XG3 SERIES CLIENT SSD

Transcription

1 XG3 SERIES CLIENT SSD The Toshiba client-focused XG3 Series combines the high speed of the PCIe 3.1 interface, the low latency of NVM Express (NVMe TM ), and Toshiba s proprietary NAND flash memory for suitable performance and reliability. The industry s highest capacity client NVMe SSD* supports up to four lanes of Gen 3 with maximum interface bandwidth of more than 6x that of SATA 6.0 Gbit/s and 3x that of SAS 12.0 Gbit/s. The NVMe PCIe SSDs feature large capacities of up to 1024GB and come in thin, space saving Single (THNSN5xxxGPU7) and Double Side (THNSN51T02DU7) M module form factor. Industry standard 2.5-inch SATA Express form factor options (THNSN5xxxGCJ7) are also available for ease of integration. Further features of the SSD include Toshiba s powerful proprietary Quadruple Swing-By Code (QSBC) and Trusted Computing Group specification, Pyrite (TCG Pyrite). The series is perfectly designed to boost the performance of notebooks, 2-in-1 laptops and all-in-one PCs. SSD Product image may represent a design model *As of August 2015, Toshiba survey KEY FEATURES High capacities up to 1024 GB in industry standard M.2 form factor High tolerance to environmental factors Support for 512 B and 4,096 B logical block sizes Device Activity Signal (DAS) is supported Standard (Non-SED) model supports TCG Pyrite ver. 1.0 Toshiba s powerful proprietary QSBC (Quadruple Swing-By Code) error correction for greater reliability Support for six power sub-states, including PCIe low power L1.2 states Automatic Thermal Control is supported APPLICATIONS For high-end notebook PCs Server boot SPECIFICATIONS Standard Models 2.5-inch M S2 (Single-sided) TOSHIBA MLC NAND Flash Memory M D2 (Double-Sided) Memory Interface PCI Express Base Specification Revision 3.1 (PCIe ) Maximum Speed 16 GT/s (PCIe Gen3 2 Lane) 32 GT/s (PCIe Gen3 4 Lane) Connector Type SATA Express M.2 M Formatted Capacity 1) 128/256/512/1024 GB 128/256/512 GB 1024 GB Command NVM Express TM Revision 1.1b (NVMe TM ) Performance Sequential up to 1),2) Read 1572 MB/s{1500 MiB/s} up to 2516 MB/s{2400 MiB/s} Sequential up to Write 1363 MB/s{1300 MiB/s} up to 1572 MB/s{1500 MiB/s} Supply Voltage 5.0 V ±5 % 3.3 V ±5 % Power Consumption Active: 6.0 W typ. Active: 6.0 W typ. Active: 6.4 W typ. Power State 5: 7.0 mw typ. Power State 5: 6.0 mw typ. Power State 5: 6.0 mw typ Operating: 0 C to 70 C Operating: 0 C to 80 C Temperature (case temperature) (components temperature) Non-operating: -40 C to 85 C Non-operating: -40 C to 85 C 1 / 18

2 Standard Models Reliability 3) 2.5-inch M S2 (Single-sided) Mean Time to Failure (MTTF): 1,500,000 hours Product Life: Approximately 5 years M D2 (Double-Sided) Size mm x mm x 80.0 mm x 22.0 mm x 80.0 mm x 22.0 mm x 7.0 mm 2.23 mm 3.58 mm Weight 50 g typ. 6.8 to 7.2 g typ. 8.6 g typ. More Features Automatic retries and corrections for read errors Compliance UL, cul, TÜV, KC, FCC, BSMI, CE, RCM, IC, VCCI 1) Definition of capacity: Toshiba defines a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 2 30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content. Actual formatted capacity may vary. 2) 1 MiB (mebibytes) = 2 20 bytes = 1,048,576 bytes 3) MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean failure rates for a large number of products which may not accurately reflect actual operation. Actual operating life of the product may be different from the MTTF. * PCIe and PCI Express are registered trademarks of PCI-SIG * NVMe TM and NVM Express TM are trademarks of NVM Express, Inc. * SRIS(Separate RefClock with Independent SSC) is not supported * Product image may represent a design model. * Read and write speed may vary depending on the host device, read and write conditions, and file size. * Standard (Non-SED) model supports TCG Pyrite ver / 18

