COM EXPRESS STANDARD ADVANTAGES

Transcription

1 COM Express

2 COM EXPRESS STANDARD ADVANTAGES For high-end designs and markets High graphics computing Extremely feature-rich For high performance project requirements Basic: 125x95 mm Compact: 95x95 mm COMPUTER-ON-MODULE APPROACH Design investment limited to the carrier board Consolidated Standard form factors Scalable and future proof Long term availability ARM and x86 cross compatibility Multi-vendor solution Highly configurable Innovative and upgradable Accelerated time-to-market COM EXPRESS INTERFACES Interface Type 2 Min / Max Type 6 Min / Max PCI Express Lanes 1* / 6 1* / 8 PCI Express (PEG) 0 / 1 0 / 1 SDVO Channels on PEG 0 / 2 N.A. PCI Bus - 32 Bit 1* N.A. LVDS 0 / 1 0 / 1 edp on LVDS 1st channel N.A. 0 / 1 VGA Port 0 / 1 0 / 1 Digital Display N.A. 0 / 3 N.A. 0 / 2 CAN interface N.A. 0 / 1 SATA ports N.A. 1* / PATA Port 1* N.A. AC 97 / HDA Digital Interface 0 / 1 0 / 1 Interface Type 2 Min / Max Type 6 Min / Max 2.0 Ports / 8 / 8 Client 0 / 1 0 / Ports N.A. 0 / LAN Ports 1* 1* Express Card 1 / 2 1 / 2 LPC Bus 1* 1* SPI 1 / 2 1 / 2 GPIO 8* 8* SDIO Muxed on GPIO N.A. 0 / 1 SM Bus 1* 1* I2C 1* 1* Watchdog Timer 0 / 1 0 / 1 Speaker Out 1* 1* *Mandatory interface

3 COM Express Type 6 COM Express Compact with AMD Embedded 3rd gen R-Series SOC (formerly Merlin Falcon) or G-Series SOC-I (formerly Brown Falcon) COM Express Compact 3.0 with the AMD Ryzen Embedded V1000 processors Next Generation x86 Zen Core and elite GPU performance When scalable graphics performance makes the difference COMe-B75-CT6 COMe-A98-CT6 All components qualified for Industrial Temperature Range, -0 C +85 C AMD Ryzen Embedded V1807B with AMD Radeon Vega 11, Quad Core Dual 3.35GHz (3.8 Boost), TDP 35-5W AMD Ryzen Embedded V1756B with AMD Radeon Vega 8, Quad Core Dual 3.25GHz (3.6 Boost), TDP 35-5W AMD Ryzen Embedded V1605B with AMD Radeon Vega 8, Quad Core Dual 2.0GHz (3.6 Boost), TDP 12-25W AMD Ryzen Embedded V1202B with AMD Radeon Vega 3, Dual Core Dual 2.3 GHz (3.2 Boost), TDP 12-25W AMD Ryzen Embedded V10I with AMD Radeon Vega 3, Quad Core / Single Thread, TDP 15W,Industrial Temperature range Up to two DDR SO-DIMM Slots supporting DDR-3200 ECC (DDR200 with V1605B, V1202B and V10I) AMD Radeon Vega GPU with up to 11 Compute Units DirectX 12 supported H.265 (10-bit) decode and 8-bit video encode VP9 decode independent displays supported 3 x Digital Display (DDIs), supporting DP 1.3, DVI and HDMI 1./2.0 edp or Single/Dual-Channel 18-/2- bit LVDS interface DDIs, edp LVDS up to K up to 1920 x 1200 Mass Storage 2 x S-ATA Gen3 Channels All components qualified for Industrial Temperature Range, -0 C +85 C AMD RX-21BD, Quad 2.1 GHz (3. GHz Max), TDP 35W AMD RX-18GD, Quad 1.8 GHz (3.2 GHz Max), TDP 35W AMD RX-216GD, Dual 1.6GHz (3.0 GHz Max), TDP 15W AMD RX-16GD, Quad 1.6 GHz (2.GHz Max), TDP 15W, Industrial Temperature range AMD GX-217GI, Dual (2.0GHz Max), TDP 15W Two SO-DIMM slots supporting DDR ECC / non-ecc modules up to 2133MHz (up to 1600MHz with GX217GI) AMD Radeon 3rd -Generation Core Next (GCN) AMD RX-21BD - Radeon R7 AMD RX-18GD, RX-16GD - Radeon R6 AMD GX-217GI - Radeon R6E Up to 3 independent displays supported (up to 2 with GX217GI) DirectX 12 supported UVD 6 (K H.265 and H.26 decode) and VCE 3.1 (K H.26 encode) supported Up to 3 x Digital Display (DDIs), supporting edp 1., DP 1.2, DVI and HDMI 1.b/2.0 Optional VGA