16-Mbit (1 M words 16 bit / 2 M words 8 bit) Static RAM with Error-Correcting Code (ECC)

Transcription

1 16-Mbit (1 M words 16 bit / 2 M words 8 bit) Static RAM with Error-Correcting Code (ECC) 16-Mbit (1 M words 16 bit / 2 M words 8 bit) Static RAM with Error-Correcting Code (ECC) Features Ultra-low standby current Typical standby current: 5.5 A Maximum standby current: 16 A High speed: 45 ns / 55 ns Embedded error-correcting code (ECC) for single-bit error correction Wide voltage range: 1.65 V to 2.2 V, 2.2 V to 3.6 V, and 4.5 V to 5.5 V 1.0-V data retention Transistor-transistor logic (TTL) compatible inputs and outputs Error indication (ERR) pin to indicate 1-bit error detection and correction 48-pin TSOP I package configurable as 1 M 16 or 2 M 8 SRAM Available in Pb-free 48-ball VFBGA and 48-pin TSOP I packages Functional Description CY62167G and CY62167GE are high-performance CMOS, low-power (MoBL ) SRAM devices with embedded ECC [1]. Both devices are offered in single and dual chip enable options and in multiple pin configurations. The CY62167GE device includes an ERR pin that signals a single-bit error-detection and correction event during a read cycle. To access devices with a single chip enable input, assert the chip enable (CE) input LOW. To access dual chip enable devices, assert both chip enable inputs CE 1 as LOW and CE 2 as HIGH. To perform data writes, assert the Write Enable (WE) input LOW, and provide the data and address on the device data pins (I/O 0 through I/O 15 ) and address pins (A 0 through A 19 ) respectively. The Byte High Enable (BHE) and Byte Low Enable () inputs control byte writes and write data on the corresponding I/O lines to the memory location specified. BHE controls I/O 8 through I/O 15 and controls I/O 0 through I/O 7. To perform data reads, assert the Output Enable (OE) input and provide the required address on the address lines. You can access read data on the I/O lines (I/O 0 through I/O 15 ). To perform byte accesses, assert the required byte enable signal (BHE or ) to read either the upper byte or the lower byte of data from the specified address location. All I/Os (I/O 0 through I/O 15 ) are placed in a high-impedance state when the device is deselected (CE HIGH for a single chip enable device and CE 1 HIGH / CE 2 LOW for a dual chip enable device), or the control signals are de-asserted (OE,, BHE). These devices have a unique Byte Power-down feature where, if both the Byte Enables (BHE and ) are disabled, the devices seamlessly switch to the standby mode irrespective of the state of the chip enables, thereby saving power. On the CY62167GE devices, the detection and correction of a single-bit error in the accessed location is indicated by the assertion of the ERR output (ERR = High). See the Truth Table CY62167G/CY62167GE on page 17 for a complete description of read and write modes. The CY62167G and CY62167GE devices are available in a Pb-free 48-pin TSOP I package and 48-ball VFBGA packages. The logic block diagrams are on page 2. The device in the 48-pin TSOP I package can also be configured to function as a 2 M words 8 bit device. Refer to the Pin Configurations section for details. For a complete list of related documentation, click here. Note 1. This device does not support automatic write-back on error detection. Cypress Semiconductor Corporation 198 Champion Court San Jose, CA Document Number: Rev. *L Revised February 7, 2015

2 Logic Block Diagram CY62167G ECC ENCODE DATA IN DRIVERS A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 ROW DECODER 1M x 16 / 2M x 8 RAM ARRAY SENSE AMPS ECC DECODE I/O 0 -I/O 7 I/O 8 -I/O 15 COLUMN DECODER A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 POWER DOWN CIRCUIT CE BHE BYTE BHE WE OE CE 2 CE 1 Logic Block Diagram CY62167GE ECC ENCODE DATA IN DRIVERS A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 ROW DECODER 1M x 16 / 2M x 8 RAM ARRAY SENSE AMPS ECC DECODE ERR I/O 0 -I/O 7 I/O 8 -I/O 15 COLUMN DECODER A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 POWER DOWN CIRCUIT CE BHE BYTE BHE WE OE CE 2 CE 1 Document Number: Rev. *L Page 2 of 26

3 Contents Pin Configuration CY62167G...4 Pin Configuration CY62167GE...5 Product Portfolio... 7 Maximum Ratings... 8 Operating Range... 8 DC Electrical Characteristics... 8 Capacitance Thermal Resistance AC Test Loads and Waveforms Data Retention Characteristics Data Retention Waveform Switching Characteristics Switching Waveforms Truth Table CY62167G/CY62167GE ERR Output CY62167GE Ordering Information Ordering Code Definitions Package Diagrams Acronyms Document Conventions Units of Measure Document History Page Sales, Solutions, and Legal Information Worldwide Sales and Design Support Products PSoC Solutions Cypress Developer Community Technical Support Document Number: Rev. *L Page 3 of 26

