OCuLink x4 Cable end

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Arabella Wright
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1 PAGE /5 OCuLink x4 Receptacle Connector OCuLink x4 Cable end

2 PAGE 2/5.0 SCOPE This Product Specification covers the performance requirements of the Pitch 0.5mm PCI-e OCuLink Pluggable Connectors 2.0 PRODUCT DESCRIPTION 2. PRODUCT NAME AND SERIES NUMBER(S) PCI-e OCuLink x4 Receptacle R/A SMT with SMT shell Attached JPC DWG No.: SD_P933G042-D PCI-e OCuLink x4 Receptacle R/A SMT with DIP shell Attached JPC DWG No.: SD_P933F042-D PCI-e OCuLink x4 Receptacle VT SMT with SMT shell Attached JPC DWG No.: SD_P93G042-D PCI-e OCuLink x4 Receptacle VT SMT with DIP shell Attached JPC DWG No.: SD_P93F042-D PCI-e OCuLink x4 Receptacle VT SMT with HR-I DIP shell Attached JPC DWG No.: SD_P93C042-D PCI-e OCuLink x4 Receptacle VT SMT with HR-II DIP shell Attached JPC DWG No.: SD_P93D042-D PCI-e OCuLink x4 Receptacle VT SMT with HR-III DIP shell Attached JPC DWG No.: SD_P93E042-D PCI-e OCuLink x8 Receptacle R/A SMT with SMT shell Attached JPC DWG No.: SD_P933G0-D PCI-e OCuLink x8 Receptacle R/A SMT with DIP shell Attached JPC DWG No.: SD_P933F0-D PCI-e OCuLink x8 Receptacle VT SMT with SMT shell Attached JPC DWG No.: SD_P93G0-D PCI-e OCuLink x8 Receptacle VT SMT with DIP shell Attached JPC DWG No.: SD_P93F0-D PCI-e OCuLink x8 Receptacle VT SMT with HR-II DIP shell Attached JPC DWG No.: SD_P93D0-D

3 PAGE 3/5 PCI-e OCuLink x4 cable Straight type and Active Latch JPC DWG No.: Refer to Cable drawing PCI-e OCuLink x4 cable Right Angel type and Active Latch JPC DWG No.: Refer to Cable drawing PCI-e OCuLink x4 cable Left Side type and Active Latch JPC DWG No.: Refer to Cable drawing PCI-e OCuLink x4 cable Straight type and Passive Latch JPC DWG No.: Refer to Cable drawing PCI-e OCuLink x8 cable Straight type and Active Latch JPC DWG No.: Refer to Cable drawing PCI-e OCuLink x8 cable Right Angel type and Active Latch JPC DWG No.: Refer to Cable drawing 2.2 DIMENSIONS,MATERIS,PLATINGS AND MARKING See Customer Drawing for information on dimensions, material, plating and marking

4 PAGE 4/5 3.0 APPLICABLE DOCUMENTS AND SPECIFICATIONS PCIe OCuLink Specification EIA 364 Series: Electrical Connector Test Procedures Including Environmental Classifications with Test Procedures EIA Environmental Test Methodology for Assessing the Performance of Connectors and Sockets Used in Business Office Applications 4.0 QUALIFICATION Laboratory condition and sample selection are in accordance with EIA RATINGS ITEM Voltage Continuous Current Temperature Durability SPEC 30 Volts AC(RMS)/DC Max 0.5 Amps Operating: -25 C to +60 C Non-Operating: - 40 C to +85 C 0.76 um Au-250 Cycles (Internal Application)

5 PAGE 5/5 6.0 PERFORMANCE 6. TEST GROUP - TEMPERATURE LIFE (*Presents :For 0 Years Life Spam Test) Base Line 2 Durability EIA ; perform plug & (precondition) unplug cycles: 50 3 EIA Method A, Test Condition 3, 72 hours at 05 ± Temperature 2 C Life *0 Years Temperature life Test None 432 hours at 5 ±2 C 4 5 Reseating Manually unplug & plug the connector, 3 cycles 6 Note:. Sample size = 25 test points minimum.(e.g. 4x receptacle connector 42 ckt approx. 6pcs)

