ANSYS, Inc. March 3, 2016 PCB 板极电热耦合分析及对电子设备热设计的影响

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1 ANSYS, Inc. March 3, 2016 PCB 板极电热耦合分析及对电子设备热设计的影响

2 Printed Circuit Board Reliability Real world operating conditions = Multiphysics environment Electrical Reliability Power and Signal Integrity Analysis Thermal Reliability Thermal Analysis Resistive Losses Temperatures Design Iterations Temperatures Mechanical Reliability Thermal Stress Analysis ANSYS, Inc. March 3, 2016

3 Summary of Multiphysics Workflow Electrical DC Analysis (Conductive Losses) Thermal Analysis (Operating Temperature) Thermal Convergence No Max( T )<goal? Yes Thermal Stress Analysis (Deformation) ANSYS, Inc. March 3, 2016

4 SIwave DC with Icepak Thermal Full Automation Inputs Convergence Based Automation Setup File (optional) Board Layout File SIwave DC Thermal Convergence Heat Sources File (optional) Icepak Thermal No Max( T )<goal? Yes Temperature Profile Single Interface End to End Automation ANSYS, Inc. March 3, 2016

5 DC Analysis SIwave DC DC Analysis (Conductive Losses) ANSYS, Inc. March 3, 2016

6 SIwave R17 PowerArtist RTL RedHawk SoC Totem Analog/IP RH CTA Thermal DC AC SYZ Plane Resonance Near/Far Field ALinks for EDA: ECAD Translation Loop Inductance Frequency Sweep Signal Net Analyzer Z o & X talk Scans PI Advisor: Decoupling Optimization SI Circuit Analyses: IBIS, IBIS AMI, Transient ANSYS, Inc. March 3, 2016

7 SIwave DC R17 ECAD Translation SIwave GUI I 2 R DC Solver DC Path Resistance Solver Leadframe Editor Functionality N e w SIwave DC ANSYS, Inc. March 3, 2016

8 SIwave DC A product offering specialized for predicting DC power delivery issues within PKGs and PCBs. 1. The solver uses a unique Adaptive Mesh Refinement process to ensure highly accurate predictive analyses for Chip, Packages, and Printed Circuit Boards which include ECAD primitives such as planes, traces, vias, bondwires, solderballs and solderbumps. 2. Produces the following analytic results DC voltage drop (Voltage) for all nets including GND and V dd DC current direction (Amps/Area 2 ) that includes return paths DC current magnitude (Amps) into and out of vias Power density (W/Area 2 ) and power loss (Watts) per layer 3. Has bi directional coupling to Icepak to account for thermal losses (joule heating) 4. Automated reports for user defined pass/fail criteria using.html formats ANSYS, Inc. March 3, 2016

9 DC Adaptive Mesh Refinement 1 Adaptive Pass 3 Adaptive Passes 10 Adaptive Passes 20 Adaptive Passes ANSYS, Inc. March 3, 2016

10 DC Work Flow Wizard with Solver Options ANSYS, Inc. March 3, 2016

11 DC Results & Analysis Path Resistance Initial Mesh Time & RAM Path Resistance Adaptive Passes Time & RAM Voltage Source to U1 (path) mω 1 Pass 11 Seconds 6.7 MB mω 3 Adaptive Passes 17 Seconds 8.1 MB Voltage Source to U2 (path) mω 1 Pass 10 Seconds 6.7 MB mω 3 Adaptive Passes 16 Seconds 8.1 MB Initial 3 Passes Pass U1 U2 V s ANSYS, Inc. March 3, 2016

12 DC Results & Analysis 0.99mΩ 0.96mΩ DC Path Resistance Current Vectors Showing Electron Direction Power & Ground Plane Voltage Drop SIwave Thermal Solves using Icepak ANSYS, Inc. March 3, 2016

13 IR Drop with SIwave DC ANSYS, Inc. March 3, 2016 Voltage Drop Power Power Supply Loss Along Loss: to Active All Specific Geometry Devices Nets