3 ORDERING INFORMATION THN SX X XXXX X X X Model Name THN: Toshiba NAND drive 2. Model Type SN: Non-SED 3. Controller Type 5: Type 5 4. Capacity 128G / 256G / 512G /1T02 128G is 128 GB, 256G is 256 GB, 512G is 512 GB and 1T02 is 1024 GB (1 GB = 1,000,000,000 bytes) 5. Form Factor C: 2.5-inch (7.0 mm height), P: M S2 Module type, D: M D2 Module type, 6. Host I/F Type J: SATA Express, U: M.2 M(PCI Express I/F) 7. NAND Type 7: MLC 3 / 18

4 PRODUCT LINE UP Model Number THNSN5128GCJ7 THNSN5256GCJ7 THNSN5512GCJ7 THNSN51T02CJ7 THNSN5128GPU7 THNSN5256GPU7 THNSN5512GPU7 Formatted Capacity 128 GB 256 GB 512 GB 1024GB 128 GB 256 GB 512 GB Interface 2.5-inch Specification Revision M.2 Type 2280-S2 1) -M module THNSN51T02DU7 1024GB M.2 Type 2280-D2 2) -M module 1) Single Side, 2) Double Side Function Note Non- SED CAPACITY Capacity Total Number of User Addressable Sectors in LBA Mode 512 bytes sector 4,096 bytes sector 128 GB 250,069,680 31,258, GB 500,118,192 62,514, GB 1,000,215, ,026, GB 2,000,409, ,051,158 Note: 1 GB (Gigabyte) = 1,000,000,000 bytes PERFORMANCE THNSN5128GCJ7 THNSN5128GPU7 THNSN5256GCJ7 THNSN5256GPU7 THNSN5512GCJ7 THNSN5512GPU7 THNSN51T02CJ7 THNSN51T02DU7 Interface Speed M : 32 GT/s (Gen3x4 Lane), 20 GT/s (Gen2x4 Lane), 16 GT/s (Gen3x2 Lane), 10 GT/s (Gen2x2 Lane) 2.5 inch with SATA Express: 16 GT/s (Gen3x2 Lane), 10 GT/s (Gen2x2 Sequential Read 1) 2,202 MB/s 2,516 MB/s 2,516 MB/s {2,100 MiB/s} {2,400 MiB/s} {2,400 MiB/s} Sequential Write 1) 629 MB/s 1,153 MB/s 1,572 MB/s {600 MiB/s} {1,100 MiB/s} {1,500 Sequential Read 1) 1,572 MB/s 1,572 MB/s 1,572 MB/s {1,500 MiB/s} {1,500 MiB/s} {1,500 MiB/s} Sequential Write 1) 629 MB/s 1,153 MB/s 1,363 MB/s {600 MiB/s} {1,100 MiB/s} {1,300 MiB/s} 1) Under the condition of measurement with 128 KiB unit sequential access (1 KiB = 1024 bytes) 2,516 MB/s {2,400 MiB/s} 1,572 MB/s {1,500 MiB/s} 1,572 MB/s {1,500 MiB/s} 1,363 MB/s {1,300 MiB/s} 4 / 18

5 SUPPLY VOLTAGE 2.5-inch M Module Allowable voltage 5.0 V ±5 % 3.3 V ±5 % Allowable noise/ripple 100 mv p-p or less Allowable supply rise time ms Note: These drive have over current protection circuit. (Rated current: 3.15A) POWER CONSUMPTION Operation (Ta 1) =25 C) 2.5-inch THNSN5128GCJ7 THNSN5256GCJ7 THNSN5512GCJ7 THNSN51T02CJ7 Read 2) 3.6 W typ. 3.7 W typ. 3.7 W typ. 4.0 W typ. Write 2) 3.5 W typ. 4.8 W typ. 5.7 W typ. 6.0 W typ. Power State 3 3) mw typ mw typ mw typ mw typ. Power State 4 3) 13.0 mw typ mw typ mw typ mw typ. Power State 5 3) 7.0 mw typ. 7.0 mw typ. 7.0 mw typ. 7.0 mw typ. Operation (Ta 1) =25 C) M Module THNSN5128GPU7 THNSN5256GPU7 THNSN5512GPU7 THNSN51T02DU7 Read 2) 4.0 W typ. 5.5 W typ. 5.5 W typ. 5.5 W typ. Write 2) 3.5 W typ. 4.8 W typ. 6.0 W typ. 6.4 W typ. Power State 3 3) mw typ mw typ mw typ mw typ. Power State 4 3) 12.0 mw typ mw typ mw typ mw typ. Power State 5 3) 6.0 mw typ. 6.0 mw typ. 6.0 mw typ. 6.0 mw typ. Note: 1) Ambient Temperature 2) The values are specified at the condition causing maximum power consumption and Power State 0. 3) PCIe Link state is L1.2. Power consumption during the Admin command processing is excluded. 5 / 18

