Commercial Connector Catalog

Transcription

1 ommercial onnector atalog

2 Delphi onnection Systems is a global leader as a connection system provider. We offer full-service integration designing, engineering and manufacturing a comprehensive line of innovative electronic connection products and systems. 2. Delphi onnection Systems

3 The Power to onnect Technology comprehensive portfolio of commercial connectors to link your world lthough you may know Delphi as an automotive interconnect supplier, we also serve a broad range of commercial markets. Our Military, erospace and ommercial group functions like an entrepreneurial start-up within a Fortune 500 company. This makes us small enough to address custom requirements, and big enough to manufacture products anywhere in the world. When it comes to meeting your specific needs for connector technologies, we provide advanced products with dedicated experts who are committed to helping you succeed. ontents Product pplications Overview I/O Systems Sockets t Delphi, we know our customers want technologies to address their specific connection system requirements. That s where Delphi s experience, knowledge and innovation make an important difference. Our history goes back more than 100 years. We ve created many industry firsts along the way and we are continuing to develop leading-edge technologies. With a strong global presence, we re poised to follow you oard-to-oard ackplane Pin & Socket Energy Products Product Index anywhere, anytime with the depth, breadth, strength and global resources start-ups can only dream of. We re the best-kept secret in the connection business and we re ready to be your secret weapon. Our goal is simple; we want to be your best connection systems supplier. P roduct pplications Delphi s line of commercial connectors covers a breadth of markets including computer, telecom, medical and consumer applications. Our components are designed into diverse products ranging from portable music players and PDs, to computers, network hubs and patient monitoring systems. With our ever expanding product selection, comprehensive service and global logistical support, we re the right link for your connection system requirements. ommercial onnector atalog 3.

4 Product pplications OMPUTER I/O Products Socket Products oard-to-oard Products ackplane Products Pin & Socket Products Energy Products T drive arrays lade servers Desktop computers External storage devices File servers Host uss dapter cards (Hs) Industrial controllers Internal and external disk drives Typical pplications Keypads, keyboards Laptop and notebook computers Modem cards Networked ttached Storage (NS) P-to-P Interconnections PI Express and GP video cards Printers Scanners Servers Storage arrays (RIDs) Workstations ONSUMER ellular & mobile phones ompact peripherals onsumer devices Digital cameras This Product pplications chart is a quick reference guide. ommercial connectors within this catalog may offer other product applications that extend beyond the general categories listed above. more complete listing of typical applications may be present on individual product pages within this catalog. For additional product information and application support, please contact your local Delphi onnection Systems' sales representative or contact us directly at [1] , or visit our website at 4. Delphi onnection Systems

5 Product pplications ONSUMER I/O Products Socket Products oard-to-oard Products ackplane Products Pin & Socket Products Energy Products Digital video systems Handheld electronics Handheld scanners Handsets High end audio products Office automation PDs Pocket pagers Typical pplications Portable music recorders/players Set top boxes Wireless mobile electronics devices MEDIL Diagnostic ultrasound equipment Hand held data collection Medical instruments and monitoring equipment TELEOM ompactpi, backplanes and daughter cards ompactpi, P3 & VME64 P0 models Futurebus backplanes and daughter cards Instrumentation Network Hubs P-to-P interconnections Routers Switches ommercial onnector atalog 5.

6 I/O Systems Delphi can provide I/O technologies, no matter what the challenge may be. Delphi s I/O connectors and cable assemblies are ideal for applications that require small, lightweight interfaces such as computers, digital equipment, networking hubs and routers, as well as medical data collection devices. 6. Delphi onnection Systems

7 Meeting the Diverse Demands of I/O I/O Systems onnection Technology Delphi onnection Systems offers a wide range of the latest input/output (I/O) interfaces for digital and analog based systems. Utilizing these standards offers a great method for various devices to communicate with each other. ontents Our I/O product line includes IEEE 1394, US 2.0, Mini US, Mini DIN, Serial T onnectors and able ssemblies, SSI Type onnectors, as well as the popular RJ-11 and RJ-45 Modular Jacks. Intro IEEE 1394 Serial us onnectors IEEE 1394 able ssemblies ompatible Systems Our industry standard connectors are offered in a wide range of mounting styles which allows them to be flexible and compatible with many of today s products, while meeting the electrical demands of higher speed peripherals. We cover interface options for TX, US 2.0, US OTG (On-The-Go), i.link, FireWire, and SSI. Flexible Systems Depending on the I/O product line, a variety of options are offered including: Through hole and SMT with straight, right angle or vertical connector mountings Standard and custom cable lengths Standard and low profile heights US 2.0 onnectors Mini US onnectors Mini US able ssemblies Lighted US able ssemblies Serial T (ST) oard onnectors Serial T (ST) able ssemblies Mini DIN Stacked onnectors RJ-11 Modular Telephone Jacks RJ-45 Modular Right ngle Jacks SSI Type onnectors Gold plating options for high cycle life versions Typical pplications: omputing Products: T drive arrays lade servers Desktop and notebook computers External storage devices Internal and external disk drives File servers Host uss dapter cards (Hs) Modem cards Networked ttached Storage (NS) Printers and scanners Stand-alone servers Storage arrays (RIDs) onsumer Devices: Digital cameras Digital video systems High end audio products PDs, cell phones Portable music recorders/players Telecom Devices: Network hubs Routers Switches Tape storage systems Medical Devices: Diagnostic ultrasound equipment Hand held data collection Patient monitoring systems ommercial onnector atalog 7.

8 I/O Systems IEEE 1394 Serial us Description: oard mount connectors for IEEE 1394 (also called FireWire and i.link ) serial bus interface provides easy-to-use, high bandwidth cable connections for both audio and video signals. Typical pplications: Desktop and notebook computers Digital video systems High end audio products Portable music recorders/players enefits/features: Industry Standard Meets 1394 Trade ssociation Document : 1394 onnector and able ompliant Testing riteria 1.0 requirements for both 4 and 6 position connectors. Flexible System oth 4 Pin (i.link) and 6 Pin (FireWire) parts are available Through hole and SMT mounting styles are available llows for hot plugging of multiple devices. Ruggedness and Reliability... Full metal shields help protect contacts from physical and ESD (Electro Static Discharge) damage High cycle life versions are available. Selectable Features: Other Properties: Product Type IEEE 1394 serial bus systems Packaging Type Tray Total No. of Positions 4 Pin or 6 Pin Housing Material Nylon GF enterline Spacing 4 Pin: 0.80 mm [.031 in.] 6 Pin: 2.00 mm [.079 in.] pplicable Soldering Process ontact ase Material IR, vapor phase, wave 4 Pin: phosphor bronze, 6 Pin: brass Orientation Vertical or horizontal Insulation Resistance 100 MΩ initial Mounting Style DIP or SMT Withstanding Voltage 4 Pin: 100 V RMS, 6 Pin: 500 V RMS Voltage P Thickness ontact Style ontact rea Plating Height bove oard Shield Material (4 Pin) 30 VD (power pins), 5 VD signal TH: 1.57 mm [.062 in.], SMT: N/ Formed Gold plated (see product print for thickness) 4 Pin: 5.9 mm [0.23 in.] 6 Pin R/: 8.5 mm [0.33 in.] Front: steel, tin plated or nickel plated Rear: brass alloy, nickel plated urrent Rating ontact Resistance Voltage Rating Temperature Range Normal Force ontact Retention Force Durability (Mating ycles) 4 Pin: 0.5 amp max. per contact 6 Pin: 1.0 amp max. per contact Terminal: 30 mω, Shell: 50 mω 40 V -25 to g min. (controlled by cable connector) 8.9 N [2 lbf] min. 4 Pin: 1000 cycles, 6 Pin: 1500 cycles Shield Material (6 Pin) rass alloy, tin plated or nickel plated Mating Force 39.2 N [8.81 lbf] max. Spring Shield (6 Pin) Stainless steel Unmating Force 4 Pin: 4.9 N [1.10 lbf] min., 6 Pin: 9.8 N [2.20 lbf] min. Housing olor lack Plating (ontact rea) Plating (Soldering End) Gold (thickness varies per Delphi spec.) over nickel underplating 3.81 µm [150 µin.] tin-lead over nickel underplating Underplating 2.54 µm [100 µin.] nickel Standards IEEE Specification; 1394 Trade ssociation Document : "1394 able and onnector ompliant Testing riteria 1.0" pprovals and ertification UL approved 8. Delphi onnection Systems

9 I/O Systems IEEE 1394 Serial us 4 Pin Right ngle Solder Type Ordering Nomenclature Pin: R/, Solder Pin Right ngle Surface Mount Type 6 Pin: R/, SMT Vertical Solder ontact Plating Thickness: 1 = Gold Flash 2 = µm [15 µin.] 3 = µm [30 µin.] (standard) 6 Pin Vertical Solder Type Unless otherwise specified, dimensions are shown in millimeters and [inches]. ommercial onnector atalog 9.

10 I/O Systems IEEE 1394 able ssemblies Description: able assemblies for IEEE 1394 (also called FireWire and i.link ) serial bus interface was developed to provide a high bandwidth protocol capable of transporting both audio and video signals. Typical pplications: Desktop and notebook computers Digital video systems Portable music recorders/players External storage devices High end audio products enefits/features: Industry Standard.. Meets 1394 Trade ssociation Document : 1394 onnector and able ompliant Testing riteria 1.0 requirements for both 6 and 4 position connectors. Flexible System.... Various interface options: FireWire 6 position to 6 position, FireWire 6 position to i.link 4 position, i.link 4 position to 4 position. Translucent braided cables and overmolds in several colors are available. Hot pluggable to 1394 qualified devices. Ruggedness Full metal shields help protect contacts from physical and ESD (Electro Static Discharge) damage. Reliability High cycle life versions are available. Selectable Features: Other Properties: Product Type IEEE 1394 serial bus cable assemblies Product Tradename i.link, FireWire pplication Wire-to-board Total No. of Positions 4/4, 6/4, 6/6 enterline Spacing Operating Voltage Insertion Style 0.80 mm [.031 in.] 2.00 mm [.079 in.] 30 VD (power pins) 5 VD (signal) able Packaging Type Housing Material (Plug) Overmold Material (Plug) able Jacket ontact ase Material Shell ase Material Insulation Resistance Withstanding Voltage Polybag PT, UL94V-0 PV PV opper alloy 4P: opper alloy 6P: Steel 100 MΩ initial 4P: 100 V RMS 6P: 500 V RMS Mating Force Unmating Force Plating (ontact rea) Plating (Soldering End) Underplating Impedance Differential 4P: 39.0 N [8.77 lbf] max. 6P: 39.2 N [8.81 lbf] max. 4P: 4.9 N [1.10 lbf] min. 6P: 9.8 N [2.20 lbf] min. Gold (thickness varies per Delphi spec.) over nickel underplating 2.54 µm [100 µin.] tin-lead min. over nickel underplating 1.27 µm [50 µin.] nickel min. 110±6 Ω ontact Style ontact rea Plating (Plug) Shell Plating (4P Plug) Length able Diameter Wire Size Formed Gold plated (see product print for thickness) 4P: Nickel plated (front) Tin plated (rear) 6P: Tin plated 1 m, 1.8 m, 3 m 5.0 mm, 4.8 mm, 6.1 mm 4/4: 30 WG 6/4: 30 WG 6/6: 28/22 WG urrent Rating ontact Resistance (Plug) ontact Resistance (able) Voltage Rating Temperature Range Normal Force 4P: 0.5 amp max., per contact 6P: 1.0 amp max., per contact 30 mω (terminal) 50 mω (shell) 2 Ω max. 40 V -25 to g min. (controlled by cable connector) ttenuation Propagation Delay rosstalk Delay Skew Standards MHz max MHz max MHz max ns/m max. < -26 d (1 MHz 75 MHz) 0.4 ns max. IEEE Specification; 1394 Trade ssociation Document : "1394 able and onnector ompliant Testing riteria 1.0" Housing olor (Plug) lack ontact Retention Force 8.9 N [2 lbf] min. pprovals and ertification UL approved Overmold olor (Plug) able Jacket olor Gray Gray Durability (Mating ycles) 4P: 1000 cycles 6P: 1500 cycles 10. Delphi onnection Systems

11 I/O Systems IEEE 1394 able ssemblies Ordering Nomenclature /4 Type /4 Type /6 Type able Options: 4/4, 6/4: 1 = 1000 ±30 [39.37 ±1.18] long and 5.0 ±0.2 [.20 ±.01] dia. 2 = 1800 ±50 [70.87 ±1.97] long and 4.8 ±0.2 [.19 ±.01] dia. 3 = 3000 ±50 [ ±1.97] long and 4.8 ±0.2 [.19 ±.01] dia. 6/6: 1 = 1000 ±30 [39.37 ±1.18] long and 6.1 ±0.2 [.24 ±.01] dia. 2 = 1800 ±50 [70.87 ±1.97] long and 6.0 ±0.2 [.24 ±.01] dia. 3 = 3000 ±50 [ ±1.97] long and 6.0 ±0.2 [.24 ±.01] dia. 4/4 Type /4 Type /6 Type Unless otherwise specified, dimensions are shown in millimeters and [inches]. ommercial onnector atalog 11.

12 I/O Systems US 2.0 onnectors Description: oard mount I/O connectors for the industry standard US (Universal Serial us) interface used to connect peripheral devices to computers. US 2.0 is backwards compatible with today s products, while also meeting the electrical requirements for higher speed US 2.0 peripherals. Typical pplications: Desktop and notebook computers Printers and scanners Portable music recorders/players External disk drives enefits/features: Industry Standard Meets the speed requirements of US 2.0. ompatible with US 1.1 devices. Flexible System Operates at 1.5 Mb/s, 12 Mb/s, and 480 Mb/s. Through hole and SMT mounting styles are available. llows for hot plugging of multiple devices. Ruggedness and Reliability.. Full metal shields help protect contacts from physical and ESD (Electro Static Discharge) damage. Standard product is rated for 1500 cycles. Selectable Features: Other Properties: Product Type Total No. of Positions enterline Spacing US 2.0 Series "" and "" receptacles 4, 8 (dual stack) 12 (triple stack) 1.25 mm [.049 in.] 2.0 mm [.079 in.] 2.5 mm [.098 in.] Packaging Type Housing Material pplicable Soldering Process ontact ase Material Insulation Resistance Withstanding Voltage Tray GF PT or Nylon P9T GF UL94V-0 IR, vapor phase, wave Phosphor bronze 1000 MΩ initial 750 V RMS Orientation Style Mounting Style Operating Voltage Horizontal R/, Vertical R/, upright Single, double, triple Through hole or SMT 30 V RMS urrent Rating ontact Resistance Voltage Rating Temperature Range Normal Force 1.5 amp max. per contact 30 mω initial 250 V max. -40 to g min. (controlled by cable connector) P Thickness ontact Style ontact rea Plating Shell (Shield) Material Housing olor SMT: N/ T/H: 1.57 mm [.0618 in.] Formed Gold plated (see product print for thickness) rass lack or white Durability (Mating ycles) Mating Force Unmating Force Plating (ontact rea) Plating (Soldering End) Plating (Shield) 1500 cycles 35 N [7.9 lbf] max. 10 N [2.25 lbf] min. initial Gold (thickness varies per Delphi spec.) over nickel underplating 2.54 µm [100 µin.] min. tin-lead over nickel underplating µm [120 µin.] min. tin-lead over nickel underplating, or 2.03 µm [80 µin.] min. nickel Underplating 1.27 µm [50 µin.] nickel Standards Universal Serial us Revision 2.0 Specification pprovals and ertification UL approved 12. Delphi onnection Systems

13 I/O Systems US 2.0 onnectors Ordering Nomenclature Style : Style : R/, T/H R/, T/H R/, Double, T/H R/, SMT R/, SMT Vertical, T/H Vertical, T/H Flag, T/H R/, Triple, T/H Selective Plating: Gold plated on contact area and 2.54 µm [100 µin.] min. tin-lead plated on soldering end over 1.27 µm [50 µin.] min. nickel underplating 1 = Gold Flash 2 = µm [15 µin.] 3 = µm [30 µin.] Housing olor: 0 = lack 1 = White Style R/, Double, T/H Style R/, SMT Style Vertical, T/H Style Flag, T/H Style R/, Triple, T/H Style R/, T/H Style, R/, SMT Style, Vertical, T/H Style R/, T/H Dimensions are shown in millimeters [inches]. ommercial onnector atalog 13.

14 I/O Systems Mini US onnectors Description: oard mount I/O connectors for the industry standard US (Universal Serial us) interface used to connect high speed peripheral devices to computers. Mini USs are ideal for applications that require small, lightweight connectors. Typical pplications: Desktop and notebook computers PDs, cell phones Portable music recorders/players Digital cameras External disk drives enefits/features: Industry Standard.. Meets the speed requirements of US 2.0. Meets preliminary requirements of US OTG (On-The-Go). Flexible System.... SMT and through hole mounting styles are available. llows for hot plugging of multiple devices. Ruggedness and Reliability Full metal shields help protect contacts from physical and ESD (Electro Static Discharge) damage High cycle life versions are available. Selectable Features: Product Type Total No. of Positions 5 enterline Spacing Orientation Mounting Style Operating Voltage P Thickness ontact Style ontact rea Plating Height bove oard Shell (Shield) Material Housing olor Mini US receptacles 0.8 mm [.0315 in.] Horizontal DIP or SMT 30 V RMS SMT: N/ TH: 0.8 mm [.0315 in.] Formed Gold plated (see product print for thickness) 4 mm [.16 in.] rass lack Other Properties: Packaging Type Housing Material pplicable Soldering Process ontact ase Material Insulation Resistance Withstanding Voltage urrent Rating ontact Resistance Temperature Range Normal Force Durability (Mating ycles) Mating Force Unmating Force Plating (ontact rea) Plating (Soldering End) Plating (Shield) Underplating Standards pprovals and ertification SMT: tape and reel, Through hole: tray Nylon GF IR, vapor phase, wave Phosphor bronze 100 MΩ initial 100 V RMS 1 amp max. per contact 30 mω -25 to g min. (controlled by cable connector) 5000 cycles 35 N [7.9 lbf] max. 7 N [1.6 lbf] min. initial Gold (thickness varies per Delphi spec.) over nickel underplating 2.03 µm [80 µin.] min. tin-lead over nickel underplating 2.03 µm [80 µin.] min. tin-lead over nickel underplating 1.27 µm [50 µin.] nickel Universal Serial us Revision 2.0 Specification US 2.0 Specification EN #1: Mini onnector UL approved 14. Delphi onnection Systems

15 I/O Systems Mini US onnectors Ordering Nomenclature Surface Mount Through Hole Selective Plating: Gold plated on contact area and 2.54 µm [100 µin.] min. tin-lead plated on soldering end over 1.27 µm [50 µin.] min. nickel underplating 1 = Gold Flash 2 = µm [15 µin.] 3 = µm [30 µin.] SMT Through Hole Dimensions are in millimeters and [inches]. ommercial onnector atalog 15.

16 I/O Systems Mini US able ssemblies Description: Miniature cable assemblies for US (Universal Serial us) based interfaces to small, handheld devices. Mini USs are used to connect high speed peripheral devices to computers. Mini USs are ideal for applications that require small, lightweight connectors. Typical pplications: Notebook computers PDs, cell phones Digital cameras Portable music recorders/players enefits/features: Industry Standard.. Meets the speed requirements of US 2.0. Meets preliminary requirements of US OTG (On The Go). Flexible System.... Several standard cable lengths are available. Non terminated (bare wire) cables for customer defined interfaces can be provided. Integral ferrite cores are available. Ruggedness and Reliability Full metal shields help protect contacts from physical and ESD (Electro Static Discharge) damage Mini US connectors are rated for 5,000 cycles. Selectable Features: Other Properties: Product Type Mini US cable assemblies Packaging Type Polybag Mating Force 35 N [7.87 lbf] max. able Types pplication Total No. of Positions enterline Spacing Operating Voltage Insertion Style ontact Style ontact rea Plating (Plug) Shell Plating (4P Plug) able Length able Diameter Wire Size Housing olor (Plug) Overmold olor (Plug) able Jacket olor Mini captive, US Type to Type Mini detachable, US Type to Type Mini detachable with ferrite core Wire-to-board 5/0, 4/5, 4/5 with ferrite core 0.80 mm [.031 in.] 2.00 mm [.079 in.] 30 VD (power pins) 5 VD (signal) able Formed 0.76 µm [30 µin.] gold Nickel 0.3 m, 0.5 m, 1 m (Mini captive) 1 m, 1.5 m, 1.8 m ( to Mini detachable) 4.2 mm Signal pair/power pair: 28/26 WG Drain wire: 28 WG Type : white Type Mini : black lack lack Housing Material (Plug) Overmold Material (Plug) able Jacket ontact ase Material Shell ase Material Insulation Resistance Withstanding Voltage urrent Rating ontact Resistance (Plug) ontact Resistance (able) Voltage Rating Temperature Range Durability (Mating ycles) ttenuation PT, UL94V-0 PV PV opper alloy Steel 100 MΩ initial Type : 500 V RMS Type Mini : 100 V RMS Type : 1.5 amp max. per contact Type Mini : 1.0 amp max. per contact able ssembly: 1.0 amp max. per contact Type : 30 mω max. Type Mini : 50 mω max. 2Ω max. 30 V 0 to +50 Type : 1500 cycles Type Mini : 5000 cycles Up to 5.8 d at 400 MHz (see specification for details) Unmating Force Plating (ontact rea) Plating (Soldering End) Underplating Type : 10 N [2.25 lbf] min. Type Mini : 7 N [1.57 lbf] min. initial Type Mini : 3 N [0.67 lbf] min. after 5000 cycles 0.76 µm [30 µin.] gold over nickel underplating 2.54 µm [100 µin.] tin-lead min. over nickel underplating 1.27 µm [50 µin.] nickel min. Mutual apacitance 20 pf/ft at 10 KHz max. Impedance 90Ω ± 15% Differential Impedance ommon 30Ω ± 30% Mode Propagation Delay 5.2 ns/m max. Delay Skew Less than 100 ps Standards Universal Serial us Revision 2.0 Specification US 2.0 Specification EN #1: Mini onnector pprovals and ertification UL approved 16. Delphi onnection Systems

17 I/O Systems Mini US able ssemblies Ordering Nomenclature Mini US able ssemblies: Mini aptive to Mini Detachable to Mini Detachable with Ferrite ore able Length Options: Mini aptive: 1 = 300 ±10 mm [11.81 ±.39 in.] 2 = 500 ±10 mm [19.69 ±.39 in.] 3 = 1000 ±30 mm [39.37 ±1.18 in.] to Mini Detachable: to Mini Detachable w/ferrite ore: 0 = 250 ±30 mm [9.84 ±1.18 in.] 1 = 1000 ±30 mm [39.37 ±1.18 in.] 2 = 1500 ±50 mm [59.06 ±1.97 in.] 3 = 1800 ±50 mm [70.87 ±1.97 in.] 1 = 1000 ±30 mm [39.37 ±1.18 in.] 2 = 1500 ±50 mm [59.06 ±1.97 in.] 3 = 1800 ±50 mm [70.87 ±1.97 in.] Mini aptive to Mini Detachable to Mini Detachable with Ferrite ore Dimensions are in millimeters and [inches]. ommercial onnector atalog 17.

