPC MS-7916 MSI Z97 GAMING 7 (MS-7916) Motherboard Version: 1.0 BIOS Manufacturer: American Megatrends Inc. BIOS Version: V1.9 BIOS Release Date: 02/13/2015 CPU CPU manufacturer: CPU Type: Codename: GenuineIntel Intel(R) Core(TM) i7-4790k 4.00GHz Haswell CPUID Family 6, Model 3C, Stepping 3 Socket: Lithography: LGA nm Physical CPU's: 1 Cores per CPU: 4 Hyperthreading: CPU features: Enabled MMX SSE SSE2 SSE3 SSSE3 SSE4.1 SSE4.2 DEP PAE Intel64 VMX Turbo AES AVX AVX2 XOP FMA3 Clock frequencies: - Measured CPU speed: MHz [Turbo: MHz] - Multiplier: x40.0 [Turbo: x47.0] - Base Clock: MHz

2 - Multiplier range: Min: x8, Max non turbo: x40 [Ratio: 4C: x47, 3C: x47, 2C: x47, 1C: x47] Cache per CPU package: - L1 Instruction Cache: 4 x 32 KB - L1 data cache: 4 x 32 KB - L2 cache: 4 x 256 KB - L3 cache: 8 MB Memory Total Physical Memory: Available Physical Memory: 16333MB 14821MB Memory devices: Slot 1: 8GB DDR3 SDRAM PC Corsair CMY16GX3M2A2400C11 XMP: 1.65V, Clk: MHz, Timings Slot 2: 8GB DDR3 SDRAM PC Corsair CMY16GX3M2A2400C11 XMP: 1.65V, Clk: MHz, Timings Slot 3: Slot 4: Virtual memory: t populated t populated C:\pagefile.sys (allocated base size 16384MB) Memory SPD DIMM#0 Memory type: DDR3 SDRAM SPD revision: 1.1 Manufacturer: Corsair Serial number: Part number: Clock speed: Memory size: CMY16GX3M2A2400C MHz 8192 MB Number of banks: 8 Row address bits: 16 Column address bits: 10 Bus width: Device width: 64 bits 8 bits Number of ranks: 2 ECC: Module voltage: 1.5V Minimum clock cycle time (tck): ns Supported CAS latencies:

3 Minimum CAS latency time (taa): Minimum RAS to CAS delay time (trcd): Minimum row precharge time (trp): Minimum active to precharge time (tras): ns Supported timing at highest clock speed: Minimum Row Active to Row Active Delay (trrd): Minimum Active to Auto-Refresh Delay (trc): Minimum Recovery Delay (trfc): Minimum Write Recovery time (twr): Minimum Write to Read CMD Delay (twtr): Minimum Read to Pre-charge CMD Delay (trtp): Minimum Four Activate Window Delay (tfaw): ns ns ns ns Operating temperature range: 0-95C Supports Auto Self-Refresh: Supports Partial Array Self-Refresh: Thermal Sensor present: Supports On-Die Thermal Sensor readout: n-standard SDRAM type: Module type: Module Height: Module Thickness: Module Width: Yes Standard Monolithic UDIMM mm Front: 2-3 mm, Back: 2-3 mm mm Reference raw card used: Raw Card B Rev. 0 XMP Revision: 1.3 [XMP Profile 1] Module voltage: 1.65V [XMP Profile 1] Clock speed: [XMP Profile 1] Minimum clock cycle time (tck): MHz ns [XMP Profile 1] Supported CAS latencies: 6 10 [XMP Profile 1] Minimum CAS latency time (taa): [XMP Profile 1] Minimum RAS to CAS delay time (trcd): [XMP Profile 1] Minimum row precharge time (trp): [XMP Profile 1] Minimum active to precharge time (tras): ns ns [XMP Profile 1] Supported timing at highest clock speed: [XMP Profile 1] Minimum Row Active to Row Active Delay (trrd): [XMP Profile 1] Minimum Active to Auto-Refresh Delay (trc): [XMP Profile 1] Minimum Recovery Delay (trfc): [XMP Profile 1] Minimum Write Recovery time (twr): [XMP Profile 1] Minimum Write to Read CMD Delay (twtr): [XMP Profile 1] Minimum Read to Pre-charge CMD Delay (trtp): ns ns ns ns

4 [XMP Profile 1] Minimum Four Activate Window Delay (tfaw): [XMP Profile 1] Maximum trefi Time (Average Periodic Refresh Interval): [XMP Profile 1] Write to Read CMD Turn-around Time Optimizations: [XMP Profile 1] Read to Write CMD Turn-around Time Optimizations: [XMP Profile 1] Back 2 Back CMD Turn-around Time Optimizations: [XMP Profile 1] System CMD Rate Mode: ns us adjustment adjustment adjustment 1N DIMM#1 Memory type: DDR3 SDRAM SPD revision: 1.1 Manufacturer: Corsair Serial number: Part number: Clock speed: Memory size: CMY16GX3M2A2400C MHz 8192 MB Number of banks: 8 Row address bits: 16 Column address bits: 10 Bus width: Device width: 64 bits 8 bits Number of ranks: 2 ECC: Module voltage: 1.5V Minimum clock cycle time (tck): ns Supported CAS latencies: Minimum CAS latency time (taa): Minimum RAS to CAS delay time (trcd): Minimum row precharge time (trp): Minimum active to precharge time (tras): ns Supported timing at highest clock speed: Minimum Row Active to Row Active Delay (trrd): Minimum Active to Auto-Refresh Delay (trc): Minimum Recovery Delay (trfc): Minimum Write Recovery time (twr): Minimum Write to Read CMD Delay (twtr): Minimum Read to Pre-charge CMD Delay (trtp): Minimum Four Activate Window Delay (tfaw): ns ns ns ns Operating temperature range: 0-95C Supports Auto Self-Refresh: Supports Partial Array Self-Refresh: Yes