interface (excludes one DDI Port) Optional edp or Single / Dual-Channel 18- / 2- bit LVDS interface (R-Series SOCs only, excludes one DDI Port) xpress (PEG) x 8 (x with GX217GI) DDIs: LVDS, VGA: up to K up to 1920 x 1200 Intel I21x family GbE Controller Mass Storage 2 x SATA Gen3 Channels SD interface shared with GPI/Os x 3.0 Host ports 8 x 2.0 Host ports Intel I210 / I211 GbE Controller Up to x x1 Gen3 lanes + 2 x x1 Gen2 ports xpress (PEG) x 8 Gen3 x 3.0 Host ports 8 x 2.0 Host ports HD interface 3 x x1 Gen3 lanes 2 x UARTs HD Interface SPI, I2C bus, SM Bus, LPC bus, FAN management LID#/SLEEP#/PWRBTN#, Watchdog x GPI, x GPO 2 x HS UART interfaces +12VDC ± 10% and + 5VSB (optional) SPI, I2C Bus, SM Bus, LPC Bus, 2 x Express Card, FAN management LID# / SLEEP# / PWRBTN#, Watchdog x GPI, x GPO (multiplexed with SD interface) Microsoft Windows 10 Linux Ubuntu +12VDC ± 10% and +5VSB (optional) Microsoft Windows 7 Microsoft Windows 8.1 Microsoft Windows 10 Microsoft Windows 10 IoT Microsoft Windows Embedded Standard 7 Microsoft Windows Embedded Standard 8 Linux -0 C +85 C (Industrial version) 95 x 95 mm (COM Express Compact Form factor, Type 6 pinout) *Measured at any point of SECO standard heastpreader for this product, during any and all -0 C +85 C (Industrial version) 95 x 95 mm (Com Express Compact Form factor, Type 6 pinout)

4 COM Express 3.0 Compact with the Intel Atom X Series, Intel Celeron J / N Series and Intel Pentium N Series (formerly Apollo Lake) s Exceptional platform performance with up to six cores for more processing power COMe-C2-CT6 COMe-C08-BT6 All components qualified for Industrial Temperature Range, -0 C +85 C Intel Atom, Pentium and Celeron family of SoCs (formerly Apollo Lake): Intel Atom x7-e3950, Quad 2MB L2Cache, 12W TDP Intel Atom x5-e390, Quad 2MB L2 Cache, 9.5W TDP Intel Atom x5-e3930, Dual 2MB L2Cache, 6.5W TDP Intel Pentium N200, Quad 2MB L2 Cache, 6W TDP Intel Celeron N3350, Dual 2MB L2Cache, 6W TDP Intel Celeron J355, Quad 2MB L2Cache, 10W TDP Intel Celeron J3355, Dual 2MB L2Cache, 10W TDP Max Thread Two DDR3L SO-DIMM Slots supporting DDR3L-1866 non-ecc, up to 8GB Integrated Intel HD 500 series controller with up to 18 Execution Units Three Independent displays supported HW decoding of HEVC(H.265), H.26, MVC, VP8, VP9, MPEG2, VC-1, WMV9, JPEG/MJPEG formats HW encoding of HEVC(H.265), H.26, MVC, VP8, VP9 and JPEG/MPEG formats Up to 2 x Digital Display (DDIs), supporting DP 1.2, DVI and HDMI 1.b edp 1.3 or Single/Dual-Channel 18-/2- bit LVDS interface optional VGA interface through a DP-to-VGA bridge DP: edp: LVDS, VGA: Up to 096 x Up to 380 x Up to 380 x Up to 1920 x 60Hz 2 x external S-ATA Gen3 Channels Mass Storage Optional emmc Drive soldered on-board External SD interface (multiplexed with 8x GPIOs) Optional Intel I210 or I211 GbE Controller (MAC + PHY) Up to x 3.0 Host ports 8 x 2.0 Host port Up to 5 x x 1 Gen2 lanes HD Interface 2x UARTs SPI, I2C, SM Bus, Thermal Management, FAN management LPC bus Optional TPM 2.0 on-board LID#/SLEEP#/PWRBTN#, Watchdog x GPI, x GPO +12VDC ± 10% and +5VSB (optional) Microsoft Windows 10 Enterprise (6-bit) Microsoft Windows 10 IoT core Wind River Linux (6 bit) Yocto (6 bit) Android (planning) -0 C +85 C (Industrial version) COM Express 3.0 Basic with the Intel 8th generation Core / Xeon (formerly Coffee Lake H) CPUs Rugged solution for industrial environment COM Express Type 6 