18 I/O Systems Lighted US able ssemblies Description: able assemblies for US 2.0 (Universal Serial us) with integrated illumination at the connectors. These cables add a distinctive glow to their normal job of connecting peripheral devices to computers. They are available in a variety of colors and are ideal for applications that benefit from improved aesthetics, peripheral discrimination, or visual confirmation that the cable is powered-up. Typical pplications: Desktop computers Notebook computers Printers, scanners External hard disk drives enefits/features: esthetics Lighted connectors provide striking visual appeal. lear-braid cable adds to improved appearance. Industry Standards... Meets the speed requirements of US 2.0. Flexible System..... Several standard cable lengths are available. vailable in a variety of illumination colors to match visual preferences. Ruggedness and Reliability Full metal shields and overmolded illumination circuitry help protect the cable from physical and ESD (Electro Static Discharge) damage. Selectable Features: Other Properties: Product Type Total No. of Positions 4/4 enterline Spacing Operating Voltage Insertion Style ontact Style Lighted US cable assemblies 2.00 mm (.079 in.) 2.50 mm (.098 in.) 30 VD (Power pins) 5 VD (Signal) able Formed ontact rea Plating (Plug) 0.76 µm (30 µin.) gold Shell Plating (4P Plug) Nickel Housing olor (Plug) White (Type and Type ) able Types US Type to Type detachable able Diameter 4.5 mm Wire Size Signal pair/power pair: 28/24 WG Drain wire: 26 WG LED olors White, red, green, blue, orange Length 0.5 m, 1.0 m, 1.5 m, 1.8 m, 2.0 m, 3.0 m Overmold olor (Plug) Transparent able Jacket olor Transparent pplication Wire-to-board Packaging Type Housing Material (Plug) Overmold Material (Plug) able Jacket ontact ase Material Shell ase Material Insulation Resistance Withstanding Voltage urrent Rating ontact Resistance (Plug) ontact Resistance (able) Voltage Rating Temperature Range Durability (Mating ycles) Mating Force Unmating Force Plating (ontact rea) Polybag PT, UL94V-0 PV PV opper alloy Steel 1000 MΩ min. 500 V RMS 1.5 amp max. per contact 30 mω max. Signal pair:.237 Ω/m max. Power pair:.093 Ω/m max. 30 V 0 to cycles 35 N [7.87 lbf] max. 10 N [2.25 lbf] min µm (30 µin.) gold over nickel underplating Plating (Soldering End) 2.54 µm [100 µin.] tin-lead min. over nickel underplating Underplating 1.27 µm [50 µin.] nickel min. Impedance Differential 90Ω ± 15% Impedance ommon Mode 30Ω ± 30% ttenuation Up to 5.8 d at 400 MHz (see specification for details) Propagation Delay 5.2 ns/m max. Delay Skew 100 ps max. ontact apacitance 2 pf max. per contact Standards Universal Serial us Revision 2.0 Specification US 2.0 Specification EN #1: Mini onnector pprovals and ertification UL approved 18. Delphi onnection Systems

19 I/O Systems Lighted US able ssemblies Ordering Nomenclature olor Options: 1 = White 4 = lue 2 = Red 5 = Orange 3 = Green able Length Options: 0 = 250 ±30 [9.84 ±1.18] 1 = 500 ±30 [19.69 ±1.18] 2 = 1000 ±30 [39.37 ±1.18] 3 = 1500 ±50 [59.06 ±1.97] 4 = 1800 ±50 [70.87 ±1.97] 5 = 2000 ±50 [78.74 ±1.97] 6 = 3000 ±50 [ ±1.97] Dimensions are in millimeters and [inches]. ommercial onnector atalog 19.

20 I/O Systems S erial T (ST) oard onnectors Description: oard mount connectors for the Serial T (ST) mass storage interface standard. These connectors are primarily used to connect hard drives to the motherboard inside a P. Typical pplications: Desktop computers Mini-tower computers T drive arrays enefits/features: Industry Standard.. Meets the mechanical and electrical requirements of the Serial T Specification (High Speed Serialized T ttachment). Flexible System.... Through hole and SMT connector attachment styles are available. Right angle and vertical connector mountings are available. Selectable Features: Other Properties: Product Type Serial T signal plug connectors Packaging Type Tubes Total No. of Positions 7 Housing Material GF PT or GF LP enterline Spacing 1.27 mm [.050 in.] pplicable Soldering Process IR, vapor phase, wave Orientation Mounting Style Operating Voltage P Thickness T/H: Vertical SMT: Horizontal Through hole or SMT 30 VD T/H: 1.57 mm [.062 in.] SMT: N/ ontact ase Material Insulation Resistance Withstanding Voltage urrent Rating ontact Resistance Phosphor bronze 1000 MΩ initial 500 V RMS 1.5 amp max. per contact 30 mω initial ontact Style Formed Voltage Rating 30 V ontact rea Plating Height bove oard Housing olor Gold plated (see product print for thickness) T/H: 8.4 mm [.32 in.] SMT: 8.9 mm [.35 in.] lack Temperature Range Normal Force ontact Retention Force Durability (Mating ycles) Mating Force -25 to g min. end-of-life 600 g 50 cycles 45 N [10.12 lbf] max. Unmating Force 10 N [2.25 lbf] min. Plating (ontact rea) Gold (thickness varies per Delphi spec.) over nickel underplating Plating (Soldering End) 2.54 µm [100 µin.] min. tin-lead over nickel underplating Underplating 1.27 µm [50 µin.] nickel Standards Serial T: High Speed Serialized T ttachment, Revision 1.0 pprovals and ertification UL approved 20. Delphi onnection Systems

21 I/O Systems S erial T (ST) oard onnectors 0375 Recommended P layout Ordering Nomenclature onnectors: Vertical, T/H, Polarized Vertical, T/H SMT Recommended P layout ontact Plating Thickness: 1 = Gold flash 2 = µm [15 µin.] 3 = µm [30 µin.] 0614 Recommended P layout Dimensions are shown in millimeters [inches]. ommercial onnector atalog 21.

22 I/O Systems S erial T able ssemblies Description: onnectorized cable assemblies for the Serial T (ST) mass storage interface standard. These cables are primarily used to connect hard drives to the motherboard inside a P. Typical pplications: Desktop computers T drive arrays Mini-tower computers enefits/features: Industry Standard.. Meets the mechanical and electrical requirements of the Serial T Specification (High Speed Serialized T ttachment). Flexible System.... Straight and right angle cable exits are available. Several standard cable lengths are available. Multiple cable types match performance needs. Selectable Features: Product Type Total No. of Positions 7/7 enterline Spacing Operating Voltage ontact Style ontact rea Plating Housing olor able Lengths able Diameter Wire Size Overmold olor able Jacket olor Dust over pplication Serial T cable assemblies 1.27 mm [.050 in.] 30 VD Formed Gold plated (see product print for thickness) lack 255 mm [10.0 in.], 500 mm [19.7 in.], 1000 mm [39.4 in.] Oval 2.08 mm x 7.80 mm [.082 in. x.307 in.] 26 WG lack Red vailable with or without Wire-to-board Other Properties: Packaging Type Polybag Housing Material GF PT or GF LP Overmold Material PV able Jacket PV ontact ase Material opper alloy Insulation Resistance 1000 MΩ initial Withstanding Voltage 500 V RMS urrent Rating 1.5 amp max. per contact ontact Resistance 30 mω initial Voltage Rating 30 V Temperature Range -25 to +65 Normal Force 50 g min. end-of-life ontact Retention Force 600 g Durability (Mating ycles) 50 cycles Mating Force 45 N [10.12 lbf ] max. Unmating Force 10 N [2.25 lbf ] min. Plating (ontact rea) Gold (thickness varies per Delphi spec.) over nickel underplating Plating (Soldering End) 2.54 µm [100 µin.] min. tin-lead over nickel underplating Underplating 1.27 µm [50 µin.] nickel min. Mated onnector Impedance 100 Ω ±15%, rise 70 ps Insertion Loss 6 d 1200 MHz rosstalk -26 d 1200 MHz Rise Time 85 ps Intra-pair Skew 10 ps max. Standards Serial T: High Speed Serialized T ttachment, Revision 1.0 pprovals and ertification UL approved 22. Delphi onnection Systems

23 I/O Systems S erial T able ssemblies Ordering Nomenclature ables: Straight Dust over: 0 = Without dust cover 1 = With dust cover able Length Option: 1 = 255 mm [10.0 in.] 2 = 500 mm [19.7 in.] 3 = 1000 mm [39.4 in.] able Option: 0 = Grade 1 = Grade 0373 Pin ssignment 0374 SERIL T Dimensions are shown in millimeters [inches]. ommercial onnector atalog 23.

24 I/O Systems Mini DIN Stacked onnectors Description: Dual stacked mini DIN board mount I/O connectors for the P industry standard TX interface used to connect the keyboard and mouse to a computer. Typical pplications: Desktop computers Workstations lade servers Stand alone servers enefits/features: Industry Standard. Meets the mating interface requirements for PS/2 keyboard and mouse. Meets color coding requirements of P99. Standard through hole mounting configuration. Flexible System... vailable with or without secondary ground shield contact. Several centerline distance options are available. Ruggedness and Reliability Full metal shields help protect contacts from physical and ESD (Electro Static Discharge) damage High cycle life versions are available. Selectable Features: Other Properties: Product Type Stacked Mini DIN receptacle Packaging Type Housing Material Tray PT, UL94V-0 Total No. of Positions 2 x 6 positions pplicable Soldering Process IR, vapor phase, wave Orientation Horizontal ontact ase Material Phosphor bronze Mounting Style Through hole Insulation Resistance 500 MΩ min. Operating Voltage 12 VD Withstanding Voltage 500 V RMS P Thickness ontact Style ontact rea Plating mm Formed Gold-plated (see product print for thickness) urrent Rating ontact Resistance Temperature Range Insertion Force 0.5 amp max. per contact 30 mω max. -10 to g max. per pin Height bove oard Front Shell (Shield) Material Rear Shell (Shield) Material onnector olor mm rass Steel Green (top connector) Purple (bottom connector) Withdrawal Force Durability (Mating ycles) Mating Force Unmating Force Plating (ontact rea) Plating (Soldering End) 21 g min. per pin 500 cycles 4.5 Kg max. 0.9 Kg min. to 3.0 Kg max. Gold (thickness varies per Delphi spec.) over nickel underplating 3.05 µm [120 µin.] tin-lead over nickel underplating Plating (Shield) 3.05 µm [120 µin.] bright tin over 1.27 µm [50 µin.] copper Underplating 1.27 µm [50 µin.] nickel pprovals and ertification UL approved 24. Delphi onnection Systems

25 I/O Systems Mini DIN Stacked onnectors Ordering Nomenclature Position Shielded Plating: 1 = Gold flash 2 = 0.38 µm [15 µin.] gold 3 = 0.76 µm [30 µin.] gold Ground Panel: 0 = No ground panel 1 = Ground panel ontact rrangement Recommended P Layout Dimensions are shown in millimeters and [inches]. ommercial onnector atalog 25.

26 I/O Systems RJ-11 Modular Telephone Jacks Description: RJ-11 jacks for standard telephone cable interface Typical pplications: Desktop computers Modem cards Notebook computers enefits/features: Industry Standard... Meets the F Part 68, Subpart F mating interface requirements for standard North merican telephone systems. Standard through hole mounting configuration. Flexible System lack or gray housing colors are available. Standard and low profile heights are available. Several gold plating options are available. Ruggedness and Reliability Wrap around contact design helps prevent contact stubbing during cable insertion High cycle life versions are available. Selectable Features: Product Type RJ-11 Total No. of Positions 6 Number of ontacts 4 Number of Ports 1 enterline Spacing 1.02 mm [0.040 in.] Orientation Horizontal R/ Mounting Style Through hole P Thickness 1.57 mm [.0618 in.] Height bove oard 14.5 mm [0.571 in.] 11.6 mm [0.457 in.] ontact Style Formed ontact rea Plating Gold-plated (see product print for thickness) Shielding None Housing olor Gray or black Other Properties: Packaging Type Housing Material pplicable Soldering Process ontact ase Material Insulation Resistance Withstanding Voltage urrent Rating ontact Resistance Voltage Rating Temperature Range Durability (Mating ycles) Mating Force P Retention (Pre-Solder) P Retention (Post-Solder) Plating (ontact rea) Plating (Soldering End) Underplating Standards pprovals and ertification Tray PT GF UL94V-0 Wave Phosphor bronze 1000 MΩ initial 1000 V RMS 1.5 amp max. per contact 30 mω (initial) 125 V max. -40 to cycles 2.27 Kg [5.0 lbf] max Kg [1 lb] min Kg [10 lb] min. Gold (thickness varies per Delphi spec.) over nickel underplating Gold (thickness varies per Delphi spec.) over nickel underplating 1.27 µm [50 µin.] nickel Mates with modular plug conforming to F Part 68, Subpart F UL approved 26. Delphi onnection Systems

27 I/O Systems RJ-11 Modular Telephone Jacks Right ngle Ordering Nomenclature = Right angle = Right angle, low profile Recommended P Layout Recommended P Thickness [.063] Plating Options: 1 = Gold flash 2 = 0.38 µm [15 µin.] gold 3 = 0.76 µm [30 µin.] gold Right ngle Low Profile Recommended P Layout Dimensions are shown in millimeters and [inches]. ommercial onnector atalog 27.

28 I/O Systems RJ-45 Modular Right ngle Jacks Description: RJ-45 modular jacks for telecom and networking products Typical pplications: Routers Hubs Switches Servers Desktop computers Notebook computers enefits/features: Industry Standard... Meets the F Part 68, Subpart F mating interface requirements. Standard through hole mounting configuration. Flexible System..... Shielded and unshielded configurations are available. Single channel and ganged versions are available. Several gold plating options are available. Ruggedness and Reliability Wrap around contact design helps prevent contact stubbing during cable insertion High cycle life versions are available. Selectable Features: Product Type RJ-45 Total No. of Positions 8 Number of ontacts 8 Number of Ports 1, 4 enterline Spacing 1.27 mm [0.050 in.] Orientation Horizontal R/ Mounting Style Through hole P Thickness 1.57 mm [.0618 in.] ontact Style Formed ontact rea Plating Gold-plated (see product print for thickness) Shielding vailable with or without Shield Plating Nickel Housing olor lack Other Properties: Packaging Type Housing Material pplicable Soldering Process ontact ase Material Insulation Resistance Withstanding Voltage urrent Rating ontact Resistance Voltage Rating Storage Temperature Range Operating Temperature Range Durability (Mating ycles) Mating Force P Retention (Pre-Solder) P Retention (Post-Solder) Plating (ontact rea) Plating (Soldering End) Underplating Plating (Shield) Standards pprovals and ertification Tray PT GF UL94V-0 Wave Phosphor bronze 1000 MΩ initial 1000 V RMS 1.5 amp max. per contact 40 mω (initial) 125 V max. -40 to to cycles 2.27 Kg [5.0 lbf] max Kg [1 lb] min Kg [10 lb] min. Gold (thickness varies per Delphi spec.) over nickel underplating 3.81 µm [150 µin.] min. tin-lead over nickel underplating 1.27 µm [50 µin.] nickel 0.51 µm [20 µin.] to 1.02 µm [40 µin.] nickel Mates with modular plug conforming to F Part 68, Subpart F UL approved 28. Delphi onnection Systems

29 I/O Systems RJ-45 Modular Right ngle Jacks Ordering Nomenclature = 1 port, no shield = 4 ports, no shield = 1 port, with shield = 4 ports, with shield Grounding Tab Options:* 1 = Tabs 1 & 5 2 = Tabs 1, 3, 5 3 = ll 5 tabs * Only. 1 Port, No Shield Plating Options: 1 = Gold flash 2 = 0.38 µm [15 µin.] gold 3 = 0.76 µm [30 µin.] gold Recommended P Layout 4 Ports, No Shield Recommended P Layout Recommended P Thickness [.063] 1 Port, With Shield 4 Ports, With Shield Recommended P Layout Dimensions are shown in millimeters and [inches]. Recommended P Layout Recommended P Thickness [.063] ommercial onnector atalog 29.

30 I/O Systems SSI Type, ll Plastic or Metal Shielded Vertical and Right ngle Female onnectors Description Delphi onnection Systems offers a wide range of board-mount receptacles for Small omputer Systems Interface (SSI) data-transfer applications. These connectors are available in 50 and 68 pin positions in all plastic or metal shielded, vertical or right angle female connectors. SSI type connectors are designed for attaching disk drives and other devices internal or external to computers that comply with NSI SSI-2 and SSI-3 specifications. The metal shielded connector offers full EMI/RFI shielding and a latch retention system. Typical pplications Networked ttached Storage (NS) Storage arrays (RIDs) Host uss dapter cards (Hs) PI add-in cards (standard and low-profile) File servers Work stations Tape storage systems Performance haracteristics ll Plastic Metal Shielded Insulator Material UL94V-0 rated, glass filled thermoplastic, color black UL94V-0 rated, glass filled thermoplastic, color black ontact Material Phosphor bronze, selective gold plated over nickel Phosphor bronze, selective gold plated over nickel Outer Shell Material Die-cast zinc, nickel plated Insulation Resistance 500 MΩ min. at 100 VD 500 MΩ min. at 100 VD Dielectric Withstanding Voltage 250 V for 1 minute (sea level) 250 V for 1 minute (sea level) ontact Resistance 35 mω max. 35 mω max. ontact urrent Rating 1 amp 1 amp Voltage Rating 30 V 30 V Operating Temperature -55 to to +105 ontact Retention 1000 gf min. 800 gf min. Mating Force 70 gf max. per contact 60 gf max. per contact Unmating Force 30 gf min. per contact 20 gf min. per contact 30. Delphi onnection Systems

31 I/O Systems SSI ll Plastic Vertical Female 50 and 68 Positions Section - Recommended P Layout - 50 Positions Option - Standard Footprint Recommended P Layout - 68 Positions Option - Standard Footprint Recommended P Layout - 50 Positions Option - Reverse Footprint Recommended P Layout - 68 Positions Option - Reverse Footprint No. of Positions Dim. Dim. Dim [1.200] [1.369] [1.508] [1.650] [1.819] [1.958] Ordering Nomenclature 88063K No. of Positions: 50 = 50 positions 68 = 68 positions Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. P Pattern (Mounting Style): = Standard footprint = Reverse footprint Selective Plating: Gold plating in contact area per part number code and 2.54 µm [100 µin.] minimum tin/lead plating on solder tail over 1.27 µm [50 µin.] minimum nickel underplate ode 4 = µm [5 µin.] gold ommercial onnector atalog 31.

32 I/O Systems SSI ll Plastic Right ngle Female 68 Positions Recommended P Layout Option - Standard Footprint Recommended P Layout Option - Reverse Footprint Ordering Nomenclature 88064S No. of Positions: 68 = 68 positions Selective Plating: Gold plating in contact area per part number code and 2.54 µm [100 µin.] minimum tin/lead plating on solder tail over 1.27 µm [50 µin.] minimum nickel underplate ode 4 = µm [5 µin.] gold ode 6 = µm [15 µin.] gold P Pattern (Mounting Style): = Standard footprint = Reverse footprint Ground lip Option: 0 = No ground clip 1 = Ground clip Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. 32. Delphi onnection Systems

33 I/O Systems SSI Metal Shield Vertical Female 50 and 68 Positions Section - Recommended P Layout Standard Footprint Recommended P Layout Reverse Footprint No. of Positions Dim. Dim. Dim. Dim. D Dim. E [1.200] [1.831] [1.369] [1.662] [2.065] [1.650] [2.281] [1.819] [2.112] [2.515] Ordering Nomenclature No. of Positions: 50 = 50 positions 68 = 68 positions Latch/Thread Option: 11 = No UN 12 = No UN Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. Selective Plating: Gold plating in contact area per part number code and 2.54 µm [100 µin.] minimum tin/lead plating on solder tail over 1.27 µm [50 µin.] minimum nickel underplate ode 4 = µm [5 µin.] gold ode 6 = µm [15 µin.] gold P Pattern (Mounting Style): = Standard footprint = Reverse footprint ommercial onnector atalog 33.

34 I/O Systems SSI Metal Shield Right ngle Female 14, 20, 26, 36, and 50 Positions Section - Recommended P Layout No. of Positions Dim. Dim. Dim. Dim. D Dim. E Dim. F [.374] 7.62 [.300] [.498] [.673] [.927] [1.161] [.524] [.450] [.648] [.904] [1.081] [1.313] [.674] [.600] [.798] [1.054] [1.231] [1.463] [.924] [.850] [1.048] [1.304] [1.441] [1.713] [1.274] [1.200] [1.398] [1.654] [1.831] [2.063] Ordering Nomenclature 88064R No. of Positions: 14 = 14 positions 36 = 36 positions 20 = 20 positions 50 = 50 positions 26 = 26 positions Selective Plating: Gold plating in contact area per part number code and 2.54 µm [100 µin.] minimum tin/lead plating on solder tail over 1.27 µm [50 µin.] minimum nickel underplate ode 4 = µm [5 µin.] gold ode 6 = µm [15 µin.] gold Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. 34. Delphi onnection Systems

35 I/O Systems SSI Metal Shield Right ngle Female 50 and 68 Positions Section - Recommended P Layout No. of Positions Dim. Dim. Dim. Dim. D Dim. E [1.200] [1.831] [1.369] [1.662] [2.065] [1.650] [2.281] [1.819] [2.112] [2.515] No. of Positions: 50 = 50 positions 68 = 68 positions Ordering Nomenclature 88064P Selective Plating: Gold plating in contact area per part number code and 2.54 µm [100 µin.] minimum tin/lead plating on solder tail over 1.27 µm [50 µin.] minimum nickel underplate ode 4 = µm [5 µin.] gold ode 6 = µm [15 µin.] gold Thread Option: 1 = No UN 2 = No UN Ground lip Option: 0 = No ground clip 1 = Ground clip ommercial onnector atalog 35.

