Laser Micro-Fabricator. Innovative Laser Technology KORTherm Science

Transcription

1 Laser Micro-Fabricator Innovative Laser Technology KORTherm Science

2 Wavelength and material Interaction 10600n 1064nm 532nm 351nm 308nm 248nm 193nm 157nm N-H C-H O-H H-H O-O C-C N-O C-N N-N C-O THERMAL PHOTOCHEMICAL INCREASE IN COST QUALITY Bond and Photon ev

3 Laser Micromachining Technique Direct Write techniques Imaging techniques Direct machining - Serial processing with focal spot DPSS Lasers 1064nm, 532nm, 355nm, 266nm AND femto-second Mask Imaging techniques Mask projection Area Machining Synchronised Image Scanning (SIS) Excimer lasers 308nm, 248nm, 193nm, 157nm

4 Solid State Laser Feature Wide choice of wavelengths : 1064nm, 532nm, 355nm, 266nm, 800nm A variety of temporal pulse widths: milliseconds to a few femtoseconds High pulse repetition rates (from tens to hundreds of kilohertz) Excellent "wall-plug" efficiencies (especially with diode-pumped systems) Compact sizes Economically - favorable running costs Side pump DPSS Laser End pump DPSS Laser

5 Excimer Laser Feature Short wavelength: 193nm to 351nm High resolution generation (approximately 1µm features in process materials) Shallow absorption depth:0.1 to 0.5µm Energy highly absorbed by materials Uniform power density over relatively large area Large beam size and high peak power allow simultaneous large area exposure

6 Laser Micromachining Technique Workpiece Workpiece (Mask Image) DPSS Laser Direct writing KOS X-axis scanner KOS KOS Imaging lens system Y-axis scanner KOS MASK Beam Expansion & Homogenization Optics Excimer Laser Mask Projection

7 Laser Micromachining Technique DIRECT WRITING Simple technique Only sample or beam motion is required Optics are usually simple and inexpensive Can interface with CAD data files for complex patterning Can use lasers which run at very high repetition rates Can be used for serial writing rapid prototyping of Devices MASK PROJECTION Very flexible technique Many types of structures can be produced with the same system Can use the short wavelengths of excimer lasers to machine with very high precision And Quality Mask projection can mimic direct writing technique by projecting circular aperture. Can machine relatively large areas (100mm2) at a time Can be used for batch processing of volume products Limited range of features which can be produced Only a small area can be machined at a time. Projection optics can be expensive Excimer lasers operate at modest repetition rates Needs manufacture of masks

8 Beam Profile vs. Footprint 2D Spatial Profile Spatial Energy Profile Beam Footprint DPSS Excimer Excimer (homogenised)

9 Direct Write Techniques Industrial Applications Isolation Drilling Wafer Drilling Fuel injectors drilling Gas sensor drilling Aerosol atomizer drilling Probe card drilling Circuit microvia drilling Cutting & Scribing Solar panel and cell scribing Displays thin film scribing Wafer cutting/scribing/drilling (e.g. Si, Sapphire, SiN) Displays thin film scribing and patterning Circuit tuning MEMS prototyping

10 Application of Direct Write Techniques Hole Drilling Wafer Drilling Fuel injectors drilling Gas sensor drilling Aerosol atomizer drilling Probe card drilling Circuit microvia drilling

11 Application of Direct Write Techniques Cutting & Scribing Silicon Alumina (ceramic) Fused silica Aluminum nitride Gallium arsenide CVD Diamond PZT ceramic Thin metals and oxides Solar panel and cell scribing Displays thin film scribing

12 Application of Direct Write Techniques Wafer Cutting & Scribing Spot size 50 μm Effective scribing speed 200mm/s

13 Application of Direct Write Techniques Wafer Cutting & Scribing Smooth edge cut at >100mm/sec UV Laser

14 Application of Direct Write Techniques PZT Ceramic cutting 532nm DPSS Laser 30um cut width Solar cell scribing 532nm < 100um scribing width

15 Application of Direct Write Techniques Comparison of Sawing System The indisputable problem of the saw A lock of constant cutting quality due to wear of the saw blade Advantage of laser dicing Constant cutting quality No Tool wear No reliable forecast of the service life of a sawblade High consumption of saw blade leading to high consumption cost Chipping front and back side Mechanical stress and the formation of cracks Less suitable for very thin wafer Only straight contours can be cut Very few consumptions part, low running cost No Chipping No mechanical stress, force-free Ideal for ultra-thin wafers (smart card) Omnidirectional cutting No Z-axis, no rotary axis Cutting of straight and round shape Speed and cutting quality have reached their limits Can be applied in variety applications (Hole drilling, scribing, etc)

16 Application of Direct Write Techniques Comparison of Sawing System Laser machine Sawing machine

17 Application of Direct Write Techniques Solar panel and cell scribing 50 µm scribe in Mo 50 µm scribe in ZnO PDP Patterning PDP Patterning PDP Patterning 200 x 70μm cells Black Matrix

18 Mask Imaging Techniques Industrial Applications - Drilling Ink jet nozzle drilling Fiber catheter reagent hole drilling - Displays TFT LCD annealing - 3D Manufacturing Biochips Micro-optics MST, MEM S, MOEM S devices Micro-fluidics - Fiber gratings & waveguide structures

