Photonics Test Solution

Transcription

1 Photonics Test Solution VCSEL/TO-CAN/CoC/TOSA/BOSA Get digital brochures by downloading Chroma ATE Solutions APP Turnkey Test & Automation Solution Provider ios Android

2 Founded in 1984, Chroma ATE Inc. is a world leading supplier of precision Test and Measurement Instrumentation, Automated Test Systems, Manufacturing Execution Systems and Turnkey Test and Automation Solutions marketed globally under the brand name "Chroma". Significant markets Chroma serves include LED, photovoltaic, Li-battery, electric vehicle (EV/EVSE), semiconductor/ic, photonics, flat panel display, video and color, power electronics, passive component, electrical safety, and thermoelectric test, as well as automated optical inspection and manufacturing execution systems. The photonics test solutions are mainly applied to laser diode chips and segment packing of optical communication active components. With more than 30 years of remarkable technologies Chroma possesses in power electronic and optical measurement, the integrated mechanism and temperature control are able to perform aging and characteristics testing for optical devices under various ambient temperature conditions. Paris Madrid Kobenhavn Ede, The Netherlands Augsburg, Germany Roma Beijing Shanghai Chongqing Suzhou Shenzhen Xiamen Dongguan Hong Kong Shinyokohama, Japan Taoyuan, Taiwan Hsinchu Kaohsiung Santa Clara, CA Irvine, CA Foothill Ranch, CA Chandler, AZ Juarez, MX Marlborough, MA Singapore, Southeast Asia Headquarters Overseas branch offices Distributors Photonics Test Solution VCSEL Mapping Prober Wafer Inspection System Laser Diode Characterization System Laser Diode Burn-in & Reliability Test System TO-CAN Package Inspection System TOSA/BOSA Temperature Control System Wafer Package Four-quadrant High Precision Source Measure Unit TEC Controller

3 Double Sides Wafer Inspection System Model 7936 The Chroma 7936 double sided wafer inspection system is an automatic inspection system for after-dicing wafer chip. It can do double sided inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous when the advanced illumination technology is in use. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip, VCSEL or flip chip. Applied with high speed camera and inspection algorithms, the Chroma 7936 can inspect a 2" LED wafer in 4.5 minutes with throughput about 35msec/ chip. The Chroma 7936 also provides auto focus and warpage compensation function to solve wafer warpage and chuck leveling problems. It has two magnifications for selection by applicable chip size or defect size. The minimum resolution is 0.7um that is capable of detecting 2 um defect size. Double-sided inspection simultaneously Maximum 8 in. wafer handling capability (10 in. inspection area) Unique detection algorithm can be replaced or added for different customer or product No precise wafer loading is required for auto alignment Edge finding to test various wafer shapes Defect criteria editor for versatile pass/fail settings Defect detection rate > 98% Able to combine AOI and upstream data to form a final mapping file for uploading to next processing device Customized inspection report for defect analysis SPECIFICATIONS Model 7936 Suitable Chip and Package Type Applicable Ring Grip ring holder or wafer holder Inspection Area 10", suit for 6" LED expanding wafer and 8" sawing wafer Chip Size 125umX125um ~1.2mmX1.2mm Chip Height 10um~1.5mm Suitable Package Vertical chip, flip chip Inspection Camera 5M Color Camera X 2 Light Source LED co-axis light, ring light, back light Magnification 2X, 5X objective lens selectable Throughput For LED, 2" wafer in 4.5 minutes at 2 lights Algorithm Pad defect, mesa defect, chipping defect, double chips and emitting area defect External Interface Provide external algorithm interface to replace or add new inspection algorithm System Loading/ unloading Auto load port X 2 Warpage Compensation Software auto focus to overcome wafer warpage PC X1 Software Function Monitor Real-time wafer map display Image Storage All/ defect image saving selectable Report Including chip position, defect type, inspection results Cassette Selection Programmable cassette selection and scheduling Facility Requirement Dimension 1200mm x 800 mm x 1550mm Weight 800kg Power AC 220V 10%, 50/60 Hz, 1, 2KW Compressed Air 0.6 MPa Operation Temperature +5 C ~40 C Operation Humidity 20%~65% R.H. Application for LD/PD Ball Missing Ball Chipping Ball Shift Lead Short Lead Open Lead Notch All specifications are subject to change without notice. Please visit our website for the most up to date specifications.

