Motherboard, Processors and Memory

Transcription

1 Motherboard, Processors and Memory Chapter 1 Daren Russ All Rights Reserved No part of this material or any of its contents may be reproduced, copied, modified or adapted, without the prior written consent of the author, unless otherwise indicated for stand-alone materials.

2 What we will go over Identifying components of a motherboard System board form factors - ATX, micro ATX,ITX System board components Identifying purposes and characteristics of processors Identifying purposes and characteristics of memory important memory terms types of memory memory packaging Identifying purposes and characteristics of cooling systems fans memory coolers hard drive cooling chipset cooling cpu cooling

3 The Motherboard Main board consists of several types of components and connection points and paths. Data paths, Control lines, bus lines etc control the manipulation of hardware and data and interaction between all areas of the computer. The purpose of the main board (motherboard) is to facilitate the transfer of data from component to component. Involved is also the control of this flow.

4 The Form Factor used to describe the size and format of a device AT Advanced Technology ATX Advanced Technology Extension Mini ATX Micro ATX Flex ATX BTX Balanced Technology Extended ITX New Low Profile Extended Mini-ITX Low Profile Extension

5 AT Form Factor Universal form factor Can be mounted in almost any case Ribbons connect ports to the board Used by most Pentium (classic) systems

6 ATX Form Factor Today s most popular motherboard design Ports are permanently affixed to the board

7 Form factor comparison Flex-ATX

8 BTX Designed due to heat issues BTX is designed to allow the most efficient flow of air through all components

9 System Board Components

10 Chipsets Chipsets are the main control circuitry (Heart) of the motherboard They control and limit bus speed, main memory (both speed and capacity), expansion buses, processors and dictate support for all on board technologies as well as the communication and interaction between components Typically consists of two or more non-socketed chips found on the motherboard.

11 Chipset Surface mount North/front bus/bridge South/back bus/bridge

12 Chipset North Bridge (front side bus) South Bridge (back side bus)

13 Expansion Slots PCI 32 or 64 Bit (older servers), 33Mhz, 66Mhz White Running 33Mhz cards with 66Mhz cards will make all run at 33Mhz

14 PCI-X PCI-X (where X is for extended) comes with 32 or 64 bit slots that are designed to be backward compatible with 32 bit PCI cards. These cards are designed to be operated at 3.3 V. The higher voltage portion of the slot is beyond what the 32 bit 3.3 V card can reach

15 PCI PCI-X

16 PCI-E A variation of PCI (where E is for Express) is sometimes written as PCIe. Remember PCI e and PCI-X are not compatible with each other and the terms mean something completely different. When using PCI- Express, 16 lanes of communication are available. The physical size of the card will determine the number of lanes it may utilize. For example an x 16 slot will accommodate an x 1 card

17 PCI-E (PCI Express) Created bit and 64bit Per lane: (Simplex/Duplex) v1.x: 250 MB/s (2.5 GT/s) v2.x: 500 MB/s (5 GT/s) v3.0: 985 MB/s (8 GT/s) v4.0: 1969 MB/s (16 GT/s) 16-lane slot (each direction): v1.x: 4 GB/s (40 GT/s) v2.x: 8 GB/s (80 GT/s) v3.0: GB/s (128 GT/s) v4.0: GB/s (256 GT/s) GT/s, gigatransfers per second. Transfer rate is expressed in transfers per second instead of bits per second because the number of transfers includes the overhead bits, which do not provide additional throughput A lane is composed of two differential signaling pairs: one pair for receiving data, the other for transmitting. Speeds may be limited

18 The black IDE connector is used with ATA 100 or lower speed drives rpm HDD CD-Rom The blue connection point is for ATA 133 speed drives (7200 rpm). Commonly called PATA or parallel ATA IDE

19 Floppy Far left black connector In comparison the floppy drive connection point is a 34 pin connector as apposed to a 40 pin connector it is the smaller connector on the left

20 Memory expansion slots Shown here (3 sticks) may be DDR, DDR2, DDR3 etc

21 External connection points

22 External ports

23 SATA, serial ATA connectors

24 BIOS Battery Eternal connection points for such things as case USB, Fire wire, Audio, message LEDs etc

25 Expansion Slot/port speeds PCI132 MB/s AGP 8X2,100 MB/s PCI Express 1x250 [500]* MB/s *(based on PCI-E V1.0) PCI Express 2x500 [1000]* MB/s PCI Express 4x1000 [2000]* MB/s PCI Express 8x2000 [4000]* MB/s PCI Express 16x4000 [8000]* MB/s PCI Express 32x8000 [16000]* MB/s USB 2.0 (Max Possible)60 MB/s IDE (ATA100)100 MB/s IDE (ATA133)133 MB/s SATA150 MB/s SATA II300 MB/s Gigabit Ethernet125 MB/s IEEE1394B [Firewire 800]~100 MB/s