4 Pin Configuration CY62167G Figure ball VFBGA pinout (Dual Chip Enable without ERR) CY62167G [2] OE A 0 A 1 A 2 CE 2 A I/O 8 BHE A 3 A 4 CE 1 I/O 0 B I/O 9 I/O 10 A 5 A 6 I/O 1 I/O 2 C V SS I/O 11 A 17 A 7 I/O 3 V CC D V CC I/O 12 NC A 16 I/O 4 Vss E I/O 14 I/O 13 A 14 A 15 I/O 5 I/O 6 F I/O 15 A 19 A 12 A 13 WE I/O 7 G A 18 A 8 A 9 A 10 A 11 NC H [2, 3] Figure pin TSOP I pinout (Dual Chip Enable without ERR) CY62167G A15 A14 A13 A12 A11 A10 A9 A8 A19 NC WE CE 2 NC BHE A18 A17 A7 A6 A5 A4 A3 A2 A A16 BYTE Vss I/O15/A20 I/O7 I/O14 I/O6 I/O13 I/O5 I/O12 I/O4 Vcc I/O11 I/O3 I/O10 I/O2 I/O9 I/O1 I/O8 I/O0 OE Vss CE 1 A0 Notes 2. NC pins are not connected internally to the die and are typically used for address expansion to a higher-density device. Refer to the respective datasheets for pin configuration. 3. Tie the BYTE pin in the 48-pin TSOP I package to V CC to use the device as a 1 M 16 SRAM. The 48-pin TSOP I package can also be used as a 2 M 8 SRAM by tying the BYTE signal to V SS. In the 2 M 8 configuration, pin 45 is the extra address line A20, while BHE,, and I/O 8 to I/O 14 pins are not used and can be left floating. Document Number: Rev. *L Page 4 of 26

5 Pin Configuration CY62167GE Figure ball VFBGA pinout (Single Chip Enable with ERR) CY62167GE [4, 5] OE A 0 A 1 A 2 ERR A I/O 8 BHE A 3 A 4 CE I/O 0 B I/O 9 I/O 10 A 5 A 6 I/O 1 I/O 2 C V SS I/O 11 A 17 A 7 I/O 3 V CC D V CC I/O 12 NC A 16 I/O 4 Vss E I/O 14 I/O 13 A 14 A 15 I/O 5 I/O 6 F I/O 15 A 19 A 12 A 13 WE I/O 7 G A 18 A 8 A 9 A 10 A 11 NC H [4, 5] Figure ball VFBGA pinout (Dual Chip Enable with ERR) CY62167GE OE A 0 A 1 A 2 CE 2 A I/O 8 BHE A 3 A 4 CE 1 I/O 0 B I/O 9 I/O 10 A 5 A 6 I/O 1 I/O 2 C V SS I/O 11 A 17 A 7 I/O 3 V CC D V CC I/O 12 ERR A 16 I/O 4 Vss E I/O 14 I/O 13 A 14 A 15 I/O 5 I/O 6 F I/O 15 A 19 A 12 A 13 WE I/O 7 G A 18 A 8 A 9 A 10 A 11 NC H Note 4. NC pins are not connected internally to the die and are typically used for address expansion to a higher-density device. Refer to the respective datasheets for pin configuration. 5. ERR is an Output pin. If not used, this pin should be left floating. Document Number: Rev. *L Page 5 of 26

6 Pin Configuration CY62167GE (continued) Figure pin TSOP I pinout (Dual Chip Enable with ERR) CY62167GE [6, 7] A15 A14 A13 A12 A11 A10 A9 A8 A19 NC WE CE 2 ERR BHE A18 A17 A7 A6 A5 A4 A3 A2 A A16 BYTE Vss I/O15/A20 I/O7 I/O14 I/O6 I/O13 I/O5 I/O12 I/O4 Vcc I/O11 I/O3 I/O10 I/O2 I/O9 I/O1 I/O8 I/O0 OE Vss CE 1 A0 Notes 6. NC pins are not connected internally to the die and are typically used for address expansion to a higher density device. Refer to the respective datasheets for pin configuration. 7. Tie the BYTE pin in the 48-pin TSOP I package to V CC to use the device as a 1 M 16 SRAM. The 48-pin TSOP I package can also be used as a 2 M 8 SRAM by tying the BYTE signal to V SS. In the 2 M 8 configuration, pin 45 is the extra address line A20, while the BHE,, and I/O 8 to I/O 14 pins are not used and can be left floating. Document Number: Rev. *L Page 6 of 26

7 Product Portfolio Features and Options Product (see the Pin Configurations section) CY62167G(E)18 Single or dual CY62167G(E)30 Chip Enables CY62167G(E) Optional ERR pin Current Consumption Range V CC Range (V) Speed (ns) Operating I CC, (ma) f = f max Standby, I SB2 (µa) Typ [8] Max Typ [8] Max 1.65 V 2.2 V Industrial 2.2 V 3.6 V 4.5 V 5.5 V Note 8. Typical values are included only for reference and are not guaranteed or tested. Typical values are measured at V CC = 1.8 V (for V CC range of 1.65 V 2.2 V), V CC =3V (for V CC range of 2.2 V 3.6 V), and V CC = 5 V (for V CC range of 4.5 V 5.5 V), T A = 25 C. Document Number: Rev. *L Page 7 of 26