19 Mask Imaging Techniques Laser drilling techniques : Percussion Drilling Direct focusing Coherent sources tight focusing Focused spot size hole size High fluence high drilling speed Low repeatability Projection Imaging Incoherent sources Mask Projection shape flexibility Low fluence slow drilling

20 Mask Imaging Techniques Step-and-Repeat Mask High-speed replication of identical patterns Production of MEMs devices in polyimide Excimer laser at 248nm Depth 125um in 200 pulses Laser-LIGA: electroformed Ni replicas Workpiece

21 Mask Imaging Techniques Mask Dragging Channels and Trenches Mask

22 Mask Imaging Techniques Mask Dragging Channels and Trenches Mask

23 Mask Imaging Techniques Nozzle drilling φ1 φ2 φ3 φ4 φ5 = = = = φ1 φ2 φ2 φ4 φ5 Static Mask Laser Beam Result Material Direction

24 Configuration of Laser Machining System Motion System Beam Delivery System Vision System for Alignment Auto-Focus System Debris Extraction System MMI Software

25 Configuration of Laser Machining System Motion System Stage Galvo-Scanner Advantages Accuracy Resolution Position Sync Long Travel Flexibility Size Speed Cost Disadvantages Speed High cost Weight Maintenance Accuracy Thermal drift Anology device

26 Configuration of Laser Machining System Beam Delivery System Direct writing Laser Source Turning Mirror Beam Expansion Optics Beam Profiler Beam Splitter Focusing Optics Aperture Mask Turning Mirror Workpiece Stage

27 Configuration of Laser Machining System Beam Delivery System Homogenizer unit Beam Shaper Beam Delivery Optics Mask & Aperture Unit Scanner Or Focusing Lens DPSS Laser Low M2 Gaussian Profile Square top hat Collimated Beam Square image

28 Configuration of Laser Machining System Vision System for Alignment - 2-camera system On-axis camera Process monitoring Off-axis camera Position alignment Pattern matching (Pattern recognition) Distance measurement FOV: 800x600 um Resolution: 0.57x0.57 um

29 Configuration of Laser Machining System Auto-Focus System Focusing Lens CCD Camera LD Laser Stage Camera View

30 Configuration of Laser Machining System Auto-Focus System Monitoring Camera LD Laser Alignment Camera CCD Camera

31 Configuration of Laser Machining System Debris Extraction System Piezo Sensor Focusing Lens Quartz Window Assist Gas Nozzle -N2, He, Ar Suction Nozzle Laser Displacement sensor Laser Displacement sensor Substrate

32 Configuration of Laser Machining System Debris Extraction System Alignment Camera Assist Gas Nozzle Focusing Optics Suction Nozzle

33 Configuration of Laser Machining System MMI Software Motion Monitor 1 Computer (Program) Vision Monitor 2 Laser In/Out

34 Specification of the μ-fab Series Feature Sealed Optics Boxes Lasers and optics mounted to Granite for robust reliable operation Vibration Isolation Up to 300 x 300mm travel X-Y stages Motorized Stages (3-Axis) Vision System (Pattern recognition, Monitoring)

35 Specification of the μ-fab Series Main Components Multiple lasers can be fitted Enclosure isolated from machine core Lay MAX software for system control Fume extraction system Gas assist system Optical Alignment System (Pattern recognition system) Semi-Autofocus System Safety interlocked laser enclosure

36 Specification of the μ-fab Series System Configuration Aperture Unit Low Resolution CCD camera Light box Laser Mirror Flow meter Smoke Extracti on Focusi ng Lens Fume Extracti on High Resolution CCD camera Light box Solenoi d valve Stage Controller Z-Stage Y-Stage X-Stage Com 1 Com 2 Com 3 Com 4 Main Control PC Grabber Board Com 6 Com 5

37 Specification of the μ-fab Series Laser Source DPSS Laser 532nm and 355 Wavelength Pulse repetition rate: 1to 100 khz Pulse Width: < 20ns Average Power: < 30W Excimer Laser 248nm Wavelength Pulse repetition rate: <1kHz Pulse Width: < 20ns Pulse energy: <250mJ

38 Specification of the μ-fab Series Optical System Fully sealed optical delivery enclosure Dual coated optics for 248, 355 and 532nm operation Beam Expansion Optics Homogenizer Unit with Excimer laser Focusing Lens F=50 focus lens Spot size: < 10um Aperture and Mask Unit Beam Profiler System Beam Monitoring System

39 Specification of the μ-fab Series Workstation Granite base to mount the motorised stages, optics and Laser Gas assist nozzle and Fume extraction system Optical alignment system Levellable chuck (Mechanical Type, Vacuum Chuck - Option) Precision Motorised Stage: 200 x 200mm Moving Range (300x300mm moving range: Option) Auto-Focus System (Option) Auto-Alignment System (Option) Energy Monitoring system (Option)

40 Simulation Movie of Fabrication PDP Patterning

41 Simulation Movie of Fabrication Line Scribing

42 Simulation Movie of Fabrication Micro Lens

43 Simulation Movie of Fabrication Micro Lens Array