36 Sockets Delphi sockets offer high quality, cost effective options for attaching integrated circuits to Ps. The product portfolio includes: DDR2 DIMM, DDR DIMM, DDR SO-DIMM, DIMM, PG 370 ZIF and Expressard TM connectors. 36. Delphi onnection Systems

37 Sockets Socket onnectors for Plug-in Integrated ircuits and Modules ontents Our socket connectors have been designed to meet the requirements of the latest industry specifications, such as our Expressard connector that is intended for use in next Intro Expressard onnectors generation computing systems that include PI Express and US 2.0 technologies. s with all Delphi quality products, they have been successfully tested to the highest standards, including durability and high-speed testing. DDR2 DIMM Sockets DIMM & DDR DIMM Sockets.. 42 With Delphi s experience and understanding of manufacturing and assembly processes, our sockets offer product-specific design features such as molded-in standoffs, inspection DDR SO-DIMM SM Sockets PG 370 ZIF Sockets windows and pick-and-place capabilities. Other product features and options include: variations on standard mounting configurations, surface mount versions, and customer-specific plating options. Lead-free plating can be provided. ontact Delphi for availability. Typical pplications: omputing systems Hand held devices Instrumentation Network routers, switches and hubs Office automation Servers Set top boxes ommercial onnector atalog 37.

38 Sockets Expressard onnectors Description: Delphi onnection Systems Expressard onnector has been designed to meet all the requirements of the latest PMI specification. These connectors are intended for use in next generation computing systems utilizing PI Express TM and US 2.0 technology. Expressard modules offer end users a fast, easy way to add functionality to their systems. Delphi offers both the host and module connector in surface mount versions. Our connectors have been successfully tested to the PMI standard, which includes high speed testing, DWV, and 5000 cycle durability. Variations of the standard mounting configuration can be provided upon request. enefits/features: Reliable blade style contacts Surface mount 26 position high speed serial interface Qualified to PMI Expressard standard Typical pplications: Notebook computers Servers Set top boxes Selectable Features Desktop computers Hand held devices Product Type Modular card solution for Expressard Total No. of Positions 26 enterline Spacing 1.0 mm [.039 in.] Orientation Horizontal ontact Style lade on eam Mounting Style SMT Housing olor lack Other Properties Packaging Type Housing Material pplicable Soldering Process ontact ase Material Plating (ontact rea) Plating (Solder Tail) Underplate Operating Temperature Range Low Level ontact Resistance Insulation Resistance Dielectric Withstanding Voltage (DWV) urrent Rating Durability Mating Force Unmating Force Physical Shock Vibration Insertion Loss (IL) Return Loss (RL) Inter Pair Skew ross Talk (NeXT) Standards pprovals and ertifications Tray LP SMT, lead free compatible Host connector - high performance phosphor bronze ard connector - high performance brass 0.38 µm [15 µin.] gold 2.5 µm [100 µin.] min. Sn-Pb or optional Pb free finish 1.27 µm [50 µin.] min. Ni all over -25 to mω max initial, 55 mω max after test 1000 MΩ minimum 1000 V rms for 1 minute 0.75 per contact 5,000 cycle (standard) 39 N maximum 3.7 N minimum, 18.5 N maximum 50 G for 11 ms 10 to 500 Hz over 5 minutes 1.7 d max up to GHz 5.5 d up to 6 GHz 10 d up to GHz 5 d up to 6 GHz 5 ps max 32 d up to GHz 26 d up to 6 GHz Meets performance criteria per PMI Expressard Standard, Version 1.0 and EI UL approved 38. Delphi onnection Systems

39 Sockets Expressard onnectors ard onnector P/N = Pb Sn Solder Tail Host onnector P/N = u Solder Tail (Pb free) -100 = Pb Sn Solder Tail -200 = u Flash Solder Tail (Pb free) Recommended P layout Recommended P layout ommercial onnector atalog 39.

40 Sockets DDR2 DIMM Sockets Description: 1mm centerline sockets for DDR2 DIMM (Double Data Rate 2, Dual Inline Memory Modules). These sockets are provided with dual eject latches for easy module removal, voltage keys to enable proper module insertion, and color keyed latches for visual end-user identification. Typical pplications: Desktop computers Servers Network routers, switches and hubs enefits/features: Flexible System.... The 240 position socket is available in several solder tail lengths to accommodate various P thicknesses. Latches are available in different colors for visual identification. Industry Standard.. Meets JEDE MO-237 module mating requirements for DDR2 DIMM. Reliability Several gold plating options are available for improved reliability. Selectable Features: Product Type Total No. of Positions 240 enterline Spacing Orientation Mounting Style Voltage Insertion Style ontact Style ontact rea Plating Height bove oard Housing olor Latch olor DDR2 DIMM Sockets 1.0 mm [.039 in.] Vertical Through Hole 1.8 V & 2.5 V Vertical Formed Gold-plated (see product print for thickness) 5.2 mm [.205 in.] lack White, black or blue Other Properties: P Retention Feature Yes Packaging Type Tray Housing Material LP pplicable Soldering Process IR, vapor phase, wave ontact ase Material opper alloy Latch ase Material Stainless steel Floating Tab Material opper alloy Insulation Resistance 250 MΩ (initial) Withstanding Voltage 500 V (initial) urrent Rating 0.5 amp max. per contact ontact Resistance 30 mω (initial) Voltage Rating 25 V Temperature Range -55 to +85 Normal Force 0.69 N [70 gf] min. ontact Retention Force 4.90 N [500 gf] min. Durability (Mating ycles) 25 P Mating Force N [25 lbf] max. Plating (ontact rea) Gold (thickness varies per Delphi spec.) over nickel underplating Plating (Soldering End) 2.54 µm [100 µin.] tin-lead over nickel underplating Plating (Floating Tab) 2.54 µm [100 µin.] tin-lead over nickel underplating Underplating 1.27 µm [50 µin.] nickel Standards JEDE MO-237 pprovals and ertification UL approved 40. Delphi onnection Systems

41 Sockets DDR2 DIMM Sockets Ordering Nomenclature Plating: 1 = Gold flash 2 = 0.38 µm [15 µin.] gold Tail Length (Dim. ): 1 = 2.54 [0.100] 2 = 3.00 [0.118] Voltage/olor: 1 = 1.8 V - black housing/white latch 2 = 2.5 V - black housing/white latch 3 = 1.8 V - black housing/black latch 4 = 2.5 V - black housing/black latch 5 = 1.8 V - black housing/blue latch 6 = 2.5 V - black housing/blue latch Recommended P layout ommercial onnector atalog 41.

42 Sockets DIMM & DDR DIMM Sockets Description: Sockets for DRM memory modules Typical pplications: Desktop computers Network routers, switches, and hubs Servers enefits/features: Flexible System.... Product available for standard 168 position modules and DDR (Double Data Rate) 184 position modules. Various voltage mating keys are available. Industry Standard... Meets JEDE MO-161 module mating requirements for DIMM and MO-206 module mating requirements for DDR DIMM. Ruggedness Dual retention/ejector latches hold module securely and aid in module removal. Reliability Several gold plating options are available for improved durability. DIMM 168 DDR DIMM 184 Selectable Features: Product Type DIMM Total No. of Positions 168 and 184 enterline Spacing 1.27 mm [.050 in.] Orientation Vertical Mounting Style oard through hole Voltage DIMM: 3.3 V, DDR DIMM: 2.5 V Memory Type Synch DRM P Thickness 1.57 mm [.062 in.] Insertion Style Direct ontact Style Formed ontact rea Plating 0.38 µm [15 µin.] gold Height bove oard mm [.965 in.] Tail Length 2.54 mm [.100 in.] No. of Ejectors 2 Hold Down Material opper alloy Housing olor lack Other Properties: P Retention Feature Yes Packaging Type Tray Housing Material LP pplicable Soldering Process IR, vapor phase, wave Ejector olor Ivory ontact ase Material opper alloy Insulation Resistance MΩ Withstanding Voltage 1000 V RMS urrent Rating 1 amp max. per contact ontact Resistance 30 mω Voltage Rating 150 V/D Temperature Range -55 to +85 ontinuous Operating Temperature +85 Normal Force 0.49 N [50 gf] ontact Retention Force 6.67 N [1.5 lbf] Durability (Mating ycles) 25 Plating (ontact rea) Gold (thickness varies per Delphi spec.) over nickel underplating Plating (Soldering End) 2.54 µm [100 µin.] tin-lead over nickel underplating Underplating 1.27 µm [50 µin.] nickel Standards JEDE MO-161, MO-206 pprovals and ertification UL and S approved 42. Delphi onnection Systems

43 Sockets DIMM & DDR DIMM Sockets Ordering Nomenclature DIMM Selective Plating: Gold plated on contact area and 100 µin. min. tin-lead plated on soldering end over 50 µin. min. nickel underplating 1 = Gold Flash 2 = µm [15 µin.] blue dot 3 = µm [30 µin.] green dot Recommended P layout Top view - ejector latches not shown Function Key Option: 1 = Offset Right Key (UDRM) 2 = Offset entered Key (DRM) 3 = Offset Left Key (SDRM) DDR DIMM 184 Selective Plating: Gold plated on contact area and 100 µin. min. tin-lead plated on soldering end over 50 µin. min. nickel underplating 1 = Gold Flash 2 = µm [15 µin.] blue dot 3 = µm [30 µin.] green dot Recommended P layout Function Key Option: 0 = oard Lock 1 = Peg Top view - ejector latches not shown Unless otherwise specified, dimensions are shown in millimeters. ommercial onnector atalog 43.

44 Sockets DDR SO-DIMM Surface Mount Sockets Description: Sockets for Double Data Rate Small Outline DRM memory modules Typical pplications: Notebook computers Small form factor servers Small form factor network routers, switches and hubs enefits/features: Flexible System.... The 200 position socket is available in standard and reverse keying options for dual socket implementation. Sockets are available for 1.8 V or 2.5 V modules. Sockets are available in 4.0 mm or 5.2 mm module stack heights. Industry Standard.. Meets JEDE MO-224 module mating requirements for DDR SO-DIMM. Ruggedness Metal reinforced retention latches hold module securely. Reliability Several gold plating options are available for improved reliability. Selectable Features: Product Type Total No. of Positions 200 enterline Spacing Orientation Mounting Style Voltage Insertion Style ontact Style ontact rea Plating Height bove oard Housing olor DDR SO-DIMM Sockets 0.60 mm [.024 in.] Horizontal Surface mount 1.8 V, 2.5 V am-in Formed Gold-plated (see product print for thickness) 4.0 mm [.157 in.] 5.2 mm [.205 in.] lack or tan (natural) Other Properties: P Retention Feature Yes Packaging Type Tray Housing Material LP pplicable Soldering Process IR, vapor phase, wave ontact ase Material opper alloy Latch ase Material Stainless steel Floating Tab Material opper alloy Insulation Resistance 250 MΩ (initial) Withstanding Voltage 500 V (initial) urrent Rating 0.3 amp max. per contact ontact Resistance 30 mω (initial) Voltage Rating 25 V Temperature Range -55 to +85 Normal Force 0.69 N [70 gf] min. ontact Retention Force 4.90 N [500 gf] min. Latch Spring Retention Force N [2000 gf] min. Durability (Mating ycles) 25 P Mating Force 9.81 N [1000 gf] max. Plating (ontact rea) Gold (thickness varies per Delphi spec.) over nickel underplating Plating (Soldering End) 2.54 µm [100 µin.] tin-lead over nickel underplating Plating (Floating Tab) 2.54 µm [100 µin.] tin-lead over nickel underplating Underplating 1.27 µm [50 µin.] nickel Standards JEDE MO-224 pprovals and ertification UL approved 44. Delphi onnection Systems

45 Sockets DDR SO-DIMM Surface Mount Sockets Ordering Nomenclature Standard Type Standard Type Reverse Type NOR X.X mm 2.5V Plating: 1 = Gold flash 2 = 0.38 µm [15 µin.] gold Voltage/olor: 1 = 1.8 V - black 2 = 2.5 V - black 3 = 1.8 V - tan (natural) 4 = 2.5 V - tan (natural) Height bove oard (Dim. D ): 1 = 4.0 [.157] 2 = 5.2 [.205] Reverse Type Power olor Dim. Dim. Dim. Dim. Supply D 1.8 V lack [.09] [.11] [.691] [.16] 1.8 V lack [.09] [.11] [.691] [.20] 2.5 V lack [.06] [.07] [.726] [.16] 2.5 V lack [.06] [.07] [.726] [.20] 1.8 V Tan [.09] [.11] [.691] [.16] 1.8 V Tan [.09] [.11] [.691] [.20] 2.5 V Tan [.06] [.07] [.726] [.16] 2.5 V Tan [.06] [.07] [.726] [.20] NOR X.X mm 2.5V Unless otherwise specified, dimensions are shown in millimeters and [inches]. ommercial onnector atalog 45.

46 Sockets PG 370 ZIF Sockets Description: Zero Insertion Force (ZIF) Pin Grid rray socket for microprocessors. This socket accepts Intel 370 position PPG (Plastic Pin Grid rray) processors, which includes some eleron and Pentium III processors. Typical pplications: Desktop computers Set top boxes enefits/features: Industry Standard.. ZIF sockets are drop in replacements for existing PG 370 sockets. Dual heat sink retention clips accept a wide variety of thermal solutions. Flexible System.... Different plating thicknesses are available. Zero Insertion Force feature allows for easy installation or removal of processor package. Ruggedness and Reliability Dual beam contact assures reliable mating interface Stainless steel lever arm guarantees solid processor retention. Selectable Features: Product Type PG ZIF sockets Total No. of Positions 370 enterline Spacing 1.27 mm [.050 in.] (Interstitial 2.54 mm [0.100 in.]) Other Properties: Housing Material Heat Sink Retention Features Packaging Type pplicable Soldering Process GF LP or nylon Yes Tray IR, vapor phase, wave Orientation Horizontal ontact ase Material Phosphor bronze Mounting Style Through hole Lever ase Material Stainless steel Voltage Insertion Style 3.3 VD Drop in Zero Insertion Force (am-action) Insulation Resistance Withstanding Voltage ontact Resistance 1000 MΩ min V min. 20 mω (initial) ontact Style Formed urrent Rating 1.0 amp max. per contact ontact rea Plating Gold-plated (see product print for thickness) Voltage Rating Temperature Range 500 V -55 to +105 Height bove oard Housing olor 7.70 mm [.303 in.] Natural Pin Extraction Force N [20 gf] min. (closed position) ontact Retention Force N [300 gf] min. Durability (Mating ycles) 50 Intel, eleron, and Pentium III are registered trademarks of Intel orporation. Plating (ontact rea) Underplating pprovals and ertification Gold (thickness varies per Delphi spec.) over nickel underplating 1.27 µm [50 µin.] nickel UL approved 46. Delphi onnection Systems

47 Sockets PG 370 ZIF Sockets Ordering Nomenclature Plating: 1 = Gold flash 2 = 0.38 µm [15 µin.] gold 3 = 0.76 µm [30 µin.] gold ontact Type: 1 = Single contact 2 = Double contact Housing Material: 1 = GF LP 2 = Nylon Recommended P Layout Unless otherwise specified, dimensions are shown in millimeters and [inches]. ommercial onnector atalog 47.

48 oard-to-oard Delphi onnection Systems oard-to-oard onnectors are the ideal option when you need small, lightweight connectors. oard-to-oard onnectors are offered in several categories, each offering distinct features and benefits. In addition to the listed products, Delphi is continually developing new connectors to add to our board-to-board family. 48. Delphi onnection Systems

49 oard-to-oard Series oard-to-oard Delphi onnection Systems oard-to-oard (T) onnectors are offered in five categories: Edge ard onnectors 0.8mm Hermaphroditic T SMT onnectors ompression onnectors 0.5mm Fine Pitch T SMT onnectors 0.5mm & 1mm Pitch FP onnectors Each series offers specific features and benefits: ontents Delphi s Edge ard connector line includes PI Express TM (PIe) and ccelerated Graphics Port (GP) onnectors. PIe connectors support the newest high speed serial technology for leading edge computing systems. PIe connectors are available in x1, x4, x8, and x16 configurations. The GP connector is designed for video cards that support today s 3D graphics applications. Various gold plating options are available for improved reliability. Intro PI Express onnectors mm Fine Pitch SMT onnectors The 0.5mm oard-to-oard onnector series is a fine pitch product recommended for high density applications. It is intermateable with several existing competitors products. 0.8mm Hermaphroditic SMT onnectors mm & 1mm Pitch FP onnectors The unique 0.8mm Hermaphroditic oard-to-oard onnector series actually mates with itself, which results in less confusion over P ompression onnectors footprints and lowers the number of stocked part numbers. The fine pitch 0.8mm Hermaphroditic system is used in connecting Ps having high density circuitry. GP onnectors Delphi s 0.5mm and 1mm Pitch Flexible Printed ircuit (FP) onnectors interface with flat flexible cable or flexible printed circuits. The contacts use a Zero Insertion Force (ZIF) actuator mechanism which snaps down over the cable for termination. Our ompression onnector s innovative one-piece design offers a more space-efficient and cost-effective solution than conventional pin and socket connectors. It features a variety of custom options to address your specific connector needs. Typical pplications: Desktop computers Digital cameras Disk drives Handheld scanners Keypads, keyboards Laptop and notebook computers Medical equipment Mobile phones Notebook computers P-to-P interconnections PI Express and GP video cards PDs, cell phones Portable music recorders/players Printers Servers Test equipment Wireless mobile electronics devices Workstations ommercial onnector atalog 49.

50 oard-to-oard PI Express onnectors Description: 1.0mm pitch card edge connectors for PI Express expansion slots. These connectors support single (x1) or multiple (x4, x8, x16) serial data lanes at 2.5 Gbps data rates per lane. PI Express connectors are the industry standard interface to replace parallel PI bus applications. Typical pplications: Desktop computers Servers enefits/features: Industry Standard.. Meets all requirements of PI SIG (Peripheral omponent Interface Special Interest Group) PI Express ase Specification. Flexible System.... onnectors are available in x1, x4, x8, and x16 sizes. Two solder tail lengths provided for varying P thicknesses. Ruggedness Injection molded housings have integral retention ledge. Reliability Several gold plating options are available for improved reliability. Selectable Features: Product Type Total No. of Positions enterline Spacing Orientation Mounting Style Voltage Insertion Style ontact Style ontact rea Plating Height bove oard Housing olor PI Express ard Edge onnectors 36 (x1), 64 (x4), 98 (x8), 164 (x16) 1.0 mm [.039 in.] Vertical Through Hole 3.3 V Edge ard Formed Gold-plated (see product print for thickness) mm [0.443 in.] lack Other Properties: P Retention Feature No Packaging Type Tube Housing Material Glass filled thermoplastic pplicable Soldering Process IR, vapor phase, wave ontact ase Material opper alloy Insulation Resistance 1,000 MΩ Withstanding Voltage 500 V urrent Rating 1.1 amp max. per power contact ontact Resistance 30 mω (initial) Voltage Rating 25 V Temperature Range -55 to +85 ard Insertion Force 1.15 N [117 gf] max per contact pair Durability (Mating ycles) 20 Plating (ontact rea) Plating (Soldering End) Underplating Standards pprovals and ertification Gold (thickness varies per Delphi spec.) over nickel underplating 2.54 µm [100 µin.] tin-lead over nickel underplating (Lead free available, contact factory) 1.27 µm [50 µin.] nickel PI SIG PI Express Specification UL approved 50. Delphi onnection Systems

51 oard-to-oard PI Express onnectors Ordering Nomenclature Plating: 1 = Gold flash 2 = 0.38 µm [15 µin.] gold Housing olor: 1 = lack 2 = White 3 = lue 4 = Green 5 = Purple Dim. "" Dim. " " Tail Length (Dim. ): 1 = 2.30 mm [0.091 in.] 2 = 2.54 mm [0.100 in.] 3 = 3.00 mm [0.118 in.] Dim. " " Dim. "D" Dim. "" Recommended P Layout PI Express Dimension Table Size ase Number Dim. Dim. Dim. Dim. D x [.984] See Legend 6.00 [.236] 9.15 [.360] x [1.535] See Legend [.787] [.911] x [2.205] See Legend [1.457] [1.581] x [3.504] See Legend [2.756] [2.880] Dimensions are shown in millimeters and [inches]. ommercial onnector atalog 51.

52 oard-to-oard 0.5mm Fine Pitch oard-to- oard SMT onnectors Description: The 0.5mm board-to-board connector series is a fine pitch product for use in connecting Ps having high density circuitry. It is ideal for portable device applications that require small, lightweight connectors. Typical pplications: Notebook computers PDs, cell phones Digital cameras Portable music recorders/players enefits/features: High Density..... Two rows of contacts on 0.5mm pitch offer very high I/O density while fitting normal P process requirements. Flexibility Offered in a variety of popular sizes from 20 to 100 positions to accommodate a wide range of applications. Provided in tape and reel packaging to permit easy pick-and-place. Ruggedness and Reliability Glass filled LP and auto-inserted gold plated contacts help provide an accurate and rugged assembly. Selectable Features: Product Type oard-to-board receptacle and plug ontact Interface lade-on-beam Total No. of Positions 20, 30, 40, 60, 80, 100 Mated Height 5.0 mm [.197 in.] enterline Spacing 0.5 mm [.02 in.] Rows 2 onnector Orientation Vertical P Orientation Parallel Mounting Style Surface mount Insertion Style Direct ontact Style Formed ontact rea Plating 0.2 µm [8 µin.] minimum gold Locator Peg Material Housing olor LP, 30% GF UL94V-0 lack Other Properties: Packaging Type Housing Material pplicable Soldering Process ontact ase Material Insulation Resistance Withstanding Voltage urrent Rating ontact Resistance Voltage Rating ontinuous Operating Temperature Normal Force ontact Retention Force Durability (Mating ycles) Mating Force Unmating Force Plating (ontact rea) Plating (Soldering End) Underplating Pick-and-Place Feature pprovals and ertification Tape and reel LP, 30% GF UL94V-0 IR, vapor phase, wave Phosphor bronze 100 MΩ min. 500 V RMS 0.4 amp max. per contact 80 mω max. (final) 50 V/D -25 to N [100 gf] min N [100 gf] 50 cycles 1.96 N [200 gf] 0.5 N [51 gf] 0.2 µm [7.87 µin.] gold over nickel underplating 1.2 µm [47.22 µin.] max. 90/10 tin/lead over nickel underplating 1.2 µm [47.22 µin.] min. nickel Yes UL approved 52. Delphi onnection Systems

53 oard-to-oard 0.5mm Fine Pitch oard-to- oard SMT onnectors Ordering Nomenclature Plug onnector Receptacle onnector Plug No. of Positions: 0 = 20 2 = 40 4 = 80 1 = 30 3 = 60 5 = 100 ontact Plating: 1 = 0.2 µm [8 µin.] gold Dim. Dim. Dim Receptacle Dim. Dim. Dim Dimensions are shown in millimeters. ommercial onnector atalog 53.