8 Maximum Ratings Exceeding maximum ratings may shorten the useful life of the device. User guidelines are not tested. Storage temperature C to C Ambient temperature with power applied C to C Supply voltage to ground potential V to 6 V DC voltage applied to outputs in High Z state [9] V to V CC V DC input voltage [9] V to V CC V Output current into outputs (LOW) ma Static discharge voltage (MIL-STD-883, Method 3015)... >2001 V Latch-up current... >140 ma Operating Range Grade Ambient Temperature V CC [10] Industrial 40 C to +85 C 1.65 V to 2.2 V, 2.2 V to 3.6 V, 4.5 V to 5.5 V DC Electrical Characteristics Over the operating range of 40 C to 85 C Parameter Description Test Conditions V OH V OL Output HIGH voltage Output LOW voltage 45/55 ns Min Typ [11] Max 1.65 V to 2.2 V V CC = Min, I OH = 0.1 ma 1.4 V 2.2 V to 2.7 V V CC = Min, I OH = 0.1 ma V to 3.6 V V CC = Min, I OH = 1.0 ma V to 5.5 V V CC = Min, I OH = 1.0 ma V to 5.5 V V CC = Min, I OH = 0.1 ma V CC 0.4 [12] 1.65 V to 2.2 V V CC = Min, I OL = 0.1 ma V to 2.7 V V CC = Min, I OL = 0.1 ma V to 3.6 V V CC = Min, I OL = 2.1 ma V to 5.5 V V CC = Min, I OL = 2.1 ma 0.4 V IH Input HIGH 1.65 V to 2.2 V 1.4 V voltage [9] CC V to 2.7 V 2.0 V CC V to 3.6 V 2.0 V CC V to 5.5 V 2.2 V CC V IL Input LOW voltage [9] 1.65 V to 2.2 V V to 2.7 V V to 3.6 V V to 5.5 V I IX Input leakage current GND < V IN < V CC A I OZ Output leakage current GND < V OUT < V CC, Output disabled I CC V CC operating supply current V CC = Max, I OUT = 0 ma, CMOS levels Unit f = MHz ma (45 ns) f = MHz (55 ns) f = 1 MHz Notes 9. V IL(min) = 2.0 V and V IH(max) = V CC + 2 V for pulse durations of less than 2 ns. 10. Full device AC operation assumes a 100-µs ramp time from 0 to V CC (min) and 200-µs wait time after V CC stabilizes to its operational value. 11. Indicates the value for the center of distribution at 3.0 V, 25 C and not 100% tested. 12. This parameter is guaranteed by design and is not tested Document Number: Rev. *L Page 8 of 26

9 DC Electrical Characteristics (continued) Over the operating range of 40 C to 85 C Parameter Description Test Conditions 45/55 ns Min Typ [11] Max Automatic Power-down CE 1 > V CC 0.2 V or CE 2 < 0.2 V Current CMOS Inputs; V CC = 2.2 to 3.6 V and 4.5 to 5.5 V or (BHE and ) > V CC 0.2 V, [13] I SB1 Automatic Power-down V IN > V CC 0.2 V, V IN < 0.2 V, Current CMOS Inputs V CC = 1.65 to 2.2 V f = f max (address and data only), f = 0 (OE, and WE), V CC = V CC(max) Automatic Power-down CE 1 > V CC 0.2V or 25 C [14] Current CMOS Inputs V CC = 2.2 to 3.6 V and 4.5 to 5.5 V CE 2 < 0.2 V or 40 C [14] (BHE and ) > V CC 0.2 V, 70 C [14] Unit A I SB2 [13] Automatic Power-down Current CMOS Inputs V CC = 1.65 to 2.2 V V IN > V CC 0.2 V or V IN < 0.2 V, f = 0, V CC = V CC(max) 85 C CE 1 > V CC 0.2V or CE 2 < 0.2 V or (BHE and ) > V CC 0.2 V, V IN > V CC 0.2 V or V IN < 0.2 V, f = 0, V CC = V CC(max) Notes 13. Chip enables (CE 1 and CE 2 ) and BYTE must be tied to CMOS levels to meet the I SB1 / I SB2 / I CCDR spec. Other inputs can be left floating. 14. The I SB2 maximum limits at 25 C, 40 C, and 70 C are guaranteed by design and not 100% tested. Document Number: Rev. *L Page 9 of 26

10 Capacitance Parameter [15] Description Test Conditions Max Unit C IN Input Capacitance 10.0 pf T A = 25 C, f = 1 MHz, V CC = V CC(typ) C OUT Output Capacitance 10.0 pf Thermal Resistance Parameter [15] Description Test Conditions 48-ball VFBGA 48-pin TSOP I Unit JA JC Thermal Resistance (junction to ambient) Thermal Resistance (junction to case) Still air, soldered on a inch, two-layer printed circuit board C/W C/W AC Test Loads and Waveforms V CC OUTPUT 30 pf INCLUDING JIG AND SCOPE R1 R2 Figure 6. AC Test Loads and Waveforms V HIGH 10% GND Rise Time = 1 V/ns Equivalent to: THÉVENIN EQUIVALENT OUTPUT ALL INPUT PULSES 90% 90% 10% R TH V TH Fall Time = 1 V/ns Parameters 1.8 V 2.5 V 3.0 V 5.0 V Unit R R R TH V TH V V HIGH V Note 15. Tested initially and after any design or process changes that may affect these parameters. Document Number: Rev. *L Page 10 of 26

