High Density HDB 3 /HSB 3 Connectors

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HB 3 /HSB 3 onnectors TBL OF ONTNTS HB 3 and HSB 3 onnectors Table of ontents.............................7 Introduction - Features, Options, Performance... 8, 9 HB 3 HB 3 Mother Board onnector.

1 HB 3 /HSB 3 onnectors TBL OF ONTNTS HB 3 and HSB 3 onnectors Table of ontents Introduction - Features, Options, Performance... 8, 9 HB 3 HB 3 Mother Board onnector... 0 HB 3 aughter Board onnector HB 3 I/O onnector HB 3 Stacker onnector... 3 HSB 3 HSB 3 Mother Board onnector... HSB 3 aughter Board onnector HSB 3 rrangements Recommended Board Layout - HSB 3 aughter Board... 7 Recommended Board Layout - HSB 3 Mother Board...8 Hardware for both HB 3 and HSB 3 onnectors LRM HB 3 Typical and HSB Markets: 3 Typical Markets: Military Transportation & ommercial viation UVs ISR Military Medical Vehicles quipment Naval Space Missiles/Ordnance Military & ommercial vionics High Radar efinition ameras ISR ontact for more information at

Staggered/ GN-X Hybrids - Fiber Optics/ /RF/Power Options/ ccessories VMx / HSB3 HB3 Hybrids - Signal/Power/ oax/fiber Optics

00 inch) Staggered Grid Spacing This new connector series of brush connectors incorporates a higher density contact pattern

HB 3 connectors utilize the same durable and reliable B 3 brush contact in a tighter.070 X.00 staggered grid pattern.

Provides the durability and performance of the contact Low cost HB 3 Stacker MPHNOL HB 3 OMPR TO OMPTITION onnector Features

INTROUTION: FTURS & OPTIONS Hypertronics HPH HB 3 Stacker for pplications that Need or emand Parallel Boards irborn RM ontact

07.07 X.070 aughter Board.070 X.00.07 X.00.07 X.00 onnector Width.3.00 Mated Height, MB to th row of B.80.98.

bundled together to form brush-like contacts. See Technology section of this catalog for further description.

2 Staggered/ GN-X Hybrids - Fiber Optics/ /RF/Power Options/ ccessories VMx / HSB3 HB3 Hybrids - Signal/Power/ oax/fiber Optics ocking onn./ ccessories/install. New/Featured Product s HB 3 Series with Tighter (.070 inch X.00 inch) Staggered Grid Spacing This new connector series of brush connectors incorporates a higher density contact pattern and lower mated height than s standard low mating force rectangular connectors. HB 3 connectors utilize the same durable and reliable B 3 brush contact in a tighter.070 X.00 staggered grid pattern. HB 3 dvantages over ompetitive onnectors: Higher density contact pattern Uses less board space llows for shorter mated height Provides the durability and performance of the contact Low cost HB 3 Stacker MPHNOL HB 3 OMPR TO OMPTITION onnector Features HB 3 aughter Board/Mother Board HB 3 aughter Board onnector HB 3 Mother Board onnector HB3 HB 3 and HSB 3 onnectors INTROUTION: FTURS & OPTIONS Hypertronics HPH HB 3 Stacker for pplications that Need or emand Parallel Boards irborn RM ontact System Hyperoloid Pin & Socket urability, Mating ycles 00,0000, ontact Mating Forces (ounces)... Mother Board.070 X X X.070 aughter Board.070 X X X.00 onnector Width.3.00 Mated Height, MB to th row of B HIGH NSITY STYLS MPHNOL S BRUSH ONTT - TH SUPRIOR HOI FOR BOR LVL INTRONNTS Multiple strands of high tensile strength wire bundled together to form brush-like contacts. See Technology section of this catalog for further description. HB 3 I/O onnector HSB 3 High Speed HSB 3 High Speed onnectors are apable of 3. Gbps BRUSH ONTT ONVNTIONL PIN N SOKT RIMP ONTT HB 3 I/O onnector HB 3 Mother Board onnector HB 3 Mother Board onnector 8 ontact for more information at

HB 3 and HSB 3 onnectors INTROUTION: FTURS & PRFORMN HB 3 0 pin Mother Board and aughter Board HB 3 & HSB 3 HIGH NSITY ONNTOR PRFORMN: urability 00,000 mating cycles Insertion/xtraction Force:.

