IC Testing and Development in Semiconductor Area

Transcription

1 IC Testing and Development in Semiconductor Area Prepare by Lee Zhang, 2004

2 Outline 1. Electronic Industry Development 2. Semiconductor Industry Development

3 4Electronic Industry Development Electronic Industry in Worldwide and in China Wide Electronic product revenue in worldwide is $1.5 trillion (US dollar) at year of Electronic product revenue in China wide is $160 billion (US dollar) at year of 2003, which is about 11% of world revenue. Electronic product revenue in China wide is $180 billion (US dollar) at year of 2004, and it will be reached $270 billion by 2007.

4 4Electronic Industry Development Electronic Industry in Worldwide and in China Wide Electronic industry revenue in China wide is $227 billion (US dollar) at year of China electronics export is $124 billion, 1/3 of China total export.

5 4Electronic Industry Development Electronic Products Produced on 2003 PC revenue was 48 million units. TV revenue was 58 million units. Mobile phone was 211 million units. Communication bandwidth exchange equipments were increased by over 40%. Auto mobile industries were increased by over 40% and will be reached $5.5 billion revenue on 2007.

6 4Electronic Industry Development Electronic Products vs. Semiconductor Semiconductor revenue in worldwide is $163 billion (US dollar) at year of Semiconductor revenue in China wide is $25.2 billion at year of 2003, which is about 16% of worldwide revenue. 1) CPU design and development 2) DSP design and development 3) LCD design and development 4) Mobile phone related chip design and development

7 4Semiconductor Development How to look into semiconductor industry development? People give a prediction for 10 years or 50 years or forever in changing or keeping semiconductor materials or factor. Companies change the strategy to challenge the semiconductor industry. More business specialists believe the market is the key to look into. Someone only look for the business cycles to believe the development no ending.

8 4Semiconductor Development How to look into China s semiconductor industry development? China s semiconductor industry has a very young age. China s semiconductor is learning the business strategies from USA, Japan, and Europe. China is not concerning the problem with the world but we need more intellectual properties. China would look into high-end products in semiconductor development.

9 4Semiconductor Development The Strong Point and The Weak Point From China Semiconductor Development Developing traditional and continuous able products (like analog circuit design). Developing new mini product design and simple circuit design (like digital circuit design on mobile phone chip, smart card chip). Semiconductor manufacturing cost reduction and competition (low-end process like 6 wafer manufacture).

10 4Semiconductor Development The Strong Point and The Weak Point From China Semiconductor Development Build low cost bases for manufacturing of assembly and testing (like real-state cost, facility cost, material cost and engineer cost). Lack of intellectual property of design and technology. Lack of good base of technology research and professional experience on high-end design. Lack of long-term strategies to invest a research and development center.

11 Outline 1. Overview IC Testing Establishment 2. The Types of Tests in IC Manufacture 3. The Types of IC Product Tests 4. Test Classification 5. Basic Manufacture Test Flow 6. Basic Production Test Flow 7. Impact Test Cost in IC Manufacture

12 Outline 8. Impact Test Cycle in IC Manufacture 9. Objectives of Product and Production Testing 10. Test vs. Quality and Reliability 11. Tester Divided by Test Capabilities 12. Tester Divided by Test Functions 13. Other Important Facilities

13 4Overview IC Test Establishment How is IC test established? From design point of view From manufacture point of view From system design point of view From failure analysis point of view From customer requirement point of view How important is the testing in IC industry? Measuring new products realistic Monitoring manufacture process Evidence for consumer acceptance

14 4Overview IC Test Establishment What is the future development for IC test? Design for self-test Separate IP core test Multiple test methods on single tester Simple product test with complicated tester Reduce software development time

15 4Types of Testing in IC Mfg. How many are the major types of testing? Design type of test. Manufacture or product type of test. Production type of test. Reliability type of test. Physical failure analysis type of test. Detail Included Each Test Type Design types: design simulation test, design debug test, design characterization test and design qualification test.

16 4Types of Testing in IC Mfg. Detail Included Each Test Type Mfg and product types: process step test, E (electron) test, engineering test and yield enhancement test. Production types: wafer probing test, assembly package test, final test and QA test. Reliability types: characterization test and qualification test. Physical FA types:

17 4Types of Product Testing Six Types of Product Testing in IC Field Memory types ROM and RAM devices. Logic types programmable logic devices. System types embedded, microcontroller, Soc devices. Mixed-signal types analog and digital devices. RF types optical and communication devices. LCD types display driver devices.

18 4Testing Classification Memory Testing (SRAM, DRAM, EEPROM, Flash Memory, Embedded Memory) Logic Testing (ASIC, FPGA, PLD, CPU) Mixed Signal Testing (ADC, DAC) SoC Testing (System on Chip Device) LCD Testing (Liquid Crystal Driver) IP Testing (PLL, ADC, DAC, USB, Bandgap, Vregulator, High-Speed I/O and so on)

19 4Impact of Testing Cost Requiring huge amounts of investments Largely varying with volumes Product and process maturity Product and process complexity Product lead time (testing on wafer, packaging cycle time and package testing)

20 4Impact of Testing Cycle Design for Testability (DFT in design side) Characterization (design development) Reliability Assessment (process manufacturing) Pre-production Testing (product engineering) Production Testing (production manufacturing) Yield Enhancement (product engineering)

21 4Impact of Testing Cycle Performance Improvement (process engineering) Test cost Reduction (manufacturing side) Product Cost Reduction (production side)

22 4Objective of Production Testing Screening sequence Performance of specification Collecting data for better control Manufacturing process fine-tuning Progress in yield enhancement process Same product by different classes of performance (speed, vcc range, temperature range, W/R & R/W performance)