11 Data Retention Characteristics Over the Operating Range Parameter Description Conditions Min Typ [16] Max Unit V DR V CC for data retention 1.0 V I [17, 18] CCDR Data retention current 1.2 V < V CC < 2.2 V, CE 1 > V CC 0.2 V or CE 2 < 0.2 V or (BHE and ) > V CC 0.2 V, V IN > V CC 0.2 V or V IN < 0.2 V 2.2 V < V CC < 3.6 V or 4.5 V < V CC < 5.5 V, CE 1 > V CC 0.2 V or CE 2 < 0.2 V A A t CDR [19] t R [19, 20] Chip deselect to data retention time or (BHE and ) > V CC 0.2 V, V IN > V CC 0.2 V or V IN < 0.2 V 0.0 Operation recovery time 45/55 ns Data Retention Waveform Figure 7. Data Retention Waveform [21] V CC V CC (min) DATA RETENTION MODE V DR = 1.0 V V CC (min) t CDR t R CE 1 or BHE. CE 2 Notes 16. Indicates the value for the center of distribution at 3.0 V, 25 C and not 100% tested. 17. Chip enables (CE 1 and CE 2 ) and BYTE must be tied to CMOS levels to meet the I SB1 / I SB2 / I CCDR spec. Other inputs can be left floating. 18. I CCDR is guaranteed only after the device is first powered up to V CC (min) and then brought down to V DR. 19. These parameters are guaranteed by design and are not tested. 20. Full-device operation requires linear V CC ramp from V DR to V CC(min) > 100 s or stable at V CC(min) > 100 s. 21. BHE. is the AND of both BHE and. Deselect the chip by either disabling the chip enable signals or by disabling both BHE and. Document Number: Rev. *L Page 11 of 26

12 Switching Characteristics [22, 23] Parameter Description READ CYCLE 45 ns 55 ns Min Max Min Max t RC Read cycle time ns t AA Address to data valid / Address to ERR valid ns t OHA Data hold from address change / ERR hold from ns address change t ACE CE 1 LOW and CE 2 HIGH to data valid / CE LOW ns to ERR valid t DOE OE LOW to data valid / OE LOW to ERR valid ns t LZOE OE LOW to Low Z [23, 24] ns t HZOE OE HIGH to High Z [23, 24, 25] ns t LZCE CE 1 LOW and CE 2 HIGH to Low Z [23, 24] ns t HZCE CE 1 HIGH and CE 2 LOW to High Z [23, 24, 25] ns t PU CE 1 LOW and CE 2 HIGH to power-up [26] ns t PD CE 1 HIGH and CE 2 LOW to power-down [26] ns t DBE / BHE LOW to data valid ns t LZBE / BHE LOW to Low Z [23] ns t HZBE / BHE HIGH to High Z [23, 25] ns WRITE CYCLE [24, 27] t WC Write cycle time ns t SCE CE 1 LOW and CE 2 HIGH to write end ns t AW Address setup to write end ns t HA Address hold from write end 0 0 ns t SA Address setup to write start 0 0 ns t PWE WE pulse width ns t BW / BHE LOW to write end ns t SD Data setup to write end ns t HD Data hold from write end ns t HZWE WE LOW to High Z [23, 24, 25] ns t LZWE WE HIGH to Low Z [23, 24] ns Unit Notes 22. Test conditions assume signal transition time (rise/fall) of 3 ns or less, timing reference levels of 1.5 V (for V CC > 3 V) and V CC /2 (for V CC < 3 V), and input pulse levels of 0 to 3 V (for V CC > 3 V) and 0 to V CC (for V CC < 3V). Test conditions for the read cycle use the output loading shown in Figure 6 on page 10, unless specified otherwise. 23. At any temperature and voltage condition, t HZCE is less than t LZCE, t HZBE is less than t LZBE, t HZOE is less than t LZOE, and t HZWE is less than t LZWE for any device. 24. Tested initially and after any design or process changes that may affect these parameters. 25. t HZOE, t HZCE, t HZBE, and t HZWE transitions are measured when the outputs enter a high-impedance state. 26. These parameters are guaranteed by design and are not tested. 27. The internal write time of the memory is defined by the overlap of WE = V IL, CE 1 = V IL, BHE or or both = V IL, and CE 2 = V IH. All signals must be ACTIVE to initiate a write and any of these signals can terminate a write by going INACTIVE. The data input setup and hold timing must refer to the edge of the signal that terminates the write. 28. The minimum write cycle pulse width for Write Cycle No. 1 (WE controlled, OE LOW) should be equal to the sum of t HZWE and t SD. Document Number: Rev. *L Page 12 of 26

13 Switching Waveforms [29, 30] Figure 8. Read Cycle No. 1 of CY62167G (Address Transition Controlled) t RC ADDRESS t AA t OHA DATA I/O PREVIOUS DATA OUT VALID DATA OUT VALID Figure 9. Read Cycle No. 1 of CY62167GE (Address Transition Controlled) [29, 30] t RC ADDRESS t AA t OHA DATA I/O PREVIOUS DATA OUT VALID DATA OUT VALID t OHA t AA ERR PREVIOUS ERR VALID ERR VALID Notes 29. The device is continuously selected. OE = V IL, CE = V IL, BHE or, or both = V IL. 30. WE is HIGH for read cycle. Document Number: Rev. *L Page 13 of 26