26 Memory

27 Measuring RAM Made up of individual bits which are 1 s or 0 s (5v or 0v) 8 bits = 1 byte A byte represents a character, number or symbol 1024 bytes = a kilobyte 1024 kilobytes = a megabyte 1024 megabytes = a gigabyte

28 Purpose To hold, short term or long term, data. Memory has many different forms and functions.. Two categories are Volatile memory Non volatile memory

29 Volatile Memory Types of volatile memory Main board memory or RAM Cache Video memory Hard drive cache Volatile memory will lose its memory when power is lost. etc

30 Non volatile memory Types of non volatile memory CD ROM/DVD ROM Floppy disk Hard disk drive USB thumb drive BIOS None volatile memory will not lose its contents when power is removed.

31 RAM (main board)

32 Memory RAM - Random Access Memory RAM is a volatile type of memory, thus data in memory is lost when it is no longer powered. RAM stores data that is currently being used by the computer. When you load an application or a game, or play a song or even load the Operating System, it s loaded into system RAM. Random Access means that your system can instantly (almost) extract information from memory regardless of where it may be stored in memory

33 Memory Characteristics Parity vs. Non-Parity Older versions of RAM were available in parity or non-parity types. Parity RAM has the ability to detect memory-based data errors (but does not correct them), while non-parity RAM does not have this function. Parity RAM was made largely obsolete by ECC RAM. ECC RAM Error-Correcting Code (ECC) RAM can both detect and correct memory-based data errors. ECC RAM is commonly used in critical servers where data corruption cannot be tolerated. ECC RAM is more expensive, and requires ECC-supporting motherboards and processors which are more expensive as well. Buffered vs. Unbuffered Buffered RAM places less power load on a system s memory controller. This is desirable when you have a lot of RAM installed in a machine, as is commonly the case with high-performance servers. Regular workstations usually have unbuffered RAM installed. Single-sided vs. Double-sided If all of the RAM chips are on one side of the RAM module, it is single-sided RAM. If there are chips on both sides of the module, it is double-sided RAM. Single-sided RAM is newer, and older motherboards may have trouble recognizing it.

34 SIPP - retired Single Inline Pin Package Eliminated need for individually installing memory modules 30 pins but easy to break Very quickly replaced by 30-pin SIMMs

35 Types of RAM SRAM - Static Random Access Memory Usually in the form of DIPP or COAST (or in the processor die itself) Short for Cache on a Stick (small circuit board used with mother boards) Referred to as cache memory More reliable Does not have to be refreshed as often as dram DRAM Dynamic Random Access Memory Usually in the form of SIMM, DIMM or RIMM Known as main memory or primary memory

36 DRAM (Main Memory) Fast Page Mode (FPM) Extended Data Out (EDO) Synchronous Dynamic RAM (SDRAM) Double Data Rate SDRAM (DDR-SDRAM) Double Data Rate version 2 SDRAM (DDR2-SDRAM) Double Data Rate version 3 SDRAM (DDR3-SDRAM) Rambus DRAM (RDRAM) Small outline dual in-line memory module (SODIMM)

37 Common Types of Memory Modules Single Inline Memory Module (SIMM) 30 pin FPM 72 pin FPM, EDO Dual Inline Memory Module (DIMM) 168 pin EDO, PC66, PC100, PC133 SDRAM 184 pin DDR SDRAM Rambus Inline Memory Module (RIMM) 184 pin RDRAM (some older 168-pin) DDR 184 pins DDR2 240 pins 2x faster than DDR DDR3 240 pins 2x faster than DDR2

38 Rambus (RDRAM) - retired Rambus memory is only used with high-end Intel processors, though it is possible to use DDR with P4 s (on some motherboards) When installing Rambus memory, the empty sockets must be filled with CRIMMs (continuity modules) Most motherboard chipsets require that Rambus be installed in pairs

39 DDR SDRAM DDR (Double Data Rate) memory uses both the rise and fall of the clock cycle to effectively double it s speed for reads and writes. DDR memory was initially used with high end AMD processors, but is now the standard memory used DDR2 is the second generation memory that basically increases the bandwidth doubling its predecessor under optimal conditions. DDR3 is the current generation of memory doubling its speed to its predecessor under optimal conditions. As DDR grew, power requirements lessened.

