CUBE.460. The system for automation in the manual soldering area

Transcription

1 CUBE.460 The system for automation in the manual soldering area

2 CUBE.460 The new entry-level selective soldering system The new CUBE.460 entry-level soldering system is designed as a production cell for small and medium batch sizes. 7 0 The capability of setting the soldering angle to 0 and 7 with program control makes it possible to use various soldering nozzles under optimum conditions for each one. This means difficult layouts can often be achieved, with ultra-narrow clearances. With the loading shuttle, it is possible to perform THT assembly directly on the machine, at the same time as significantly improving quality when compared to manual soldering. The simplified graphical programming gives you a quick entry into selective soldering technology. Benefit from the professional functions and proven technology available in the larger systems, such as process monitoring or bus-capable DC servomotors. The CUBE.460 is excellently suited to using various solders when our set-up carriage is employed. Increase your throughput and flexibility by a second soldering module with program-controlled stroke. Circuit boards or components up to 460 x 460 mm, with or without lead content, are processed with quick-change, flexible soldering nozzles. In the design, particular attention has been paid to simple setup and maintenance, through good accessibility. The standard microdrop fluxer achieves a precise application pattern for fluxing with very few residues. High-performance quartz pre-heating guarantees efficient pre-heating and low energy consumption. An electrodynamic pump is available as an alternative to the standard soldering pump. The process observation camera helps you to optimize the process.

3 CUBE.460 Software INERTEC has worked on the software GUI (Graphical User Interface) specifically for simplified operation. The control system for the CUBE is based on the systems from the ELS 3.3 and EMLS product lines which have proven themselves over many years. Programming can be carried out without having to dispense with the convenience of offline software. The software has been expanded to include a warpage correction module. This makes it possible to compensate for circuit board warpage by correcting the z-axis. During the programming, the circuit board warpage is visualized at every point and transferred into the program. The optional Fiducial sensor is correcting the positioning during the solder process. Also the RT-Console control program now impresses with additional modules. The statistical module records the circuit boards that are produced. The production figures can be called up subsequently (according to DMX code or program name). A line plotter function makes it possible to log the analog measurement values (such as solder temperature, nitrogen temperature) on a 24/7 basis. Barcode integration, automatically time functions, integrated maintenance reminders as well as online access are standard functions and included in the software. Inertec Löttechnik GmbH Kreuzstraße Kreuzwertheim Tel: 0049 (0) Fax: 0049 (0) info@inertec.de

4 Machine Specification Dimensions with shuttle L 2000 mm; W 1550 mm; H 1250 mm (79 x 61 x50 ) Dimensions without shuttle L 1430 mm; W 1550 mm; H 1250 mm (57 x 61 x 50 ) Weight Ca 800 kg Colour base frame RAL7035; door panel RAL7021 Exhaust opening Ø150 mm (6 ) Extraction rate 400m³/h Power requirements 3x32 A; 3x400V; 50 Hz;6KW System control Control concept PC; Beckhoff PLC Interface Ethernet, USB USV Optional PC PC; Flat screen monitor; keyboard; mouse Offline software Offline software for easy programming Axis type XY-Portal; Z-axis lift Camera Camera with cross hair for online programming Axis movement Combination of toothed belts and ball screw Drive concept DC Servo motors with encoders; CAN-BUS Repeatability ±0,15 mm (±0,006 ) Board size Dimensions min/max 20x20 mm / 460x460 mm (0,8 x0,8 / 18 x18) Soldering angle 0 Soldering angle 0 oder 7 Bottom side clearance 30 mm (1,2 ) Top side clearance 150 mm (6 ) Carrier Special fixtures available, downholder, etc. Flux System Fluxer type Micro Drop Flux Alcohol based with 5% solids recommended Flux container 3 litre pressurised pot with level indicator Second flux pot for different flux type available Preheat Type Quartz Rods Power approx. 4 KW Top side preheat Built into the gripper Solder Pot Solder pot (big size) enables to add a Solder volume lead-free (45 Kg) / leaded (50 Kg) second mini wave module Using two small solder pots enables to Solder volume lead-free (21 Kg) / leaded (24 Kg) operate with different alloys Solder pot with a wave module = 200mm Solder volume lead-free (58 Kg) / leaded (66 Kg) Additional mini wave module For parallel soldering or in combination with the module lifting different nozzles can be used in one programm Additional nozzle heating High performance additional nozzle heating including temperature controller Additional solder nozzles Different sizes are available Ø4 mm - Ø20 mm (0,02 0,08 ) Wetted (multi directional) nozzle Different sizes are available Ø4 mm - Ø20 mm (0,02 0,08 ) Warm up time Circa 45 minutes Solder temperature Maximum 330 C Solder temperature control solder aggregate Solder wave height control Programm controlled Solder wire feeder Motor driven up to 1,5-2mm (other sizes on request), solder wire max 5 kg Nitrogen inerted Nitrogen quality, 5.0 is recommended, max pressure 5,5 bar Nitrogen consumption Depending on User soldering nozzle 1-3 m3/ hr Process Camera Camera real time to view the soldering process Trolley and Exchangeable solder pot Exchanging of the soldering aggregate for the use of different alloys Electro-dynamic solder pump Alternative to a standard rotarydrive pump Standard Optional

5 Inertec Löttechnik GmbH Kreuzstraße Kreuzwertheim Tel: 0049 (0) Fax: 0049 (0) info@inertec.de STUDIO TSCHÖP Wertheim