Quality/Failure Analysis

Transcription

1 Quality/Failure Analysis Tom Siegel, Failure Analysis and Quality Class ID: OC12I Renesas Electronics America Inc.

2 Tom Siegel: Senior Manager, Failure Analysis and Quality Education MBA: Indiana University (2004) BSEE: Gannon University (1983) Twenty-nine (29) Years Semiconductor Industry Experience 4 Yrs: Delco Electronics - Kokomo, IN Microprocessor and ASIC Development 3 Yrs: Elgin Electronics Erie, PA Design Engineering for Telecommunications Power Products Purchasing Manager 18 Yrs: Delphi Delco Electronics Kokomo, IN Microprocessor and ASIC Development Manager Materials Engineering Manager Failure Analysis Manager 4 Yrs: Renesas Electronics New Business Development Manager Mixed Signal Development Manager Failure Analysis and Quality Manager 2

3 Renesas Technology & Solution Portfolio 3

4 Agenda: Automotive Quality/Failure Analysis Glossary of Acronyms Renesas quality performance Automotive Industry Requirements Requested timing for analysis Renesas Global Quality Support Structure Failure Analysis Flow Mechanical inspection Electrical testing Fault isolation Physical analysis Requested information from customers to ensure successful analysis results Minimize No-Trouble-Found (NTF) analysis results 4

5 Agenda: Automotive Quality/Failure Analysis Glossary of Acronyms Renesas Quality Performance Automotive Industry Requirements Requested timing for analysis Renesas Global Quality Support Structure Failure Analysis Flow Mechanical inspection Electrical testing Fault isolation Physical analysis Requested information from customers to ensure successful analysis results Minimize No-Trouble-Found (NTF) analysis results 5

6 Glossary of Acronyms ATE Automated Test Environment BGA Ball Grid Array CAD Computer Aided Design DFM Design for Manufacturing DFR Design for Reliability DFT Design for Test FDT Fault Diagnosis Tool FIB Focused Ion Beam GDS Graphic Database System IR-OBIRCH Infra Red - Optical Beam Induced Resistance Change OBELISCH Optical BEam induced LogIc State Change SAT Scanning Acoustic Tomography STEM Scanning Tunneling Electron Microscopy 6

7 Agenda: Automotive Quality/Failure Analysis Glossary of Acronyms Renesas Quality Performance Automotive Industry Requirements Requested timing for analysis Renesas Global Quality Support Structure Failure Analysis Flow Mechanical inspection Electrical testing Fault isolation Physical analysis Requested information from customers to ensure successful analysis results Minimize No-Trouble-Found (NTF) analysis results 7

8 Global Quality Leader The Drive to Zero Defects Zero Defects Unified Quality System Continuous Quality Improvement Quality Management Fast Analysis and Feedback P lan D o C heck A ction Subcontractors outside Renesas Approval (same quality as Renesas) Continuous Quality Improvement Change Control Nonconforming Control To prevent defects in each process To prevent defects outflow Continuously improve the Quality of Products towards Zero Failure Target by expanding Best Practice for Company-wide Activities with Benchmarking by carrying out strict quality control of subcontractors with strong relationship 8

9 Shipping Qty [Mpcs] Field Failure Rate [PPM] Continuous Auto MCU * Quality Improvement * Flash MCU Renesas realized less than 1ppm level of defects in ! Design DFT (Design for Test) DFR (Design for Reliability) DFM (Design for Manufacturing) Feedback to Design 400 MCU Quality Performance (Auto) 4.0 Production Feedback for Quality Improvement Quality Control Short Loop TEG for Defect Density reduction 2.22ppm Wafer Test Stressed Test High Fault Coverage ppm 2.0 Outlier Screening LSI Test Failure Analysis ppm ppm 0.79ppm Shipment Failure Chip (FY) 9

10 Field failure rate Number of shipments (millions pcs per year) Renesas s automotive PowerMOSFETs providing outstanding quality result in the market Field failure rate trends 400M Number of shipments 300M 40ppb 39ppb 200M 30ppb 20ppb 19ppb Target <10ppb FY