4 Wafer Inspection System Model 7940 Chroma 7940 wafer chip inspection system is an automated inspection system for post-diced wafer chip inspection. It is capable of inspecting both top and bottom view of the wafer chip simultaneously. Utilizing an advanced illumination technology and color camera acquisition, the system can be customized for various wafer processes and test configuration such as vertical chip or flip chip inspection. With high-speed camera and inspection algorithms, Chroma 7940 can inspect up to 6" wafer in 3 minutes with a throughput of up to 15 msec./chip. It provides auto focus and compensation for wafer warpage and leveling of an uneven chuck. 2X and 5X magnifications with 1.3µm/pixel and 0.5µm/pixel resolutions respectively are used to detect various defects down to 1.5µm in size. System Function After tape expansion, individual chip orientation may become irregular and chip realignment is needed during the inspection process. Chroma 7940 includes a software alignment function that automatically adjusts wafer alignment angle for precision scanning. The system comes with an easy-to-read and user-friendly interface that significantly reduces user's learning time while providing visual wafer mapping of defect regions and inspection result. Defect Analysis Besides pass/fail inspection and bin data, all raw data for the inspection result may be recorded for further analysis. This database makes it easy to analyze and obtain optimal parameters for balancing the over-kill and under-kill. It is also used to monitor defect trend caused by the production process, therefore capable of providing advanced feedback for production control. Simultaneous double side color inspection 6" wafer / 8" inspection area Automatic wafer alignment Wafer shape / edge identification Unique defect detection algorithm Versatile defect criteria definitions Complete defect classification Defect detection rate > 99% Wafer mapping - Yield - Up/down stream operation Detail defect raw data for analysis

5 Applications LED Top Side Defects LED Back Side Defects - Pad Defect - Pad Residue - ITO Peeling - Finger Broken - Mesa Abnormality - Epi Defect - Chipping - Chip Residue - Dicing Abnormality - Pad Bump - Chipping - Metal Lack VCSEL Top Side Defects VCSEL Back Side Defects - Pad Defect - Pad Scratch - Emitting Area Defect - Peeling - Mesa Abnormality - Epi Defect - Chipping - Chip Residue - Dicing Abnormality - Pad Bump - Chipping - Metal Lack SPECIFICATIONS Model 7940 Suitable Chip and Package Type Applicable Ring Grip ring or wafer frame Inspection Area 8 inches Chip Size 125um x 125um ~ 2.2mm x 2.2mm at 5X magnification Suitable Package LED vertical chip, flip chip, VCSEL Inspection Camera 25M Color Camera x 2 Light Source LED co-axis light, ring light, back light Magnification 2X, 5X objective lens selectable Resolution 1.28um/pixel (2X), 0.5um/pixel (5X) Throughput 6" wafer in 3 minutes at 2 lights, 2X magnification Algorithm - Pad defect, mesa defect, chipping defect, double chips and emitting area defect - Provide algorithm interface to replace or add new inspection algorithm System Cassette Load Port Auto load ports x 3 Warpage Compensation software auto focus to overcome wafer warpage PC x 1 Software Function Monitor Real-time wafer map display Image Storage All/defect image saving selectable Report Including chip position, defect type, inspection results Cassette Selection Programmable cassette selection and scheduling Facility Requirement Dimension (WxDxH) 1950 mm x 1650 mm x 1750 mm Weight 2000 kg Power AC 220V 10%, 50/60 Hz, 1, 3KW Compressed Air 0.6 MPa Operation Temperature +5 C ~40 C Operation Humidity 20%~60% R.H. All specifications are subject to change without notice. Please visit our website for the most up to date specifications.

6 TO-CAN/CoC Burn In System Model Burn-in, Reliability & Life Test The Chroma is a high density, multifunction, and temperature controlled module for laser diode burn-in and lifetime tests. Each module has up to 128 discrete channels which can source current and measure voltage in various control modes as described below. Auto Current Control Mode (ACC) In auto current control (ACC) mode, the control circuit will provide the preset current to each laser diode with high stability. No matter how the device resistance and temperature change, the current will be kept constant over the test period. The device voltage will be recorded as a quality reference parameter. Auto Power Control Mode (APC) With feedback signal from the optional external Photo Diode PCB, the control circuit can adjust the laser diode current automatically to keep constant feedback signal strength, which means the optical output of the laser diode is maintained constant over the test period. The device voltage and current are recorded as quality parameters for reference. TO-CAN carrier Temperature Control A proprietary designed heat plat will control the laser diode case temperature with high accuracy, excellent stability, and good uniformity. Compared with oven or chamber types of laser diode burn-in systems, our solution is much more compact, easier to operate, better performance, and energy saving. Customers gain benefit for small footprint, versatile usage, and easy maintenance. Individual Module Operation Modules are mounted in a 19" rack to form a system. Each module is a 3U height drawer to fit in the rack. Customers can set different modules in different temperatures, operated in different control modes, and with different start and stop times. This provides great flexibility in operation. CoC carrier Protection and Individual Channel Shotdown The control circuit is specially designed for protecting laser diodes. No rush current or voltage will occur to hurt the devices. High/Low limits of current and voltage can be set to perform shutdown protection. When abnormality happens, only the particular channel will be shutdown while others are running normally. Besides the protection functions implemented in the control circuit, isolation and ESD protection are also taken care in system design. Auto Data Recovery aftercommunication Interruption The burn-in data are stored in system PC and optional remote servers. If the communication between the module and PC is broken temporarily, the data will be buffered in the module up to 8 hours or even longer. After the communication is restored, the buffered data will be dumped to the PC/server without loss. For Burn-In, Reliability and Life Testing Up to 128 laser diodes per module Up to 10 modules (1280 laser diodes) per systems ACC and APC control modes Individual channel driving and measurement Driving current 500 ma per channel and up Precise temperature control up to 120 Individual module operation Customization for device form factor upon request Optical module Half height rack Full height rack

