12500 TI Boulevard, MS 8640, Dallas, Texas 75243

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1 2500 TI Boulevard, MS 8640, Dallas, Texas PN TPS6223TDRYRQ and TPS62234TDRYRQ LLGA to etch and Datasheet update for TPS6223-Q/TPS62234-Q Final hange Notification Date: 3/30/206 To: EBV PN Dear ustomer: This is an announcement of change to a device that is currently offered by Texas Instruments. The details of this change are on the following pages. Texas Instruments requires acknowledgement of receipt of this notification within 30 days of the date of this notice. Lack of acknowledgement of this notice within 30 days constitutes acceptance of the change. The proposed first ship date is indicated on page 3 of this notification, unless customer agreement has been reached on an earlier implementation of the change. If samples or additional data are required, requests must be received within 30 days of acknowledgement as samples are not built ahead of the change. You may contact the PN Manager or your local Field Sales Representative to acknowledge this PN and request samples or additional data. This notice does not change the end-of-life status of any product. Should product affected be on a previously issued product withdrawal/discontinuance notice, this notification does not extend the life of that product or change the life time buy offering/discontinuance plan. For questions regarding this notice, contact your local Field Sales Representative or the PN Manager (PN_ww_admin_team@list.ti.com). Sincerely, PN Team S Business Services Texas Instruments, Inc. PN

2 Final hange Notification Attachments Products Affected: The devices listed on this page are a subset of the complete list of affected devices. According to our records, these are the devices that you have purchased within the past twenty-four (24) months. The corresponding customer part number is also listed, if available. DEVIE TPS62234TDRYRQ USTOMER PART NUMBER null Technical details of this Product hange follow on the next page(s). Texas Instruments, Inc. PN

3 PN Number: PN Date: 03/30/206 TPS6223TDRYRQ and TPS62234TDRYRQ LLGA to etch and Title: Datasheet update for TPS6223-Q/TPS62234-Q ustomer Quality PN Manager PN Type: 80 day Dept: ontact: Services Proposed st Estimated Sample Date provided at Ship Date: 09/30/206 Availability: sample request hange Type: Assembly Site Design Wafer Bump Site Assembly Process Data Sheet Wafer Bump Material Assembly Materials Part number change Wafer Bump Process Mechanical Specification Test Site Wafer Fab Site Packing/Shipping/Labeling Test Process Wafer Fab Materials Wafer Fab Process PN Details Description of hange: Texas Instruments Incorporated is announcing the qualification to convert leadframe from LLGA (Lead-frame Land Grid Array) to etch and change Die Attach/Mold ompound as seen in the below table. Datasheet is also changing per updated thermal model data. Description From To Mold ompound SID#Z040 SID#Z0297 LeadFrame SID#FO0003 SID#FU048 Die Attach SID#PZ0039 SID#PZ0037 The product datasheet is being updated as summarized below. The following change history provides further details. The datasheet number will be changing. Device Family hange From: hange To: TPS6223-Q/TPS62234-Q SLVSB63 SLVSB63A These changes may be reviewed at the datasheet links provided. The electrical parameter and characteristics will not change. Texas Instruments, Inc. PN

4 Reason for hange: Proactively improved device package delamination performance. Update thermal model data in the datasheet to reflect the change in leadframe. Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative): None. hanges to product identification resulting from this PN: None. Product Affected: TPS62234TDRYRQ, TPS6223TDRYRQ Automotive New Product Qualification Summary (As per -Q00 and Guidelines) TI onfidential NDA Restrictions Attributes TPS6223TDRYRQ Approved 5-Dec-205 Product Attributes TPS62237TDRYRQ TPS62239TDRYRQ Assembly Site UTA UTA UTA Package Type USON USON USON Flammability Rating UL 94 V-0 UL 94 V-0 UL 94 V-0 Wafer Fab Supplier DMOS5 DMOS5 DMOS5 Wafer Process ID LB7 LB7 LB7 Type # - QBS: Qual By Similarity - Qual Device TPS6223TDRYRQ is qualified at LEVEL2-260 Test Spec Qualification Results Data Displayed as: Number of lots / Total sample size / Total failed Min Lot Qty SS/Lo t Test Name / ondition Test Group A Accelerated Environment Stress Tests P HAS T A T A A2 A3 A4 J-STD- 020 A3 A0 A02 A04 and Appendi Automotive Preconditionin g Level 2 Biased HAST, 30/85%RH Autoclave 2 Temperature ycle, - 65/50 Duration TPS6223TDRYRQ TPS62237TDRYRQ TPS62239TDRYRQ 260 peak 3/all/ hrs /77/ hrs /77/ cycles /77/0 - - Texas Instruments, Inc. PN