54 oard-to-oard 0.8mm Hermaphroditic oardto-oard SMT onnectors Description: The hermaphroditic 0.8mm board-to-board connector series is a fine pitch product for use in connecting Ps having high density circuitry. It is ideal for portable device applications that require small, lightweight connectors. Typical pplications: Notebook computers PDs, cell phones Digital cameras Portable music recorders/players enefits/features: High Density..... Two rows of contacts on 0.8mm pitch offer very high I/O density with typical, easy to implement P requirements. Flexibility The hermaphroditic feature allows applications to use the same part on both boards. This reduces inventory costs, bill of materials (OM) size, inspection requirements and stocking requirements. Several mated heights from 4.5mm to 12.0mm and pin counts from 30 to 80 are available. This permits the hermaphroditic 0.8mm board-to-board series to accommodate a wide range of applications. Ruggedness and Reliability Glass filled LP and gold plated contacts help provide high performance, rugged assemblies. Selectable Features: Product Type ontact Interface Hermaphroditic board-to-board receptacle and plug lade-on-beam Total No. of Positions 30, 40, 50, 60, 80 Mated Height enterline Spacing Rows 2 onnector Orientation P Orientation Mounting Style Insertion Style ontact Style ontact rea Plating Locator Peg Material Housing olor 4.5 mm, 6.5 mm, 12.0 mm 0.8 mm [.0315 in.] Vertical Parallel Surface mount Direct Formed µm [5 µin.] min. gold LP, 30% GF, UL94V-0 lack Other Properties: Packaging Type Housing Material pplicable Soldering Process ontact ase Material Insulation Resistance Withstanding Voltage urrent Rating ontact Resistance Voltage Rating ontinuous Operating Temperature ontact Retention Force Durability (Mating ycles) Mating Force Unmating Force Plating (ontact rea) Plating (Soldering End) Underplating Pick-and-Place Feature pprovals and ertification Tape and reel LP, 30% GF, UL94V-0 IR, vapor phase, wave Phosphor bronze 1000 MΩ min. 250 V RMS 0.5 amp max. per contact 50 mω max. (4.5 mm & 6.5 mm mated height) 65 mω max. (12.0 mm mated height) 100 V/D -40 to N [300 gf] min. 100 cycles 1.86 N [190 gf] max. per mated pair N [30 gf] min. per mated pair µm [5 µin.] gold over nickel underplating 2.54 µm [100 µin.] min. 90/10 tin/lead over nickel underplating 1.27 µm [50 µin.] min. nickel ap UL approved 54. Delphi onnection Systems

55 oard-to-oard 0.8mm Hermaphroditic oardto-oard SMT onnectors Ordering Nomenclature mm mated height mm mated height mm mated height Shown: 4.5 mm Mated Height No. of Positions: 1 = 30 3 = 50 5 = 80 2 = 40 4 = 60 Mated Height Dim. Dim. 4.5 mm 0.90 [.035] 3.60 [.142] 6.5 mm 1.90 [.075] 4.60 [.181] 12.0 mm 4.65 [.183] 7.35 [.289] No. of Positions Dim. Dim. D Dim. E Dim. F Dim. G Dim. H [.441] [.584] [.587] [.638] [.701] [.819] [.598] [.742] [.744] [.795] [.858] [.976] [.756] [.899] [.902] [.953] [1.016] [1.134] [.913] [1.057] [1.059] [1.110] [1.173] [1.291] [1.228] [1.372] [1.374] [1.425] [1.488] [1.606] Dimensions are shown in millimeters [inches]. ommercial onnector atalog 55.

56 oard-to-oard 0.5mm & 1mm Pitch FP onnectors Description Delphi onnection Systems 0.5mm and 1mm Pitch Flexible Printed ircuit (FP) onnectors interface with flat flexible cable or flexible printed circuits. The contacts use a Zero Insertion Force (ZIF) actuator mechanism which snaps down over the cable for termination. 0.5mm 0.5mm Pitch FP onnectors are horizontal configurations that interface with pads on 0.5mm [0.020 in.] centers and with a thickness of 0.3mm [0.012 in.]. Sizes accommodate 4 through 50 positions. 1mm 1mm Pitch FP onnectors are available in horizontal or vertical configurations. These connectors interface with pads on 1mm centers with a thickness of 0.3mm [0.12 in.]. Sizes accommodate 3 through 32 positions. Typical pplications FP onnectors are used in a variety of electronic applications, including: Mobile phones Handheld scanners Keyboards Keypads Disk drives Printers Fax machines Laptop and notebook computers Industry pprovals These components have been evaluated by Underwriters Laboratories as recognized components, and are included in UL File E Performance haracteristics 0.5mm 1mm Total No. of Positions 4 through 50 3 through 32 Orientation Top or bottom contact, horizontal format Top or bottom contact, horizontal or vertical formats Mounting Style Surface mount (SMT) Surface mount (SMT) ontact Style Stamped and formed Stamped and formed Packaging Type Tubes (standard), or Tape & reel (available upon request) Tubes (standard), or Tape & reel (available upon request) Insulator Material Molded thermoplastic, UL94V-O Molded thermoplastic, UL94V-O ontact ase Material Phosphor bronze Phosphor bronze urrent Rating 0.3 amps max. 1 amp max. ontact Resistance 40 mω max. (final) 40 mω max. (final) Voltage Rating 25 VD 200 V RMS Operating Temperature -25 to to +85 Durability (Mating ycles) 30 cycles 30 cycles Plating (ontact rea) 2.54 µm [100 µin.] tin/lead over nickel 2.54 µm [100 µin.] tin/lead over nickel Insulator olor lack Tan (natural) ctuator olor Tan (natural) rown 56. Delphi onnection Systems

57 oard-to-oard Horizontal FP onnectors Ordering Nomenclature FP HT 03 T R 0.5mm Top ontact Series: FP5 = 0.5mm FP = 1mm Packaging: T = Tubes (standard) R = Tape and reel onfiguration: HT = Horizontal Top Plating: T = Tin/lead ctuator open No. of ontact Positions: 04 through 50 = 0.5mm 03 through 32 = 1mm 1mm Top ontact P Layout ctuator open For dimensions,,, and D, see charts on page 61. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog 57.

58 oard-to-oard Horizontal FP onnectors Ordering Nomenclature FP H 03 T R 0.5mm ottom ontact Series: FP5 = 0.5mm FP = 1mm onfiguration: H = Horizontal ottom Packaging: T = Tubes (standard) R = Tape and reel Plating: T = Tin/lead No. of ontact Positions: 04 through 50 = 0.5mm 03 through 32 = 1mm ctuator open 1mm ottom ontact P Layout ctuator open For dimensions,,, and D, see charts on page 61. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. 58. Delphi onnection Systems

59 oard-to-oard 1mm Vertical FP onnectors 1mm Vertical onnectors ctuator open P Layout Ordering Nomenclature FP V 03 T R Series: FP = 1mm onfiguration: V = Vertical Packaging: T = Tubes (standard) R = Tape and reel Plating: T = Tin/lead No. of ontact Positions: 03 through 32 For dimensions,,, and D, see chart on page 61. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog 59.

60 oard-to-oard 0.5mm & 1mm FP onnectors 0.5mm P Layout 0.5mm Recommended Mating able Layout 1mm Recommended Mating able Layout For dimensions,,, and D, see charts on page 61. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. 60. Delphi onnection Systems

61 oard-to-oard 0.5mm & 1mm FP Dimensions 0.5mm Dimensions No. of Positions Dim. Dim. Dim. Dim. D [.059] 2.65 [.104] 6.30 [.248] 8.70 [.343] [.079] 3.15 [.124] 6.80 [.268] 9.20 [.362] [.098] 3.65 [.144] 7.30 [.287] 9.70 [.382] [.118] 4.15 [.163] 7.80 [.307] [.402] [.138] 4.65 [.183] 8.30 [.327] [.421] [.157] 5.15 [.203] 8.80 [.346] [.441] [.177] 5.65 [.222] 9.30 [.366] [.461] [.197] 6.15 [.242] 9.80 [.386] [.480] [.217] 6.65 [.262] [.406] [.500] [.236] 7.15 [.281] [.425] [.520] [.256] 7.65 [.301] [.445] [.539] [.276] 8.15 [.321] [.465] [.559] [.295] 8.65 [.341] [.484] [.579] [.315] 9.15 [.360] [.504] [.598] [.335] 9.65 [.380] [.524] [.618] [.354] [.400] [.543] [.638] [.374] [.419] [.563] [.657] [.394] [.439] [.583] [.677] [.413] [.459] [.602] [.697] [.433] [.478] [.622] [.717] [.453] [.498] [.642] [.736] [.472] [.518] [.661] [.756] [.492] [.537] [.681] [.776] [.512] [.557] [.701] [.795] No. of Positions Dim. Dim. Dim. Dim. D [.531] [.577] [.720] [.815] [.551] [.596] [.740] [.835] [.571] [.616] [.760] [.854] [.591] [.636] [.780] [.874] [.610] [.656] [.799] [.894] [.630] [.675] [.819] [.913] [.650] [.695] [.839] [.933] [.669] [.715] [.858] [.953] [.689] [.734] [.878] [.972] [.709] [.754] [.898] [.992] [.728] [.774] [.917] [1.012] [.748] [.793] [.937] [1.031] [.768] [.813] [.957] [1.051] [.787] [.833] [.976] [1.071] [.807] [.852] [.996] [1.091] [.827] [.872] [1.016] [1.110] [.846] [.892] [1.035] [1.130] [.866] [.911] [1.055] [1.150] [.886] [.931] [1.075] [1.169] [.906] [.951] [1.094] [1.189] [.925] [.970] [1.114] [1.209] [.945] [.990] [1.134] [1.228] [.965] [1.010] [1.154] [1.248] 1mm Dimensions No. of Positions Dim. Dim. Dim. Dim. D [.079] 4.30 [.169] 7.80 [.307] [.406] [.118] 5.30 [.209] 8.80 [.346] [.445] [.157] 6.30 [.248] 9.80 [.386] [.484] [.197] 7.30 [.287] [.425] [.524] [.236] 8.30 [.327] [.465] [.563] [.276] 9.30 [.366] [.504] [.602] [.315] [.406] [.543] [.642] [.354] [.445] [.583] [.681] [.394] [.484] [.622] [.720] [.433] [.524] [.661] [.760] [.472] [.563] [.701] [.799] [.512] [.602] [.740] [.839] [.551] [.642] [.780] [.878] [.591] [.681] [.819] [.917] [.630] [.720] [.858] [.957] No. of Positions Dim. Dim. Dim. Dim. D [.669] [.760] [.898] [.996] [.709] [.799] [.937] [1.035] [.748] [.839] [.976] [1.075] [.787] [.878] [1.016] [1.114] [.827] [.917] [1.055] [1.154] [.866] [.957] [1.094] [1.193] [.906] [.996] [1.134] [1.232] [.945] [1.035] [1.173] [1.272] [.984] [1.075] [1.213] [1.311] [1.024] [1.114] [1.252] [1.350] [1.063] [1.154] [1.291] [1.390] [1.102] [1.193] [1.331] [1.429] [1.142] [1.232] [1.370] [1.469] [1.181] [1.272] [1.409] [1.508] [1.220] [1.311] [1.449] [1.547] Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog 61.

62 oard-to-oard ompression onnectors Description Delphi onnection Systems compression connectors offer an alternative solution to other types of compression interconnection methods such as spring plunger pins, "fuzz buttons" or elastomerics. The distinctive one-piece design offers a more space-efficient and cost-effective solution than conventional pin and socket connectors. The compression connectors are offered in various options, with surface mount contacts on one side and compression contacts on the other side, or with compression contacts on both sides. oth singlerow and dual-row designs are available. Single-sided ompression This configuration has stationary tails on one end of the contact and deflecting beams on the other. One side of the connector is soldered to the P board for ease of assembly. The second P board is pressed against the compression contacts, deflecting the beam and applying force to the second board s pads. Dual ompression This configuration has a separate piece that is not soldered to either board, with deflecting beams protruding from both sides of the housing. It is clamped in place while the two connecting P boards are brought into position. Typical pplications Delphi s compression connectors are custom designed for compact applications: Wireless mobile electronics devices Medical equipment Test equipment Disk drives for HD to P interconnections P-to-P interconnections redit card calculators enefits/features High strength beryllium copper contacts Gold flash over palladium nickel for high reliability and durability Optional tin plating for economical and/or high force systems Optional palladium nickel plating for high durability applications Profile heights: 1.00 mm [.039 in.] to over 15 mm [.590 in.] Fine pitch contact spacing: 0.50 mm [.020 in.] and up Lower actual applied cost than pin and socket ontact deflection of 0.20 mm [.008 in.] to 1.00 mm [.039 in.] dependent upon beam length Variety of packaging options for use with automatic placement equipment including pick-up caps Dual compression or SMT-to-compression configurations, housings (and contacts) to fit custom applications 62. Delphi onnection Systems

63 oard-to-oard ompression onnectors Usage Guidelines: onnector body can be used to precisely set spacing between boards Proximity of mounting hardware depends on board/system stiffness onnector can incorporate special mounting holes Mating pads are flat to avoid any over stressing of contact beams End Use Form Factor Limitations: Maximum height: 15 mm [.590 in.] Minimum height: 1.00 mm [.039 in.] Minimum contact pitch: 1.00 mm [.039 in.] which can be interdigitated for an effective pitch of 0.50 mm [.020 in.] onnector Specifications Insulation Resistance ontact Resistance Normal Force Durability (Mating ycles) Greater than 500 mω Less than 25 mω 50 to 250 grams per contact, dependent upon application Greater than 500 cycles (with palladium nickel) No outgassing from any components Infrared reflow process compatible Delphi can provide custom designs based on customer requirements. For more information on specific applications, please contact us or visit our website. ommercial onnector atalog 63.

64 oard-to-oard ccelerated Graphics Port (GP) onnectors Description: onnector for GP video cards Typical pplications: Desktop computers Workstations Servers enefits/features: Industry Standard.. Meets GP Implementer s Forum specification mating requirements. Supports high performance 3D graphics cards. Flexible System.... Meets speed requirements of GP 1x, 2x and 4x. Ruggedness Metal board locks hold connector securely during P processing. Reliability Several gold plating options are available for improved reliability. Low mating force through staggered mating contacts. Selectable Features: Product Type Total No. of Positions 124 enterline Spacing Orientation Mounting Style Voltage P Thickness Insertion Style ontact Style ontact rea Plating Height bove oard Tail Length Hold Down Material Housing olor GP edge card 1.00 mm [.039 in.] Vertical oard through hole 0.8 V, 1.5 V, 3.3 V 1.57 mm [.062 in.] Direct Formed 0.2 µm [8 µin.] gold mm [.606 in.] 2.60 mm [.102 in.] or 3.10 mm [.122 in.] ronze alloy rown Other Properties: Packaging Type Housing Material pplicable Soldering Process ontact ase Material Insulation Resistance Withstanding Voltage urrent Rating ontact Resistance Voltage Rating Temperature Range ontinuous Operating Temperature Normal Force ontact Retention Force Durability (Mating ycles) Mating Force Unmating Force Plating (ontact rea) Plating (Soldering End) Underplating Standards pprovals and ertification Tubes or tray GF PT IR, vapor phase, wave Phosphor bronze 800 MΩ 400 V RMS 1 amp max. per contact 30 mω 150 or 250 V/D -20 to to N [30 gf] min N [1.5 lbf] 50 cycles 56.9 N [12.8 lbf] max N [7.7 lbf] min. Gold (thickness varies per Delphi spec.) over nickel underplating 2.54 µm [100 µin.] tin-lead over nickel underplating 1.27 µm [50 µin.] nickel ccelerated graphics port interface specification UL approved 64. Delphi onnection Systems

65 oard-to-oard ccelerated Graphics Port (GP) onnectors Ordering Nomenclature Selective Plating: Gold plated on contact area and 2.54 µm [100 µin.] min. tin-lead plated on soldering end over 1.27 µm [50 µin.] min. nickel underplating 1 = Gold Flash 2 = µm [15 µin.] 3 = µm [30 µin.] 0 = N/ Dim. - Solder Tail Length: 1 = 2.60 mm [.102 in.] 2 = 3.10 mm [.122 in.] P oard Layout 3X Ø X Ø = = PRT NO. DTE ODE X = = (2.8) 3.00 Unless otherwise specified, dimensions are shown in millimeters. ommercial onnector atalog 65.

66 ackplane Delphi s ackplane 2.0 Hard Metric onnectors are capable of addressing high density signal transmission requirements for industrial computing applications. Delphi backplane connectors are designed and manufactured to meet the emerging trend of higher density and faster signal transmission in the electronic industries and are ideal for ompactpi, telecom and datacom applications. 66. Delphi onnection Systems

67 ackplane ackplane 2.0 Hard Metric onnectors Delphi s ackplane onnectors are designed for most industry standard rack and panel cabinets. They are offered in three series, featuring a large, comprehensive family of standard 2.0mm Hard Metric onnectors, 2.0mm Hard Metric 8+2 onnectors, and Futurebus onnectors. It is a classic, reliable two-piece pin and socket connector system. Several important features of this system include: Five rows of signal contacts for maximum signal density Three mating levels for contact engagement sequencing and Hot Swap capability uilt-in alignment guides add reliable blind mating functionality ontents Intro mm Hard Metric onnector Series: Features and enefits Mechanical and Electrical haracteristics Ordering Information Vertical Male onnectors for Fixed oards: Type Type The 2.0mm Hard Metric 8+2 onnector series is a modular design for higher-density, two-piece backplane connection systems. It is a versatile connector offering eight rows of signal lines in mix-and-match solutions to complex I/O requirements. It also provides three mating length pins for mates-last, breaks-first options and reduced mating force. Integrated shielding is available to minimize EMI. Futurebus onnectors are another modular two-piece backplane connection system. This system features a generous lead-in to allow selfalignment for blind mating and offers five row versions for increased line/inch density. s with all Delphi 2.0mm backplane systems, these connectors are fully qualified to all applicable industry standards. ackplane Typical pplications: dd/drop multiplexers Servers Type Type L, M and N Right ngle Female onnectors for Free oards: Type Type Type Type L, M and N Shrouds for Vertical Male Type // onnectors oding Keys Shielding overs ustom Loading Worksheet. 95 pplication Tooling mm Hard Metric 8+2 onnectors Futurebus onnectors ompactpi, backplanes and daughter cards ompactpi, P3 and VME64 P0 models Switches VME64 daughter cards Futurebus backplanes and daughter cards Routers ommercial onnector atalog 67.

68 ackplane Delphi 2.0mm Hard Metric onnector Series Delphi 2.0mm Hard Metric onnectors are designed and manufactured to meet the emerging trend of higher density and faster signal transmission in the electronic industries and are ideal for ompactpi, telecom and datacom applications. Delphi 2.0mm Hard Metric onnectors comply with international IE 917 and IE standards. Features and enefits: Designed to meet the requirements of the IE 917 and IE for industry standard compatibility lassic, reliable two-piece pin and socket connector system Full range of configurations specially designed to meet the requirements of ompactpi applications as defined by the latest PIMG specifications 5 rows of signal contacts for maximum signal density Separate modules having a high density 2.0mm pin grid can be efficiently stacked end-to-end Three mating levels for contact engagement sequencing and Hot Swap capability Minimum contact wipe of 2.5mm for even the shortest pins Shielding available on both top and bottom for crosstalk control and EMI protection in high-speed signaling Suitable for sub-nano second risetimes to meet the requirements of highspeed system designs Improved impedance, propagation delay, crosstalk and back-reflection compared to other 2mm HM products Proven eye-of-the-needle compliant press-fit design provides a highly reliable, gas-tight connection to the P ompliant pins press into small 0.6mm diameter plated through holes for easier P routing Flexible "ode Key" indexing system for fool-proof, user defined card slot discrimination Extended rear pins available for through-the-backplane I/O applications vailable with pre-lubricated contacts for severe environments or systems requiring adherence to Telcordia GR-1217 ORE specifications (Telcordia tests pending) uilt-in alignment guides add reliable blind mating functionality Hybrid and special purpose modules provide mixed signal, power, and coaxial contacts Fully compatible with systems designed according to the Hard Metric Equipment Practice standard as defined in DIN 43356, IEEE 1301, and NSI/VIT The data presented within does not account for all variables that would be present in an actual application. Please contact Delphi for additional customer-specific application information or use the ustom Loading Worksheet on page 95. PIMG, ompactpi, and the PIMG and ompactpi logos are trademarks of the PI Industrial omputer Manufacturers Group. 68. Delphi onnection Systems

69 ackplane Delphi 2.0mm Hard Metric onnector Series Type onnectors Type onnectors Type onnectors Type L onnectors Type M onnectors Type N onnectors Shrouds oding Keys Shielding overs ommercial onnector atalog 69.