7 User Friendly Softpanel The soft panel provides an intuitive visual interface that one can check certain device at certain module with some simple mouse-clicks anytime during the tests. The burn-in raw data are stored in Microsoft Excel compatible format for further analyses. Optional barcode system can be cooperated for test management. Flexible to choose condition Comprehensive test data GUI calibration interface SPECIFICATIONS Model Module Channel Number up to 128 Laser Diode Type TO-46, TO-56, CoC, CoS Test Function ACC, APC (optional) Burn-in Record Time 1 min to 5000 hours Communication Port RS232 Change Kit DUT carrier board Auto Current Control Mode Current Range 0~500 ma *1 Currnt Setting Resolution 0.02 ma Current Accuracy 1%+1mA Compliant Voltage 4 V Voltage Measurement Range 4 V Voltage Measurement Resolution 200uV Voltage Measurement Accuracy 1%+10mV Auto Power Control Mode (Optional) External PD type Si or InGaAs *2 Wavelength Range 390 to 1700 nm PD Current Stability 1% LD Current Range 0~500 ma LD Current Measurement Accuracy 1%+1mA LD Compliant Voltage 4 V LD Voltage Measurement Accuracy 1% + 10mV Temperature Control Temperature Measuring Range 0~150 Temperature Setting Range 40~120 Temperature Setting/Reading Resolution 0.1 Temperature Stability 0.2 Temperature Accuracy 1 Temperature Uniformity ( % T) System Configuration 23" rack, half or full height Number of Modules up to 10 (For full height rack) DUTs per system up to 1280 (For full height rack) CommunicationPort Ethernet to server Dimensions Half height rack, 3 modules 1600 x 600 x 900 mm (H x W x D) Full height rack, 10 modules 2000 x 600 x 900 mm Weights Half height rack, 3 modules 230kg Full height rack, 10 modules 500kg Power Requirements Half height rack, 3 modules AC 220V 10%, 50/60Hz, 11.4A, 2.5KW Full height rack, 10 modules AC 220V 10%, 50/60Hz, 20A, 4.4KW Environment Temperature 20~30 Humidity <80% RH, non-condensing Note *1 : Can be customized for other specifications Note *2 : Wavelength dependent, customized PD types upon request Note *3 : Thermal platform temperature without DUT loading, T = ambient temperature - setting temperature All specifications are subject to change without notice. Please visit our website for the most up to date specifications.

8 Laser Diode Burn-in & Reliability Test System Model Burn-in, Reliability & Life Test The Chroma is a high density, multifunction, and temperature controlled module for laser diode burn-in and lifetime tests. Each module has up to 256 SMU channels which can source current and measure voltage in various control modes as described below. Auto Current Control Mode (ACC) In auto current control (ACC) mode, the control circuit will provide the preset current to each laser diode with high stability. No matter how the device resistance and temperature change, the current will be kept constant over the test period. The device voltage will be recorded as a quality reference parameter. Auto Power Control Mode (APC) With feedback signals from the optional external photo diode PCB, the control circuit can adjust the laser diode current automatically to keep constant feedback signal strength, which means the optical output of the laser diode is maintained constant over the test period. The device voltage and current are recorded as quality parameters for reference. Burn-in Test Temperature Control A proprietary designed heat plate will control the laser diode case temperature with high accuracy, excellent stability, and good uniformity. Compared with oven or chamber types of laser diode burn-in systems, our solution is much more compact, easier to operate, better performance, and energy saving. Customers can gain benefit from small footprint, versatile usage, and easy maintenance. Individual Module Operation Customers can set different modules in different temperatures, and operated in different control modes, with different start and stop times. This provides great flexibility in operation. Protection and Individual Channel Shutdown The control circuit is specifically designed for protecting laser diodes. No rush current or voltage will occur to hurt the devices. High/Low limits of current and voltage can be set to perform shutdown protection. When abnormality happens, only that particular channel will be shut down while others will run normally. Besides the protection functions implemented in the control circuit, isolation and ESD protection are also taken care in system design. Auto Data Recovery after Communication Interruption The burn-in data are stored in the system PC and optional remote servers. If the communication between the module and PC is disconnected temporarily, the data will be buffered in the module up to 6 hours or even longer. After the communication is restored, the buffered data will dump to PC/server without loss. Applicable for burn-in, reliability and life testing ACC and APC control modes Individual channel driving and measurement Driving current 500 ma per channel and up Precise temperature control up to 125 Individual module operation CoC carrier Test Fixture Full height rack