0 hertz, rms @ Sea Level, 0 volts, 0 hertz, rms @ 70,000 feet elevation Solderability: MIL-ST-0, Method 08 Salt Fog: 8 Hours IW MIL-ST-3, method 00, test condition B Humidity: IW MIL-ST-3, method 00,

00,test condition G ata Rate (HSB 3 ): apable of 3.

SMPM RF contacts can be supplied by SV Microwave. Phone: -80-800 Website: www.svmicrowave.

3 HB 3 and HSB 3 onnectors INTROUTION: FTURS & PRFORMN HB 3 0 pin Mother Board and aughter Board HB 3 & HSB 3 HIGH NSITY ONNTOR PRFORMN: urability 00,000 mating cycles Insertion/xtraction Force:. ounce typical per contact Operating Temperature: - to urrent Rating: amperes Hot swap ampere maximum (load dependent) Insulation Resistance: gigaohms minimum ielectric Withstanding Voltage: 70 volts, 0 hertz, Sea Level, 0 volts, 0 hertz, 70,000 feet elevation Solderability: MIL-ST-0, Method 08 Salt Fog: 8 Hours IW MIL-ST-3, method 00, test condition B Humidity: IW MIL-ST-3, method 00, type II Vibration: hours in each of 3 mutually perpendicular axes IW MIL ST-3, method 00, test condition V, letter H Shock: shock along each of three mutually perpendicular axes IW MIL-ST-3, method 00,test condition G ata Rate (HSB 3 ): apable of 3. Gbps (consult for arrangement) USTOM SIGN VILBILITY: HSB 3 Hybrid onnector with Metal Shell and RF ontacts supplied by SV Microwave* * See more information on SMPM RF contacts in Section, page. SMPM RF contacts can be supplied by SV Microwave. Phone: Website: HB 3 Mother Board and aughter Board Mated HB 3 & HSB 3 HIGH NSITY ONNTOR FTURS: Polarization: Keying: Guide Pins shaped design Optional keys offer 3 unique keying combinations Optional guide pins provide additional alignment Radial Misalignment: apable of correcting up to a 00 initial radial misalignment ngular Misalignment: apable of mating with up to a initial angular misalignment MTRILS: Insulator: Liquid crystal polymer, 30% glass filled ontact: Wire: Beryllium copper per STM B97; finish is gold per STM B88 over nickel per MS-QQ-N-90 Holder: Brass similar to UNS 3300; available finishes include gold per MIL-G-0, tin-lead per MIL-P- 878 or tin per MIL-T-077 (RoHS ompliant) Sleeve: Stainless steel per MS-, passivated IW QQ-P-3 (aughterboard, I/O and Stacker connector) Staggered/ Hybrids - Fiber Optics/ Options/ GN-X /RF/Power ccessories VM x/ HB3 HSB3 Hybrids - Signal/Power/ ocking onn./ oax/fiber Optics ccessories/install. ontact for more information at

HB 3 Mother Board onnector IMNSIONL RWING & HOW TO ORR Staggered/ GN-X Hybrids - Fiber Optics/ /RF/Power Options/ ccessories VMx / HB 3 MOTHR BOR - HOW TO ORR Mates with: aughter Board I/O Stacker.

00000 u Min. thick over Nickel.. 3.... Number of Wire Termination ontact Termination Less Hardware ontacts Plating Finish (Purchased separately see pg XX for hardware options) HB-M -00 M X.33 MX..0 ±.