6 ENVIRONMENTAL CONDITIONS TEMPERATURE Condition HUMIDITY 2.5-inch Range M Module Gradient Operating 1) 0 C (Tc) 70 C (Tc) 0 C (Tc) 80 C (Tc) 30 C (Ta) / h maximum Non-operating -40 C 85 C 30 C / h maximum Under Shipment 2) -40 C 85 C 30 C / h maximum 1) Ta: Ambient Temperature, Tc: Case or Components Temperature 2) Packaged in Toshiba s original shipping package Condition Operating Non-operating Under Shipment 1) 1) Packaged in Toshiba s original shipping package Range 8 % 90 % R.H. (No condensation) 8 % 95 % R.H. (No condensation) 5 % 95 % R.H. SHOCK Operating Condition Non-operating Range km/s 2 {1500 G}, 0.5 ms, half sine wave Under Shipment 1) 100 cm free drop 1) Apply shocks in each direction of the drive s three mutually perpendicular axes, one axis at a time. Packaged in Toshiba s original shipping package. VIBRATION Operating Condition Non-operating Range 196 m/s 2 {20 G} Peak, 10-2,000 Hz (20 minutes per axis) x 3 axis 6 / 18

7 COMPLIANCE SAFETY / EMI STANDARDS Title Description Region UL (Underwriters Laboratories) cul (Underwriters Laboratories of Canada) TÜV (Technischer Überwachungs Verein) UL CSA-C22.2 No EN USA Canada EURO KC KN22, KN24 Korea FCC FCC part 15 Subpart B USA BSMI (Bureau of Standards, Metrology and Inspection) CNS13438(CISPR Pub. 22) Taiwan CE EN 55022, EN EURO RCM AS/NZS CISPR Pub. 22 Australia, New Zealand IC ICES-003 Canada VCCI Class B Japan RELIABILITY Parameter Mean Time to Failure Product Life Value 1,500,000 hours Approximately 5 years 7 / 18

8 MECHANICAL SPECIFICATIONS 2.5-INCH Model Weight Width Height Length THNSN5128GCJ7 7.0 mm THNSN5256GCJ7 THNSN5512GCJ7 THNSN51T02CJ7 50 g typ mm 7.0 mm mm Figure 1: 2.5-inch Drive Dimension 8 / 18

9 2.5-INCH DIMENSIONS Dimension SFF-8200 Rev3.2 1) SFF-8201 Rev3.3 SFF-8223 Rev2.7 Toshiba XG3 SSD (Differences only) Millimeters Inches Millimeters Inches A A A A A A6 2) * * ± ± A A ± ± A10 3) ± ± A A ± ± A26 M3 N/A A / / A ± ± A32 M3 N/A A38 3 # 3 # A # 2.5 # A50 2) ± ± A51 2) ± ± A52 2) ± ± A53 2) ± ± * = maximum # = minimum number of threads 1) SFF-8200: Small Form Factor Standard 2) PCB, Connector not included 3) Connector center defined is the same as SFF / 18

10 M MODULE Model Weight Width Height Length THNSN5128GPU7 6.8 g typ. THNSN5256GPU7 THNSN5512GPU7 7.1 g typ. 7.2 g typ mm 2.23 mm 80.0 mm THNSN51T02DU7 8.6 g typ mm Figure 2: M S2 Module Dimension Unit:mm 10 / 18