11 Agenda: Automotive Quality/Failure Analysis Glossary of Acronyms Renesas Quality Performance Automotive Industry Requirements Requested timing for analysis Renesas Global Quality Support Structure Failure Analysis Flow Mechanical inspection Electrical testing Fault isolation Physical analysis Requested information from customers to ensure successful analysis results Minimize No-Trouble-Found (NTF) analysis results 11

12 Automotive FA Response Request Initial report: 48 hours Final report: 14 days Includes 8D report format and irreversible corrective action 12

13 Agenda: Automotive Quality/Failure Analysis Glossary of Acronyms Renesas Quality Performance Automotive Industry Requirements Requested timing for analysis Renesas Global Quality Support Structure Failure Analysis Flow Mechanical inspection Electrical testing Fault isolation Physical analysis Requested information from customers to ensure successful analysis results Minimize No-Trouble-Found (NTF) analysis results 13

14 Quality Support Structure for Global Customers Quality assurance and failure analysis network Global design centers and manufacturing sites Regional direct support to each customer Kitaitami Musashi Dusseldorf Beijing / Suzhou Roseville,CA Tamagawa Renesas Electronics Europe GmbH Quality Center Renesas Electronics China Co, Ltd. Quality Center Renesas Electronics Corporation Quality Assurance Division Renesas Electronics America, Inc. Quality Center 14

15 Agenda: Automotive Quality/Failure Analysis Glossary of Acronyms Renesas Quality Performance Automotive Industry Requirements Requested timing for analysis Renesas Global Quality Support Structure Failure Analysis Flow Mechanical inspection Electrical testing Fault isolation Physical analysis Requested information from customers to ensure successful analysis results Minimize No-Trouble-Found (NTF) analysis results 15

16 Roseville FA Lab Capability The Roseville FA Lab is fully equipped for start to finish analysis. FA Flow Available Techniques 1) Mechanical Inspection Optical Inspection X-Ray SAT (Scanning Acoustical Tomography) BGA Rework 2) Electrical Testing Curve Tracer Flash Programmer & debugger tools ATE Tester (Teradyne J pin) FDT (Fault Diagnosis Tool) 3) Fault Isolation Photon Emission IR-OBIRCH OBELISCH Columbo CAD GDS Analysis/Overlay 4) Physical/Destructive Analysis Delayer (Polish, Plasma & Wet Etch) FIB STEM 16

17 Agenda: Automotive Quality/Failure Analysis Glossary of Acronyms Renesas Quality Performance Automotive Industry Requirements Requested timing for analysis Renesas Global Quality Support Structure Failure Analysis Flow Mechanical inspection Electrical testing Fault isolation Physical analysis Requested information from customers to ensure successful analysis results Minimize No-Trouble-Found (NTF) analysis results 17

18 Mechanical Inspection Techniques (Optical) Optical Inspection is used to verify the correct sample has been received and no external mechanical damage exists. Verify Part Number & Lot Codes Missing Corner Pin 18

19 Mechanical Inspection Techniques (Optical) Often a customer will send a PCB board with the device still attached. Bent leads can cause soldering issues in their assembly line. Lifted Pin not soldered Solder Bridge 19

20 Mechanical Inspection (X-Ray) Using the X-Ray, we can see inside the device to check the internal bond structures and lead frame. 20

21 Mechanical Inspection Techniques (SAT) SAT (Scanning Acoustical Tomography) The SAT uses an ultrasonic transducer to produce sound energy in a tank of DI water. The sound energy penetrates the sample and the reflections are detected. An image of the inside structure is generated by using the reflected sound energy. 21

22 Mechanical Inspection Techniques (SAT) From the images, we can determine internal package problems such as Delamination, Popcorn, and Die Crack. Unlike the X-Ray, the die is visible. Good Device Delamination Die Crack Popcorn 22