4 HB 3 Mother Board onnector IMNSIONL RWING & HOW TO ORR Staggered/ GN-X Hybrids - Fiber Optics/ /RF/Power Options/ ccessories VMx / HB 3 MOTHR BOR - HOW TO ORR Mates with: aughter Board I/O Stacker. onnector Type HB-M esignates HB 3 Mother Board. Number of ontacts Number of ontacts Wire Plating M u Min. thick over Nickel u Min. thick over Nickel Number of Wire Termination ontact Termination Less Hardware ontacts Plating Finish (Purchased separately see pg XX for hardware options) HB-M -00 M X.33 MX..0 ±.00 ±.00 Mother Board 3 aughter Board.08 MIN. I. THRU HOL (US NO. SRW) PIN HSB3 HB3 Hybrids - Signal/Power/ oax/fiber Optics ocking onn./ ccessories/install.. Termination Type Stickout (im. ) PB, Straight,.0 ia PB, Straight,.0 ia 0.0 PB, Straight,.0 ia 0.80 PB, Straight,.0 ia PB, Straight,.0 ia ontact Termination Finish Gold plated in accordance with MIL-G-0, Type II, Min. thick Gold over Min. thick Nickel Tin plated in accordance with STM B,.0000 Min. thick Matte Tin over.0000 Min. thick Nickel Tin-Lead plated in accordance with S-MS-P-878,.0000 Min. thick Tin-Lead over.0000 Min. thick opper.0 ±.00. Hardware X Less Hardware Hardware is purchased separately (see page 9 for hardware options) B F.9 MIN. HX.070 MIN P (US 3/ HX H) Mother Board Layout.0.0 ± M FINISH HOL SIZ PR USTOMR STNRS FOR.0 PB TIL 0 ontact for more information at

5 HB 3 aughter Board onnector IMNSIONL RWING & HOW TO ORR HB 3 UGHTR BOR - HOW TO ORR Mates with: Mother Board. Number of ontacts Number of ontacts Number of Wire Termination ontact Termination ontacts Plating Finish Less Hardware (Purchased separately see pg X for hardware options). onnector Type HB- HB- 00 M 0 X esignates HB 3 aughter Board ±.00 TYP PIN MIN. I. THRU HOL (US NO. SRW) Staggered/ Hybrids - Fiber Optics/ Options/ GN-X /RF/Power ccessories 3. Wire Plating M u Min. thick over Nickel u Min. thick over Nickel. Termination Type Stickout (im. ) 0 PB, Right ngle,.0 ia PB, Right ngle,.0 ia PB, Right ngle,.0 ia PB, Right ngle,.0 ia PB, Right ngle,.0 ia ontact Termination Finish Gold plated in accordance with MIL-G-0, Type II, Min. thick Gold over Min. thick Nickel Tin plated in accordance with STM B,.0000 Min. thick Matte Tin over.0000 Min. thick Nickel Tin-Lead plated in accordance with S-MS-P-878,.0000 Min. thick Tin-Lead over.0000 Min. thick opper aughter Board Layout.0 ± M.00 ORGNIZR (TO MINTIN PIN LIGNMNT URING USTOMR INSTLLTION). Hardware X Less Hardware Hardware is purchased separately (see page 9 for hardware options)..0 F B ONNTOR MOUNTING SURF ±.00 TYP Mated Height s UGHTR BOR ONNTOR UGHTR BOR VM x/ HB3 HSB3 Hybrids - Signal/Power/ ocking onn./ oax/fiber Optics ccessories/install. BOR G.03 FINISH HOL SIZ PR USTOMR STNRS FOR.0 PB TIL MOTHR BOR MOTHR BOR ONNTOR ontact for more information at

HB 3 I/O onnector IMNSIONL RWING & HOW TO ORR Staggered/ GN-X Hybrids - Fiber Optics/ /RF/Power Options/ ccessories VMx / HSB3 HB3 Hybrids - Signal/Power/ oax/fiber Optics ocking onn.