Intel Core i7-8850h, Six 2.6GHz (.3GHz in Turbo Boost), with HT, 9MB Cache, 5W TDP Intel Core i5-800h, Quad 2.5GHz (.2GHz in Turbo Boost), with HT, 8MB Cache, 5W TDP Intel Core i3-8100h, Quad 3.0GHz, 6MB Cache, 5W TDP Intel Xeon E-2176M, Six 2.7GHz (.GHz in Turbo Boost), with HT, 12MB Cache, 5W TDP 6 Max Thread 12 Platform Controller Hub (PCH) Intel QM370, HM370 or CM26 PCH Two DDR SO-DIMM Slots supporting DDR-2666, up to 32GB ECC DDR memory modules supported only with Xeon and Core i3 CPUs combined with CM26 PCH Intel UHD 630 (Core processors), P630 (Xeon processors) Up to 3 independent displays supported DirectX 12, OpenGL.5, and OpenCL 2.1 support HW accelerated video decode MPEG2, VC1/WMV9, AVC/H.26, VP8, JPEG/ MJPEG, HEVC/H.265 (8-/10-bit), VP9 HW accelerated video encode MPEG2, AVC/H.26, VP8, JPEG HEVC/H.265, VP9 Up to 3 x Digital Display (DDIs), supporting DP 1.2, DVI, HDMI 1. edp 1. or Single/Dual-Channel 18-/2-bit LVDS interface or LVDS + VGA interface edp, DP up to 60Hz, 2bpp HDMI up to 2Hz, 2bpp (HDMI 1.) LVDS, VGA up to 60Hz Mass Storage x S-ATA Gen3 Channels SD interface (shared with GPI/Os) Intel I219-LM GbE Controller x 3.0 Host Ports 8 x 2.0 Host ports 8 x x 1 Gen3 lanes xpress (PEG) Gen3 x16 HD interface 2 x UARTs SPI, I2C, SM Bus, Thermal Management, FAN management LPC bus Optional TPM 2.0 on-board LID#/SLEEP#/PWRBTN#, Watchdog x GPI, x GPO (pins shared with SD interface) +12VDC ± 10% and +5VSB (optional) Microsoft Windows 10 6-bit Linux 6-bit 125 x 95 mm (COM Express Basic Form factor, Type 6 pinout) 95 x 95 mm (Com Express Compact Form factor, Type 6 pinout) *Measured at any point of SECO standard heastpreader for this product, during any and all

5 COM Express Basic with Intel 6th and 7th generation Core / Xeon (formerly Skylake and Kaby Lake) CPUs COM Express Type 6 COM Express Basic with Intel Haswell family CPUs When high graphics and Hyper-threading matter High performance for any design in a scalable form factor COMe-B09-BT6 COMe-953-BT6 Max Thread Platform Controller Hub (PCH) Intel Core i3-6102e, Dual 1.9GHz, 3MB Cache, 25W TDP Intel Core i3-6100e, Dual 2.7GHz, 3MB Cache, 35W TDP Intel Core i5-62eq, Quad 1.9GHz (2.7GHz in Turbo Boost), 6MB Cache, 25W TDP Intel Core i5-60eq, Quad 2.7GHz (3.GHz in Turbo Boost), 6MB Cache, 5W TDP Intel Core i7-6822eq, Quad 2GHz (2.8GHz in Turbo Boost), 8MB Cache, 25W TDP Intel Core i7-6820eq, Quad 2.8GHz (3.5GHz in Turbo Boost), 8MB Cache, 5W TDP Intel Xeon E3-1505M V5, Quad 2.8GHz (3.7GHz in Turbo Boost), 8MB Cache, 5W TDP Intel Xeon E3-1515M V5, Quad 2.8 GHZ, 8MB Cache, 5W TDP (ECC supported), GTE LINE (D0) with OPC (A0) Intel Core i3-7102e, Dual 2.10 GHz (3M Cache, 2.10 GHz) FCBGA10 CPU + GPU - 25W TDP (ECC supported) Intel Core i3-7100e, Dual 2.9GHz, 3MB Cache, 35W TDP Intel Core i5-72eq, Quad 2.90 GHz (6M Cache, up to 2.90 GHz) FCBGA10 CPU + GPU - 25W TDP (ECC no supported) Intel Core i5-70eq, Quad 2,90GHZ ( up to 3.60 GHz), 6MB Cache, 5W TDP Intel Core i7-7820eq, Quad 3.0GHz (3.7GHz in Turbo Boost), 8MB Cache, 5W TDP Intel Xeon E3-1505L V6, Quad 2.20 GHz (8M Cache, 2.20 GHz) FCBGA10 CPU + GPU - 25W TDP (ECC supported) Intel Xeon E3-1505M V6, Quad 3.0GHz (.0GHz in Turbo Boost), 8MB Cache, 5W TDP 8 (HT not available with 6th Generation Core i5 and 7th Generation Core i3/i5 s) SkyLake Platform: Intel QM170, HM170 or CM236 PCH Kabylake Platform: Intel QM175 or CM238 PCH Up to two DDR SO-DIMM