5 Type # Test Spec Min Lot Qty SS/Lo t Test Name / ondition Duration TPS6223TDRYRQ TPS62237TDRYRQ TPS62239TDRYRQ x 3 PT HTSL A5 A6 A05 A03 5 Wire Pull Post T /5/ Power Temperature ycle High Temp Storage Bake 50 Test Group B Accelerated Lifetime Simulation Tests HTO L ELFR EDR B B2 B3 A08 Q Q ycles N/A N/A N/A 000 cycles /77/0 - - Life Test, hrs - - /77/ Test Group Package Assembly Integrity Tests WBS WBP SD PD SBS SBS LI Q00-00 MIL- STD883 Method 20 B02 B00 and B08 Q00-00 Q00-00 B05 30 Early Life Failure Rate, 25 NVM Endurance, Data Retention, and Operational Life Wire Bond Shear 48 Hrs N/A N/A N/A pk>.67 /30/0 30 Wire Bond Pull pk>.67 /30/ Test Group E Electrical Verification Tests HBM DM E2 E3 Q Q00- Surface Mount Solderability Auto Physical Dimensions Solder Ball Shear (pk>.67) Solder Ball Shear (pk>.67) >95% Lead overage /5/0 - - pk>.67 /0/0 - - Post HTSL/Bum p NA NA NA Solder Balls NA NA NA 50 Lead Integrity - NA NA NA 3 3 ESD - HBM - Q00 ESD - DM - Q V /3/ V (all pins) /3/0 - - Texas Instruments, Inc. PN

6 Type # LU ED E4 E5 Test Spec Min Lot Qty SS/Lo t Test Name / ondition Duration V (corner pins) Q Q V (all pins) For information only TPS6223TDRYRQ TPS62237TDRYRQ TPS62239TDRYRQ /3/ Latch-up 05 /6/ Auto Electrical Distributions pk>.67 Room, hot, and cold test A (P): Preconditioning: Performed for THB, Biased HAST, A, uhast &T samples, as applicable. /30/0 /30/0 /30/0 Junction Operating Temperature by Automotive Grade Level: Grade 0 (or E): -40 to +50 Grade (or Q): -40 to +25 Grade 2 (or T): -40 to +05 Grade 3 (or I) : -40 to +85 E (TEST): Electrical test temperatures of Qual samples (High temperature according to Grade level): Room/Hot/old : HTOL, ED Room/Hot : THB / HAST, T / PT, HTSL, ELFR, ESD & LU Room : A/uHAST Green/Pb-free Status: Qualified Pb-Free(SMT) and Green TI Qualification ID: Quality and Reliability Data Disclaimer TI assumes no liability for applications assistance or customer product design. ustomers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customer should provide adequate design and operating safeguards. Quality and reliability data provided by Texas Instruments is intended to be an estimate of product performance based upon history only. It does not imply that any performance levels reflected in such data can be met if the product is operated outside the conditions expressly stated in the latest published data sheet or agreed-to customer specification for a device. Reliability data shows characteristic failure mechanisms of the specific environmental stress as documented in the industry standards for each stress condition. For questions regarding this notice, s can be sent to the regional contacts shown below or your local Field Sales Representative Location USA PNAmericasontact@list.ti.com Europe PNEuropeontact@list.ti.com Asia Pacific PNAsiaontact@list.ti.com Japan PNJapanontact@list.ti.com Texas Instruments, Inc. PN