Number of ontacts Number of ontacts 3. Wire Plating M 00.37.07 00.7. 080.07.77 0.77.7 0 3.7 3.7 0.00000 u Min. thick over Nickel

6 HB 3 I/O onnector IMNSIONL RWING & HOW TO ORR Staggered/ GN-X Hybrids - Fiber Optics/ /RF/Power Options/ ccessories VMx / HSB3 HB3 Hybrids - Signal/Power/ oax/fiber Optics ocking onn./ ccessories/install. HB 3 I/O PPLITIONS able to board applications rimp termination Uses wire well size HB 3 I/O - HOW TO ORR Mates with: Mother Board. onnector Type HB- esignates HB 3 I/O onnector. Number of ontacts Number of ontacts 3. Wire Plating M u Min. thick over Nickel u Min. thick over Nickel. ontact Termination Finish Gold plated in accordance with MIL-G-0, Type II, Min. thick Gold over Min. thick Nickel MTING MOTHR BOR ONNTOR Number of ontacts Wire Plating Mother Board ontact Termination Finish HB- -0 SSMBL INPUT/OUTPUT ONNTOR MTING SURF PIN FRONT HLF INPUT/OUTPUT ONNTOR RR HLF INPUT/OUTPUT ONNTOR I/O onnector -Piece onstruction - THR LOKING SRW SUPPLI THR BOSS ( RQUIR FOR MOTHR BOR ONNTOR S HRWR ON PG 0) XPLO ISOMTRI VIW RMOVBL RIMP ONTTS FOR SIZ THRU 8 GG WIR LOKING SRWS SUPPLI ontact for more information at

7 HB 3 Stacker onnector IMNSIONL RWING & HOW TO ORR HB 3 STKR PPLITIONS For applications that need or demand parallel boards HB 3 STKR - HOW TO ORR Mates with: Mother Board. onnector Type HB-S esignates HB 3 Stacker onnector. Number of ontacts Number iff Signals Number of ontacts Number of ontacts Stacker onnector Wire Plating Termination ontact Termination Finish Less Hardware (Purchased separately see pg XX for hardware options) HB-S 0 X PIN Mother Board MTING SURF Staggered/ Hybrids - Fiber Optics/ Options/ GN-X /RF/Power ccessories VM x/ 3. Wire Plating M u Min. thick over Nickel u Min. thick over Nickel. Termination HB3 HSB3. ontact Termination Finish Type Stickout (im. ) PB, Straight,.0 ia PB, Straight,.0 ia 0.0 PB, Straight,.0 ia PB, Straight,.0 ia Gold plated in accordance with MIL-G-0, Type II, Min. thick Gold over Min. thick Nickel. Hardware X Less Hardware Hardware is purchased separately (see page 9 for hardware options). STIKOUT.3 MX Hybrids - Signal/Power/ ocking onn./ oax/fiber Optics ccessories/install. XPLO ISOMTRI VIW HB3 STKR ONNTOR STNR HB3 MB ONNTOR WITH OPTIONL GUI PINS STNR HB3 MB SHOWN WITH OPTIONL LOKING GUI PINS ontact for more information at

& High Speed HSB 3 Mother Board onnector IMNSIONL RWING & HOW TO ORR Staggered/ GN-X Hybrids - Fiber Optics/ /RF/Power Options/ ccessories VMx / HSB3 HB3 HSB 3 - HIGH SP SRIS 3.