6 PAGE 6/5 6.2 TEST GROUP 2 -CYCLIC TEMPERATURE & HUMIDITY Base Line 2 Durability EIA ; perform plug & (precondition) unplug cycles: 50 3 Thermal EIA , Method A, test Shock condition I(0 cycles) None 4 EIA Cycle connectors 5 Cyclic Temperature & Humidity between 25º ± 3ºC at 80% RH and 65 º± 3 ºC at 50% RH 24 cycles. Ramp times should be 0.5 hour and dwell should be.0 hour. None 6 7 Reseating Manually unplug & plug the connector, 3 cycles 8

7 PAGE 7/5 6.3 TEST GROUP 3-MECHANICAL SHOCK & VIBRATION Base Line 2 Durability EIA ; perform plug & (precondition) unplug cycles: 50 3 EIA-364-7, Method A, Test Temperature Condition 3 Life 240 hours at 90 ±2 C (precondition (60 C for 5 years) None 4 5 Vibration EIA test condition VII test condition letter D 5 minutes in each of 3 mutually perpendicular directions. Both mating halves rigidly fixed to not contribute to relative motion of one contact against another. <30 mω Δ max (Change from initial baseline contact resistance) Discontinuity < μsec 6

8 PAGE 8/5 6.4TEST GROUP 4 - MIXED FLOWING GAS (*Presents :For 0 Years Life Spam Test) current of 00 ma. Base Line 2 Durability EIA ; perform plug & (precondition) unplug cycles: 50 3 Temperature Life (precondition) EIA-364-7, Method A, Test Condition 3 20 hours at 05 ±2 C None (Conditioning Exposure) 4 current of 00 ma. See note 3 5 Mixed Flowing Gas (*0 Years) EIA ; Class IIA, First Un- 224 Hours; After 2 Hours Total 336 Hours 4 days Un-/ None (Conditioning Exposure) 6 current of 00 ma. Cycle connectors 0 times between 5º ± 3ºC and 85 º± 3 ºC. Ramps 7 Thermal Disturbance should be a minimum of 2 C per minute and dwell times should insure that the contacts reach the temperature extremes for a minimum of 5 minutes. None (Conditioning Exposure) 8 current of 00 ma. See note 3

9 PAGE 9/5 9 Reseating Manually unplug & plug the connector, 3 cycles No vidence of 0 current of 00 ma. Note:. Expose receptacles unmated for 9.34 days (224 hours) of the test duration. Mate the receptacle to the same plug used during preconditioning temperature life. Expose mated plug and receptacle for the remainder of the test duration 4.66 days (2 hours). 2. Characterize porosity & plating thickness before test sequence. 3. Intermediate test values must meet 0 mω max delta at 99% and % of samples shall not exceed 5 mω delta. 6.5TEST GROUP 5 Withstanding Voltage Dielectric EIA ; 500VDC minimum No breakdown or Withstanding applied between adjacent flashover Voltage contacts for minute 2 Base Line () 3 Durability EIA ; (cycles: 50) 4 () 5 Dielectric Withstanding Voltage EIA ; 300VDC minimum applied between adjacent contacts for minute No breakdown or flashover

10 PAGE 0/5 6.6T GROUP 6 - SOLDERABILITY General Examination connector tested Unmated 2 Solder ability EIA Category,no stream RMA class flux Immerse in molten solder at 245 ºC at a rate of 25.4mm per second. Solder Duration:5±0.5 seconds. Unmated 3 SMT See Section 9.0 for JPC Process Connector Only Test Profile Compatibility Unmated Note:. Solderability:4 from each terminal style for each part number. Solderable area shall have a minimum of 95% solder Coverage: when testing 30 random loose contacts. Dimensional: Conformance to Sales Drawing Requirements Visual No Damage 6.7 TEST GROUP 7 Durability EIA ; apply a voltage of No disruptive Dielectric 500 VDC minimum for minute discharge Withstanding between adjacent terminals No leakage current in Voltage and between adjacent excess of 5mA terminals and ground 2 Base Line EIA ; perform plug & 3 Durability unplug cycles: 250 (Internal Application) 0.76 um Au-0,000 Cycles (External Application)

