TABLE OF CONTENTS III. Section 1. Executive Summary

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1 Section 1. Executive Summary Section 2. Global IC Industry Outlook and Cycles IC Insights' Forecast Methodology Overview Worldwide GDP Electronic System Sales IC Capacity Trends Unit, Dollar Volume, and ASP Data IC Industry Cycle Model IC Insights' Experience The Electronic System/Semiconductor Relationship Semiconductor Content Macroeconomics Worldwide GDP Update U.S. Economy China's Economy Worldwide GDP Growth versus Semiconductor Market Growth The Aftermath of Global Recessions Oil Price Effects PMI Index Worldwide Electronic System Production The Global Semiconductor Market Currency Effects Semiconductor Market History and Forecast IC Industry Cycles Introduction IC Market Forecast Assumptions and Database A Review of the 2010 Assumptions THE MCCLEAN REPORT 2011 III

2 2011 Assumptions IC Industry Forecast Unit, Dollar, and ASP Analysis IC Unit Shipments IC Unit CAGRs IC ASP Analysis Q/4Q IC Market Direction Indicator Quarterly IC Market Figures Market Forecast by Region Overview China IC Production Section 3. Leading IC Suppliers and Foundries IC Suppliers Overview Top Semiconductor Supplier Rankings Top 50 Semiconductor Suppliers Top 50 Fabless IC Suppliers The Increasing Role of the Fabless IC Supplier IC Foundry Industry Analysis Pure-Play/IDM Definitions IC Foundry Forecast Through Foundry Sales Impact IC Foundry Sales Analysis IC Foundry Sales by Company Foundry Sales by Customer Type Foundry Sales by Region Foundry Sales by Application Foundry Sales by Product Type Foundry Revenue per Wafer Foundry Sales by Feature Size IC Foundry Capacity Overview IV THE MCCLEAN REPORT 2011

3 Section 4. Capital Spending and Capacity Semiconductor Industry Capital Spending Outlook Overview Does the 2010 Capital Spending Surge Signal Trouble Ahead? Quarterly Spending Outlook Survey versus Actual Spending Results Semiconductor Capital Spending by Company Capital Spending by Nationality Capital Spending by Product Type Capital Spending Effectiveness Capital Spending Summary IC Industry Capacity Trends Overview IC Units Shipped per Wafer Trends Total IC Industry Capacity Trends Installed Capacity Leaders MOS IC Capacity Forecast by Feature Size IC Capacity by Wafer Size Revenue per Wafer When will the Rebound Occur? Section 5. Market Overview by Device Type Section 6. Memory Overview Section 7. Flash and Non-Volatile Memory Overview Flash Memory Market Flash Memory Applications Flash s Growing Presence in PCs Solid-State Drives Hybrid Flash/Hard-Disk Drives Flash Memory in Cellphones Flash Memory in Handheld Computing Devices THE MCCLEAN REPORT 2011 V

4 EEPROMs EPROMs ROMs Section 8. DRAM and SRAM DRAM Market Review DRAM Unit Shipments DRAM Architectures DRAM Bit Volume SRAM Market Review Section 9. Microcomponent Overview Section 10. MCU and DSP Microcontroller Market Overview Digital Signal Processors Section 11. MPU Microprocessor Market Overview Microprocessors for Personal Computers PC Market Forecast Microprocessor Evolution Tablet Processor Market Remains Wide Open Graphics Section 12. ASIC Introduction ASIC Market Overview ASIC Market Forecast by Product Type ASIC Marketshare by Region MOS Gate Array Market MOS Standard Cell Market MOS PLD Market VI THE MCCLEAN REPORT 2011

5 Section 13. Analog Introduction Analog Market Standard Analog Products Amplifiers and Comparators Interface Circuits Voltage Regulators and References Data Converters Application-Specific Analog Products Consumer Computer Telecom Automotive Industrial/Other Analog Analog Units Applications Trends Low Voltage Analog CMOS Manufacturing on 300mm Wafers Increased Integration Move to Foundry? Section 14. Technology Introduction IC Integration Trends Transistor Count Trends D Integration Chip Size Trends Interconnect and Dielectric Trends Future Interconnects Transistor Scaling Trends Device Feature Size Trends /40nm-Process Volumes Grow While 32/28nm Era Begins THE MCCLEAN REPORT 2011 VII

6 Lithography Trends Memory Cell Technologies Supply Voltage and Power Trends Silicon-on-Insulator (SOI) Strain Engineering Overcoming Scaling s Limits High-K Gate Oxides and Metal Gates Multiple-Gate Transistors Wafer Trends mm Wafer Developments The Future Section 15. Packaging Introduction OSAT Service Providers Unit Shipments by Package Type General Packaging Trends Package Mounting Transitions Through-Silicon Vias (TSVs) Lead Count Trends Lead Spacing Trends Ball Grid Arrays Chip-to-Package Interconnect Trends Chip-Scale Packages Stacked-Chip CSPs Package-On-Package Wafer-Level Packaging Bare Die Assembly Conclusion Section 16. IC Economics Introduction Research and Development Spending VIII THE MCCLEAN REPORT 2011

7 IC Fabrication Facility and Design Cost Trends IC Cost Trends and Models Die Size Wafer Size Total Dice Available per Wafer Defect Density and Yield Die Cost Packaging Cost and Assembly Yield Final Test Cost and Yield Gross Margin and Revenue per Wafer Summary Section 17. Monthly Updates THE MCCLEAN REPORT 2011 IX

8 X THE MCCLEAN REPORT 2011