QUALIFICATION REPORT RELIABILITY LABORATORY PCN #: JAON-14ZJMR243. Date: August 22, 2016

Transcription

1 QUALIFICATION REPORT RELIABILITY LABORATORY PCN #: JAON-14ZJMR243 Date: August 22, 2016 Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 0.18um TSMC wafer technology available in 132L DQFN at ANAC assembly site. Distribution: CORPORATE QA/RE CORPORATE PACKAGING SUPPLIER ENGINEERING

2 OBJECTIVE Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 0.18um TSMC wafer technology available in 132L DQFN at ANAC assembly site. QUAL ID QAR BD # BDM PART # TEA021NBXA1C (MEC5055) CCB # 2532 PRODUCT INFORMATION PACKAGE TYPE PACKAGE LEAD COUNT PACKAGE CODE MANUFACTUR PART # WAFER LOT WAFER MASK WAFER PROCESS FAB CIRCUIT UNDER PAD DQFN (PUNCH) 132 (11X11x0.85mm) NBX TEA021NBXA1C (MEC5055) TEA um TSMC Material used in the Assembly: LEADFRAME PART NUMBER LEADFRAME MATERIAL C7025 (ETCHED) LEADFRAME INTERNAL PLATING DOUBLE RING LEADFRAME SURFACE Cu roughened LEADLOCK DIE ATTACH EPOXY TYPE CRM1085A EPOXY CONDUCTIVE WIRE TYPE CuPdAu DOWNBOND MOLDING COMPOUND TYPE EMC-G631BQ LEAD FINISH PROCESS Matte Tin MARKING LASER

3 Manufacturing Information PACKAGE QUALIFICATION REPORT Assembly Lot No. Wafer Lot No. MARKING /Date Code ANAC W2K (#25) / SMSC MEC5055-LZY-7 A1614-AB41 614VSUA ATC-CN (e3) ANAC W2K (#25) / SMSC MEC5055-LZY-7 A1614-AB41 614VSVA ATC-CN (e3) ANAC W2K (#25) / SMSC MEC5055-LZY-7 A1614-AB41 614VSYA ATC-CN (e3) Result Pass Fail The 132L DQFN (11x11X0.85mm) package using ALS Leadframe with CuPdAu wire and 0.18um TSMC Technology, assembled by ANAC Pass Reliability test per QCI This package was qualified the Moisture/Reflow Sensitivity Classification Level 3 at 260 C reflow temperature per IPC/JEDEC J-STD-020D standard. Prepared By: Peter Boudouris Date: August 22, 2016 (Corporate Reliability & FA) Approved By: Vassilios Danginis Date: August 22, 2016 (Corporate Reliability & FA)

4 Test Number (Reference) PACKAGE QUALIFICATION REPORT Test Condition Standard/ Method Qty. (Acc.) Def/SS Result Remarks Moisture/Reflow Sensitivity Classification Test (At MSL Level 3 - accelerated) 60 C/ 60%RH Moisture Soak 40 hrs. ( IPC/JEDEC J-STD-020D) IPC/ JEDEC J-STD-020D 0/ 0/ 0/ Pass Pass Pass LOT 1 LOT 2 LOT 3 Precondition Prior Perform Reliability Tests (At MSL Level 3) Electrical Test: +85 C JESD22- A113 (0) Lot 1 Good Devices Bake 125 C, 24hrs 60 C/60%RH Moisture Soak 40hrs 3x Convection-Reflow 260 C Electrical Test : +85 C Precondition Prior Perform Reliability Tests (At MSL Level 3) Electrical Test: +85 C JESD22- A113 (0) Lot 2 Good Devices Bake 125 C, 24hrs 60 C/60%RH Moisture Soak 40hrs 3x Convection-Reflow 260 C Electrical Test : +85 C

5 Precondition Prior Perform Reliability Tests (At MSL Level 3) Electrical Test: +85 C JESD22- A113 (0) Lot 3 Good Devices Bake 125 C, 24hrs 60 C/60%RH Moisture Soak 40hrs 3x Convection-Reflow 260 C Electrical Test : +85 C

6 Test Number (Reference) Temp Cycle Test Condition PACKAGE QUALIFICATION REPORT Stress Condition: C to +150 C, 1000 Cycles Standard/ Method Qty. (Acc.) Def/SS. Result Remarks JESD22-A Parts had been pre-conditioned at 260 C Electrical Test: + 85 C 231 (0) 0/231 Pass 77 units / lot uhast Stress Condition: 96hrs, 192hrs C/85%RH, JESD22-A Parts had been pre-conditioned at 260 C Electrical Test: + 85 C 231 (0) 0/231 Pass 77 units / lot High Temperature Storage Life Stress Condition: Bake +150 C, 1008hrs Electrical Test : + 85 C JESD22-A Parts had no Pre- Condition 231 (0) 0/231 Pass 77 units / lot