14 SIwave DC Automatic Report Fully Automated Report: Set Voltage/Current Limits HTML or PDF Format Layer by Layer Results ANSYS, Inc. March 3, 2016

15 DC Power Tree (Signal Flow Graph) Need to Update SFG Picture ANSYS, Inc. March 3, 2016

16 SIwave Thermal Solutions using Icepak Solver Joule Heating & Temperature analysis from SIwave Uses Icepak Solver: Joule Heating Conduction only analysis Forced convection (fan) analysis Air can flow across (parallel) PCB or normal (perpendicular) to PCB Natural convection analysis Simplified cabinet enclosures included Component power (Watts) allocation during setup Ability to Open and perform more detailed analysis in Icepak GUI ANSYS, Inc. March 3, 2016

17 Icepak Setup within SIwave ANSYS, Inc. March 3, 2016

18 Example Multiphysics simulation of a PCB Evaluate DC IR drop, thermal and thermo mechanical performance for a PCB Multiphysics coupling of electrical, thermal and mechanical physics to determine electrical, thermal and mechanical reliability Printed circuit board and components ANSYS, Inc. March 3, 2016

19 DC IR Drop with SIwave DC Power Delivery Determine if voltage regulator is supplying the proper DC voltage to all active components DC current density quickly identifies current crowding and high current vias Export Joule Heating to ANSYS Icepak Post process current density, voltage distribution and power dissipation from a DC IR drop analysis ANSYS, Inc. March 3, 2016

20 PCB Setup in Icepak The board along with the trace and via information imported into Icepak PCB ANSYS, Inc. March 3, 2016

21 SIwave Icepak Coupling Specify Siwave Directory Specify Boundary condition for High Side of PCB (HTC or Temperature) Run Icepak and Export Temperature to SIwave Specify Power Value to Filter Imported Power Map sources Specify Temperature Dependency Settings ANSYS, Inc. March 3, 2016

22 Power Maps from SIwave Separate assemblies of 2D sources are created for each power map imported from SIwave ANSYS, Inc. March 3, 2016

23 SIwave DC with Icepak Thermal Board Layout File Setup File (optional) SIwave DC Materials and Stackup Voltages and Currents Mesh Options Power Loss Thermal Convergence Temperature Icepak Thermal Board Layout File Problem Setup Board, Traces, Component Layout Geometry setup, Mesh options Materials, BCs, Component Power ANSYS, Inc. March 3, 2016

24 Thermal DC with Icepak Impact of SIwave & Icepak Link Without Joule Heating With Joule Heating DC Power Consumption 69.3 Watts 75.7 Watts PCI Graphics card PCI express spec: Max power not to exceed 75 W Includes dissipation from IC dies and PCB Joule heating card with components Add Reference ANSYS, Inc. March 3, 2016

25 Thermal Stress Simulation with Mechanical Transfer volumetric temperature field to a thermal stress simulation with Mechanical Volumetric temperature mapping across a dissimilar mesh interface provide by the Workbench environment Icepak temperature results Imported temperatures in Mechanical ANSYS, Inc. March 3, 2016

26 Thermal Stress Simulation with Mechanical Mechanical simulation provides information on the mechanical reliability of the board Evaluate board thermal deformations and stress Evaluate thermal fatigue in solder joints from temperature cycling Stresses in solder joints from insertion or tightening Shock loading from drop test requirements Define material properties, contact, and other mechanical loads and boundary conditions Post process deformation and stress results with ANSYS Mechanical ANSYS, Inc. March 3, 2016

27 Benefits of Multiphysics Simulation Multiphysics simulation of printed circuit board DC solution provides information on power delivery and power dissipation for thermal analysis. Thermal solution identifies hot spots and provides temperatures for DC and mechanical solutions. Mechanical solution determines thermal deformation and stresses. Integration of physics provides multiphysics simulation, which improves electrical, thermal and mechanical reliability Multiphysics simulation offers an unequaled level of accuracy for thermal design of printed circuit boards ANSYS, Inc. March 3, 2016

28 THANK YOU ANSYS China ANSYS 中国 ANSYS, Inc. March 3, 2016