Transcription

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2 Introduction

3 Introduction

4 Introduction

5 Introduction

6 Introduction use damage for processing!

7 Outline

8 Outline Processing with fs pulses Role of focusing Low-energy processing

9 Processing with fs pulses 10 1 F th (J/m 2 ) τ 1/2 τ pulse duration (ps) Du et al., Appl. Phys. Lett. 64, 3071 (1994)

10 Processing with fs pulses

11 Processing with fs pulses clear evidence that no bulk plasmas... [and]... no bulk damage could be produced with femtosecond laser pulses. von der Linde, et al., J. Opt. Soc. Am. 13, 216 (1996)

12 Processing with fs pulses focus laser beam inside material 100 fs transparent material objective Glezer, et al., Opt. Lett. 21, 2023 (1996)

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15 Processing with fs pulses

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26 Processing with fs pulses 2 x 2 µm array fused silica, 0.65 NA 0.5 µj, 100 fs, 800 nm Opt. Lett. 21, 2023 (1996)

27 Processing with fs pulses 2 x 2 µm array fused silica, 0.65 NA 0.5 µj, 100 fs, 800 nm Opt. Lett. 21, 2023 (1996)

28 Processing with fs pulses 2 x 2 µm array fused silica, 0.65 NA 0.5 µj, 100 fs, 800 nm Opt. Lett. 21, 2023 (1996)

29 Processing with fs pulses 2 x 2 µm array fused silica, 0.65 NA 0.5 µj, 100 fs, 800 nm Opt. Lett. 21, 2023 (1996)

30 Processing with fs pulses 100 fs 0.5 µj 200 ps 9 µj

31 Processing with fs pulses 5 x 5 µm array fused silica, 0.65 NA 0.5 µj, 100 fs, 800 nm Opt. Lett. 21, 2023 (1996)

32 Processing with fs pulses Points to keep in mind: fs laser processing works focusing very important no collateral damage

33 Outline Processing with fs pulses Role of focusing Low-energy processing

34 Role of focusing Dark-field scattering objective sample

35 Role of focusing block probe beam detector probe objective sample

36 Role of focusing bring in pump beam pump detector probe objective sample

37 Role of focusing damage scatters probe beam pump detector probe objective sample

38 Role of focusing signal (a.u.) fused silica 0.1 µj time (µs)

39 Role of focusing signal (a.u.) fused silica 1.0 µj time (µs)

40 Role of focusing signal (a.u.) plasma fused silica 1.0 µj time (µs)

41 Role of focusing signal (a.u.) fused silica 1.0 µj permanent change time (µs)

42 Role of focusing signal (a.u.) thermal transient fused silica 1.0 µj time (µs)

43 Role of focusing vary numerical aperture in Corning threshold energy (nj) numerical aperture

44 Role of focusing threshold energy (nj) spot size determined by numerical aperture: E th I th A I th 2 and thus I th E th (NA) 2 2 (NA) numerical aperture

45 Role of focusing fit gives threshold intensity: I th = 2.5 x W/m threshold energy (nj) numerical aperture

46 Role of focusing threshold intensity (10 17 W/m 2 ) threshold energy (nj) bandgap (ev) numerical aperture threshold fluence (kj/m 2 )

47 Role of focusing vary material threshold intensity (10 17 W/m 2 ) SF11 fused silica bandgap (ev) CaF threshold fluence (kj/m 2 )

48 Role of focusing threshold varies with bandgap threshold intensity (10 17 W/m 2 ) SF11 fused silica bandgap (ev) CaF threshold fluence (kj/m 2 )

49 Role of focusing Points to keep in mind: threshold critically dependent on NA surprisingly little material dependence avalanche ionization important

50 Outline Processing with fs pulses Role of focusing Low-energy processing

51 Low-energy processing threshold decreases with increasing numerical aperture 200 threshold energy (nj) numerical aperture

52 Low-energy processing less than 10 nj at high numerical aperture! 200 threshold energy (nj) numerical aperture

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55 10 µm Low-energy processing

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61 Low-energy processing µm

62 Low-energy processing µm

63 Low-energy processing µm

64 Low-energy processing µm

65 Low-energy processing 12 radius (µm) number of shots

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71 Low-energy processing waveguide machining

72 Low-energy processing waveguide machining

73 Low-energy processing waveguide mode analysis CCD He:Ne

74 Low-energy processing near field mode 0 10 distance (µm) distance (µm) 30

75 Low-energy processing near field mode 15 intensity (AU) µm position (µm)

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80 Low-energy processing 3D wave splitter output He:Ne

81 Low-energy processing Bragg grating nλ

82 Low-energy processing Bragg grating λ λ 5 λ 4 λ 3 λ 2 1

83 Low-energy processing monolithic amplifier laser active glass

84 Low-energy processing epi-fluorescence microscope CCD camera UV lamp objective

85 Low-energy processing mount fluorescently tagged sample CCD camera UV lamp sample objective

86 Low-energy processing UV illumination CCD camera UV lamp sample objective

87 Low-energy processing causes fluorescence CCD camera fluorescence UV lamp sample objective

88 Low-energy processing process with fs laser beam CCD camera fluorescence UV lamp fs laser sample objective

89 Low-energy processing CCD camera fluorescence UV lamp sample objective

90 Low-energy processing 10 µm

91 Low-energy processing 10 µm

92 Low-energy processing 5 µm

93 Low-energy processing channel 5 µm

94 cavity Low-energy processing channel 5 µm

95 Low-energy processing

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123 Summary E (nj) rep rate (MHz)

124 Summary E (nj) SINGLE-SHOT DISRUPTION CUMULATIVE EFFECTS rep rate (MHz)

125 Summary E (nj) SINGLE-SHOT DISRUPTION CUMULATIVE EFFECTS cell manipulation 1 rep rate (MHz)

126 Summary E (nj) SINGLE-SHOT DISRUPTION CUMULATIVE EFFECTS cell manipulation 1 He:Ne device fabrication rep rate (MHz)

127 Summary E (nj) SINGLE-SHOT DISRUPTION CUMULATIVE EFFECTS data storage cell manipulation 1 He:Ne device fabrication rep rate (MHz)

128 Summary E (nj) SINGLE-SHOT DISRUPTION CUMULATIVE EFFECTS 1000 basic science 100 data storage cell manipulation 1 He:Ne device fabrication rep rate (MHz)

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130 SLIDE HEADING

131 SLIDE HEADING Funding: National Science Foundation Harvard Office of Technology and Trademark Licensing Acknowledgments: Prof. Nico Bloembergen (Harvard University) Willie Leight (Yale University) Yossi Chai (Sagitta, Inc.) For a copy of this talk and additional information, see:

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