14 Switching Waveforms (continued) Figure 10. Read Cycle No. 2 (OE Controlled) [31, 32, 33, 35] ADDRESS t RC CE t PD t ACE t HZCE OE t DOE t HZOE BHE/ t LZOE t LZBE t DBE t HZBE DATA I/O HIGH IMPEDANCE DATA OUT VALID HIGH IMPEDANCE t LZCE t PU V CC SUPPLY CURRENT I SB [32, 34, 35, 33] Figure 11. Write Cycle No. 1 (WE Controlled, OE LOW) t WC ADDRESS CE t SCE BHE/ t BW t AW t HA WE t SA t PWE thzwe t SD t HD t LZWE DATA I/O Note 36 DATA IN VALID Notes 31. WE is HIGH for read cycle. 32. For all dual chip enable devices, CE is the logical combination of CE 1 and CE 2. When CE 1 is LOW and CE 2 is HIGH, CE is LOW; when CE 1 is HIGH or CE 2 is LOW, CE is HIGH. 33. Address valid prior to or coincident with CE LOW transition. 34. The internal write time of the memory is defined by the overlap of WE = V IL, CE 1 = V IL, BHE or, or both = V IL, and CE 2 = V IH. All signals must be ACTIVE to initiate a write and any of these signals can terminate a write by going INACTIVE. The data input setup and hold timing must refer to the edge of the signal that terminates the write. 35. Data I/O is in the high-impedance state if CE = V IH, or OE = V IH, or BHE, and/or = V IH. 36. During this period, the I/Os are in the output state. Do not apply input signals. 37. The minimum write cycle pulse width should be equal to the sum of t HZWE and t SD. Document Number: Rev. *L Page 14 of 26

15 Switching Waveforms (continued) [38, 39, 40] Figure 12. Write Cycle No. 2 (CE Controlled) t WC ADDRESS t SA t SCE CE t AW t PWE t HA WE t BW BHE/ OE t HZOE t SD t HD DATA I/O Note 41 DATA IN VALID Notes 38. For all dual chip enable devices, CE is the logical combination of CE 1 and CE 2. When CE 1 is LOW and CE 2 is HIGH, CE is LOW; when CE 1 is HIGH or CE 2 is LOW, CE is HIGH. 39. The internal write time of the memory is defined by the overlap of WE = V IL, CE 1 = V IL, BHE or or both = V IL, and CE 2 = V IH. All signals must be ACTIVE to initiate a write and any of these signals can terminate a write by going INACTIVE. The data input setup and hold timing must refer to the edge of the signal that terminates the write. 40. Data I/O is in the high-impedance state if CE = V IH, or OE = V IH, or BHE, and/or = V IH. 41. During this period, the I/Os are in output state. Do not apply input signals. Document Number: Rev. *L Page 15 of 26

16 Switching Waveforms (continued) [42, 43, 44] Figure 13. Write Cycle No. 4 (BHE/ controlled, OE LOW) t WC ADDRESS CE t SCE t AW t SA t BW t HA BHE/ WE t PWE t HZWE t SD t HD t LZWE DATA I/O Note 45 DATA IN VALID Figure 14. Write Cycle No. 5 (WE controlled) [42, 43, 44] t WC ADDRESS CE t SCE t AW t SA t HA t PWE WE t BW BHE/ OE t HZOE t SD t HD DATA I/O Note 45 DATAIN VALID Notes 42. For all dual chip enable devices, CE is the logical combination of CE 1 and CE 2. When CE 1 is LOW and CE 2 is HIGH, CE is LOW; when CE 1 is HIGH or CE 2 is LOW, CE is HIGH. 43. The internal write time of the memory is defined by the overlap of WE = V IL, CE 1 = V IL, BHE or or both = V IL, and CE 2 = V IH. All signals must be ACTIVE to initiate a write and any of these signals can terminate a write by going INACTIVE. The data input setup and hold timing must refer to the edge of the signal that terminates the write. 44. Data I/O is in the high-impedance state if CE = V IH, or OE = V IH, or BHE, and/or = V IH. 45. During this period, the I/Os are in output state. Do not apply input signals. Document Number: Rev. *L Page 16 of 26