70 ackplane 2.0mm Hard Metric Mechanical and Electrical haracteristics Mechanical Specifications Grid Size Operating Temperature 2.0mm -55 to +125 Insulation Material Glass filled Polyester, UL 94V-0 ontact Material reepage and learance Distance Phosphor ronze Male 0.8mm, Female 0.6mm ontact Levels 5.3mm - Level 1 6.8mm - Level 2 8.3mm - Level 3 Mating Force per Signal ontact Mating Force per Shield ontact Withdrawal Force Termination Technique Misalignment Inclination 0.75N Max. 1N Max. 0.15N Min. ompliant Press-Fit Longitudinal - 2.0mm Transverse - 2.0mm ±2 degrees Electrical Performance urrent Rating 1.5 at 20, 1.0 at 70 Test Voltage 750 Vrms ontact Resistance 20mΩ Max. Insulation Resistance 10,000MΩ Min. Recommended P... Plated Through Holes Drilled Hole ø mm u Min. 25µm Sn 5-15µm Plated Through Hole ø mm Performance Levels Mating ycles 2 (Standard) 250 Mating ycles 70. Delphi onnection Systems

71 2.0mm Hard Metric ackplane Ordering Information Delphi onnection Systems 2.0mm Hard Metric onnector Part Number System allows users to create most standard part number configurations. oding Keys (page 93) and Shielding overs (page 94) are also available for ordering. For custom loadings, please use the worksheet on page 95 and contact the factory for special part number assignments. HM 11 M S02 General 2mm HM Designator Primary omponent N ode Key 17 L 27 Tool 18 M Gender / Option Selector Reconfigurable Option ode M F S X Male Female Shroud ustom S 0 2 S 0 2 N S Pin Type See Male ontact Options Performance lass ** 0 - Not pplicable 1 - Level Level 2 (standard) Shielding ** 0 - None 1 - Row f 2 - Row z 3 - Rows f & z Secondary onfiguration S - Standard V - 22, 22 * W - 19, 19 * PI Sub lass (if applicable) N - None T - Telephony R - Reverse Telephony Performance lass ** 0 - Not pplicable 1 - Level Level 2 (standard) Shielding ** 0 - None 1 - Upper Secondary onfiguration S - Standard V - 22, 22 * W - 19, 19 * Standoff Height - 0.9mm - 1.1mm - 1.3mm D - 1.5mm E - 1.7mm F - 1.9mm Not Used Not Used Secondary onfiguration S - Standard V - 22, 22 * W - 19, 19 * Serial numbers are assigned by Factory * pplicable on "" & "" modules only ** Not applicable on "L" & "N" modules Male ontact Options N = not applicable D E F G H J K L M Front mating Seating plane L3 L2 L1 3.7±0.3 13± ±0.3 16±0.3 Rear mating Please Note: Specifications are subject to change without notice. ll dimensions are in millimeters unless otherwise specified. ommercial onnector atalog 71.

72 ackplane 2.0mm Hard Metric Vertical Male Type onnectors for Fixed oards The type connector provides 110 signal contacts plus 44 optional shielding contacts in 5 rows and 22 columns with an additional 2 rows for grounding. The multipurpose center provides alignment guides and accepts optional coding keys. locating peg positively indexes the part during assembly and ensures proper orientation. Various standard configurations are shown here, including the popular ompactpi models, but custom pin loading is possible. Please see page 95 for the "ustom Loading Worksheet". Dimensions z a b c d e f X2=12 Delphi Part Number Date ode x 2 = 48 Recommended P... Layout 0.6± z a b c d e f Dimensions shown are for reference only. ll dimensions are in millimeters unless otherwise specified. 72. Delphi onnection Systems

73 2.0mm Hard Metric ackplane Vertical Male Type onnectors for Fixed oards Ordering Information L1, Stub Tail, No Shield Pins Loading Drawing Number of Pins Part Number z a b c d e f 110 HM11MS L2, Stub Tail, No Shield Pins z a b c d e f 110 HM11MS L1, Stub Tail, Shield Rows f & z z a b c d e f 154 HM11MS Male ontact Options D E F G H J K L M Front mating Seating plane L3 L2 L1 3.7±0.3 13± ±0.3 16±0.3 Rear mating Dimensions shown are for reference only. ll dimensions are in millimeters unless otherwise specified. ommercial onnector atalog 73.

74 74. Delphi onnection Systems f e d c b a z f e d c b a z ompactpi Hot Swap P1 ompactpi Telephony Spec P Loading Drawing of Pins Number HM11X0005 HM11X0001 Part Number e 2 1 f d c b z a 154 HM11MS32 L2, Stub Tail, Shield Rows f & z Vertical Male Type onnectors for Fixed oards Ordering Information ± ± ±0.3 D E F G H Seating plane 16±0.3 Front mating J K L M Rear mating L3 L2 L1 Male ontact Options Dimensions shown are for reference only. ll dimensions are in millimeters unless otherwise specified. ackplane 2.0mm Hard Metric

75 2.0mm Hard Metric ackplane Vertical Male Type 25 onnectors for Fixed oards The type 25 vertical male connector provides 125 signal contacts and 50 optional shielding contacts in 5 rows and 25 columns with an additional 2 rows for shielding. ll are end to end stackable with no change in contact pitch. Various standard configurations are available, but custom pin loading is possible. Please see page 95 for the "ustom Loading Worksheet". Dimensions z a b c d e f X2=12 Delphi Part Number Date ode x 2 = 48 Recommended P... Layout 0.6± z a b c d e f Dimensions shown are for reference only. ll dimensions are in millimeters unless otherwise specified. ommercial onnector atalog 75.

76 ackplane 2.0mm Hard Metric Vertical Male Type 25 onnectors for Fixed oards Ordering Information Loading Drawing Number of Pins Part Number 25 L1, Stub Tail, No Shield Pins z a b c d e f 125 HM12MS L2, Stub Tail, No Shield Pins z a b c d e f 125 HM12MS L1, Stub Tail, Shield Rows f & z z a b c d e f 175 HM12MS L2, Stub Tail, Shield Rows f & z z a b c d e f 175 HM12MS Male ontact Options D E F G H J K L M Front mating Seating plane L3 L2 L1 3.7±0.3 13± ±0.3 16±0.3 Rear mating Dimensions shown are for reference only. ll dimensions are in millimeters unless otherwise specified. 76. Delphi onnection Systems

77 2.0mm Hard Metric ackplane Vertical Male Type 22 onnectors for Fixed oards The type 22 vertical male connector provides signal contacts and 44 optional shielding contacts respectively in 5 rows and 22 columns with an additional 2 rows for grounding. ll are end to end stackable with no change in contact pitch. Various standard configurations are shown here, including the popular ompactpi models, but custom pin loading is possible. Please see page 95 for the "ustom Loading Worksheet". Dimensions z a b c d e f X2=12 Delphi Part Number Date ode x 2 = 42 Recommended P... Layout 0.6± z a b c d e f Dimensions shown are for reference only. ll dimensions are in millimeters unless otherwise specified. ommercial onnector atalog 77.

78 ackplane 2.0mm Hard Metric Vertical Male Type 22 onnectors for Fixed oards Ordering Information Loading Drawing 22 L1, Stub Tail, No Shield Pins Number of Pins Part Number z a b c d e f 110 HM12MV L2, No Shield Pins z a b c d e f 110 HM12MV L1, Stub Tail, Shield Rows f & z z a b c d e f 154 HM12MV ompactpi P2 & P5 asic onfiguration z a b c d e f 154 HM12MV ompactpi Telephony Spec P5 z a b c d e f 154 HM12MV Delphi onnection Systems

79 2.0mm Hard Metric ackplane Vertical Male Type 19 onnectors for Fixed oards The type 19 vertical male connector provides 95 signal contacts and optional shielding contacts respectively in 5 rows and 19 columns with an additional 2 rows for grounding. ll are end to end stackable with no change in contact pitch. Various standard configurations are available, including the popular ompactpi P3 and VME64 P0 models, but custom pin loading is possible. Please see page 95 for the "ustom Loading Worksheet". Dimensions z a b c d e f X2=12 Delphi Part Number Date ode x 2 = 36 Recommended P... Layout 0.6± z a b c d e f Dimensions shown are for reference only. ll dimensions are in millimeters unless otherwise specified. ommercial onnector atalog 79.

80 80. Delphi onnection Systems Vertical Male Type 19 onnectors for Fixed oards Ordering Information Dimensions shown are for reference only. ll dimensions are in millimeters unless otherwise specified ± ± ±0.3 D E F G H Seating plane 16±0.3 Front mating J K L M Rear mating L3 L2 L1 Male ontact Options Loading Drawing of Pins 95 Number HM12MW32 HM12MW32 HM12MW02 Part Number HM12MW f e d c b a z f e c d b z a f e c d b z a f e c d b z a ompactpi P3, 19, L1, Stub Tail, No Shield Pins 19, L2, Stub Tail, No Shield Pins 19, L1, Stub Tail, Shield Rows f & z 19, L2, Stub Tail, Shield Rows f & z ackplane 2.0mm Hard Metric

81 2.0mm Hard Metric ackplane Vertical Male Type onnectors for Fixed oards The type vertical male connector provides 55 signal contacts and 22 optional shielding contacts in 5 rows and 11 columns of primary contacts with an additional 2 rows for shielding. This half-size connector is polarized and the insulator features guides for alignment of the mating connectors. ustom pin loading is possible. Please see page 95 for the "ustom Loading Worksheet". Dimensions z a b c d e f X2=12 Delphi Part Number Date ode x2=20 Recommended P... Layout 0.6± z a b c d e f Dimensions shown are for reference only. ll dimensions are in millimeters unless otherwise specified. ommercial onnector atalog 81.

82 ackplane 2.0mm Hard Metric Vertical Male Type onnectors for Fixed oards Ordering Information Loading Drawing Number of Pins Part Number L1, Stub Tail, No Shield Pins z a b c d e f 55 HM13MS L2, Stub Tail, No Shield Pins z a b c d e f 55 HM13MS L1, Stub Tail, Shield Rows f & z z a b c d e f 77 HM13MS L2, Stub Tail, Shield Rows f & z z a b c d e f 77 HM13MS Male ontact Options D E F G H J K L M Front mating Seating plane L3 L2 L1 3.7±0.3 13± ±0.3 16±0.3 Rear mating Dimensions shown are for reference only. ll dimensions are in millimeters unless otherwise specified. 82. Delphi onnection Systems

83 2.0mm Hard Metric ackplane Vertical Male Type L/M/N onnectors for Fixed oards These connectors have 3 or 6 cavities for high current or coaxial contacts. The multipurpose center on type L and M provides alignment guides and accepts optional coding keys. The half-size type N also provides additional guidance when used on the end of a card slot. Dimensions Type L max 15.4 Delphi Part Number Date ode Recommended P... Layout Type L Part Number HM17MS00N Dimensions shown are for reference only. ll dimensions are in millimeters unless otherwise specified. ommercial onnector atalog 83.

84 ackplane 2.0mm Hard Metric Vertical Male Type L/M/N onnectors for Fixed oards Dimensions Type M Recommended P... Layout Type M z a b c d e f x2= max 2 0.6± z a b c d e f Delphi Part Number Date ode This hybrid configuration offers both signal and ground contacts, plus 3 cavities for special purpose contacts Unshielded Part Number HM18MS02 Shielded Part Number HM18MS32 Dimensions Type N Recommended P... Layout Type N max 3.75max Part Number HM19MS00N Dimensions shown are for reference only. ll dimensions are in millimeters unless otherwise specified. 84. Delphi onnection Systems

85 2.0mm Hard Metric ackplane Right ngle Female Type onnectors for Free oards The type right angle female connector provides 110 contacts in a 5 row by 22 column configuration. The multipurpose center provides basic alignment and accepts optional code keys. This connector, in standard and special configurations, is used in the J1 and J4 positions of the ompactpi daughter cards. Upper and lower* ground shields are also available. * Lower shields are ordered separately and customer installed. See page 94. Dimensions a b c d e x 2 = x2= Delphi Part Number Date ode Shown with optional alignment pins Recommended P... Layout f e d c b a 0.6± ±0.1 Unshielded configuration shown Shown with optional alignment pins Unshielded Part Number * Shielded Part Number * HM11FS02N HM11FS12N * Part number without optional alignment pins. ommercial onnector atalog 85.

86 ackplane 2.0mm Hard Metric Right ngle Female Type 25 onnectors for Free oards The type 25, right angle female connector provides 125 signal contacts in a 5 row by 25 column configuration. Upper and lower* shields are optional. * Lower shields are ordered separately and customer installed. See page 94. Dimensions 24 x 2 = 48 a b c d e 4x2= Delphi Part Number Date ode Recommended P... Layout f e d c b a 0.6± ±0.1 Unshielded configuration shown 25 1 Unshielded Part Number Shielded Part Number HM12FS02N HM12FS12N Dimensions shown are for reference only. ll dimensions are in millimeters unless otherwise specified. 86. Delphi onnection Systems

87 2.0mm Hard Metric ackplane Right ngle Female Type 22 onnectors for Free oards The right angle female type 22 connector provides 110 signal contacts in a 5 row by 22 column configuration. This connector is also used in the J2 and J5 locations of ompactpi daughter cards. Upper and lower* shields are optional. * Lower shields are ordered separately and customer installed. See page 94. Dimensions 21 x 2 = 42 a b c d e 4x2= Delphi Part Number Date ode Recommended P... Layout 0.6± f e d c b a 2 1.5±0.1 Unshielded configuration shown 22 1 Unshielded Part Number HM12FV02N Shielded Part Number HM12FV12N Dimensions shown are for reference only. ll dimensions are in millimeters unless otherwise specified. ommercial onnector atalog 87.

88 ackplane 2.0mm Hard Metric Right ngle Female Type 19 onnectors for Free oards The right angle female type 19 connector provides 95 signal contacts in a 5 row by 19 column configuration. This connector is used in the J3 location of ompactpi daughter cards, and the J0 location on VME64 daughter cards. Upper and lower* shields are optional. * Lower shields are ordered separately and customer installed. See page 94. Dimensions 17 x 2 = 34 a b c d e 4x2= Delphi Part Number Date ode Recommended P... Layout f e d c b a 0.6± ±0.1 Unshielded configuration shown 19 1 Unshielded Part Number HM12FW02N Shielded Part Number HM12FW12N Dimensions shown are for reference only. ll dimensions are in millimeters unless otherwise specified. 88. Delphi onnection Systems

89 2.0mm Hard Metric ackplane Right ngle Female Type onnectors for Free oards The right angle female half-size type connector is polarized and provides 55 signal contacts in a 5 row by 11 column configuration. Upper and lower* shields are optional. * Lower shields are ordered separately and customer installed. See page 94. Dimensions 10x2=20 a b c d e Delphi Part Number Date ode Recommended P... Layout 1.5± f e d c b a Unshielded configuration shown 11 1 Unshielded Part Number HM13FS02N Shielded Part Number HM13FS12N Dimensions shown are for reference only. ll dimensions are in millimeters unless otherwise specified. ommercial onnector atalog 89.

90 ackplane 2.0mm Hard Metric Right ngle Female Type L/M/N onnectors for Free oards These connectors have 3 or 6 cavities for high current, coaxial or fiber optic contacts. The multipurpose center on type L and M provides alignment guides and accepts optional coding keys. The half-size type N also comes with polarized guide pins. * Lower shields for type M are ordered separately and customer installed. See page 94. Dimensions Type L Delphi Part Number Date ode 6 50 Recommended P... Layout Type L 3.5± (Not plated through) (Plated through) (Not plated through) Part Number HM17FS00N Note: Drilling pattern for special purpose contacts may vary depending upon the contact selection. 90. Delphi onnection Systems

91 2.0mm Hard Metric ackplane Right ngle Female Type L/M/N onnectors for Free oards Dimensions Type M Recommended P... Layout Type M x2= a b c d e 1.5± ± f e d c b a (Not plated through) (Plated through) (Not plated through) Unshielded configuration shown Delphi Part Number Date ode Unshielded Part Number HM18FS02N Shielded Part Number HM18FS12N Dimensions Type N Recommended P... Layout Type N 3.75max ± (Not plated through) (Plated through) (Not plated through) Delphi Part Number Date ode Unshielded Part Number HM19FS00N Dimensions shown are for reference only. ll dimensions are in millimeters unless otherwise specified. ommercial onnector atalog 91.

92 ackplane 2.0mm Hard Metric Shrouds for Vertical Male Type // onnectors Shrouds are fitted over the rear of a male connector with rear plug up tails to provide a protected mating interface. Shrouds with 6 different standoff heights are provided for application in various thickness of backplanes. Dimensions 1 MX 1 MX 1 MX 1 MX z z a a b c d e b c d e f f 24 x 2 = x 2 = Delphi Part Number Date ode a Delphi Part Number Date ode a MX x2= Delphi Part Number Date ode 1 z a b c d e f a Stand-off Height Dimension = 0.9mm = 1.1mm = 1.3mm D = 1.5mm E = 1.7mm F = 1.9mm Dimensions shown are for reference only. ll dimensions are in millimeters unless otherwise specified. 92. Delphi onnection Systems

93 2.0mm Hard Metric ackplane oding Keys oding keys are optionally used in both male and female type, L and M connectors to help ensure the proper insertion of cards. Only connector pairs equipped with matching coding keys are intermateable. The unique color of the coding pairs provides easy visual identification of the correct mating connectors. Fixed oard Keys Free oard Keys oding Key ode Number olor Part Number oding Key ode Number olor Part Number Pastel orange HM25M Pastel orange HM25F Steel blue HM25M Steel blue HM25F Slate grey HM25M Slate grey HM25F admium yellow HM25M admium yellow HM25F Reseda green HM25M Reseda green HM25F rilliant blue HM25M rilliant blue HM25F lue/lilac HM25M lue/lilac HM25F Ochre yellow HM25M Ochre yellow HM25F Strawberry red HM25M Strawberry red HM25F Nut brown HM25M Nut brown HM25F4578 The color/code number combinations listed above follow IE recommendations. onsult factory for other versions. ommercial onnector atalog 93.

94 ackplane 2.0mm Hard Metric Shielding overs The optional upper shields are pre-installed on the female connectors, however the lower shields are assembled separately after installing the connectors onto the printed circuit board. Dimensions Upper Shield Delphi Part Number Date ode Delphi Part Number Date ode Delphi Part Number Date ode Lower Shield Delphi Part Number Date ode Delphi Part Number Date ode Delphi Part Number Date ode Part Number HM11X0202 HM12X0202 HM12X0204 HM12X0206 HM13X0202 Description Lower Shield Female Lower Shield 25 Female Lower Shield 22 Female Lower Shield 19 Female Lower Shield /M Female Dimensions shown are for reference only. ll dimensions are in millimeters unless otherwise specified. 94. Delphi onnection Systems

95 Delphi 2.0mm Hard Metric onnectors / ustom Loading Worksheet ackplane ompany: ontact Name: ddress: Phone: Fax: nnual Forecast: Sample Qty. Required: Signature: Date: Fill in the diagram below with desired pin type. Unfilled positions to be left blank. Fax to [1] Type onnector z a b c d e f Type onnector z a b c d e f Type onnector Type M onnector z a b c d e f z a b c d e f Pin Options D E F G H J K L M Front mating Seating plane L3 L2 L1 3.7±0.3 13± ±0.3 16±0.3 Rear mating Dimensions shown are for reference only. ll dimensions are in millimeters unless otherwise specified. ommercial onnector atalog 95.

96 ackplane 2.0mm Hard Metric pplication Tooling Male onnector Insertion Upper Mounting Rail Upper Insert onnector P... P... Support Lower Mounting Rail Ordering Information Description Upper Mounting Rail Lower Mounting Rail Tool Part Number HM27M0061 HM27M0071 Upper Insert Type HM27M0001 Upper Insert Type 25 HM27M0002 Upper Insert Type 22 HM27M0003 Upper Insert Type 19 HM27M0004 Upper Insert Type HM27M0005 P... Support Type P... Support Type 25 P... Support Type 22 P... Support Type 19 P... Support Type HM27M0101 HM27M0102 HM27M0103 HM27M0104 HM27M Delphi onnection Systems

97 2.0mm Hard Metric ackplane pplication Tooling Female onnector Insertion Upper dapter ar I Upper Insert onnector Simple Inserter P... onnector P... P... Support Tool P... Support Tool Ordering Information Description Upper dapter ar I P... Support Tool Tool Part Number HM27F0061 HM27F0071 Simple Inserter Type HM27F0101 Simple Inserter Type 25 HM27F0102 Simple Inserter Type 22 HM27F0103 Simple Inserter Type 19 HM27F0104 Simple Inserter Type HM27F0105 Upper Insert Type HM27F0001 Upper Insert Type 25 HM27F0002 Upper Insert Type 22 HM27F0003 Upper Insert Type 19 HM27F0004 Upper Insert Type HM27F0005 ommercial onnector atalog 97.

98 ackplane 2mm Hard Metric 8+2 onnectors Description: Modular, high-density, two-piece backplane connection system Typical pplications: Servers Switches Routers dd/drop multiplexers enefits/features: Industry Standard.. Meets IE performance requirements and extends mounting, mating and other specifications from the 5+2 series. Versatility onfigurations similar to the 5+2 series allow mix-andmatch to create solutions to complex I/O requirements. Three mating length pins allow thousands of early mate, last break options and reduced mating force. Integrated shielding available to minimize EMI. Extended tails available for through the backplane I/O. Flexible code-key indexing for user-defined slot discrimination. Reliability Generous lead-in allows self-alignment for blind mating. Minimum contact wipe of 2mm for all pin lengths. Mechanical and Electrical haracteristics: Mechanical Specifications Grid Size Temperature Range Insulation Material ontact ase Material reepage and learance Distance ontact Levels Tail Lengths (±0.3) Mating Force per Signal ontact 2.0 mm -55 to +105 Glass filled polymer, UL 94V-0 Phosphor bronze 0.40 mm contact row 0.40 mm adjacent contacts 5.3, 6.8, 8.3 mm 3.7, 13.0, 14.5, 16.0 mm 0.75 N [0.169 lbf] max. Unmating Force 0.12 N [0.027 lbf] min. Termination Technique Press-fit Misalignment 2.0 mm Inclination Longitudinal: ±2 Transverse: ±2 Electrical Performance urrent Rating 1 amp Voltage Rating 30 V Insulation Resistance Initial: 10,000 MΩ Dielectric Withstanding Voltage 750 V Recommended P Plated Through Holes Drilled Hole mm u 0.25 µm min. Sn 0.10 µm max. Plated Through Hole mm Performance lass mating cycles mating cycles 98. Delphi onnection Systems

99 ackplane 2mm Hard Metric 8+2 onnectors Ordering Nomenclature HM14M S 0 2 Part Number: Male D... HM14M E... HM15M F... HM16M DE.. HM30M Female D... HM14F E... HM15F F... HM16F DE.. HM30F Shielding: Male 0 = None 2 = Row Z 1 = Row Y 3 = Row Y & Z Shielding: Female 0 = None 2 = ottom 1 = Upper 3 = oth Performance lass: 1 = Perf. lass 1 2 = Perf. lass 2 3 = Perf. lass 1 with LU 4 = Perf. lass 2 with LU Pin Type: Male See Table 1 Pin Type: Female N = None Sub-onfiguration: S = Standard V = 22 column (E & DE only) W = 19 column (E & DE only) HM14M HM15M HM16M HM30M HM14F HM15F HM16F HM30F Dimensions are shown in millimeters. ommercial onnector atalog 99.