Slots supporting DDR-2133 (DDR-200 for 7th Generation processors) ECC DDR memory modules supported only with Xeon and Core i3 processors combined with CM236 / CM238 PCH Intel HD 530 (6th Generation Core processors), P530 (6th Generation Xeon processors) Intel HD 630 (7th Generation Core processors), P630 (7th Generation Xeon processors) Up to 3 independent displays supported DirectX 12.1, OpenGL., and OpenCL 2.0 support HW accelerated video decode MPEG2, VC1 / WMV9, AVC / H.26, VP8, JPEG / MJPEG, HEVC / H.265, VP9 HW accelerated video encode MPEG2, AVC / H.26, VP8, JPEG / MJPEG, HEVC / H.265, VP9 Up to 3 x Digital Display (DDIs), supporting DP 1.2, DVI and HDMI 1. edp or Single / Dual-Channel 18- / 2- bit LVDS interface or LVDS + VGA interface xpress (PEG) Gen3 x16 edp, DP: up to 2bpp up to 2bpp LVDS, VGA: up to 1920 x Mass Storage x SATA Gen3 Channels Intel I219-LM GbE Controller x 3.0 Host ports 8 x 2.0 Host ports 8 x x1 Gen3 lanes Intel Core i3-100e, Dual Core with 2.GHz, 3MB Cache, 37W TDP Intel Core i3-102e, Dual Core with 1.6GHz, 3MB Cache, 25W TDP Intel Core i5-00e Dual Core with 2.7GHz, 3MB Cache, 37W TDP Intel Core i5-02e Dual Core with 1.6GHz, 3MB Cache, 25W TDP Intel Core i7-700eq Quad Core with 2.GHz, 6MB Cache, 7W TDP Intel Celeron 2002E Dual 2MB Cache, 25W TDP Intel Celeron 2000E Dual 2MB Cache, 37W TDP Chipset Intel QM87 Chipset Up to 16GB 1.35V DDR3L-1600 on two SO-DIMM slots, supporting DualChannel M953 modules support non-ecc SO-DIMMs only, MB28 modules support ECC modules only Integrated Intel HD Up to 3 independent displays supported DirectX 11, OpenGL.0 supported 3 x HDMI / DVI / Multimode Display Port interfaces embedded Display Port or 18 / 2 bit single / dual channel LVDS interface CRT interface PCI Express (PEG) x 16 interface CRT Interface: DVI: Display Port: LVDS, edp: HD Interface 2 x UARTs 2 x SPI, I2C, SM Bus, LPC Bus, 2 x Express Card, FAN management Optional TPM 1.2 LID# / SLEEP# / PWRBTN#, Watchdog x GPI, x GPO +12VDC ± 10% and +5VSB (optional) Microsoft Windows 7 Microsoft Windows 8.1 Microsoft Windows 10 Microsoft Windows 10 IoT Microsoft Windows Embedded Standard 7 Microsoft Windows Embedded Standard 8 Linux 125 x 95 mm (Com Express Basic Form factor, Type 6 pinout) up to 1920 x 60Hz up to 2Hz / 60Hz up to 60Hz up to 380 x 60Hz up to 1920 x 60Hz Mass Storage x external SATA channels Supports remote management (Intel AMT Technology) 8 x 2.0 Host ports x 3.0 Host ports 7 x x1 lanes (configurable as 1 x + 3 x1) HD interface 2 x serial ports (Tx/Rx only, TTL interface) (MB28 module only) 2 x Express Card interfaces I2C Bus LPC Bus SM Bus x GPI, x GPO Thermal / FAN management Watch Dog timer Optional TPM on-board (M953 modules only) Management Signals +12VDC ± 10% and + 5VSB (optional) Microsoft Windows 7 (32 / 6 bit) Microsoft Windows 8.1 (32 / 6 bit) Microsoft Windows 10 (32 / 6 bit) Microsoft Windows 10 IoT Microsoft Windows Embedded Standard 7 (32 / 6 bit) Microsoft Windows Embedded Standard 8 (32 / 6 bit) Microsoft Windows Embedded Compact 7 Linux 125 x 95 mm (.92 x 3.7 )