17 Truth Table CY62167G/CY62167GE BYTE [46] CE 1 CE 2 WE OE BHE Inputs/Outputs Mode Power Configuration X [47] H X [47] X X X X High-Z Deselect/Power-down Standby (I SB ) 2 M 8 / 1 M 16 X X [47] L X X X X High-Z Deselect/Power-down Standby (I SB ) 2 M 8 / 1 M 16 X X [47] X [47] X X H H High-Z Deselect/Power-down Standby (I SB ) 1 M 16 H L H H L L L Data Out (I/O 0 I/O 15 ) Read Active (I CC ) 1 M 16 H L H H L H L Data Out (I/O 0 I/O 7 ); High-Z (I/O 8 I/O 15 ) Read Active (I CC ) 1 M 16 H L H H L L H High Z (I/O 0 I/O 7 ); Data Out (I/O 8 I/O 15 ) Read Active (I CC ) 1 M 16 H L H H H L H High-Z Output disabled Active (I CC ) 1 M 16 H L H H H H L High-Z Output disabled Active (I CC ) 1 M 16 H L H H H L L High-Z Output disabled Active (I CC ) 1 M 16 H L H L X L L Data In (I/O 0 I/O 15 ) Write Active (I CC ) 1 M 16 H L H L X H L Data In (I/O 0 I/O 7 ); High-Z (I/O 8 I/O 15 ) Write Active (I CC ) 1 M 16 H L H L X L H High-Z (I/O 0 I/O 7 ); Data In (I/O 8 I/O 15 ) Write Active (I CC ) 1 M 16 L L H H L X X Data Out (I/O 0 I/O 7 ) Read Active (I CC ) 2 M 8 L L H H H X X High-Z Output disabled Active (I CC ) 2 M 8 L L H L X X X Data In (I/O 0 I/O 7 ) Write Active (I CC ) 2 M 8 ERR Output CY62167GE Output [48] Mode 0 Read operation, no single-bit error in the stored data. 1 Read operation, single-bit error detected and corrected. High-Z Device deselected / outputs disabled / Write operation Notes 46. This pin is available only in the 48-pin TSOP I package. Tie the BYTE to V CC to configure the device in the 1 M 16 option. The 48-pin TSOP I package can also be used as a 2 M 8 SRAM by tying the BYTE signal to V SS. 47. The X (Don t care) state for the chip enables refer to the logic state (either HIGH or LOW). Intermediate voltage levels on these pins is not permitted. 48. ERR is an Output pin.if not used, this pin should be left floating. Document Number: Rev. *L Page 17 of 26

18 Ordering Information Speed (ns) Ordering Code Package Diagram Package Type Operating Range CY62167G30-45BVXI ball VFBGA (6 8 1 mm) (Pb-free), Package Code: BZ48, Dual Chip Enable without ERR 45 CY62167G30-45ZXI CY62167G-45ZXI pin TSOP I ( mm) (Pb-free), Package Code: Z48A, Dual Chip Enable without ERR 48-pin TSOP I ( mm) (Pb-free), Dual Chip Enable without ERR CY62167GE30-45BVXI CY62167GE30-45ZXI CY62167GE-45ZXI ball VFBGA (6 8 1 mm) (Pb-free), Dual Chip Enable with ERR output at pin E3 48-pin TSOP I ( mm) (Pb-free), Dual Chip Enable with ERR output at pin pin TSOP I ( mm) (Pb-free), Dual Chip Enable with ERR output at pin 13 Industrial 55 CY62167G18-55BVXI CY62167GE18-55BVXI ball VFBGA (6 8 1 mm) (Pb-free), Dual Chip Enable without ERR 48-ball VFBGA (6 8 1 mm) (Pb-free), Dual Chip Enable with ERR output at pin E3 CY62167G18-55ZXI pin TSOP I ( mm) (Pb-free), Dual Chip Enable with ERR output at pin 13 Ordering Code Definitions CY G E XX - XX XX X X X Temperature Grade: X = I I = Industrial Pb-free X = blank or 1 blank = Dual Chip Enable; 1 = Single Chip Enable Package Type: XX = BV or Z BV = 48-ball VFBGA Z = 48-pin TSOP I Speed Grade: XX: 45 = 45 ns and 55 = 55ns Voltage range: 30 = 3-V typ; 18 = 1.8-V typ; no character = 5-V typ ERR output: Single-bit error correction indicator Process Technology: G = 65 nm Bus width: 7 = 16 Density: 6 = 16-Mbit Family Code: MoBL SRAM family Company ID: CY = Cypress Document Number: Rev. *L Page 18 of 26

19 Package Diagrams Figure ball VFBGA ( mm) BV48/BZ48 Package Outline, *H Document Number: Rev. *L Page 19 of 26

20 Package Diagrams (continued) Figure pin TSOP I ( mm) Z48A Package Outline, *D Document Number: Rev. *L Page 20 of 26

21 Acronyms Document Conventions Acronym Description Units of Measure BHE CE CMOS I/O OE SRAM TSOP VFBGA WE Byte High Enable Byte Low Enable Chip Enable Complementary metal oxide semiconductor Input/output Output Enable Static random access memory Thin small outline package Very fine-pitch ball grid array Write Enable Symbol C degree Celsius MHz megahertz A microampere s microsecond ma milliampere mm millimeter ns nanosecond ohm % percent pf picofarad V volt W watt Unit of Measure Document Number: Rev. *L Page 21 of 26