8 & High Speed HSB 3 Mother Board onnector IMNSIONL RWING & HOW TO ORR Staggered/ GN-X Hybrids - Fiber Optics/ /RF/Power Options/ ccessories VMx / HSB3 HB3 HSB 3 - HIGH SP SRIS 3. GBS High speed configuration available that allows data rates up to 3. Gb/s via 00 ohm matched impedance differential pairs. Partially populated standard HB 3 mother board and daugher board bodies ontact an sales engineer for validation results HSB 3 HIGH SP MOTHR BOR - HOW TO ORR Mates with: High Speed aughter Board. onnector Type HSB-M esignates High Speed HB 3 I/O onnector. Number of ontacts Number ifferential Pairs No. Low Speed Signals ifferential Signal ontact Number of ifferential Wire Termination Termination ifferential Pairs Signal Plating Finish HSB-M -03 M X 3 PIN MTING INTRF Less Hardware (Purchased separately see pg XX for hardware options) ONNTOR MOUNTING SURF Hybrids - Signal/Power/ oax/fiber Optics ocking onn./ ccessories/install.. Wire Plating M u Min. thick over Nickel u Min. thick over Nickel. Termination. ontact Termination Finish Type Stickout (im. ) PB, Straight,.0 ia PB, Straight,.0 ia 0.0 PB, Straight,.0 ia 0.80 PB, Straight,.0 ia PB, Straight,.0 ia Gold plated in accordance with MIL-G-0, Type II, Min. thick Gold over Min. thick Nickel Tin plated in accordance with STM B,.0000 Min. thick Matte Tin over.0000 Min. thick Nickel Tin-Lead plated in accordance with S-MS-P-878,.0000 Min. thick Tin-Lead over.0000 Min. thick opper 7. Hardware B X Less Hardware Hardware is purchased separately (see page 9 for hardware options). F SHOWN WITH OPTIONL GUI PIN.33 MX ontact for more information at

9 & High Speed HSB 3 aughter Board onnector IMNSIONL RWING & HOW TO ORR HSB 3 HIGH SP UGHTR BOR - HOW TO ORR Mates with: High Speed Mother Board onnector Type HSB- esignates High Speed HSB 3 aughter Board. Number of ontacts Number iff Pairs No. Low Speed Signals. Wire Plating M ifferential Signals u Min. thick over Nickel u Min. thick over Nickel. Termination Type Stickout (im. ) 0 PB, Right ngle,.0 ia PB, Right ngle,.0 ia PB, Right ngle,.0 ia PB, Right ngle,.0 ia PB, Right ngle,.0 ia ontact Termination Finish Gold plated in accordance with MIL-G-0, Type II, Min. thick Gold over Min. thick Nickel Tin plated in accordance with STM B,.0000 Min. thick Matte Tin over.0000 Min. thick Nickel Tin-Lead plated in accordance with S-MS-P-878,.0000 Min. thick Tin-Lead over.0000 Min. thick opper Number of ifferential Pairs ifferential Signals Wire Plating Termination ontact Termination Finish Less Hardware (Purchased separately see pg 0 for hardware options) HSB- 03 M 0 X PIN ORGNIZR (TO I IN PIN LIGNMNT) ±.00 TYP 7. Hardware MPTY VITIS X Less Hardware Hardware is purchased separately (see page 9 for hardware options). 3 F B ONNTOR MOUNTING SURF ±.00 TYP MIN. I. THRU HOL (US NO. SRW) Staggered/ Hybrids - Fiber Optics/ Options/ GN-X /RF/Power ccessories VM x/ HB3 HSB3 Hybrids - Signal/Power/ ocking onn./ oax/fiber Optics ccessories/install. ontact for more information at

10 & High Speed HSB 3 RRNGMNTS F F Staggered/ GN-X Hybrids - Fiber Optics/ /RF/Power Options/ ccessories 3 B 0 Pin Body with 3 ifferential Pair, 0 Signal ontacts 3 3 B 0 Pin Body with ifferential Pair, 30 Signal ontacts F B VMx / 80 Pin Body with 7 ifferential Pair, 0 Signal ontacts HSB3 HB3 Hybrids - Signal/Power/ oax/fiber Optics ocking onn./ ccessories/install. 3 F B 3 0 Pin Body with 0 ifferential Pair, 0 Signal ontacts 0 Pin Body with 3 ifferential Pair, 80 Signal ontacts F B s viewed from front of daughter board connector KY 00 Ohm ifferential Pair ontacts (00 Ohm ifferential contact pairs capable of 3. Gb/s data rates) mpty ontact avity igital, Low Speed Signal ontacts ontact for more information at