100 ackplane F uturebus onnectors Description: Modular two-piece backplane connection system Typical pplications: Servers Switches Routers dd/drop multiplexers enefits/features: Industry Standard.. Meets IE specification identifying mounting, mating, and performance requirements. Versatility Standard "block" sizes allow mix-and-match to create simple modular solutions row versions are available for increased line/inch density Multiple length pins allow virtually unlimited variations of EML (Early Mate, Last reak) and reduced mating force Solder-tail and press-fit versions are available and intermateable. Reliability Generous lead-in allows self-alignment for blind mating Several gold plating options are available for improved reliability. Mechanical and Electrical haracteristics: Mechanical Specifications Grid Size Temperature Range 2.0 mm -55 to +125 Insulation Material Glass filled LP, UL 94V-0 ontact ase Material reepage and learance Distance ontact Levels (Post Lengths) Mating Force per Signal ontact Unmating Force Termination Technique Misalignment Phosphor bronze 0.40 mm contact row 0.40 mm adjacent contacts Press-fit: 4.25 mm Solder-tail: 3.2, 4.25 mm 0.7 N [0.16 lbf] max N [0.027 lbf] min. Press-fit or solder-tail Transverse: 2.5 mm Inclination Longitudinal: ± 4 Transverse: ± 2 Electrical Performance urrent Rating Voltage Rating ontact Resistance Insulation Resistance Dielectric Withstanding Voltage Recommended P Plated Through Holes Drilled Hole u Sn 1 amp (25º) 30 V 25, 35, 40, 45, 50 mω (rows a-e, respectively) Initial: 5000 MΩ Final: 100 MΩ 1000 V mm 0.25 µm min µm max. Plated Through Hole /-0.10 Performance Levels mating cycles 100. Delphi onnection Systems

101 ackplane F uturebus onnectors Dimensions are shown in millimeters [inches]. onsult factory for selective loading configurations. Ordering Nomenclature R/ Female: 4 Row, Press-Fit Row, Press-Fit Row, Solder-Tail Row, Solder-Tail Male: 4 Row, Press-Fit Row, Press-Fit R/ Female ontact Dimension: 0 = N/ Male Press-Fit ontact Dimension: /D 0 = 5.00/4.50 mm 3 = 7.25/4.50 mm 1 = 5.75/4.50 mm 4 = 8.00/4.50 mm 2 = 6.50/4.50 mm Number of locks: 1, 2, 4, 6, and 8 ontact Plating Thickness: 1 = 30 µin 2 = 50 µin 3 = 80 µin Male: 4 Row, Solder-Tail Row, Solder-Tail Male Solder-Tail ontact Dimension: /D 0 = 5.00/3.20 mm 5 = 5.00/4.25 mm 1 = 5.75/3.20 mm 6 = 5.75/4.25 mm 2 = 6.50/3.20 mm 7 = 6.50/4.25 mm 3 = 7.25/3.20 mm 8 = 7.25/4.25 mm 4 = 8.00/3.20 mm 9 = 8.00/4.25 mm ommercial onnector atalog

102 Pin and Socket Delphi has a broad range of Pin and Socket solutions to offer. With centerline spacings from 1mm, in., 2mm, and in., we have the right options to fit your requirements. Single, double, and triple row designs are available in vertical or right angle orientations with through hole and surface mount attachments to provide endless design applications Delphi onnection Systems

103 Pin and Socket S olutions Pin and Socket ontents The Delphi onnection Systems Pin and Socket onnector family includes: inch Pitch Headers, Shrouded Headers, Receptacles and Shunts, 2mm Pitch Headers, Receptacles and Shunts, inch Pitch Headers and Receptacles, 1mm Pitch Headers and Receptacles, Pin and Socket interconnection systems offer a variety of headers, stacking headers, receptacles and shunts to meet the requirements of almost any board-to-board or flex-to-board interconnect. Headers are available in surface mount or through hole technology and are offered in single, dual and triple row configurations in various sizes. Shrouded headers are available in dual row configurations. Stacking headers, also known as "railroad track" headers, utilize through hole technology in single or dual row configurations. Receptacles can be provided in surface mount or through hole technology with top entry or bottom entry mating styles. Shunts are configured as 1 x 2 and are available in standard or low profile styles. Pin & Socket Typical pplications: ompact peripherals omputing devices onsumer devices Handheld electronics Handsets Industrial controllers Medical instruments Pagers and PDs and monitoring equipment Portable test and measurement equipment Other portable electronic devices Intro in. Pitch Headers & Receptacles in. Pitch Headers, Receptacles & Shunts: Description, pplications Product Specifications pplication / Packaging Receptacles: Standard Profile, Through Hole Low Profile, Through Hole Standard Profile, Surface Mount Low Profile, Surface Mount Headers: Standard Profile, Through Hole Standard Profile, Stacking Standard Profile, Surface Mount Shunts in. enterline Shrouded Headers mm Pitch Headers & Receptacles mm Pitch Headers, Receptacles & Shunts: Description, pplications Product Specifications pplication / Packaging Receptacles: Standard Profile, Through Hole Standard Profile, Surface Mount Low Profile, Surface Mount Headers: Standard Profile, Through Hole Standard Profile, Surface Mount Standard Profile, Straddle Mount Low Profile, Surface Mount Ultra Low Profile, Surface Mount Shunts: Standard Profile Low Profile ommercial onnector atalog

104 Pin and Socket in. Pitch Headers and R eceptacles Description Delphi onnection Systems inch headers and receptacles offer design flexibility for applications wherever there is a need for low profile, high-density compact interconnections. The inch pitch interconnection system consists of through hole or Surface Mount Technology (SMT) headers and Surface Mount Technology receptacles that meet requirements for fine pitch, board-to-board interconnections. Headers The inch through hole and SMT headers are offered in two standard pin lengths; 1.52 mm [0.060 in.] and 2.29 mm [0.090 in.]. The mm [0.016 in.] square pins are made of high strength copper alloy. The right angle headers are offered in four different pin lengths (see ordering nomenclature on page 105). Stacking Headers The inch stacking headers are offered in three pin lengths. Standard stack heights available range from a minimum of 3.15 mm [0.124 in.] to 9.55 mm [0.376 in.] for mm [0.031 in.] boards.the mm [0.016 in.] square pins are made of high strength copper alloy. Receptacles The inch receptacles utilize SMT and are available in top entry form only. The stamped and formed contacts are beryllium copper. Typical pplications Digital cellular phones Handsets PDs Portable test and measurement equipment Pagers Notebook computers ompact peripherals Other portable electronic devices Performance haracteristics Headers Stacking Headers Receptacles Total No. of Positions 4 to 30 (straight) 4 to 30 4 to 30 4 to 50 (right angle) Number of Rows Orientation Vertical or right angle (or horizontal) Vertical Vertical (top entry) Mounting Style Through hole or surface mount (SMT) Through hole Surface mount (SMT) ontact Style Stamped and formed Stamped and formed Stamped and formed Packaging Type (Through Hole) ulk or tubes ulk or tubes _ (SMT) Tubes (standard) or Tape & reel Tubes (standard) or Tape & reel Insulator Material High temperature thermoplastic, UL94V-O High temperature thermoplastic, UL94V-O Liquid rystal Polymer (LP), UL94V-O ontact ase Material opper alloy opper alloy eryllium copper ontact Resistance 20 mω max. 20 mω max. 20 mω max. Operating Temperature -40 to to to +105 Durability (Mating ycles) 50 cycles 50 cycles 50 cycles Mating Force 6 oz. max. (1.67 N) 6 oz. max. (1.67 N) 6 oz. max. (1.67 N) Unmating Force 0.75 oz. min. (0.21 N) 0.75 oz. min. (0.21 N) 0.75 oz. min. (0.21 N) Plating (ontact rea) 1.27 µm [50 µin.] nickel underplate overall 1.27 µm [50 µin.] nickel underplate overall 0.75 µm [30 µin.] nickel underplate overall and 0.38 µm [15 µin.] 80/20 palladium nickel and 0.38 µm [15 µin.] 80/20 palladium nickel and 0.25 µm [10 µin.] gold overall with gold flash overall with gold flash overall 104. Delphi onnection Systems

105 Pin and Socket in. Pitch Headers Ordering Nomenclature Through Hole Headers TH50D 02 S10-01 Packaging: = ulk T = Tubes Pins/Row: 02 through 15 Tail Length: 01 = 1.52 mm [0.060 in.] 02 = 2.29 mm [0.090 in.] Recommended P Layout Right ngle Headers Ordering Nomenclature TH50D 02 R Pins/Row: 02 through 25 Packaging: = ulk T = Tubes Post (Dim. ) / Tail (Dim. ) Version: 01 = 1.83 [.072] / 4.27 [.168] 02 = 1.83 [.072] / 2.29 [.090] 03 = 1.83 [.072] / 1.52 [.060] 04 = 3.99 [.157] / 1.52 [.060] Recommended P Layout Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

106 Pin and Socket in. Pitch Headers SMT Headers Ordering Nomenclature SMH50D T Pins/Row: 02 through 15 Packaging: T = Tubes (standard) R = Tape and reel Recommended P Layout Stacking Headers Ordering Nomenclature S50D Tail Length (Dim. ): Specify mm to one decimal place Post Length (Dim. ): Specify mm to one decimal place Pins/Row: 02 through 15 oard-to-oard Spacing (Dim. ): Specify mm to one decimal place Note: Dim. + Dim. + Dim. = 6.3 mm [.250 in.] or 10.2 mm [.400 in.] or 12.7 mm [.500 in.] Recommended P Layout Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches] Delphi onnection Systems

107 Pin and Socket in. Pitch Receptacles Ordering Nomenclature T Packaging: T = Tubes (standard) R = Tape and reel Top Entry Receptacles Pins/Row: 02 through 15 Recommended P Layout Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

108 Pin and Socket Delphi onnection Systems.100 in. interconnection system offers a variety of headers, stacking headers, receptacles and shunts to meet the requirements of any.100 in. board-to-board or flex-to-board interconnect Delphi onnection Systems

109 .100 in. Pitch Headers, Receptacles Pin and Socket & Shunts Headers Headers utilize surface mount or through hole technology and are offered in single, dual and triple row configurations in various sizes. Stacking Headers Stacking headers utilize through hole technology in single or dual row configurations. Sizes are available up to 36 pins per row with various pin lengths to accommodate board spacing requirements from 4.60 mm [0.181 in.] to 25.4 mm [1.00 in.]. Optional board retention features are available. Receptacles Receptacles utilize surface mount or through hole technology and are available in top entry or bottom entry formats that mate with standard 0.64 mm [.025 in.] square pins. Single and dual row configurations are offered in various sizes. Shunts Shunts are configured as 1 x 2 and are available in two different heights. Insulators are made of glass-filled thermoplastic. Stamped and formed contacts are made of high performance copper alloy with gold flash plating overall. Industry pprovals Delphi s.100 inch pitch headers, receptacles and shunts have been granted recognition by Underwriters Laboratories and are included as recognized components in UL File E Testing was conducted per the Standard for omponent onnectors for Use in Data, Signal, ontrol and Power pplications, UL1977. These components have also been granted certification by the anadian Standards ssociation per S Std No M1987 and are included in S File LR Typical pplications Depending on the orientation of the printed wiring board and overall stacking height, there are endless applications suitable for using Delphi s.100 in. pitch headers and receptacles. These products are suitable for low power signal applications including: omputers Medical instruments utomotive controls Please refer to pages 111 and 112 for application and packaging schemes and overall stacking height guidelines between parallel boards. Performance haracteristics - Headers and Receptacles ontact Style Stamped and formed ontact Material High performance copper alloy Insulator Material UL94V-0 thermoplastic Plating Tin/lead or selective gold with tin/lead plated tails Optional Plating Palladium nickel with gold flash available ommercial onnector atalog

110 Pin and Socket.100 in. Pitch General Product Specifications Headers Series onfiguration Orientation Lead Profile 2HSXXS Single row Vertical Through Standard 2HDXXS Dual row Vertical Through Standard 3HSXXS Single row Vertical Through Standard 3HDXXS Dual row Vertical Through Standard 2HSXXR Single row Right angle Through Standard 2HDXXR Dual row Right angle Through Standard 3HSXXR Single row Right angle Through Standard 3HDXXR Dual row Right angle Through Standard SM2HSXXS Single row Vertical SMT Standard SM2HDXXS Dual row Vertical SMT Standard SM3HSXXS Single row Vertical SMT Standard SM3HDXXS Dual row Vertical SMT Standard 2HTXXS Triple row Vertical Through Standard 2HTXXR Triple row Right angle Through Standard 3HTXXS Triple row Vertical Through Standard 3HTXXR Triple row Right angle Through Standard Receptacles Stacking Headers Series onfiguration Lead SS Single row Through SD Dual row Through Shunts Series onfiguration Orientation Lead Type Profile 101 Single row Right angle Through Horizontal entry Standard 102 Dual row Right angle Through Horizontal entry Standard 103 Single row Vertical Through Top entry Standard 104 Dual row Vertical Through Top entry Standard 106 Dual row Vertical Through ottom entry Standard 301 Single row Vertical Through Top entry Standard 302 Dual row Vertical Through Top entry Standard 304 Single row Vertical Through Top entry Low 305 Dual row Vertical Through Top entry Low 307 Dual row Vertical SMT Top entry Standard 308 Dual row Vertical SMT Top entry Low Performance haracteristics Series 2J Height 4.5 mm [0.177 in.] or 6.00 mm [0.235 in.] Headers and Stacking Headers Receptacles Shunts urrent Rating 4.0 amps max. 4.0 amps max. 1.0 amp max. ontact Resistance 20 mω max. 30 mω max. Dielectric Withstanding Voltage 1000 VRMS min VRMS min. 500 VRMS min. Insulation Resistance 1 x 10 4 MΩ 1 x 10 4 MΩ 1 x 10 4 MΩ Operating Temperature -55 to to to Delphi onnection Systems

111 .100 in. Pitch Pin and Socket pplication/packaging Schemes 2.54 [.100] enters - Single Row Unshrouded Header with Top Entry Receptacle Right ngle Header with Top Entry Receptacle Stacking Header Unshrouded Header with Horizontal Entry Receptacle Note: ll dimensions shown are mated dimensions. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

112 Pin and Socket.100 in. Pitch pplication/packaging Schemes 2.54 [.100] enters - Dual Row Unshrouded Header with Top Entry Receptacle Unshrouded Header with ottom Entry Receptacle Right ngle Header with Top Entry Receptacle Stacking Header Unshrouded Header with Horizontal Entry Receptacle Note: ll dimensions shown are mated dimensions. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches] Delphi onnection Systems

113 .100 in. Pitch Pin and Socket Standard Profile Receptacles Horizontal Entry - Through Hole 101 Series 102 Series L = [(no. of contacts/row - 1) x 2.54 mm (.100 in.)] mm [.130 in.] Recommended P Layout Ordering Nomenclature Series: 101 = Single row 102 = Dual row 141 = Single row, high temperature* 142 = Dual row, high temperature* Size: No. of contacts/row 01 thru Tail onfiguration: 000 = Standard product Plating: 02 = Tin/lead all over 30 = µm [30 µin.] selective gold with tin/lead plated tail Product Specifications Product Type Orientation Housing Material / olor Optional Housing Material / olor ontact Material ontact Plating ontact Style Packaging Type.100 in. single or dual row receptacle Horizontal Glass filled thermoplastic, UL94V-O / lack High temperature thermoplastic, UL94V-O / lack High performance copper alloy See ordering nomenclature for standard plating. onsult factory for alternate platings. Dual beam Trays *Minimum order quantities. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

114 Pin and Socket.100 in. Pitch Standard Profile Receptacles Top Entry - Through Hole 103 Series 104 Series L = [(no. of contacts/row - 1) x 2.54 mm (.100 in.)] mm [.130 in.] Recommended P Layout Ordering Nomenclature Series: 103 = Single row 104 = Dual row 143 = Single row, high temperature* 144 = Dual row, high temperature* Size: No. of contacts/row 01 thru Tail onfiguration: 000 = Standard product Plating: 02 = Tin/lead all over 30 = µm [30 µin.] selective gold with tin/lead plated tail Product Specifications Product Type Orientation Housing Material / olor Optional Housing Material / olor ontact Material ontact Plating ontact Style Packaging Type.100 in. single or dual row receptacle Vertical Glass filled thermoplastic, UL94V-O / lack High temperature thermoplastic, UL94V-O / Natural High performance copper alloy See ordering nomenclature for standard plating. onsult factory for alternate platings. Dual beam Trays *Minimum order quantities. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches] Delphi onnection Systems

115 .100 in. Pitch Pin and Socket Standard Profile Receptacles Top Entry - Through Hole 301 Series 302 Series L = [(no. of contacts/row - 1) x 2.54 mm (.100 in.)] mm [.130 in.] Recommended P Layout Ordering Nomenclature Series: 301 = Single row 302 = Dual row 341 = Single row, high temperature* 342 = Dual row, high temperature* Size: No. of contacts/row 02 thru Tail onfiguration: 01 = Standard tail Plating: 02 = Tin/lead all over 15 = µm [15 µin.] selective gold with tin/lead plated tail 30 = µm [30 µin.] selective gold with tin/lead plated tail Product Specifications Product Type Orientation Housing Material / olor Optional Housing Material / olor ontact Material ontact Plating ontact Style Packaging Type.100 in. single or dual row receptacle Vertical Glass filled thermoplastic, UL94V-O / lack High temperature thermoplastic, UL94V-O / Natural High performance copper alloy See ordering nomenclature for standard plating. onsult factory for alternate platings. Single beam Trays *Minimum order quantities. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

116 Pin and Socket.100 in. Pitch L ow Profile Receptacles ottom Entry - Through Hole 106 Series Recommended P Layout L = [(no. of contacts/row - 1) x 2.54 mm (.100 in.)] mm [.130 in.] Ordering Nomenclature Series: 106 Plating: 02 = Tin/lead all over 30 = µm [30 µin.] selective gold with tin/lead plated tails Size: No. of contacts/row 02 thru 16 Product Specifications Product Type Orientation Housing Material Housing olor ontact Material ontact Plating ontact Spacing / Tail Spacing Packaging Type.100 in. dual row receptacle Vertical Glass filled thermoplastic, UL94V-O lack High performance copper alloy See ordering nomenclature for standard plating. onsult factory for alternate platings mm [.100 in.] x 2.54 mm [.100 in.] / 2.54 mm [.100 in.] x 7.62 mm [.300 in.] centers Trays Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches] Delphi onnection Systems

117 .100 in. Pitch Pin and Socket L ow Profile Receptacles Top Entry - Through Hole 304 Series 305 Series L = [(no. of contacts/row - 1) x 2.54 mm (.100 in.)] mm [.130 in.] Recommended P Layout Ordering Nomenclature Series: 304 = Single row 305 = Dual row Size: No. of contacts/row 02 thru Tail onfiguration: 01 = Standard tail Plating: 02 = Tin/lead all over 15 = µm [15 µin.] selective gold with tin/lead plated tail 30 = µm [30 µin.] selective gold with tin/lead plated tail Product Specifications Product Type Orientation Housing Material Housing olor ontact Material ontact Plating ontact Style Packaging Type.100 in. single or dual row receptacle Vertical Glass filled thermoplastic, UL94V-O lack High performance copper alloy See ordering nomenclature for standard plating. onsult factory for alternate platings. Single beam Trays Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

118 Pin and Socket.100 in. Pitch Standard Profile Receptacles Top Entry - Surface Mount 307 Series Recommended P Layout L = [(no. of contacts/row - 1) x 2.54 mm (.100 in.)] mm [.130 in.] Ordering Nomenclature Series: R Packaging: No suffix = Trays R = Tape and reel* Size: No. of contacts/row 02 thru 20 Plating: 02 = Tin/lead all over 15 = µm [15 µin.] selective gold with tin/lead plated tail 30 = µm [30 µin.] selective gold with tin/lead plated tail Product Specifications Product Type Orientation Housing Material Housing olor ontact Material ontact Plating ontact Style Packaging Type.100 in. dual row receptacle Vertical High temperature thermoplastic, UL94V-0 Natural High performance copper alloy See ordering nomenclature for standard plating. onsult factory for alternate platings. Single beam Trays or tape and reel available *Minimum order quantities. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches] Delphi onnection Systems

119 .100 in. Pitch Pin and Socket L ow Profile Receptacles Top Entry - Surface Mount 308 Series Recommended P Layout L = [(no. of contacts/row - 1) x 2.54 mm (.100 in.)] mm [.130 in.] Ordering Nomenclature Series: R Packaging: No suffix = Trays R = Tape and reel* Size: No. of contacts/row 02 thru 20 Plating: 02 = Tin/lead all over 15 = µm [15 µin.] selective gold with tin/lead plated tail 30 = µm [30 µin.] selective gold with tin/lead plated tail Product Specifications Product Type Orientation Housing Material Housing olor ontact Material ontact Plating ontact Style Packaging Type.100 in. dual row low profile receptacle Vertical High temperature thermoplastic, UL94V-O Natural High performance copper alloy See ordering nomenclature for standard plating. onsult factory for alternate platings. Single beam Trays or tape and reel with vacuum pick-up cap available *Minimum order quantities. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

120 Pin and Socket.100 in. Pitch Standard Profile Headers Vertical - Through Hole Single Row Dual Row L = (no. of pins/row) x 2.54 mm [.100 in.]. Recommended P Layout 2H Series Dimensions Dim. Dim mm [.125 in.] mm [.455 in.] mm [.225 in.] mm [.555 in.] mm [.425 in.] mm [.755 in.] mm [.095 in.] mm [.425 in.] mm [.160 in.] mm [.490 in.] 3H Series Dimensions Dim. Dim mm [.125 in.] mm [.543 in.] mm [.225 in.] mm [.643 in.] mm [.425 in.] mm [.843 in.] mm [.095 in.] mm [.513 in.] mm [.160 in.] mm [.578 in.] Temperature Option: No Prefix = Standard material IR = High temperature material Series: 2H = Dim. = 5.84 mm [.230 in.] 3H = Dim. = 8.08 mm [.318 in.] Product Specifications Product Type Orientation Housing Material / olor Optional Housing Material / olor ontact Material Packaging Type Ordering Nomenclature IR 2H D 30 S No. of Rows: S = Single row D = Dual row.100 in. single or dual row header Vertical Glass filled thermoplastic, UL94V-0 / lack High temperature thermoplastic, UL94V-0 / Natural High performance copper alloy ulk Tail Length (Dim. ): See tables above Plating: 02 = Tin/lead all over 15 = µm [15 µin.] selective [ gold with tin/lead plated tail 30 = µm [30 µin.] selective gold with tin/lead plated tail Size: No. of contacts/row 01 thru Delphi onnection Systems