23 Agenda: Automotive Quality/Failure Analysis Glossary of Acronyms Renesas Quality Performance Automotive Industry Requirements Requested timing for analysis Renesas Global Quality Support Structure Failure Analysis Flow Mechanical inspection Electrical testing Fault isolation Physical analysis Requested information from customers to ensure successful analysis results Minimize No-Trouble-Found (NTF) analysis results 23

24 Electrical Testing Techniques (Curve Tracer) Test package pin electrical contact to the die. Small signal activates the ESD protection diodes. Waveform shape indicates the health of the device pin. Simple test can detect Pin Shorts Pin Leakage Open Failures 24

25 Electrical Testing Techniques (ATE Test) ATE (Automated Test Equipment) Test uses current production programs for verification Roseville has test boards for many V850, K0 and K0R devices Tests are performed over the guaranteed operating temperature range Typically 25C, 85C, -40C Uses a Thermostream. If a failure is confirmed, additional information can be found Example - Datalog, Shmoo Plots, IDDq Analysis) Thermostream The device is placed in the test socket inside the thermal stream temperature chamber Tester 25

26 Electrical Testing Techniques (FDT) Fault Diagnosis Tool (FDT) system captures differences between a reference sample and a claim fail sample running the same evaluation code. Code executing in both devices simultaneously. When the code reaches a specified address (Breakpoint), execution is stopped. FDT software compares the contents of internal registers of both devices FDT Setup Debugger Interface 1 Reference Sample FDT Dual Device Breadboard Workstation PC Debugger Interface 2 Fail Sample 26

27 Agenda: Automotive Quality/Failure Analysis Glossary of Acronyms Renesas Quality Performance Automotive Industry Requirements Requested timing for analysis Renesas Global Quality Support Structure Failure Analysis Flow Mechanical inspection Electrical testing Fault isolation Physical analysis Requested information from customers to ensure successful analysis results Minimize No-Trouble-Found (NTF) analysis results 27

28 Fault Isolation Techniques (Photon Emission) Photons are emitted when current flows across junction of a transistor Emission analysis captures this light Differences between the claim sample and a reference sample identify the location of the abnormal current Device is typically initialized to the failure point identified by the IDDq analysis. Caveat Often the emission point is only a side effect to the actual failure location. All of the signals associated with the emission point must be considered suspect. 28

29 Fault Isolation Techniques (IR-OBIRCH) IR-OBIRCH IDD Infra Red - Optical Beam Induced Resistance CHange Detects changes in IDD current as heat is introduced by scanning the surface of the device with an infrared laser. Resistance: R = (L/A) where Resistivity: = 0 (T T 0 ) + 0 IDD Current: I = V/R With a constant voltage(v) applied, current(i) will fluctuate as resistance(r) changes with temperature Useful in detection of shorts between metal lines where no photon emission would occur V A IR-Laser Scan Pattern Laser Scan Image Overlay Image Defect Device Under Test 29

30 Fault Isolation Techniques (OBELISCH) Optical BEam induced LogIc State CHange Useful for localizing defects in marginal devices that are sensitive to temperature Other companies may refer to it as DAL - Dynamic Analysis by Laser Stimulation SDL - Soft Defect Localization Dynamic test where the failing test pattern is run in a continuous loop on tester Pass/Fail result of each test sent to OBELISCH system IR-Laser stepped pixel-by-pixel providing localized heating Temperature sensitive defect will shift: PASS FAIL or FAIL PASS Laser Scan Map SEM Cross-section Superimpose with Optical Image 30

31 Fault Isolation Techniques (Columbo) Many devices use test methodology known as Scan testing. If device fails scan test, Columbo may help localize fail point. Columbo uses the scan datalogs and device design files Calculates failure probability at particular signal points inside the device Input output

32 Fault Isolation Techniques (CAD Overlay) If many hotspots are observed by Emission/OBIRCH analysis, using CAD Overlay can help find a common link Use a Net Tracing tool in the CAD system to search for any common nets between the Emission/OBIRCH hotspots OBIRCH Common Net Emission Common Net Both Nets run parallel to each other. A short is suspected here. 32

