Company Profile.

Transcription

1

2 Content Company Overview Products & Technology Sales & Marketing Financial Overview Appendix Manufacturing Process Guideline 2

3 Company Profile TXC Corporation, founded in 1983, is a leading professional frequency control product manufacturer. We have devoted to the research, design, manufacture, and sale of Dual-Inline-Package (DIP) and Surface Mount Device (SMD) quartz crystal products. TXC now specializes in four categories of products such as high quality Quartz Crystal, Crystal Oscillator (CXO), Surface Acoustic Wave (SAW) Filter, and Timing Module (TM). Our goal is to add value to our customers by providing a complete solution of frequency devices and modules, design-in service to fully satisfy various needs of the esteemed customers. We believe based upon the competence of cost effectiveness, quality, lead-time, and customer service TXC will go beyond customers' expectation. 3

4 Milestones Business NQA Rewarded Ranked 6 th Largest Crystal/Oscillator Manufacturer in the World Ranked 8 th Largest Crystal/Oscillator Manufacturer in the World Paid-in Capital: US$90 M Ranked 5 th Listed in Main Board of Taiwan Security Exchange (Code- 3042) Founded- Capital US$ 95,000 IPO ed Increased Capital to US$ 34.8M Implemented Oracle ERP TS Taiwan and China Factories Quality Green Product Policy & QS 9000 ISO 9001: Sigma IECQ QC Established SMD Production Lines Established SAW Production Lines ISO 14001:2004 Established TCXO Production Lines ISO 14001:1996 Completed new Ningbo Factory in China Production Total capacity can up to 112 M /m Total capacity can up to 204 M /m 4

5 Worldwide Locations Headquarter - Factories(2)- Sales FAEs(10) - Field Application Engineer Distributors(12)- Representative (8)- Taiwan Taipei Taiwan Ping-Cheng China Ningbo China Chong-Qing (Future) Taiwan Taipei China Shanghai, Suzhou, Shenzhen, Wuhan USA LA Japan Yokohama, Osaka Europe Singapore Europe-UK, Germany Korea, India, Mexico. 5

6 6

7 For Telematics Infotainment System DSC Desktop PC PMP PDA NB TPMS MP3 DVD HD Mobile Phone +DSC +MP3 +WiFi ADSL/ WLAN Cable Modem LCD TV HUD Projector WiFi Keyboard/ Mouse Application Game Console MIMO Keyless Entry For Entertainment DPF For Information High Performance Computing & Storage For Communication WIMAX UWB High Performance Switch & Routers XTAL OSC T/F XTAL OSC T/F PDA XTAL OSC Advanced OSC VCXO T/F XTAL OSC TCXO T/F HSDPA PDA +GPS NB Netbook Smartphone XTAL OSC TCXO T/F Mobile Phone 7

8 Crystal by Package Size Seam Type 8x4.5 7x5(6P) 6x3.5(6V) 5x3.2(7B) 3.2x2.5(7M) 2.5x2.0(8Z) 2.0x1.6(8Y) 1.6x1.2(8Q) Glass Type 8x4.5(6X) 7x5 6x3.5 5x3.2(7A) 3.2x2.5(7V) 2.5x x x1.2 5x3.2(4 pads, 7Y) Dip Type 8

9 Oscillator by Package Size CXO 14x9(7J) 7x5(7W) 6x3.5 5x3.2(7C) 3.2x2.5(7X) 2.5x2.0(8W) 2.0x1.6(8N) 1.6x1.2 VCXO 14x9(7H) 7x5(6U) 5x3.2 TCXO 14x9 7x5 6x3.5 5x x2.5(7Q) 2.5x2.0(7L) 2.0x1.6(7Z) 1.6x1.2 (Sample Ready) 9

10 Products and Technology Strategies Advanced Oscillators and Modules (AOM): Matured products: Crystal CXO Tuning Fork 4 HF Oscillator HF VCO TCXO 1 Networking I 2 Wireless Communication PC / Consumer Desktop/Laptop Mobile High Frequency Low Jitter High Reliability Peripherals Networking II WAN (FC/GbE/FCoE) MAN High Frequency Telecom Datacom High Stability Long Haul 5 WLAN TCXO Multimedia Stratum 3 TCXO FX/CDR OCXO Compact Low Power Bluetooth High Stability Digital Imaging Quartz Sensor 3 PND Pressure GPS Gases Others ZERO Defect Automotive Products 3 Technology Integration Gyroscopes Non-Safety Automotive Products TPMS Safety 5 10

11 2010 WorldWide Volume v.s. Revenue Comparison by Products 2010 Vol. by Products 2010 Rev. by Products VCXO 0.4% OCXO 0.0% TCXO XO 6.2% 4.7% OCXO VCXO 5% 5.76% KHz Xtal 18% 88.6% KHz Xtal 35.8% TCXO 21.70% 53% MHz Xtal 52.8% XO 14% MHz Xtal 35% 11