6 COM Express Compact with Intel Atom E3800 and Celeron families (formerly Bay Trail) COM Express Type 6 COM Express Compact based on NVIDIA Tegra K1 Mobile SoC Supreme Visual computing with ARM efficiency Versatile and rugged COMe-A1-CT6 COMe-A81-CT6 All components qualified for Industrial Temperature Range, -0 C +85 C Intel Atom E385, Quad 2MB Cache, 10W TDP Intel Atom E3827, Dual 1MB Cache, 8W TDP Intel Atom E3826, Dual 1MB Cache, 7W TDP Intel Atom E3825, Dual 1MB Cache, 6W TDP Intel Atom E3815, Single 512KB Cache, 5W TDP Intel Celeron J1900, Quad 2MB Cache, 10W TDP Intel Celeron N2930, Quad 2MB Cache, 7.5W TDP DDRL non-ecc SO-DIMM slots, GB modules supported per each slot E385, E3827, J1900, N2930: up to 8GB Dual-Channel DDR3L 1333MHz E3826: up to 8GB Dual-Channel DDR3L 1066MHz N2807: up to GB Single-Channel DDR3L 1333MHz E3825, E3815: up to GB Single-Channel DDR3L 1066MHz Integrated Intel HD 000 series controller Dual independent display support HW decoding of H.26, MPEG2, MVC, VC1, VP8, MJPEG formats HW encoding of H.26, MPEG2 and MVC formats 1 x Digital Display Interface (DDI) able to drive HDMI / DVI / DP++ interface Additional DDI, can be switched to manage embedded Display Port or 18 / 2 bit single / dual channel LVDS interface CRT interface CRT Interface: Display Port, edp: Optional LVDS interface: Up to 2560x1600@60Hz Up to 1920x1080p@60Hz Up to 2560x1600@60Hz Up to 1920x1200@60Hz Optional emmc drive soldered on-board Mass Storage 2 x external SATA channels SD Card interface (multiplexed with GPIO signals) Optional (uses one lane) 7 x 2.0 Host ports x 3.0 Host ports HD interface Up to x x1 Gen2 lanes 2 x Serial ports (TX / RX only, TTL interface) 2 x Express Card interfaces I2C Bus LPC Bus SM Bus x GPI, x GPO Thermal / FAN management Watch Dog timer Management Signals +12VDC ± 10% and + 5VSB (optional) Microsoft Windows 7 (32 / 6 bit) Microsoft Windows 8.1 (32 / 6 bit) Microsoft Windows 10 (32 / 6 bit) Microsoft Windows 10 IoT Microsoft Windows Embedded Standard 7 (32 / 6 bit) Microsoft Windows Embedded Standard 8 (32 / 6 bit) Microsoft Windows Embedded Compact 7 Linux (32 / 6 bit) Yocto -0 C +85 C (Industrial version) 95 x 95 mm (Com Express Compact Form factor, Type 6 pinout, 3.7 x 3.7 ) NVIDIA Tegra K1 Mobile Quad-core, -Plus-1 ARM Cortex A15 MPCore R3 processor Dual Channel Soldered Down DDR3L-1833 memory, up to GB Low-power NVIDIA Kepler -based GeForce graphics processor with 192 CUDA cores Supports OpenGL ES 3.0, OpenGL., DirectX 11.1, Tessellation CUDA 7 Up to 2160p30 HW decoding; up to 2160p2 HW encoding edp interface or native Single Channel 18 / 2 bit LVDS interface or Single / Dual Channel 18 / 2bit LVDS interface HDMI interface 2 x MIPI CSI Camera interfaces edp: LVDS: up to 096 x 2160 (K) up to 380 x 2160 up to 1920 x x external SATA Gen2 Channel Mass Storage Optional emmc drive soldered on-board, up to 32GB SD Card interface (multiplexed with GPIO signals) Realtek RTL8111G Controller (MAC + PHY) 8 x 2.0 Host ports x 3.0 Host ports Up to four xpress x1 interfaces (factory options) HD interface 2 x UARTS, TX / RX signals only, TTL interface I2C Bus LPC Bus SM Bus x GPI, x GPO SPI Interface Watch Dog Timer Real Time Clock (optional, additional Low RTC) Management Signals Thermal / Fan Management On-board FAN connector +12VDC and +5VSB (optional) Linux for Tegra (LT) provides flashing utilities, bootloader, Linux kernel, Tegra hardware acceleration libraries for graphics, multimedia and compute (EGL, OpenGL-ES, GLX, OpenGL), and a reference File for evaluating Linux on the Tegra platform 95 x 95 mm (COM Express Compact, 3.7 x 3.7 )