22 Document History Page Document Title: CY62167G/CY62167GE MoBL, 16-Mbit (1 M words 16 bit / 2 M words 8 bit) Static RAM with Error-Correcting Code (ECC) Document Number: Rev. ECN No. Orig. of Change Submission Date Description of Change ** TAVA 07/26/2012 New data sheet. *A AJU 10/30/2012 Updated Document title to 16-Mbit (1 M words 16 bit / 2 M words 8 bit) Static RAM with Error-Correcting Code (ECC). Updated Features (Included ECC feature, updated typical standby current spec). Added note #1 Corrected typos in Functional Description. Updated Logic Block Diagram CY62167G, Logic Block Diagram CY62167GE for better clarity. Updated Notes 2, 3, 4, 5 for better clarity. Listed all product options in Product Portfolio. Added typical values for I SB2 parameter. Updated Note 8 for better clarity. Updated Maximum Ratings to extend limits for 5 V device. Changed latch up current limit from 200 to 140 ma (per JEDEC limits). Updated DC Electrical Characteristics Corrected I OH and I OL conditions for V OH and V OL specifications. Added I CC typical and maximum values at f = 1 MHz Changed typical spec for I SB1 and I SB2 from 2.5 A to 3.2 A. Split the I SB1 and I SB2 specs across multiple voltage ranges. Updated Description and Test Conditions for I SB1 and I SB2 parameters. Added Note 13 and referred it in the I SB1 and I SB2 parameters. Changed C IN and C OUT values from 8 pf to 10 pf. Updated Thermal Resistance values of JA and JC parameters for 48 pin TSOP I package. Added values for V HIGH parameters in AC Test Loads and Waveforms. Updated Data Retention Characteristics Split Test Conditions of I CCDR parameter into two rows to cover multiple V CC ranges. Changed typical spec for I CCDR from 2.5 A to 3.2 A. Updated Note 17 to remove byte enables. Updated Data Retention Waveform (Referred Note 21 in Figure 7). Updated Switching Characteristics Updated Notes 22, 27 for better clarity. Updated Switching Waveforms Updated Note 29 for better clarity. Updated Figure 10 as a single figure applicable to both CY62167G and CY62167GE. Referred Notes 32, 33 in Figure 10. Referred Note 32 in Figure 11. Corrected typos in Note 33, 35, 40, 44. Referred Note 38 in Figure 12. Removed Write Cycle No. 3 (WE controlled, OE LOW) waveform. Removed the Note During this period the I/Os are in output state. Do not apply input signals. and its references. Removed the Note If CE goes HIGH simultaneously with WE going HIGH, the output remains in a high-impedance state. and its references (captured in Notes 35, 40, 44) Referred Notes 42, 43, 44 in Figure 13. Updated Truth Table CY62167G/CY62167GE (Removed references of Note 47 in BHE and column). Updated Package Diagrams (spec (Changed revision from *G to *H)). Document Number: Rev. *L Page 22 of 26

23 Document History Page (continued) Document Title: CY62167G/CY62167GE MoBL, 16-Mbit (1 M words 16 bit / 2 M words 8 bit) Static RAM with Error-Correcting Code (ECC) Document Number: Rev. ECN No. Orig. of Change *B MEMJ 05/28/2013 Updated Document Title to read as CY62167G/CY62167GE MoBL, 16-Mbit (1 M words 16 bit / 2 M words 8 bit) Static RAM with Error-Correcting Code (ECC) Added 55 ns (1.8 V) device details Updated Logic Block Diagram CY62167G. Updated Logic Block Diagram CY62167GE. Updated Pin Configuration CY62167GE (Added Figure 4). Updated Product Portfolio: Updated details of I SB2 parameter. Updated DC Electrical Characteristics: Changed typical value of I CC parameter from 5 ma to 7 ma and max value from 30 to 36. Changed typical value of I SB1 parameter from 3.2 µa to 4 µa for V CC = 1.65 to 2.2 V. Changed typical value of I SB2 parameter from 3.2 µa to 4 µa for V CC = 1.65 to 2.2 V. Updated AC Test Loads and Waveforms: Updated the table below Figure 6. Updated Data Retention Characteristics: Changed typical value of I CCDR parameter from 3.2 µa to 4 µa for first condition only. Updated I cc Typical to 29 ma from 25 ma. Updated Data Retention Waveform: Updated Figure 7. Updated Switching Waveforms: Updated Figure 12. Renamed Truth Table CY62167G as Truth Table CY62167G/CY62167GE and updated the same table (Added BYTE information). Updated Ordering Information (Updated part numbers). *C NILE / MEMJ Submission Date Description of Change 10/29/2013 Updated Product Portfolio: Updated values of Operating I CC at f = f MAX (Corresponding to 55-ns speed bin only). Replaced an error detection with a single-bit error detection. Updated Pin Configuration CY62167G: Updated title of Figure 1 and Figure 2. Updated Pin Configuration CY62167GE: Updated title of Figure 5. Updated DC Electrical Characteristics: Referred Note 9 in description of V IH parameter. Updated Test Conditions of I CC parameter (Removed f = f MAX and added f = MHz (45 ns) and f = MHz (55 ns) and added corresponding values). Added typical and maximum values for I SB2 parameter for intermediate temperatures. Updated Data Retention Characteristics: Added Note 18 and referred the same note in I CCDR parameter. Document Number: Rev. *L Page 23 of 26