40 Dual memory controllers dual channel Many DDR and all DDR2 and DDR3 desktops and motherboards have a built-in feature called dual channel that allows you to utilize the bandwidth of two modules at the same time. Modules must be installed in pairs for maximum performance, so if you re going to be adding 512MB of memory, you are better off buying two 256MB modules, as opposed to one 512MB one. Exact match chips work best

41 DDR DDR SDRAM (double data rate synchronous dynamic random access memory) DDR comes in speeds of PC1600 (DDR200) - 100MHz PC2100 (DDR266) - 133MHz PC2700 (DDR333) 166MHz PC3200 (DDR400) 200MHz Refer to speed charts and requirements for your memory. ECC, Non ECC, Parity, registered or un registered etc

42 DDR, DDR2, DDR3 As with most connections within the computer memory sticks are also keyed based on their type.

43 Installing RAM Modules

44 Memory Tips, installing. Always begin with lowest bank (0 if available) Always try to use identical modules and memory types Utilize dual controllers. Memory chips are extremely susceptible to ESD, so always take the necessary precautions when handling memory When in doubt refer to the manufacturers specs for recommended memorymixing memory types and manufacturers is not desirable. Different speeds may work together but for optimal results you want to mix like memory type and speeds. Packages are available of optimized memory or matched memory

45 SRAM Static RAM (Cache Memory) SRAM, unlike DRAM, doesn t have to be frequently refreshed. Once written to, it keeps data until it gets new data to replace the old SRAM is found in relatively small quantities in a system, but can have a large impact on the performance of a computer. Cache memory (SRAM) is designed to hold data that is used repeatedly by the system. Some types of cache can also hold data that is anticipated to be needed. Cache memory is present in numerous devices like Optical drives, hard drives, processors etc.

46 ROM (Read Only Memory) ROM holds it s memory even when it s not powered, thus it is nonvolatile The BIOS of your system is an example of ROM Main BIOS manufacturers: AMI Award Phoenix etc

47 Types of ROM PROM (Programmable ROM) A ROM chip that can only be programmed once (done by the manufacturer) and can t be rewritten EPROM (Erasable Programmable ROM) Can be rewritten with a special machine. This type of ROM chip has a little window on top of the chip through which ultraviolet light can erase the data stored in it EEPROM (Electrically Erasable Programmable ROM) EEPROM is the type of ROM found in most systems manufactured in the last 8 years. It can be easily reprogrammed without removing it from the computer using flash programs available from the manufacturer s web sites. It can easily be updated to support newer technology and fix bugs

48 LAPTOP Memory DIMM stands for Dual In-line Memory Module, and SODIMM stands for Small Outline Dual In-line Memory Module. SODIMMS are used in laptop computers as well as other devices i.e network printers

49 Types of ROM chips PROM EPROM EEPROM

50 Memory Types

51 Processors

52 Processors (intel) LGA 775, LGA 1155, LGA 1156, LGA 1366 LGA Land Grid Array Uses pressure rather than pinned sockets to make connections to the main board Processor reference tables pg 22

53 Processors (AMD) Socket 940, AM2, AM2+, AM3, AM3+, F, FM1 Uses PGA (pin grid array) ZIF socket design

54 The Sockets Covered by the A+ Objectives

55 Processor Technologies Hyperthreading (HT Technology) Intel technology used by some Intel processors that allow a single micro processor to act like two. Allows processor to execute two streams. Multi Core Single chip running two or more independent processing units. Equates to parallel processing. Cache With reference to processors is a staging area for data to be processed. Keeps data in a very fast memory area for the core to access to reduce wait times. L1 Built into the processor core. Small 8k to 128k. L2 Built into the processor die. Accessed when L1 does not contain info needed L3 Found on high performance processors from intel i.e. Core i7 and on high and midlevel AMD processors. If cache memory does not contain information main board memory is accessed Cache memory is not limited to processors and is found on optical drives, hard drives etc.