5 Thermal Sensor present: Supports On-Die Thermal Sensor readout: n-standard SDRAM type: Module type: Module Height: Module Thickness: Module Width: Standard Monolithic UDIMM mm Front: 2-3 mm, Back: 2-3 mm mm Reference raw card used: Raw Card B Rev. 0 XMP Revision: 1.3 [XMP Profile 1] Module voltage: 1.65V [XMP Profile 1] Clock speed: [XMP Profile 1] Minimum clock cycle time (tck): MHz ns [XMP Profile 1] Supported CAS latencies: 6 10 [XMP Profile 1] Minimum CAS latency time (taa): [XMP Profile 1] Minimum RAS to CAS delay time (trcd): [XMP Profile 1] Minimum row precharge time (trp): [XMP Profile 1] Minimum active to precharge time (tras): ns ns [XMP Profile 1] Supported timing at highest clock speed: [XMP Profile 1] Minimum Row Active to Row Active Delay (trrd): [XMP Profile 1] Minimum Active to Auto-Refresh Delay (trc): [XMP Profile 1] Minimum Recovery Delay (trfc): [XMP Profile 1] Minimum Write Recovery time (twr): [XMP Profile 1] Minimum Write to Read CMD Delay (twtr): [XMP Profile 1] Minimum Read to Pre-charge CMD Delay (trtp): [XMP Profile 1] Minimum Four Activate Window Delay (tfaw): [XMP Profile 1] Maximum trefi Time (Average Periodic Refresh Interval): [XMP Profile 1] Write to Read CMD Turn-around Time Optimizations: [XMP Profile 1] Read to Write CMD Turn-around Time Optimizations: [XMP Profile 1] Back 2 Back CMD Turn-around Time Optimizations: [XMP Profile 1] System CMD Rate Mode: ns ns ns ns ns us adjustment adjustment adjustment 1N Graphics NVIDIA GeForce GTX 980 Chip Type: GeForce GTX 980 DAC Type: Memory: BIOS: Driver provider: Integrated RAMDAC 4095MB Version f.0.d NVIDIA Driver version:

6 Driver date: Monitor 1: 1920x1080x32 60Hz (Primary monitor) Disk volumes C: Local Drive, \\?\Volume{a1495a17-7e b8-5fd3d2754c10}\, NTFS, (237.96GB total, 44.71GB free) Disk drives Disk drive: Model: Crucial_CT256MX100SSD1 Serial: 14340D003E27 (Disk: 0, Size: GB, Volumes: C) Optical drives Network Killer e2200 Gigabit Ethernet Controller (NDIS 6.30) (Speed: 1Gb/s) (MAC: D8:CB:8A:3D:90:CC) Ports Communications Port: COM1 - RS232 Serial Port (max Baud rate: ) Mouse Port: PS/2 connector Keyboard Port: PS/2 connector USB Intel(R) 9 Series Chipset Family USB xhci Host Controller - 8CB1 - Logitech Gaming Mouse G400 - Logitech USB Receiver Intel(R) 9 Series Chipset Family USB Enhanced Host Controller - 8CAD USB xhci Compliant Host Controller - Microsoft Corporation Controller (SN: 127CD34) Intel(R) 9 Series Chipset Family USB Enhanced Host Controller - 8CA6 Detailed event log Event LOG NOTE: :56:00, Status, PassMark BurnInTest V8.0 Std 1040 (64-bit) LOG NOTE: :56:01, Status, Main Tests started LOG NOTE: :56:01, 3D Graphics, 3D test starting: Duty cycle = 100. Test on primary monitor (0). (x,y) = (0,0). WxH = 375x250. LOG NOTE: :57:47, Status, Test run stopped Result summary Test Start time Thu Apr 23 12:56: Test Stop time Thu Apr 23 12:57: Test Duration 000h 01m 47s

7 Temperature CPU 0 average (Min/Current/Max) 23.8C / 31.3C / 34.8C Temperature CPU 0 core 0 (Min/Current/Max) 24.0C / 27.0C / 35.0C Temperature CPU 0 core 1 (Min/Current/Max) 23.0C / 31.0C / 31.0C Temperature CPU 0 core 2 (Min/Current/Max) 23.0C / 27.0C / 31.0C Temperature CPU 0 core 3 (Min/Current/Max) 25.0C / 40.0C / 42.0C Temperature HDD 0 (Crucial_CT256MX100SSD1) (Min/Current/Max) NA / NA / NA Temperature GPU 0 (nvidia) (Min/Current/Max) 41.0C / 69.0C / 69.0C Test Cycles Operations Result Errors Last Error 3D Graphics PASS 0 errors Temperature - - PASS 0 errors TEST RUN PASSED Serious error summary for the last test run Serious and critical errors serious or critical errors