121 .100 in. Pitch Pin and Socket Standard Profile Headers Right ngle - Through Hole Single Row Dual Row L = (no. of pins/row) x 2.54 mm [.100 in.]. Recommended P Layout Temperature Option: No Prefix = Standard material IR = High temperature material Series: 2H = Dim. = 5.84 mm [.230 in.] 3H = Dim. = 8.08 mm [.318 in.] No. of Rows: S = Single row D = Dual row Product Specifications Ordering Nomenclature IR 3H D 22 R Tail Length (Dim. ): 01 = 3.18 mm [.125 in.] 04 = 2.41 mm [.095 in.] 05 = 4.06 mm [.160 in.] Other lengths available. ontact factory. Plating: 02 = Tin/lead all over 15 = µm [15 µin.] selective gold with tin/lead plated tail 30 = µm [30 µin.] selective gold with tin/lead plated tail Size: No. of contacts/row 01 thru 36 Product Type Orientation Housing Material / olor Optional Housing Material / olor ontact Material Packaging Type.100 in. single or dual row header Right angle Glass filled thermoplastic, UL94V-O / lack High temperature thermoplastic, UL94V-O / Natural High performance copper alloy ulk Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

122 Pin and Socket.100 in. Pitch Standard Profile Headers Vertical and Right ngle - Through Hole Triple Row, Straight Triple Row, Right ngle L = (no. of pins/row) x 2.54 mm [.100 in.]. Recommended P Layout 2H Series Dimensions* Dim. Dim mm [.125 in.] mm [.455 in.] mm [.225 in.] mm [.555 in.] mm [.425 in.] mm [.755 in.] mm [.095 in.] mm [.425 in.] mm [.160 in.] mm [.490 in.] 3H Series Dimensions* Dim. Dim mm [.125 in.] mm [.543 in.] mm [.225 in.] mm [.643 in.] mm [.425 in.] mm [.843 in.] mm [.095 in.] mm [.513 in.] mm [.160 in.] mm [.578 in.] Temperature Option: No Prefix = Standard material IR = High temperature material Series: 2H = Dim. = 5.84 mm [.230 in.] 3H = Dim. = 8.08 mm [.318 in.] Size: No. of contacts/row 01 thru 36 Ordering Nomenclature IR 2H T 16 R Tail Length (Dim. ): See table above for straight headers only (e.g. 01 = 3.18 mm [.125 in.]) See graphics for right angle headers Orientation: S = Straight R = Right angle Plating: 02 = Tin/lead all over 15 = µm [15 µin.] selective gold with tin/lead plated tail 30 = µm [30 µin.] selective gold with tin/lead plated tail Product Specifications Product Type Orientation Housing Material / olor Optional Housing Material / olor ontact Material Packaging Type.100 in. triple row header Vertical or Right angle Glass filled thermoplastic, UL94V-O / lack High temperature thermoplastic, UL94V-O / Natural High performance copper alloy ulk *Table dimensions apply to straight headers only Delphi onnection Systems

123 .100 in. Pitch Pin and Socket Standard Profile Headers Stacking S Series Single Row Dual Row L = (no. of pins/row) x 2.54 mm [.100 in.]. Recommended P Layout Ordering Nomenclature Temperature Option: No Prefix = Standard material IR = High temperature material Series: S No. of Rows: S = Single row D = Dual row Size: No. of contacts/row 02 thru 36 IR S D Plating: 02 = Tin/lead all over 15 = µm [15 µin.] selective gold with tin/lead plated tail 30 = µm [30 µin.] selective gold with tin/lead plated tail Post Height (Dim. ): Specify in inches to (3) decimal places (e.g mm [.318 in.]) Spacing (Dim. ): Specify in inches to (3) decimal places (e.g mm [.590 in.]) Product Specifications Product Type Orientation Housing Material / olor Optional Housing Material / olor ontact Material Packaging Type.100 in. single or dual row stacking header Vertical Glass filled thermoplastic, UL94V-O / lack High temperature thermoplastic, UL94V-O / Natural High performance copper alloy ulk Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

124 Pin and Socket.100 in. Pitch Standard Profile Headers Vertical - Surface Mount SIngle Row Dual Row Recommended P Layout Series: SM2H = Dim. = 5.84 mm [.230 in.] SM3H = Dim. = 8.08 mm [.318 in.] No. of Rows: S = Single row D = Dual row Size: No. of contacts/row 02 thru 20 Product Specifications Product Type Orientation Housing Material Housing olor ontact Material Packaging Type *Minimum order quantities. Ordering Nomenclature SM3H D 20 S R.100 in. single or dual row header Vertical High temperature thermoplastic, UL94V-O Natural High performance copper alloy Trays or tape and reel available Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. Packaging: No suffix = Trays R = Tape and reel* Post Length (Dim. ): 01 = 5.84 mm [.230 in.] for SM2H 02 = 8.08 mm [.318 in.] for SM3H Other lengths available. ontact factory. Plating: 02 = Tin/lead all over 15 = µm [15 µin.] selective gold with tin/lead plated tail 30 = µm [30 µin.] selective gold with tin/lead plated tail 124. Delphi onnection Systems

125 .100 in. Pitch Pin and Socket Shunts Standard Profile 2J Series Ordering Nomenclature 2J - G - LP - 1 Series: 2J Plating: G = Gold flash Height (Dim. ): No suffix = 6.00 mm [.236 in.] (standard) 1 = 4.50 mm [.177 in.] Product Specifications Product Type Orientation Housing Material Housing olor ontact Material Packaging Type.100 in. standard profile shunt Vertical Glass filled thermoplastic, UL94V-O lack High performance copper alloy ulk Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

126 Pin and Socket in. enterline Shrouded Headers Description: 2.54 mm [0.100 in.] centerline dual-row, shrouded headers designed to mate with standard ribbon cable receptacles Typical pplications: omputers Medical monitoring equipment Industrial controllers onsumer devices enefits/features: Industry Standard... Mates to polarized or non polarized receptacles Standard 0.64 mm [0.025 in.] square post. Flexible System..... Through hole or surface mount solder tails Wide variety of position sizes Several gold plating options available. Ruggedness and Reliability Shrouds help guide mating connectors Polarization key slot ensures proper orientation of mating connector. Selectable Features: Product Type in. shrouded headers No. of Rows 2 Total No. of Positions 6, 8, 10, 12, 14, 16, 20, 24, 26, 30, 34, 40, 44, 50, 60, 64, 48 (SMT only) enterline Spacing 2.54 mm [.100 in.] x 2.54 mm [.100 in.] Orientation Vertical or right angle Mounting Style Through hole or Surface mount (vertical only) Insertion Style Direct ontact Style Stamped ontact rea Plating Gold or tin-lead (see product print for thickness) Height bove oard 9.10 mm [.358 in.] Standoff Height 0.30 mm [.012 in.] Housing olor lack Other Properties: Packaging Type Housing Material enter Key Slot pplicable Soldering Process ontact ase Material Insulation Resistance Withstanding Voltage urrent Rating ontact Resistance Voltage Rating Temperature Range ontact Retention Force Durability (Mating ycles) Mating Force Plating (ontact rea) Plating (Soldering End) Underplating pprovals and ertification Trays PT, UL94V-0 (Through hole) Nylon 6T, UL94V-0 (SMT) Yes IR, vapor phase, wave opper alloy 5000 MΩ 1000 V 1.0 amp max. per contact 10 mω (initial) 250 VD -40 to N [25 gf] min. per contact 100 cycles 2.23 N [227.4 gf] max. per contact Gold or tin-lead (thickness varies per Delphi spec.) over nickel underplating 2.54 µm [100 µin.] tin-lead over nickel underplating 1.27 µm [50 µin.] nickel UL approved 126. Delphi onnection Systems

127 Pin and Socket in. enterline Shrouded Headers Through Hole Ordering Nomenclature = Through hole shrouded header = Right angle through hole shrouded header = Surface mount shrouded header Right ngle Through Hole No. of Positions: (SMT only) Plating Options: 1 = 2.54 µm [100 µin.] tin-lead all over 2 = 0.25 µm [10 µin.] gold selectively plated 3 = 0.76 µm [30 µin.] gold selectively plated Surface Mount Dimensions are shown in millimeters and [inches]. ommercial onnector atalog

128 Pin and Socket 1mm Pitch Headers and R eceptacles Description s electronic designs become increasingly smaller in size, standard interconnect systems become limited in their use. Delphi onnection Systems 1mm interconnection system, consisting of Surface Mount Technology (SMT) headers and receptacles, meets the requirement for a fine-pitch, board-to-board interconnect. The 1mm by 1mm grid headers and receptacles offer design flexibility for compact designs. Headers The 1mm pitch headers are offered with mm [0.014 in.] square pins in three standard pin lengths. The pins are made of high strength copper alloy. Receptacles The 1mm pitch receptacles are available either in a top entry or bottom entry form. Stamped and formed contacts are beryllium copper. Industry pprovals These components have been evaluated by Underwriters Laboratories as recognized components, and are included in UL File E Testing was conducted per the Standard for omponent onnectors for use in Data, Signal, ontrol and Power pplications, UL1977. The components meet the anadian Standards ssociation for certification per S Std No M1987, and are included in S File LR Typical pplications The 1mm pitch headers and receptacles are designed for use in wireless mobile electronics: Digital cellular phones Pagers and PDs Portable computers Handheld electronics ny interconnect system that requires low-profile, high-density compact connections Performance haracteristics Headers Receptacles Total No. of Positions 2 x 2 to 2 x 15, for larger sizes consult factory 2 x 2 to 2 x 15, for larger sizes consult factory Orientation Top entry or bottom entry Mounting Style Surface mount (SMT) Surface mount (SMT) ontact Style Stamped and formed Stamped and formed Packaging Type Tubes or Tape & reel Tubes or Tape & reel Insulator Material High temperature thermoplastic, UL94V-O High temperature thermoplastic, UL94V-O ontact ase Material opper alloy eryllium copper ontact Resistance 20 mω max. initial 20 mω max. initial Operating Temperature -55 to to +125 Plating (ontact rea) 0.25 µm [10 µin.] gold overall* 0.25 µm [10 µin.] gold overall* Underplating 1.27 µm [50 µin.] nickel 1.27 µm [50 µin.] nickel Mating Force 150 gf max. per contact 150 gf max. per contact Unmating Force 10 gf min., 40 gf max. per contact 10 gf min., 40 gf max. per contact *Note: lternative plating for both headers and receptacles is available upon request, subject to minimum order quantities. Please consult factory Delphi onnection Systems

129 Pin and Socket 1mm Pitch Headers & R eceptacles Headers Recommended P Layout Headers Ordering Nomenclature 1MD 02 S33-01 Size: No. of contacts/row 02 thru 15 R T = Tubes R = Tape and reel 01: = 2.70 [.106] overall ht. = 1.50 [.059] pin length 02: = 3.30 [.130] overall ht. = 2.11 [.083] pin length 03: = 4.04 [.159] overall ht. = 2.84 [.112] pin length Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

130 Pin and Socket 1mm Pitch Headers & R eceptacles Receptacles, Top Entry Recommended P Layout Receptacles, Top Entry Ordering Nomenclature R T = Tubes R = Tape and reel Size: No. of contacts/row 02 thru 15 Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches] Delphi onnection Systems

131 Pin and Socket 1mm Pitch Headers & R eceptacles Receptacles, ottom Entry Recommended P Layout Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. Receptacles, ottom Entry Ordering Nomenclature R T = Tubes R = Tape and reel Size: No. of contacts/row 02 thru 15 ommercial onnector atalog

132 Pin and Socket Delphi onnection Systems 2mm interconnection system offers a variety of headers, stacking headers, receptacles and shunts to meet the requirements of any 2mm board-to-board or flex-toboard interconnect Delphi onnection Systems

133 Pin and Socket 2mm Pitch Headers, Receptacles & Shunts Headers Headers utilize surface mount (SMT) or through hole technology in single and dual row configurations and are offered in various sizes. Stacking Headers Stacking headers use through hole technology in single or dual row configurations. Sizes are available up to 36 pins per row with various pin lengths available, to accommodate board spacing requirements from 4.60 mm [.181 in.] to 25.4 mm [1.00 in.]. Receptacles Receptacles utilize surface mount or through hole technology and are available in top entry or bottom entry formats. Single and dual row configurations are offered in various sizes. Shunts Shunts are configured as 1 x 2 and are available in loose piece or break-away carriers. Insulators are made of glass-filled thermoplastic. ontacts are stamped and formed high performance copper alloy with either tin/lead or gold flash plating overall. Industry pprovals Delphi s 2mm pitch headers, receptacles and shunts have been granted recognition by Underwriters Laboratories and are included as recognized components in UL File E Testing was conducted per the Standard for omponent onnectors for Use in Data, Signal, ontrol and Power pplications, UL1977. Typical pplications Depending upon the orientation of the printed wiring boards and overall stacking height, there are endless applications suitable for using Delphi s 2mm pitch headers and receptacles for board-to-board interconnects. These products are suitable for low power signal applications including: omputers Medical instruments utomotive controls Please refer to pages 135 and 136 for application and packaging schemes and overall stacking height guidelines between parallel boards. Performance haracteristics - Headers and Receptacles ontact Style Stamped and formed ontact Material High performance copper alloy Insulator Material Thermoplastic, UL94V-O Plating Tin/lead or selective gold with tin/lead plated tails Optional Plating onsult factory for availability of alternate platings ommercial onnector atalog

134 Pin and Socket 2mm Pitch General Product Specifications Headers Series onfiguration Orientation Lead Profile 2MSXXS Single row Vertical Through Standard 2MDXXS Dual row Vertical Through Standard 2MSXXR Single row Right angle Through Standard 2MDXXR Dual row Right angle Through Standard LPSMDXXS Dual row Vertical SMT Low ULPSMDXXS Dual row Vertical SMT Ultra low SM2MSXXS Single row Vertical SMT Standard SM2MDXXS Dual row Vertical SMT Standard 2STRD Dual row Straddle SMT Standard SM2MSXXR Single row Right angle SMT Standard Stacking Headers Series onfiguration Lead 2MSS Single row Through 2MSD Dual row Through Receptacles Shunts Series onfiguration Orientation Lead Type Profile 201 Single row Vertical Through Top entry Standard 202 Dual row Vertical Through Top entry Standard 203 Dual row Vertical SMT ottom entry Standard 204 Single row Vertical SMT Top entry Standard 205 Dual row Vertical SMT Top entry Standard 206 Dual row Vertical Through ottom entry Standard 233 Dual row Vertical SMT ottom entry Low 235 Dual row Vertical SMT Top entry Low Series 2JM 2MS onfiguration 3.50 mm [.138 in.] or 4.50 mm [.177 in.] 1.90 mm [.075 in.] or 2.50 mm [.098 in.] Performance haracteristics Headers and Stacking Headers Receptacles Shunts urrent Rating 2.0 amps max. 1.0 amp max. 1.0 amp max. ontact Resistance 20 mω max. 30 mω max. Dielectric Withstanding Voltage 1000 VRMS min VRMS min. 500 VRMS min. Insulation Resistance 1 x 10 4 MΩ 1 x 10 4 MΩ 1 x 10 4 MΩ Operating Temperature -55 to to to Delphi onnection Systems

135 2mm Pitch Pin and Socket pplication/packaging Schemes 2.00 [.079] enters - Single Row Unshrouded Header with Top Entry Receptacle Right ngle Header with Top Entry Receptacle Stacking Header Note: ll dimensions shown are mated dimensions. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

136 Pin and Socket 2mm Pitch pplication/packaging Schemes 2.00 [.079] enters - Dual Row Unshrouded Header with Top Entry Receptacle Unshrouded Header with ottom Entry Receptacle Right ngle Header with Top Entry Receptacle Right ngle Header with ottom Entry Receptacle Stacking Header Note: ll dimensions shown are mated dimensions. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches] Delphi onnection Systems

137 2mm Pitch Pin and Socket Standard Profile Receptacles Top Entry - Through Hole 201 Series 202 Series L = (no. of contacts/row) x 2.0 mm [.079 in.] Recommended P Layout Ordering Nomenclature IR Temperature Option: No Prefix = Standard material IR = High temperature material* Series: 201 = Single row 202 = Dual row Plating: 15 = µm [15 µin.] selective gold with tin/lead plated tail 30 = µm [30 µin.] selective gold with tin/lead plated tail Size: No. of contacts/row 02 thru 52 Product Specifications Product Type Orientation Housing Material / olor Optional Housing Material / olor ontact Material ontact Plating Packaging Type 2mm single or dual row receptacle Vertical Glass filled thermoplastic, UL94V-O / lack High temperature thermoplastic, UL94V-O / Natural High performance copper alloy See ordering nomenclature for standard plating. onsult factory for alternate platings. Tubes *Minimum order quantities. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

138 Pin and Socket 2mm Pitch Standard Profile Receptacles ottom Entry - Through Hole 206 Series L = (no. of contacts/row) x 2.0 mm [.079 in.] Recommended P Layout Ordering Nomenclature IR Temperature Option: No Prefix = Standard material IR = High temperature material* Plating: 15 = µm [15 µin.] selective gold with tin/lead plated tail 30 = µm [30 µin.] selective gold with tin/lead plated tail Series: 206 Size: No. of contacts/row 02 thru 25 Product Specifications Product Type Orientation Housing Material / olor Optional Housing Material / olor ontact Material Packaging Type 2mm dual row receptacle Vertical Glass filled thermoplastic, UL94V-O / lack High temperature thermoplastic, UL94V-O / Natural High performance copper alloy Tubes *Minimum order quantities. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches] Delphi onnection Systems

139 2mm Pitch Pin and Socket Standard Profile Receptacles Top Entry - Surface Mount 204 Series 205 Series L = (no. of contacts/row) x 2.0 mm [.079 in.] Recommended P Layout Ordering Nomenclature Series: 204 = Single row 205 = Dual row R Packaging: No suffix = Tubes R = Tape and reel (205 series only)* Size: No. of contacts/row 04 thru 25 Product Specifications Plating: 15 = µm [15 µin.] selective gold with tin/lead plated tail 30 = µm [30 µin.] selective gold with tin/lead plated tail Product Type Orientation Housing Material Housing olor ontact Material ontact Plating Packaging Type 2mm single or dual row receptacle Vertical High temperature thermoplastic, UL94V-O Natural High performance copper alloy See ordering nomenclature for standard plating. onsult factory for alternate platings. Tubes or tape and reel with vacuum pick-up cap available *Minimum order quantities. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

140 Pin and Socket 2mm Pitch Standard Profile Receptacles ottom Entry - Surface Mount 203 Series L = (no. of contacts/row) x 2.0 mm [.079 in.] Recommended P Layout Ordering Nomenclature R Series 203** Size: No. of contacts/row 04 thru 25 Packaging: No suffix = Tubes R = Tape and reel* Plating: 15 = µm [15 µin.] selective gold with tin/lead plated tail 30 = µm [30 µin.] selective gold with tin/lead plated tail Product Specifications Product Type Orientation Housing Material Housing olor ontact Material ontact Plating Packaging Type 2mm dual row receptacle Vertical High temperature thermoplastic, UL94V-O Natural High performance copper alloy See ordering nomenclature for standard plating. onsult factory for alternate platings. Tubes or tape and reel with vacuum pick-up cap available *Minimum order quantities. **onsult factory for configuration and location of optional locating pegs. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches] Delphi onnection Systems

141 2mm Pitch Pin and Socket L ow Profile Receptacles Top Entry - Surface Mount 235 Series L = (no. of contacts/row) x 2.0 mm [.079 in.] Recommended P Layout Ordering Nomenclature R Series 235** Size: No. of contacts/row 02 thru 20 Packaging: No suffix = Tubes R = Tape and reel* Plating: 33 = µm [10 µin.] gold over 1.27 µm [50 µin.] nickel underplate Product Specifications Product Type Orientation Housing Material Housing olor ontact Material ontact Plating Packaging Type 2mm dual row low profile receptacle Vertical High temperature thermoplastic, UL94V-O Natural High performance copper alloy See ordering nomenclature for standard plating. onsult factory for alternate platings. Tubes or tape and reel with vacuum pick-up cap available *Minimum order quantities. **onsult factory for configuration and location of optional locating pegs. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

142 Pin and Socket 2mm Pitch L ow Profile Receptacles ottom Entry - Surface Mount 233 Series L = (no. of contacts/row) x 2.0 mm [.079 in.] Recommended P Layout Ordering Nomenclature R Series 233** Size: No. of contacts/row 02 thru 25 Packaging: No suffix = Tubes R = Tape and reel* Plating: 33 = µm [10 µin.] gold over 1.27 µm [50 µin.] nickel underplate Product Specifications Product Type Orientation Housing Material Housing olor ontact Material ontact Plating Packaging Type 2mm dual row low profile receptacle Vertical High temperature thermoplastic, UL94V-O Natural High performance copper alloy See ordering nomenclature for standard plating. onsult factory for alternate platings. Tubes or tape and reel with vacuum pick-up cap available *Minimum order quantities. **onsult factory for configuration and location of optional locating pegs. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches] Delphi onnection Systems

143 2mm Pitch Pin and Socket Standard Profile Headers Vertical - Through Hole 2MSXXS Series 2MDXXS Series D = (no. of spaces/row) x 2.0 mm [.079 in.] Recommended P Layout Temperature Option: No Prefix = Standard material IR = High temperature material Ordering Nomenclature IR 2M D 15 S Tail Length (Dim. ): 30 = 3.0 mm [.118 in.] (standard) Other lengths available. Specify in tenths of mm. Series: 2mm No. of Rows: S = Single row D = Dual row Size: No. of contacts/row 01 thru 36 Plating: Post (Dim. ): 02 = Tin/lead all over 37 = 3.7 mm [.146 in.] (standard) 40 = 4.0 mm [.157 in.] (standard) Other lengths available. Specify in tenths of mm. 15 = µm [15 µin.] selective gold with tin/lead plated tail 30 = µm [30 µin.] selective gold with tin/lead plated tail Product Specifications Product Type Orientation Housing Material / olor Optional Housing Material / olor ontact Material Packaging Type 2mm single or dual row header Vertical Glass filled thermoplastic, UL94V-O / lack High temperature thermoplastic, UL94V-O / Natural High performance copper alloy ulk. onsult factory for available tape and reel options. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