33 Agenda: Automotive Quality/Failure Analysis Glossary of Acronyms Renesas Quality Performance Automotive Industry Requirements Requested timing for analysis Renesas Global Quality Support Structure Failure Analysis Flow Mechanical inspection Electrical testing Fault isolation Physical analysis Requested information from customers to ensure successful analysis results Minimize No-Trouble-Found (NTF) analysis results 33

34 Physical Analysis Techniques (Delayer) Layer-by-Layer Etch Back is a combination of mechanical polishing, chemical etching, and plasma etching methods to remove individual layers from the sample When to Use? When no visual confirmation of defect can be observed Defect area is too large for FIB cross-sectional analysis Best imaging orientation is unclear due to feature obstruction. Once the defect is exposed, it may be desirable to return to FIB cross-sectional analysis method. Top View 2 nd Metal Removed 1 st Metal Removed Gate Removed Pin hole damage 34

35 Physical Analysis Techniques (FIB) Focused Ion Beam (FIB) FIB performs precision cutting and milling Allows a cross sectional view of the defect area. Uses Gallium ION for the beam Beam energy controlled to drill precise location Micro Sampling system lifts out the defect area Place in specimen holders for high magnification SEM and TEM analysis. Resolution: 180,000x 35

36 Physical Analysis Techniques (Delayer) Similar to layer-by-layer Etch Back, however the FIB is used to open a window to the lower layers Why Use? Faster when fault area is more localized Grounding properties of the FIB can be used to find a floating node and isolate a failure point Much less destructive to surrounding die than layer-by layer etch back Small defect area, unobstructed by large metal features A window is being milled into the die Al structures appear after the SiO 2 is milled 36

37 Physical Analysis Techniques (FIB) Micro Sampling Lift-Out Technique Step 1 Deposit Tungsten Step 2 Mill Away Surrounding Area Step 3 Mill Away Under Side Step 4 Attach Manipulator Step 5 Sever Micro- Bridge Step 6 Lift Away Sample 37

38 Physical Analysis Techniques (STEM) Scanning Transmission Electron Microscope (STEM) Sample mounted to the specimen holder by FIB, STEM provides high resolution imaging. Resolution: 5,000,000X Capable of imaging in Secondary Electron (SE) and Transmitted Electron (TE) modes. Sample thickness required to be <1um but preferred <500nm. Image quality improves as the sample gets thinner. Ti Short between two metal lines Sample can be transferred between the FIB and STEM in a cycle of sample thinning and imaging. 38

39 Physical Analysis Techniques (STEM) Once the defect is confirmed, the EDX system is used to determine the elemental composition. Each color represents the presence of a different element 39

40 Physical Analysis Techniques (STEM) Sample Mounted Here 3D Pillar Holder FIB is used to lift out the sample and mount it to the tip of the micro pillar. The sample can now be rotated kV accelerating voltage of the STEM, electron beam penetrates the surface of the sample 3D image can be created by positioning the sample off axis. 40

41 Agenda: Automotive Quality/Failure Analysis Glossary of Acronyms Renesas Quality Performance Automotive Industry Requirements Requested timing for analysis Renesas Global Quality Support Structure Failure Analysis Flow Mechanical inspection Electrical testing Fault isolation Physical analysis Requested information from customers to ensure successful analysis results Minimize No-Trouble-Found (NTF) analysis results 41

42 REA ABU Claims by Root Cause (12 month) 80% of FA Claims have root cause: NTF and EOS/ESD 42

43 Improving FA Results The most challenging FA item: NTF (No Trouble Found) Typically result from: Production test hole Mis-application of device Another failed component in the system Resolution of NTF s can be time consuming Understanding of customer application is essential to resolve NTF Customer applications are very different from production IC tester Proper customer diagnosis is critical ABA swap of suspect device to known good module to verify the failure follows the device Detailed failure information is extremely beneficial for timely resolution The probability of finding a failure increases as more specific details are provided for the failing device 43

44 Questions? 44

45 Please Provide Your Feedback Please utilize the Guidebook application to leave feedback or Ask me for the paper feedback form for you to use 45

46 Renesas Electronics America Inc.