11 & High Speed HSB 3 ROMMN BOR LYOUT - HSB 3 UGHTR BOR HSB 3 UGHTR BOR Ø.0 ±.00 PLS NON-PLT THRU HOL TYPIL Ø MX FINISH HOL SIZ PR USTOMR STNRS FOR Ø.0 PB TIL IFFRNTIL PIR.0 PLS SPING.0.0 BOR G.00. Staggered/ Hybrids - Fiber Optics/ Options/ GN-X /RF/Power ccessories MX VM x/ BOR G IFFRNTIL PIR.0 Places.7.77 HB3 HSB MX MX 7 IFFRNTIL PIR.7.0 Places.0 BOR G BOR G Hybrids - Signal/Power/ ocking onn./ oax/fiber Optics ccessories/install. 0 IFFRNTIL PIR Places MX 3 IFFRNTIL PIR.0 Places.7 BOR G ontact for more information at

12 & High Speed HSB 3 ROMMN BOR LYOUT - HSB 3 MOTHR BOR HSB 3 MOTHR BOR.07 Staggered/ GN-X Hybrids - Fiber Optics/ /RF/Power Options/ ccessories SPING PLS 3 IFFRNTIL PIR. FINISH HOL SIZ PR USTOMR STNRS FOR Ø.0 PB TIL Ø.0 ±.00 PLS Ø.00 HSB3 HB3 Hybrids - Signal/Power/ oax/fiber Optics ocking onn./ ccessories/install. VMx /.7.0 places IFFRNTIL PIR PLS IFFRNTIL PIR places 7 IFFRNTIL PIR.7.0 PLS 3 IFFRNTIL PIR 8 ontact for more information at

13 & High Speed HB 3 & HSB 3 HRWR FOR BOTH HB 3 N HSB 3 HRWR FOR LL ONFIGURTIONS (Sold Separately) MOTHR BOR PRT NUMBR TYP STIKOUT HB POLRIZTION KY (QTY ) 0.0 HB POLRIZTION KY (QTY ) 0.00 HB POLRIZTION KY (QTY ) 0.70 HB GUI PIN (QTY ) 0.0 HB GUI PIN (QTY ) 0.00 HB GUI PIN (QTY ) 0.70 HB THR BOSS (QTY )* 0.0 HB THR BOSS (QTY )* 0.00 HB THR BOSS (QTY )* 0.70 HB LOKING GUI PIN (QTY ) 0.0 HB LOKING GUI PIN (QTY ) 0.00 HB LOKING GUI PIN (QTY ) 0.70 * Required with Mother Board only when mating to I/O onnector UGHTR BOR PRT NUMBR TYP HB POLRIZTION KY (QTY ) HB LOW PROFIL MOUNTING NUT (QTY ) ccepts I/O onnector Jack Screw Shown with Mother Board onnector on page X Staggered/ Hybrids - Fiber Optics/ Options/ GN-X /RF/Power ccessories VM x/ HB3 HSB3 XPLO ISOMTRI VIW UGHTR BOR ONNTOR SSMBLY MOTHR BOR ONNTOR GUI PIN (OPTIONL) MOTHR BOR ONNTOR SSMBLY NOT INLU XPLO ISOMTRI VIW SHOWN WITH OPTIONL GUI PIN POLRIZTION KYS (OPTIONL) XPLO ISOMTRI VIW SHOWN WITH OPTIONL KYING LOW PROFIL MOUNTING NUT (OPTIONL) Hybrids - Signal/Power/ ocking onn./ oax/fiber Optics ccessories/install. XPLO ISOMTRI VIW SHOWN WITH OPTIONL LOW PROFIL MOUNTING NUT - SRW N WSHR PLS (NOT SUPPLI) ontact for more information at

Amphenol High Density HDB 3 /HSB 3 Connectors

Amphenol High Density HDB 3 /HSB 3 Connectors Amphenol HDB 3 /HSB 3 Connectors TABLE OF CONTENTS Amphenol HDB 3 and HSB Connectors 3 Table of Contents..............................45 Introduction - Features, Options, Performance...............................