7 Carrier Board Carrier Board for COM Express Type 6 Modules on 3.5 form factor Most compact, I/O-rich COM Express Type 6 carrier board CCOMe-C30 Development Kit Development kit compatible with both x86 and ARM COM Express Type 6 modules Platform independent kit for fast Time-to-market COM EXP T6 DEV KIT SCHEMATICS PUBLICLY AVAILABLE Carrier Board Carrier Board for COM-Express Type 6 modules on miniitx form factor Platform independent carrier board for quick prototyping CCOMe-965 Mass Storage 1 x DP++ connector 2 x minidp++ connectors LVDS 2-bit Single/Dual Channel Backlight control + LCD selectable voltages dedicated connector LVDS External EDID flash socket edp -lanes 0 poles VESA connector S-ATA 7p M connector + pins power connector M.2 Socket / 2260 Key B slot for SSD M.2 Socket Key M slot for x SSDs μsd Card slot (interface multiplexed with GPIO header) Dual RJ-5 connector (1 port managed by COM Express Gigabit Ethernet interface, 1 port managed by Carrier board s Intel I21x GbEthernet controller) M.2 Socket / 302 Key B slot for WWAN modules (modem) M.2 Socket Key E slot for WiFi / BT modules 3 x 3.0 Host ports on Type-A sockets 2 x 2.0 Host ports on Type-A sockets 1 x 2.0 Host port on internal pin header On-board HD Codec (Realtek ALC262) Mic In + Line Out internal pin header 2 x RS-232 / RS-22 / RS-85 ports on internal pin header (from carrier board s SuperI/O) 2 x RS-232 ports on feature pin header (from module) microsim slot for M.2 modem x GPI + x GPO pin header (interface multiplexed with μsd slot) Button / LEDs front panel header 3-pin tachometric FAN connector I2C + SM Bus on feature Pin header LPC internal header 9-32 V DC Mega-Fit 2x1 Connector Cabled Coin-cell connector for RTC 16x102mm (3.5 form factor, 5.75 x.02 ) *All carrier board components must remain within the operating temperature at any and all times, including start-up; carrier operating temperature is independent of the module installed. Please refer to the specific module for more details. Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. FEATURES OF CCOMe-965 Mass Storage 1 x LVDS (18bit / 2bit, single / dual channel) 3 pin connector 1 x edp connector 1 x backlight connector 2 x combo DP / HDMI Connectors 1x multimode Display Port Connector 1 x VGA connector 8-pin socket for external DID EEPROM PCI Express x16 slot 2 x SATA connectors 1 x msata Slot 2 x Gigabit Ethernet ports x 3.0 Host ports on type-a sockets 2 x 2.0 Host ports on internal pin header 1 x x slot, Gen2 compatible 2 x mini slot Full / Half Size, (one combined with SIM card slot), Gen2 compatible Internal HD Codec Triple jack S / P-DIF Out 3 pin header for digital Internal pin header for audio jacks remoting I2C EEPROM Socket LPC Bus internal pin header Front Panel Header 1 x 28 pin connector for additional features (I2C, ACPI signals, SM Bus, Watch Dog, Thermal Management) Internal pin header for GPIO / SDIO + 2 x RS-232 Serial ports (Tx / Rx signals) SIM Card slot Tachometric FAN connector, selectable +12V or +5V ATX Standard power connector 2 poles (AT mode configurable) +12V auxiliary power connector Coin cell battery Holder for CMOS and RTC 0 C +60 C 170 x 170 mm (6.69 x 6.69 ) *All carrier board components must remain within the operating temperature at any and all times, including start-up; carrier operating temperature is independent of the module installed. Please refer to the specific module for more details. Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system.

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