24 Document History Page (continued) Document Title: CY62167G/CY62167GE MoBL, 16-Mbit (1 M words 16 bit / 2 M words 8 bit) Static RAM with Error-Correcting Code (ECC) Document Number: Rev. ECN No. Orig. of Change *C (Cont.) NILE / MEMJ 10/29/2013 Updated Ordering Information: Updated part numbers. Segregated 45 ns and 55 ns parts list in the table. Updated Package Type column (Added ERR pin location information and Single or Dual Chip Enable information). Added Errata. Updated in new template. *D MEMJ 02/08/2014 Updated Operating Range: Added Note 10 and referred the same note in V CC column. *E MEMJ / VINI Submission Date Description of Change 03/07/2014 Updated DC Electrical Characteristics: Changed I SB2 (Max) at 25C from 7uA to 4.8uA Changed I SB2 (typ) at 40C from 6uA to 4.5uA Changed I SB2 (Max) at 40C from 9uA to 8uA Added Note 11 and referred to typical values Added Note 28 and referred to write cycle timing parameters in Switching Characteristics Referred Note 35 to Figure 10. Changed title of Figure 11 from WE controlled to WE controlled, OE LOW Added Note 36 and 37 in Figure 11. Added Note 41 in Figure 12. Added Figure 14, WE controlled write Corrected ERR table by replacing no error in stored data with no single bit error in stored data. Corrected ERR pin location to E3 in 'Dual Chip Enable with ERR option' in the 48-VFBGA package in Ordering Information. Added Note 45 in Figure 13 and Figure 14. *F AJU 04/02/2014 Changed lower limit for V CC from 1.0 V to 1.2 V in I CCDR conditions. *G VINI 06/03/2014 Updated Features: Changed typical standby current from 3.2 to 4.6 A Updated Product Portfolio: Changed I SB1 and I SB2 typical from 4.0 to 5.5 A and maximum from 23.0 µa to 26.0 µa in the 1.8-V part Changed 25 C I SB1 and I SB2 typical from 3.2 to 4.6 A and maximum from 4.8 µa to 6.0 µa in the 3.3-V and 5-V parts. Changed 40 C I SB2 typical from 4.5 to 5.1 A in the 3.3-V and 5-V parts Changed 70 C I SB2 typical from 9.0 to 8.4 A in the 3.3-V and 5-V parts. Reworded foot notes 10, 12, and 14. Referenced Note 12 from max values of I SB2 at 25 C, 40 C and 70 C Updated Data Retention Characteristics: Changed ICCDR typical current to 5.5 µa and maximum to 26.0 µa in the 1.8-V part Changed ICCDR typical current to 4.6 µa in the 3.3-V and 5-V parts. *H AJU 09/01/2014 Removed Errata (The Errata applicable for the Rev. ** silicon only). Added Errata (The Errata applicable for the Rev. *C silicon only). *I NILE 09/18/2014 No technical updates. Document Number: Rev. *L Page 24 of 26

25 Document History Page (continued) Document Title: CY62167G/CY62167GE MoBL, 16-Mbit (1 M words 16 bit / 2 M words 8 bit) Static RAM with Error-Correcting Code (ECC) Document Number: Rev. ECN No. Orig. of Change Submission Date Description of Change *J VINI 11/21/2014 Updated DC Electrical Characteristics: Updated I SB1 typical for 3.3-V range from 4.6 µa to 5.5 µa. Updated I SB1 typical for 1.8-V range from 5.5 µa to 7 µa. Updated I SB2 typical for 3.3-V range from 4.6 µa to 5.5 µa at 25 C. Updated I SB2 typical for 3.3-V range from 5.1 µa to 6.3 µa at 40 C. Updated I SB2 typical for 1.8-V range from 5.5 µa to 7 µa. Updated Data Retention Characteristics: Updated I CCDR typical for 3.3-V range from 4.6 µa to 5.5 µa. Updated I CCDR typical for 1.8-V range from 5.5 µa to 7 µa. *K VINI 01/16/2015 Updated Functional Description: Added related documentation hyperlink at the end. Updated Switching Characteristics: Added Note 26 and referred the same note in t PU and t PD parameters. Updated Errata: Updated CY62167G(E) SRAM Errata Summary: Updated details in Fix Status column in the table. Updated details in bulleted item Fix Status. Updated Package Diagrams: spec Changed revision from *C to *D. *L NILE 02/06/2015 Updated Pin Configuration CY62167GE: Added Note 5 and referred the same note in Figure 3, Figure 4. Updated DC Electrical Characteristics: Added details of V OH parameter corresponding to voltage range 4.5 V to 5.5 V and test condition V CC = Min, I OH = 0.1 ma. Added Note 12 and referred the same note in minimum value of V OH parameter corresponding to voltage range 4.5 V to 5.5 V and test condition V CC = Min, I OH = 0.1 ma. Updated AC Test Loads and Waveforms: Updated Figure 6. Updated table below Figure 6. Updated Data Retention Characteristics: Updated Note 19. Referred Note 19 in t R parameter. Updated ERR Output CY62167GE: Added Note 48 and referred the same note in Output column. Removed Errata. All Errata for this product have been fixed and fixed samples are available since January 20, Document Number: Rev. *L Page 25 of 26

26 Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. Products Automotive Clocks & Buffers Interface Lighting & Power Control Memory PSoC Touch Sensing USB Controllers Wireless/RF cypress.com/go/automotive cypress.com/go/clocks cypress.com/go/interface cypress.com/go/powerpsoc cypress.com/go/memory cypress.com/go/psoc cypress.com/go/touch cypress.com/go/usb cypress.com/go/wireless PSoC Solutions psoc.cypress.com/solutions PSoC 1 PSoC 3 PSoC 4 PSoC 5LP Cypress Developer Community Community Forums Blogs Video Training Technical Support cypress.com/go/support Cypress Semiconductor Corporation, The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress. Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges. Use may be limited by and subject to the applicable Cypress software license agreement. Document Number: Rev. *L Revised February 7, 2015 Page 26 of 26 QDR RAMs and Quad Data Rate RAMs comprise a new family of products developed by Cypress, IDT, NEC, Renesas, and Samsung. All products and company names mentioned in this document may be the trademarks of their respective holders.