56 Bus Speeds Bus is a shared connection between multiple hardware components. Speed is spec ed out by manufacturer but will generally refer to the FSB (frontside bus) and or BSB (backside bus). For processor it specifies the speed at which the microprocessor will execute instructions. Overclocking the process of making a computer or component operate faster than the clock frequency recommended by the manufacturer by modifying device system parameters. Not generally recommended as specific tech inside the processor is designed to operate within a given range. Overclocking can damage or destroy components and greatly reduce lifespan. 32bit V.S. 64bit 32 bit hardware and software can not access more than 3.25Gig of system memory 64Bit hardware and software can access more than the 3.25Gig limitation. 64Bit hardware and software retain backwards compatibility with the 32bit counterpart

57 Virtualization Virtualization enables the host operating system to run one or more guest operating systems at one time. Most current processors will support virtualization Virtualization allows systems and applications to run faster and use fewer system resources Integrated GPU Intel core i3, i5 and i7 as well as A series AMD processors have integrated GPU GPU is graphics processing unit Allows for faster processing of video based data Powerful GPU in video cards with ample memory is still essential to high end video processing

58 Cooling

59 The primary cause of most hardware failure is due to heat. Most components are designed to run at a very specific temperature or within a specific temperature range. Most of today s motherboards have some sort of on-board thermal monitoring and protection. How do we optimize cooling? Good CPU heat sync and fan Good case ventilation (case fan/s) Card coolers Drive coolers Refrigeration systems Clean system

60 Cooling Fans Most motherboards have 2 to 4 fan connectors Fans will typically plug into the mother board but may also use connectors attached to the power supply to deliver power Some deliver a constant 12 volts, others vary the amount of voltage to the fan (based on the thermal monitor) causing it to speed up when needed and run slower when possible. Generally these are connected to the motherboard There is active and passive cooling. Active cooling incorporates an electric fan or liquid cooling system of some sort Passive cooling (as in north bridge of chip set) uses a heat sync only When a heat sync is used thermal compound is a must

61 Cooling methods Passive cooling use only a heat sync. Seen on chipsets, some video cards and some memory sticks Active cooling The use of a heat sync and fan or cooling refrigeration system using some form of liquid. If you are to service a heat sync, always re apply thermal compound. Drive coolers, card coolers, case fans (front and back) are a few of the cooling methods you will encounter.

62 Heat pipes are closed systems that employ some form of tubing filled with a liquid suitable for the applicable temperature range. One end of the heat pipe is heated by the component to be cooled. This causes the liquid at the heated end to evaporate and increase the relative pressure at that end of the heat pipe with respect to the cooler end. This pressure imbalance causes the heated vapor to equalize the pressure by migrating to the cooler end, where the vapor condenses and releases its heat, warming the non heated end of the pipe. The cooler environment surrounding this end transfers the heat away from the pipe by convection. The condensed liquid drifts to the pipe s walls and is drawn back to the heated end of the heat pipe by gravity or by a wicking material or texture that lines the inside of the pipe. Once the liquid returns, the process repeats.

63 Peltier Cooling Devices Water- and air-cooling devices are extremely effective by themselves, but they are more effective when used with a device known as a Peltier cooling element. These devices, also known as thermoelectric coolers (TECs), facilitate the transfer of heat from one side of the element, made of one material, to the other side, made of a different material. Thus, they have a hot side and a cold side. The cold side should always be against the CPU surface, and optimally, the hot side should be mated with a heat sink or water block for heat dissipation. Consequently, TECs are not meant to replace air-cooling mechanisms but to complement them. One of the downsides to TECs is the likelihood of condensation because of the sub-ambient temperatures these devices produce. Closed-cell foams can be used to guard against damage from condensation. A peltier cooler is a cooler that uses a peltier element (TEC). Peltier coolers consist of the peltier element itself, and a powerful heatsink/fan combination to cool the TEC.

64 Phase change cooler A computer cooling method that uses the same liquid-to-gas-to-liquid cycle as a refrigerator or freezer, but with different coolants and construction. A compressor and condenser turn gas into liquid, and an evaporator converts it back into gas, while absorbing heat from the CPU chip and other components. Phase change cooling creates subzero temperatures as low as -100 degrees Centigrade, but the humidity created by condensation is a side effect that has to be dealt with.

65 How to check for over heating The best way is to have hardware monitoring software. Usually available from the main board manufacturer. You will need to check spec s for your CPU and board to find operating temps Typically can range from 85 to 95 depending on the processor. Thermal cut off on some motherboards is programmable to safe guard against damage Mother board temperatures can also be monitored and typical temperature is in the 30 to 35 degree range depending on usage. The other method is through the BIOS. Software is preferable as warnings can be set up to alert the user incase of problems

66 Results of overheating Various results will come from a system over heating System slowdown System rebooting System freezing System burning out System may not overheat unless system is under load (intermittent problems)

67 Fixing over heating issues Keep case clean and free from dust, buildup of dirt and over crowding. Allow unblocked path for air to go across CPU/Chipset/power supply Replace or addition of fans Re application of thermal compound Location of case (hindered airflow through the case) As temperatures can damage components. Components may have to be replaced.