23 4Testing vs. Quality and Reliability Design of the cell, process and product Debug and characterization of process and product Manufacturing machine: equipment, resources, materials and so on The overall process control The reliability assessment of process and product The overall know-how of the manufacture

24 4Tester Divided by Test Capabilities Bench-top Tester (PC based, Power Meter, Power Supply, Oscilloscopes and so on)

25 4Tester Divided by Test Capabilities Automatic Tester (Advantest, HP93000 Tester, Mosaid Tester and Teradyne Tester and so on)

26 4Tester Divided by Test Functions Logic Device (Credence Tester, HP93000 Tester, Teradyne Tester and so on ) Memory Device (Advantest, Mosaid Tester) Mixed-Signal Device (Teradyne Tester and HP93000, Yokogawa Tester and so on) SoC/LCD Device (Teradyne Tester and Yokogawa Tester and so on) IP Testchip (Bench-Top and ATE)

27 4Other Important Facilities Probe Station Handler Laser Repair/Laser Mark Probe Card DUT Board 4x1

28 Outline 1. Purpose of Testing 2. Basic Test Flow and DUT Flow 3. Basic Test Items 4. Test Methodology and Test Flow

29 1) Purposes of Testing For Design Houses or for Foundry - Guarantee the products meet design targets. - Pre-screen for reliability test. - Quality assurance to the production process. - Meet customer spec. and requirement. For Customers - Verification of the product s functions - Monitor the quality of incoming products

30 2) Basic Testing Flow IC Fabrication Yield: Testing Quality: Shipped Parts Fraction of good parts Defective parts per million (DPM) Rejects

31 2) Basic DUT Flow Test Stimulus DUT DUT Response Good Or Bad? Pass Fail

32 3) Basic Test Items 4DC Parameter Test (Static Test) 4Functional Test 4AC Parameter Test (Dynamic Test) 4Reliability Related Test

33 4DC Parameter Test When a voltage or current is measured during the test and the pass/fail results are based upon the measured value Continuity Test (Open & Short) Leakage Test. (Iil / lih) Output Driving Test (Vol / Voh, Iol / IoH) Dynamic Current Test (Power Consumption) Quiescent Current Test (Standby and Power Down)

34 4DC Parameter Test (Datasheet)

35 4Function Test When the device is actively performing logical functions. Input data is supplied to DUT and output data is read from the DUT to determine the pass/fail results of the test. Configuration Test (registers, state-machine and output configuring and logic functionality) Pattern Test (program/verify or write/read and different patterns test and memory functionality) Sense Amplifier Functionality Test Build-in-Self-Test (BIST and DFT)

36 4AC Parameter Test AC testing is performed by setting up the appropriate timing values (edge placements) and signal formats as defined in the device AC specification and then executing a functional test sequence. Setup Time Hold Time Output Propagation Delay Pulse Width Rising Time Falling Time

37 4AC Parameter Test (Datasheet)

38 4AC Parameter Test (Timing Diagram)

39 -Setup Time Data Input Setup Time Relative to /WE Low to High Transition WE Data In Setup Time

40 - Hold Time Data Input Hold Time Relative to /WE Low to High Transition WE Data In Hold Time

41 - Propagation Delay Output Propagation Delay Relative to Address Valid Time Address Valid Address Data In Valid Data Propagation Delay

42 - Pulse Width/Rise Time/Fall Time WE Pulse Width Data In Rise Time Fall Time

43 - AC Signal Waveform

44 4Reliability Related Test Program Cycling Test Program High Temperature Test Bake Between Test from Step to Step Burn-in Between Test from Step to Step

45 4) Test Methodology & Test Flow 4Test Aspects 4Test Methods 4Block Test Flow 4Test Program Flow 4Software Accomplishment

46 4Test Aspects DC Test & Parametric AC Test & Parametric Functional Programming Test Retention / Endurance Reliability Test Write / Read / Verify Functional Test Mixed Signal Converting Test High Speed I/O Driver Test Check Build-In-Self-Test Frequency / Timing Input and Output Test

47 4Test Methods Understand Device Technology (Memory, SoC or Mixed-Signal, or Logic CPU) Understand Test Specification and Criteria (Datasheet, Design Architecture) Create a Block Test Flow (Test steps of overall) Create a Detail Spec. Test Flow (Program test flow) Program Development -> Program Debugging - > Program Verification Program Delivery to Engineering Test or Production Test

48 4Manufactury Test Flow Wafer Acceptance Testing Final (Package) Testing Design Debug Testing Quality Control Testing Reliability Testing Characterization (Engineering) Testing Wafer Sort Testing Incoming (Inspection) Testing

49 4Production Test Flow Wafer Acceptance Testing Final (Package) Testing Wafer Sort Testing Packaging If Passed Testing Marking And Testing Repair If Failed Testing Quality Control Testing FG or Shipping

50 4Block Test Flow Wafer Sort 1 Bake at High Temp. Wafer Sort 2 Assembly (Package) Final Test 1 Burn-in For Monitor Final Test 2 QA/QC Test

51 4Test Program Flow Continuity Test Program Ptn And Verify AC Parameter Test ICC and Standby Test Configuration Or Logic Test AD/DA Convert Test Bist and Scan Test Program Pattern & ID Verify Pattern & ID

52 4Software Accomplishment Wafersort 1(Chip Probing -1) Test Program Wafersort 2 (Chip Probing -2) Test Program Final Test Program 1 Final Test Program 2 QA/QC Test Program (Qualification check for delivery test)

53 4Summary Testing of complex ICs is responsible for the second highest contribution (after wafer fab.) to the total manufacturing cost of the product. Testing is expensive and will be even more expensive if changes are made. a) Higher integration of circuit (mixed digital and analog signal, Embedded memory) b) High speed signaling (over 500MHz)