11 PAGE /5 4 5 Dielectric Withstanding Voltage EIA ; apply a voltage of 500 VDC for minute between adjacent terminals and between adjacent terminals and ground. No disruptive discharge No leakage current in excess of 5mA Note:. Separate sets of test specimens will be used to access dielectric withstanding voltage and the change in low level contact resistance. 2. Dielectric withstanding voltage testing will use different contacts than those used for low level contact resistance testing. 7.0 PERFORMANCE (MECHANICAL) 7. TEST GROUP 8 Temperature Measure the temperature rise at the rated current after 96 Rise hours. Temperature Rise: (via current (45 minutes ON and C maximum cycling) minutes OFF). Fixture as required.

12 PAGE 2/5 7.2 TEST GROUP 9 Connector Mate connector at a rate of 25 Mate Forces mm per min. (42 circuit / N MAX circuit) Connector Un-mate Un-mate connector at a rate of 25 mm per min. 2 Forces (42 circuit / 80 circuit) Un-mate 25 N MAX 7.3 TEST GROUP 0 Normal Force Apply a perpendicular force N, (30 grams) MINIMUM normal force 7.4 TEST GROUP Mate plug to connector and X Axis Load apply load on plug 22.5mm (Side) away from Rec. until open 0.4 NM min circuit. 2 Mate plug to connector and Y Axis Load apply load on plug22.5mm (Toward away from Rec. until open Latch) circuit. 0.4 NM min 3 Mate plug to connector and Plug Pullout 30 N minimum apply a right angle pullout force Force Force to overcome on the wire at a rate of 25 mm (Axial) latch per min.

13 PAGE 3/5 7.5 TEST GROUP 2 Base Line 2 Wire Flex EIA test condition II with Tension = 26 N. Flex cables 80 for 20 cycles. No TEST GROUP 3 Cable Pullout Apply an axial load to cable to Force Un- 40N Minimum Keep 0 sec (Axial Load) 8.0 PACKING Refer to Customer Drawing for packing information

14 PAGE 4/5 9.0 OTHER INFOMATION DESCRIPTION Average Ramp Rate Preheat Temperature Preheat Time Ramp to Peak Time over Liquidus(27 ) Peak Temperature Time within 5 of Peak Ramp-Cool Down Time 25 to Peak REQUIREMENT 3 C/sec Max 50 C Min to 200 C Max 60 to 80 sec 3 C/sec Max 60 to 50 sec 260+0/-5 C 20 to 40 sec 6 C/sec Max 8 min Max

15 PAGE 5/5 0.0 MODIFICATION HISTORY Rev. Comments Date Originator Approval 0 Preliminary Draft 03/5/206 Brown 02 Modify Preliminary Draft /5/206 Brown Modify Specification for 0 Year Life spam Inquiry Add IMFG And Temperature Life Hours And Durability 0,000 C/T Test Compliant with SFF-86 & 862 & PCI-SIG & Competitor Spec. Add 6.3 Test Group 3 Mechanical Shock & Vibration Change specimen q ty based on EIA & typo 2/2/206 Aaron 2/28/206 Aaron 02/4/207 Aaron 04/2/207 Jason 07 Specify Oculink 8X products together /28/207 Jason Modify the working temperature 2/4/207 Jason

OSFP Connector Cage & Cable System

PAGE /6 /5/7 UNRESTRICTED OSFP Connector Cage & Cable System PAGE /6 /5/7 UNRESTRICTED.0 SCOPE This Product Specification covers performance, test and quality requirements for the JPC Quad Small Form Factor