144 Pin and Socket 2mm Pitch Standard Profile Headers Right ngle - Through Hole 2MSXXR Series 2MDXXR Series D = (no. of spaces/row) x 2.0 mm [.079 in.] Recommended P Layout Temperature Option: No Prefix = Standard material IR = High temperature material Ordering Nomenclature IR 2M D 15 R Tail Length (Dim. ): 30 = 3.0 mm [.118 in.] (standard) Other lengths available. Specify in tenths of mm. Series: 2mm No. of Rows: S = Single row D = Dual row Size: No. of contacts/row 02 thru 25 Plating: Post (Dim. ): 02 = Tin/lead all over 37 = 3.7 mm [.146 in.] (standard) 40 = 4.0 mm [.157 in.] (standard) Other lengths available. Specify in tenths of mm. 15 = µm [15 µin.] selective gold with tin/lead plated tail 30 = µm [30 µin.] selective gold with tin/lead plated tail Product Specifications Product Type Orientation Housing Material / olor Optional Housing Material / olor ontact Material Packaging Type 2mm single or dual row header Right angle Glass filled thermoplastic, UL94V-O / lack High temperature thermoplastic, UL94V-O / Natural or brown High performance copper alloy ulk Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches] Delphi onnection Systems

145 2mm Pitch Pin and Socket Standard Profile Headers Stacking - Through Hole 2MS Series Recommended P Layout D = (no. of spaces/row) x 2.0 mm [.079 in.] Ordering Nomenclature 2MS D 25 S Series: 2MS No. of Rows: S = Single row D = Dual row Size: No. of contacts/row 02 thru 36 Tail Length (Dim. ):* Specify in mm to one decimal place Post (Dim. ): Specify in mm to one decimal place oard-to-oard (Dim. ): Specify in mm to one decimal place Plating: 02 = Tin/lead all over 15 = µm [15 µin.] selective gold with tin/lead plated tail 30 = µm [30 µin.] selective gold with tin/lead plated tail Product Specifications Product Type Orientation Housing Material Housing olor ontact Material Packaging Type 2mm single or dual row stacking header Vertical Glass filled thermoplastic, UL94V-O lack High performance copper alloy ulk *SMT version available (contact factory). Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

146 Pin and Socket 2mm Pitch Standard Profile Headers Vertical - Surface Mount SM2MSXXS Series SM2MDXXS Series D = (no. of spaces/row) x 2.0 mm [.079 in.] Recommended P Layout Ordering Nomenclature SM2M D 06 S Series: SM2M No. of Rows: S = Single row D = Dual row Size: No. of contacts/row 02 thru 15 Post onfiguration (Dim. ): 01 = 3.70 mm [.146 in.] 02 = 4.00 mm [.157 in.] Plating: 02 = Tin/lead all over 15 = µm [15 µin.] selective gold with tin/lead plated tail 30 = µm [30 µin.] selective gold with tin/lead plated tail Product Specifications Product Type Orientation Housing Material Housing olor ontact Material ontact Plating Packaging Type 2mm single or dual row header Vertical High temperature thermoplastic, UL94V-O lack High performance copper alloy See ordering nomenclature for standard plating. onsult factory for alternate platings. ulk Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches] Delphi onnection Systems

147 2mm Pitch Pin and Socket Standard Profile Headers Right ngle - Surface Mount SM2MSR Series L = (no. of spaces/row) x 2.0 mm [.079 in.] Recommended P Layout Ordering Nomenclature SM2M S 25 R Series: SM2M Size: No. of contacts/row 02 thru 25 Plating: 02 = Tin/lead all over 15 = µm [15 µin.] selective gold with tin/lead plated tail Product Specifications Product Type Orientation Housing Material Housing olor ontact Material ontact Plating Packaging Type 2mm single row header Right angle High temperature thermoplastic, UL94V-O lack High performance copper alloy See ordering nomenclature for standard plating. onsult factory for alternate platings. ulk Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

148 Pin and Socket 2mm Pitch Standard Profile Headers Vertical - Straddle Mount 2STR Series Recommended P Layout L = (no. of spaces/row) x 2.0 mm [.079 in.] Ordering Nomenclature 2STR D Series: 2STR Size: No. of contacts/row 02 thru 25 Plating: 02 = Tin/lead all over 15 = µm [15 µin.] selective gold with tin/lead plated tail 30 = µm [30 µin.] selective gold with tin/lead plated tail Product Specifications Product Type Orientation Housing Material Housing olor ontact Material ontact Plating Packaging Type 2mm dual row straddle mount header Vertical High temperature thermoplastic, UL94V-O Natural High performance copper alloy See ordering nomenclature for standard plating. onsult factory for alternate platings. ulk Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches] Delphi onnection Systems

149 2mm Pitch Pin and Socket L ow Profile Headers Vertical - Surface Mount LPSM Series D = (no. of spaces/row) x 2.0 mm [.079 in.] Recommended P Layout Series: LPSM** Size: No. of contacts/row 02 thru 20 Ordering Nomenclature LPSM D 06 S R Packaging: No suffix = ulk T = Tubes R = Tape and reel* Plating: 02 = Tin/lead all over 33 = µm [10 µin.] gold over 1.27 µm [50 µin.] nickel underplate Height (Dim. ): 01 = 3.86 mm [.152 in.] 02 = 4.80 mm [.189 in.] Product Specifications Product Type Orientation Housing Material Housing olor ontact Material ontact Plating Packaging Type 2mm dual row low profile header Vertical High temperature thermoplastic, UL94V-O Natural High performance copper alloy See ordering nomenclature for standard plating. onsult factory for alternate platings. ulk, tubes or tape and reel with vacuum pick-up cap available *Minimum order quantities. **onsult factory for configuration and location of optional locating pegs. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

150 Pin and Socket 2mm Pitch Ultra Low Profile Headers Vertical - Surface Mount ULPSM Series D = (no. of spaces/row) x 2.0 mm [.079 in.] Recommended P Layout Ordering Nomenclature Series: ULPSM** Size: ULPSM D 06 S 02 - M02 - R No. of contacts/row 01 thru 16 (contact factory for sizes larger than 2 x 16) Packaging: No suffix = ulk T = Tubes R = Tape and reel* Height: See table below Plating: 02 = Tin/lead all over Height Dim. Dim. 33 = µm [10 µin.] gold over 1.27 µm [50 µin.] nickel underplate mm [.116 in.] 1.91 mm [.075 in.] M mm [.154 in.] 2.74 mm [.108 in.] M mm [.189 in.] 3.66 mm [.144 in.] Product Specifications Product Type 2mm dual row ultra low profile header Orientation Vertical Housing Material High temperature thermoplastic, UL94V-O Housing olor Natural ontact Material High performance copper alloy ontact Plating See ordering nomenclature for standard plating. onsult factory for alternate platings. Packaging Type ulk, tubes or tape and reel with vacuum pick-up cap available *Minimum order quantities. **ontact factory for configuration and location of optional locating pegs. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches] Delphi onnection Systems

151 2mm Pitch Pin and Socket Shunts Standard Profile 2JM Series Shunt and Header pplication Ordering Nomenclature 2JM - G - 1 Series: 2JM Plating: G = Gold flash over 1.27 µm [50 µin.] nickel underplate Height (Dim. ): No suffix = 4.50 mm [.177 in.] (standard) 1 = 3.50 mm [.138 in.] Product Specifications Product Type Orientation Housing Material Housing olor ontact Material Packaging Type 2mm standard profile shunt Vertical Glass filled thermoplastic, UL94V-O lack High performance copper alloy ulk Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

152 Pin and Socket 2mm Pitch Shunts L ow Profile 2MS Series Ordering Nomenclature 2MS Series: 2MS Height: 19 = 1.90 mm [.075 in.] 25 = 2.50 mm [.098 in.] Packaging: 01 = Loose piece 02 = Metal carrier strips of ten Plating: 02 = Tin/lead all over 33 = Gold flash over µm [15 µin.] palladium nickel Product Specifications Product Type Orientation Housing Material Housing olor ontact Material Packaging Type 2mm low profile shunt Vertical Glass filled thermoplastic, UL94V-O lack High performance copper alloy Loose piece or metal carrier strips of ten Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches] Delphi onnection Systems

153 2mm Pitch Pin and Socket ommercial onnector atalog

154 Energy Products Delphi onnection Systems manufactures a variety of battery holders for use in many different electronics applications. In addition, Delphi offers resources to assist customers in the design, development, and manufacturing of custom energy products to meet specific application needs Delphi onnection Systems

155 attery Holders Energy Products ylindrical attery Holders These battery holders have through hole contacts with board-retention features and accept standard battery sizes of 1/2,, 2/3 and. Insulators are molded of a glass filled thermoplastic. Stamped and formed contacts are stainless steel with a 1.27 µm [50 µin.] nickel plate overall and a 3.81 µm [150 µin.] selective tin/lead plate on the solder tails. Optional ontents battery holder covers molded of thermoplastic are also available. oin ell attery Holders attery holders for single cell (3 volt systems) are available in SMT or through hole format. battery holder for a dual coin cell (6 volt systems) is available only in through hole format. Plastic insulators are molded of a glass filled thermoplastic. The through hole variations have the positive contact formed of fully hardened beryllium copper, with the negative contact using hard brass. The surface mount product uses full hard stainless steel for both contacts. ll contacts have an overall nickel plating of 1.27 µm Description, Industry pprovals, pplication and Packaging Schemes attery Holders: ylindrical ells 1/ /2 Low Profile, attery Retention / /3 Low Profile [50 µin.]. In addition, the SMT variation has a selective plate of 3.81 µm [150 µin.] tin/lead on the solder tails. Vertical attery Holders These battery holders are available in through hole format. Designed for industry type 2032 coin cells, these holders are for use where space limits the installation and removal of batteries horizontally. The polarized housing is molded of high temperature thermoplastic. The contacts are formed of stainless steel. Plating is 1.27 µm [50 µin.] nickel overall with a 3.81 µm [150 µin.] selective tin/lead plate on the solder tails. oin ells 3 V, T/H, Series V, S/M, SM Series V, Easy Removal, 2S Series V, 2S2032 Series V, 4S2032 Series V, 2S2325 Series V, 4S2325 Series V, 2S2425 Series V, 4S2425 Series Typical pplications ompact peripherals Desktop, notebook, and laptop computers Digital cellular phones Pocket pagers Security systems Vertical Through Hole, VH2032 Series Portable test and measurement equipment Industry pprovals These components have been granted recognition by Underwriters Laboratories and are included as recognized components in UL File E Testing was conducted per the Standard for omponent onnectors for use in Data, Signal, ontrol and Power pplications, UL1977. ommercial onnector atalog

156 Energy Products attery Holder 1/2 ylindrical ell over Installed Recommended P Layout Optional over Part Number -6S1/2 Product Specifications - attery Holder Part Number Product Type Housing Material Housing olor ontact Material Operating Temperature Packaging Type 6S1/2 1/2 cylindrical cell battery holder Glass filled thermoplastic, UL94V-O lack Spring hard stainless steel -55 to +125 ulk Product Specifications - attery Holder over Part Number over Material olor -6S1/2 Thermoplastic, UL94-VO lack Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches] Delphi onnection Systems

157 Energy Products attery Holder 1/2 ylindrical ell Low Profile with attery Retention Feature Recommended P Layout Product Specifications - attery Holder Part Number Product Type Housing Material Housing olor ontact Material ontact Finish Packaging Type 6S1/2 -LPRT 1/2 cylindrical cell battery holder Glass filled thermoplastic, UL94V-O lack Spring hard stainless steel 1.27 µm [50 µin.] min. nickel all over, 3.81 µm [150 µin.] min. tin/lead selective tails. ulk Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

158 Energy Products attery Holder ylindrical ell over Installed Part Number Optional over Part Number -6S Recommended P Layout Optional over - Part Number Optional over - Part Number -6S Product Specifications - attery Holder Part Number Product Type Housing Material Housing olor ontact Material ontact Finish Packaging Type 6S- cylindrical cell battery holder Glass filled thermoplastic, UL94V-O lack Spring hard stainless steel 1.27 µm [50 µin.] min. nickel all over, 3.81 µm [150 µin.] min. tin/lead selective tails. ulk Product Specifications - attery Holder over Part Number over Material olor or -6S Thermoplastic, UL94-VO lack Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches] Delphi onnection Systems

159 Energy Products attery Holder 2/3 ylindrical ell over Installed Recommended P Layout Optional over Part Number Product Specifications - attery Holder Part Number Product Type Housing Material Housing olor ontact Material ontact Finish Packaging Type 6S-2/3 2/3 cylindrical cell battery holder Glass filled thermoplastic, UL94V-O lack Spring hard stainless steel 1.27 µm [50 µin.] min. nickel all over, 3.81 µm [150 µin.] min. tin/lead selective tails. ulk Product Specifications - attery Holder over Part Number over Material Thermoplastic, UL94-VO olor lack Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

160 Energy Products attery Holder 2/3 ylindrical ell - L ow Profile Section - Recommended P Layout Product Specifications - attery Holder Part Number Product Type Housing Material Housing olor ontact Material ontact Finish Packaging Type 6S-2/3-LP3 2/3 cylindrical cell battery holder Glass filled thermoplastic, UL94V-O lack Spring hard stainless steel 1.27 µm [50 µin.] min. nickel all over, 3.81 µm [150 µin.] min. tin/lead selective tails. ulk Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches] Delphi onnection Systems

161 Energy Products attery Holder ylindrical ell over Installed Recommended P Layout Optional over Part Number Product Specifications - attery Holder Part Number Product Type Housing Material Housing olor ontact Material ontact Finish Packaging Type 6S- cylindrical cell battery holder Glass filled thermoplastic, UL94V-O lack Spring hard stainless steel 1.27 µm [50 µin.] min. nickel all over, 3.81 µm [150 µin.] min. tin/lead selective tails ulk Product Specifications - attery Holder over Part Number over Material Thermoplastic, UL94-VO olor lack Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

162 Energy Products attery Holder oin ell - 3 Volt, Through Hole, Series Section - Recommended P Layout Product Specifications - attery Holder Part Number Product Type oin cell battery holder Housing Material Glass filled thermoplastic, UL94V-O Housing olor lack ontact Material 302 stainless steel ontact Finish 1.27 µm [50 µin.] min. nickel all over with selective 2.54 µm [100 µin.] tin/lead on tails Operating Temperature -55 to +125 Packaging Type Tray. Tape and reel packaging is available. To specify this option, use the suffix R Notes: 1. attery holder is polarized. 2. ccepts one lithium coin cell battery. 3. attery holders also accept batteries with H designation (e.g. R2032H), for high-drain applications. 4. onsult factory for other plating and material options. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches] Delphi onnection Systems

163 Energy Products attery Holder oin ell - 3 Volt, Surface Mount, SM Series Section - Recommended P Layout Product Specifications - attery Holder Part Number SM Product Type oin cell battery holder Housing Material Glass filled thermoplastic, UL94V-O Housing olor lack ontact Material 302 stainless steel ontact Finish 1.27 µm [50 µin.] min. nickel all over with selective 2.54 µm [100 µin.] tin/lead on tails Operating Temperature -55 to +125 Packaging Type Tray. Tape and reel packaging is available. To specify this option, use the suffix R Notes: 1. attery holder is polarized. 2. ccepts one lithium coin cell battery. 3. attery holders also accept batteries with H designation (e.g. R2032H), for high-drain applications. 4. onsult factory for other plating and material options. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

164 Energy Products attery Holder oin ell - 3 Volt, Easy R emoval, 2S Series Recommended P Layout Section - attery Holder Selection Guide Part No. attery Size 2S R2032, DL2032, R2032 Product Specifications - attery Holder Part Number Product Type Housing Material Housing olor ontact Material ontact Finish Operating Temperature P layout Packaging Type (see table above) oin cell battery holder Glass filled thermoplastic, UL94V-O lack Positive - fully hardened beryllium copper Negative - hard brass 1.27 µm [50 µin.] min. nickel all over -55 to mm [.787 in.] solder tail to solder tail spacing ulk Notes: 1. ccepts one lithium coin cell battery. 2. attery holders also accept batteries with H designation (e.g. R2032H), for high-drain applications. 3. vailable in high temperature material (natural color). To specify this option, use the prefix IR ; for standard material no prefix is used. 4. vailable with tin/lead dipped tails. To specify this option, add the suffix onsult factory for other plating and material options. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches] Delphi onnection Systems

165 Energy Products attery Holder oin ell - 3 Volt, 2S2032 Series Recommended P Layout attery Holder Selection Guide Part No. attery Size Dim. Dim. Dim. Dim. D Dim. E mm [.900 in.] mm [1.08 in.] mm [.450 in.] 4.95 mm [.195 in.] 6.86 mm [.270 in.] 2S R2032, DL2032, R2032 2S R2025, DL2025 2S R2016, DL2016, R2016, R2020, LM2020 Product Specifications - attery Holder Part Number Product Type Housing Material Housing olor ontact Material ontact Finish Operating Temperature Packaging Type (see table above) oin cell battery holder Glass filled thermoplastic, UL94V-O lack Positive - fully hardened beryllium copper Negative - hard brass 1.27 µm [50 µin.] min. nickel all over -55 to +125 ulk Notes: 1. ccepts one lithium coin cell battery. 2. attery holders also accept batteries with H designation (e.g. R2430H), for high-drain applications. 3. vailable in high temperature material (natural color). To specify this option, use the prefix IR ; for standard material no prefix is used. 4. vailable with tin/lead dipped tails. To specify this option, add the suffix onsult factory for other plating and material options. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

166 Energy Products attery Holder oin ell - 6 Volt, 4S2032 Series Recommended P Layout Dim. Dim. Dim. Dim. D Dim. E mm [.900 in.] mm [1.08 in.] mm [.450 in.] 7.37 mm [.290 in.] 9.27 mm [.365 in.] attery Holder Selection Guide Part No. attery Size 4S R2032, R2032 Product Specifications - attery Holder Part Number Product Type Housing Material Housing olor ontact Material ontact Finish Operating Temperature Packaging Type (see table above) oin cell battery holder Glass filled thermoplastic, UL94V-O lack Positive - fully hardened beryllium copper Negative - hard brass 1.27 µm [50 µin.] min. nickel all over -55 to +125 ulk Notes: 1. ccepts two lithium coin cell batteries. 2. attery holders also accept batteries with H designation (e.g. R2032H), for high-drain applications. 3. vailable in high temperature material (natural color). To specify this option, use the prefix IR ; for standard material no prefix is used. 4. vailable with tin/lead dipped tails. To specify this option, add the suffix onsult factory for other plating and material options. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches] Delphi onnection Systems

167 Energy Products attery Holder oin ell - 3 Volt, 2S2325 Series Recommended P Layout Dim. Dim. Dim. Dim. D Dim. E attery Holder Selection Guide mm [1.00 in.] mm [1.13 in.] mm [.500 in.] 4.32 mm [.170 in.] 6.99 mm [.275 in.] Part No. attery Size Product Specifications - attery Holder 2S R2325, R2330 2S R2316, R2320 Part Number Product Type Housing Material Housing olor ontact Material ontact Finish Operating Temperature Packaging Type (see table above) oin cell battery holder Glass filled thermoplastic, UL94V-O lack Positive - fully hardened beryllium copper Negative - hard brass 1.27 µm [50 µin.] min. nickel all over -55 to +125 ulk Notes: 1. ccepts one lithium coin cell battery. 2. attery holders also accept batteries with H designation (e.g. R2032H), for high-drain applications. 3. vailable in high temperature material (natural color). To specify this option, use the prefix IR ; for standard material no prefix is used. 4. vailable with tin/lead dipped tails. To specify this option, add the suffix onsult factory for other plating and material options. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

168 Energy Products attery Holder oin ell - 6 Volt, 4S2325 Series Recommended P Layout Dim. Dim. Dim. Dim. D Dim. E attery Holder Selection Guide mm [1.01 in.] mm [1.135 in.] mm [.505 in.] 7.37 mm [.290 in.] mm [.400 in.] Part No. attery Size Product Specifications - attery Holder Part Number Product Type Housing Material Housing olor ontact Material ontact Finish Operating Temperature Packaging Type (see table above) oin cell battery holder Glass filled thermoplastic, UL94V-O lack Positive - fully hardened beryllium copper Negative - hard brass 4S R µm [50 µin.] min. nickel all over with 2.54 µm [100 µin.] tin/lead on tails. -55 to +125 ulk Notes: 1. ccepts two lithium coin cell batteries. 2. attery holders also accept batteries with H designation (e.g. R2325H), for high-drain applications. 3. vailable in high temperature material (natural color). To specify this option, use the prefix IR ; for standard material no prefix is used. 4. vailable with tin/lead dipped tails. To specify this option, use the suffix onsult factory for other plating and material options. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches] Delphi onnection Systems

169 Energy Products attery Holder oin ell 3 Volt, 2S2425 Series & 6 Volt, 4S2425 Series Recommended P Layout Dim. Dim. Dim. Dim. D Dim. E 2S mm [1.050 in.] mm [1.160 in.] mm [.525 in.] 4.32 mm [.170 in.] 6.99 mm [.275 in.] 4S mm [1.01 in.] mm [1.135 in.] mm [.505 in.] 7.37 mm [.290 in.] mm [.400 in.] Product Specifications - attery Holder attery Holder Selection Guide Part No. attery Size 2S R 2430, LM 2425, DL S R 2420, DL S LM2425, R2430, DL2430 Product Type Housing Material Housing olor ontact Material ontact Finish Operating Temperature Packaging Type oin cell battery holder Glass filled thermoplastic, UL94V-O lack Positive - fully hardened beryllium copper Negative - hard brass 1.27 µm [50 µin.] min. nickel all over -55 to +125 ulk Notes: 1. 2S2425 accepts one lithium coin cell battery. 4S2425 accepts two lithium coin cell batteries. 2. attery holders also accept batteries with H designation (e.g. R2032H), for high-drain applications. 3. vailable in high temperature material (natural color). To specify this option, use the prefix IR ; for standard material no prefix is used. 4. vailable with tin/lead dipped tails. To specify this option, add the suffix onsult factory for other plating and material options. Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches]. ommercial onnector atalog

170 Energy Products attery Holder Vertical - Through Hole, VH2032 Series Recommended P Layout Section - Product Specifications - attery Holder Part Number Product Type Housing Material Housing olor ontact Material ontact Finish Operating Temperature Packaging Type VH Vertical battery holder High temperature thermoplastic, UL94V-O lack Spring hard stainless steel 1.27 µm [50 µin.] min. nickel all over; 3.81 µm [150 µin.] minimum 60/40 tin/lead on tails -55 to +125 ulk Notes: 1. attery holder is polarized. 2. ccepts one lithium coin cell battery, size Dimensions shown are for reference only. Unless otherwise specified, dimensions are in millimeters and [inches] Delphi onnection Systems