11 Figure 3: M D2 Module Dimension 11 / 18

12 INTERFACE CONNECTOR 2.5-INCH SATA EXPRESS CONNECTOR Figure 4: 2.5-inch SATA Express connector 12 / 18

13 2.5-INCH DRIVE CONNECTER PIN ASSIGNMENT Segment Signal Segment Power Segment RefClk Segment Pin Position Name Signal Description Signal Direction S1 GND Ground S2 PETp0 S3 PETn0 PCIe Lane 0 Host Tx Host Output S4 GND Ground S5 PERn0 S6 PERp0 PCIe Lane 0 Host Rx Input to Host S7 GND Ground S8 GND Ground S9 PETp1 S10 PETn1 PCIe Lane 1 Host Tx pair Host Output S11 GND Ground S12 PERn1 S13 PERp1 PCIe Lane 1 Host Rx pair Input to Host S14 GND Ground P1 Reserved NC P2 PERST# PCIe reset Host Output P3 CLKREQ# L1 PM substate Host Output P4 IFDet Interface detect Input to Host P5 GND Ground P6 GND Ground P7 V5 5 V power Host Output P8 V5 5 V power Host Output P9 V5 5 V power Host Output P10 GND Ground P11 LED#1 Device Activity Input to Host P12 GND Ground P13 V12 12 V power (No Use/NC) Host Output P14 V12 12 V power (No Use/NC) Host Output P15 V12 12 V power (No Use/NC) Host Output E7 RefClk+ E8 RefClk- PCIe common RefClk Host Output E9 ClkDet PCIe RefClk detect (NC) Input to Host 13 / 18

14 M MODULE INTERFACE CONNECTOR Figure 5: M Module Interface Connector 14 / 18

15 PIN ASSIGNMENT ON M MODULE CONNECTOR Pin # Name Description Pin # Name Description 1 GND GND V 3.3 V Source 3 GND GND V 3.3 V Source 5 PETn3 PCIe Lane 3 6 Reserved NC 7 PETp3 Device Transmitter 8 Reserved NC 9 GND GND 10 LED1# Device Activity 11 PERn3 PCIe Lane V 3.3 V Source 13 PERp3 Device Receiver V 3.3 V Source 15 GND GND V 3.3 V Source 17 PETn2 PCIe Lane V 3.3 V Source 19 PETp2 Device Transmitter 20 Reserved NC 21 GND GND 22 Reserved NC 23 PERn2 PCIe Lane 2 24 Reserved NC 25 PERp2 Device Receiver 26 Reserved NC 27 GND GND 28 Reserved NC 29 PETn1 PCIe Lane 1 30 Reserved NC 31 PETp1 Device Transmitter 32 Reserved NC 33 GND GND 34 Reserved NC 35 PERn1 PCIe Lane 1 36 Reserved NC 37 PERp1 Device Receiver 38 Reserved NC 39 GND GND 40 Reserved NC 41 PETn0 PCIe Lane 0 42 Reserved NC 43 PETp0 Device Transmitter 44 Reserved NC 45 GND GND 46 Reserved NC 47 PERn0 PCIe Lane 0 48 Reserved NC 49 PERp0 Device Receiver 50 PERST# PE-Reset 51 GND GND 52 CLKREQ# Clock Request 53 REFCLKn PCIe Reference Clock 54 PEWAKE# NC 55 REFCLKp PCIe Reference Clock 56 MFG1 57 GND GND 58 MFG2 Manufacturing pin. Must be noconnect on the host board. Notch Notch 67 Reserved NC 68 SUSCLK NC 69 PEDET NC-PCIe V 3.3 V Source 71 GND GND V 3.3 V Source 73 GND GND V 3.3 V Source 75 GND GND 15 / 18

16 COMMAND TABLE ADMIN Command set Op-Code Command Name 00h Delete I/O Submission Queue 01h Create I/O Submission Queue 02h Get Log Page 04h Delete I/O Completion Queue 05h Create I/O Completion Queue 06h Identify 08h Abort 09h Set Features 0Ah Get Features 0Ch Asynchronous Event Request 0Dh Namespace Management 10h Firmware Commit 11h Firmware Image Download 15h Namespace Attachment 80h Format NVM 81h Security Send 1) 82h Security Receive 1) 1) A command is supported by TCG Pyrite and SED model only Set Features / Get Features Set Op-Code 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 80h Feature Name Arbitration Power Management LBA Range Type Temperature Threshold Error Recovery Volatile Write Cache Number of Queues Interrupt Coalescing Interrupt Vector Configuration Write Atomicity Normal Asynchronous Event Configuration Autonomous Power State Transition Software Progress Marker 16 / 18

17 NVM Command Set Op-Code Command Name 00h 01h 02h 04h 08h 09h Flush Write Read Write Uncorrectable Write Zeroes Dataset Management 17 / 18

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Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. 18 / 18