Vertex Detector Working Group
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- Kory Copeland
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1 Vertex Detector Working Group Sunday, July 13, 3:30-5:30 p.m. 3:30-4:00 LCFI Status Report Chris Damerell, Rutherford Laboratory 4:00-4:30 CCD Radiation Damage Studies Olya Igonkina, Oregon 4:30-5:00 Status of LC R&D at Oklahoma Patrick Skubic, Oklahoma 5:00-5:30 Technology Options Chris Damerell, Rutherford Laboratory Tuesday, July 15, 8:30-10:30 a.m. 9:00-10:30 Discussion Session convenors: Jim Brau & Marco Battaglia
2 A CCD-based vertex detector, Chris Damerell on behalf of the LCFI Collaboration R&D programme Development of novel CCDs and readout electronics Development of thinnest possible detector layers Physics studies Beryllium substrate with adhesive balls Thinned CCD ( 20 m) CCD brought down Shims Tests of unsupported silicon Adhesive Assembly after shim removal and curing 0.2mm Beryllium substrate (250 m) 1 mm Tests of semi-supported silicon glue issues caused unexpected results
3 CCD Radiation Damage Studies, Olya Igonkina Conclusions After 4 years the CCD still had the same traps no signicant annealing at room temperature is observed. Traps filling with signal charge takes noticeable time much larger than the time signal spend in each pixel. We expect that the increased readout speed will lead to decrease of charge transfer ineciency.
4 Status of LC R&D Proposals at Oklahoma, Patrick Skubic
5 LC vertex detector technology options, Chris Damerell
6 Detector Working Group: Tracking 13 talks Sunday, July 13, 1:00-3:00 1:00-1:15 Welcome and Introduction Bruce Schumm 1:15-1:40 JLC Tracking Report Norik Khalatyan 1:40-2:05 Status of Linear Collider TPC R&D Ron Settles 2:05-2:40 Update on TPC R&D In Canada Dean Karlen 2:40-3:00 Open for discussion Monday, July 14, 10:55-12:55 10:55-11:15 Negative Ion TPC for the Linear Collider Alexander Schreiner 11:15-11:35 Commissioning of a MicroMegas TPC Mike Ronan 11:35-11:55 Scintillating Fiber Intermediate Tracker R&D Rick Van Kooten 11:55-12:15 Silicon Drift R&D at Wayne State Rene Bellwied 12:15-12:30 Update on Frequency-Scanned Interferometry Haijun Yang 12:30-12:55 Open for Discussion Tuesday, July 15, 10:55-12:55 10:55-11:15 Overview of the Strip-based SD Tracker John Jaros 11:15-11:35 Long Shaping-Time Readout R&D Bruce Schumm 11:35-11:55 Strip-based SD Pattern Recognition: Forward Norman Graf 11:55-12:15 South Carolina Tracking Achim Weidemann 12:15-12:35 First Mass Production of Gas Electron Multipliers Ian Shipsey 12:35-12:55 Open for Discussion Session convenors: Bruce Schumm, Dean Karlen & Keith Riles
7 JLC Tracking Report, Norik Khalatyan track separation resolution
8 Selected LC TPC R&D Results, Ron Settles GEM electron transfer In magnetic fields Saclay 2T magnet
9 TPC R&D in Canada, Dean Karlen 0 Tesla 0.45 Tesla 0.9 Tesla
10 Negative Ion TPC, Alexander Schreiner UCLC proposal
11 Commissioning of a Large Micromegas TPC, Mike Ronan
12 R&D of Scintillating Fibers for Intermediate Tracking and Bunch Id Rick Van Kooten Motivation is to provide ~1 ns time stamp for each track to identify background tracks coming from multiple collisions within the integration time of detector components. simulation More Light Shorter clear fiber runs Brighter, faster fibers Notre Dame & Fermilab on SBIR and STTR projects collaborating with Ludlum Corp. and Penn to produce new dyes with larger light-yields and faster decay times
13 Silicon Drift Tracker R&D Program, Rene Bellwied UCLC proposal 8 µm in anode direction, 13 µm in drift
14 Frequency-Scanned Interferometry Haijun Yang simulation
15 Silicon Detector Tracking, John Jaros Summary for Layer 1 (half barrel r=25cm) Photon Hits 0.42% e+e- Hits ~0.10 % Noise Hits 0.20% Total Occupancy 0.7 % P=( ) 4 = 97.2 % SD Pattern Recognition looks OK Ω Coverage (requiring N layers, any orientation) 5 CCD layers.97 (vs.90 TDR VXD) 4 CCD layers.98 (vs.93 TDR VXD)
16 Long Shaping-Time Readout for Silicon Strips, Bruce Schumm &%'%( #)*+!,τ &τ-µ. ) µ.!! */0 Ł $!1 µ µ!"#$%
17 Forward Tracking Simulation, Norman Graf single crossing simulation (pairs only) shown for vertex detector and Si tracker will be applied to forward tracking Many open issues: Tiling of disks with wafers: Phi segmentation? Radial segmentation? Mix of Si pixel and µ-strip detectors? If pixel, APD or CCD? If µ-strip, double-sided or back-to-back? Strip orientations within wedges. Shallow- or large-angle stereo? Shallow Angle Stereo Large Angle Stereo
18 South Carolina Tracking Plans, Achim W. Weidemann LCRD proposal Planned Tracking Study Study existing tracking code Tracking efficiency, fake rates for existing trackers Compare different configurations Develop new tracker with Si strip planes Physics impact: Higgs, SUSY, physics yields, resolutions
19 Ian Shipsey 3M Microinterconnect Systems Division Reel-to-reel process, rolls of 16 x16 templates of detachable GEMs in any pattern. Optional processes possible. First batch of 1,980 GEMs recently produced. Low cost per unit! (~2 USD/GEM not counting R&D) Two fabrication techniques (additive, substractive) tested. Single roll of ~1,000 GEMS 3M GEm E/E = 16% Fe 55 spectrum
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