12 Business Model 12

13 Worldwide Ranking & Market Share Worldwide Revenue of the Top Crystal and Oscillator Suppliers (Unit: Millions of USD) * Data Courtesy of CS & A CS&A forecasts 7.5% YoY Growth in 2010, and 6.1% in

14 Future Driving Force 14

15 Competitive Advantage of TXC TXC Competitors of Japan Competitors of Taiwan Competitors of China Overhead Cost Medium High Medium Low Quotation advantage due to JPY appreciation High Low High High Market Focus Asia USA, Europe Asia China (Growing) (Declining) (Growing) (Growing) Flexibility High Low High High Relationship with ODM High Low High Low Diversification High High Low Low PC, Automotive, Networking, Mobile, Consumer, Global Automotive, Networking, Mobile, Consumer, Global Specific to one field PC Ability Of Production Line Transfer High High Medium Medium Economic Scale High Highest Low High (SMD) (SMD & TCXO) (DIP) Manufacturing Technology High 2016,1612 Highest 1612,1210 Medium 2520,2016 Low 3225,2520 Quality Control High Highest Medium Low 15

16 Operating Revenue (Unit: Millions of USD) % 20% 18% 5% % 19% 22% Operating Revenue

17 Sales Revenue by Marketing Field (F) ACAP 0.4% Others NETWORKING 11.1% 25.3% CONSUMER 10.7% ACAP 1.0% CONSUMER 10.4% Others 7.4% NETWORKING 25.8% PC 14.5% MOBILE 20.5% PC 14.4% GLOBAL/EMS 17.5% MOBILE 21.3% GLOBAL/EMS 19.6% 17

18 18

19 Revenue Trend Unit: $NT in Million 19

20 Gross Profit Trend Unit: $NT in Million 20

21 Net Profit Trend Unit: $NT in Million 21

22 Balance Sheets & Key Index Unit: NT$ in Million Item 09.Q4 10.Q1 10.Q2 Current Assets $ 5,175 $ 5,854 $ 6,459 Cash & Cash equivalents $ 1,566 $ 1,839 $ 2,491 Notes & Account receivables $ 2,468 $ 2,447 $ 2,697 Inventories $ 837 $ 869 $ 1,012 Fixed assets $ 4,110 $ 4,103 $ 4,354 Total assets $ 9,465 $ 10,205 $ 11,118 Current liabilities $ 2,566 $ 2,447 $ 3,717 Notes & Account payables $ 1,264 $ 1,216 $ 1,560 Long-term liabilities $ 893 $ 1,456 $ 1,329 Total liabilities $ 3,544 $ 3,947 $ 5,058 Shareholders' equity $ 5,921 $ 6,258 $ 6,059 Debt ratio 37.44% 38.68% 45.49% Current Ratio % % % Quick Ratio % % % Net Value Per Share $ $ $

23 Capital Expenditures 2010 Overall Capacity +30%; Advanced Capacity +50% Unit: PCS / NT$ Million CapEx Line Amount$ Date (F) Capacity/M Revenue/M (F) Ping-Cheng factory expansion plant (2) SMD Seam X tal (TWN) 2016 / 1612 SMD TC / VC XO (TWN) 3225 / 2520 / 2016 SMD TF (TWN) 2012 NGB factory expansion plant SMD Glass X tal (NGB) 5032 / 3225 SMD Seam X tal (NGB) 3225 / H.3Q 4.0M Q.4Q 3.0M Q 2.0M Q 15.0M Q.4Q 9.0M 35 Total 34 1, M

24 Business Highlights Revenue will ramp up quarter by quarter TXC Strategy in 09 Gross margin rate will gradually grow up Revenue will ramp up Quarter-over-Quarter China Market is still the major sales driving force Wireless modules will remain high growth along with worldwide WPAN development AOM products shipment will ramp up along with raising Cloud Computing and Smart Grid applications Will continue penetrating worldwide market with Smart Phone and GPS Applications 24

25 Appendix Manufacturing Process Guideline 25

26 1 2 Wire Sawing Blank Process 3 Quartz Bar Wafer Frequency Lapping EN A B C D

27 SMD Process and structure IC Die Bonding Wire Bonding Crystal Oscillator Blank Cleaning Base Plating Metal Lid Blank Auto- Mounting Plated Blank Frequency Adj. Seam Sealing Mechanical Testing Crystal Oscillator Oscillation IC Ceramic Package ( top ) Final Testing Marking Ceramic Package ( Bottom ) Taping 27

28 Thank You! 28