9 User Friendly Softpanel The soft panel provides an intuitive visual interface that one can check certain device at certain module with simple mouse clicks anytime during the tests. The burn-in raw data are stored in Microsoft Excel compatible format for further analysis. Optional barcode system can be cooperated for test management. Control Panel Data Analysis Test Item SPECIFICATIONS Model SMU Module Channel Number up to 256 Laser Diode Type TO-46, TO-56, CoC Test Function ACC (standard) APC, LIV (optional) Burn-in Record Time 1 min to 5000 hours Auto Current Control Mode Current Range ±500 ma Current Accuracy 0.2% F.S. Compliant Voltage ±7 V Voltage Measurement Range ±7 V Voltage Measurement Accuracy 0.2% F.S. Auto Power Control Mode (Optional) External PD type Si or InGaAs *1 Wavelength Range 400 ~ 1600 nm *1 LD Current Range ±500 ma LD Current Measurement Accuracy 0.2% F.S. LD Compliant Voltage ±7V LD Voltage Measurement Accuracy 0.2% F.S. Temperature Control Temperature Measuring Range Ambient ~ 125 Temperature Setting Range 45~125 Temperature Setting/Reading Resolution 0.1 Temperature Stability *3 1 Temperature Uniformity ±( % ΔT) *2 System CommunicationPort Ethernet to server Dimensions (D x W x H) 1,300 mm x 900 mm x 1,900 mm Weights 500±50 kg Power Requirements 187 ~ 250 Vac (3 Phase 4 Wire, Δ Connection ) or 323 ~ 437 Vac (3 Phase 5 Wire, Y Connection) / 45 ~ 65 Hz Environment Temperature 20~30 Humidity <80% RH, non-condensing Compressed Air 5 kgf/cm 3, 30 L/min. ; 0.5 Mpa Note *1 : Wavelength dependent, customized PD types upon request Note *2 : Thermal platform temperature without DUT loading, ΔT = ambient temperature - setting temperature Note *3 : 1 = (Max T - Min T) within 48 hrs burn-in time All specifications are subject to change without notice. Please visit our website for the most up to date specifications.

10 Laser Diode Characterization System Model Laser diodes are becoming more ubiquitous. Current applications ranged over medical and defense, are the critical backbone of the world's fiber optic communication networks. There are several highly precise processes involved in the production of laser diodes. These processes are cost intensive from wafer growth all the way to fiber alignment and package high speed testing. The Chroma Laser Diode Characterization Station is a state-of-the-art turnkey test system designed specifically for laser diodes. Its features range from macro inspection of the facette or aperture active area to a full suite of electro-optical parametric tests. When Chroma's high capacity carrier is used, multiple devices can be rapidly repeated and indexed that not only reduces the test time but improves the test reliability. The Chroma is equipped with a highly stable, large scale, temperature control platform providing the ability to incorporate R&D style tests in a production environment. This empowers the ability to study correlation between laser diode forward current and temperature. Automated load/unload Full turnkey automated tests for edge-emitting laser diodes High precision and large capacity carrier, interchangeable with other automated equipment Fully automated alignment function for fiber-coupled tests Automated optical inspection to decrease mechanical positioning delays Highly accurate TEC temperature controller with stability up to 0.01 PXI-Based SMU and power meter for fast test counts Full suite of software analysis tools for laser diode characterization (Ith, Rs, Vf, slope efficiency, p, etc.) Sharing Carrier One of the primary uses of high performance laser diodes is in the fields of optical data and telecommunications where the requirements for fiber coupling are quite stringent. If most DC parametric and optical characteristics are understood before a laser diode is inserted into the final product, there is a greater cost savings and higher degree of in-field reliability. The Chroma is equipped with a fully automated alignment station to simulate a real-world fiber package coupling test, and to predict coupling efficiencies as well as spectral performance. Multiple optical heads and fibers may be used and coupled to an optical receiver such as an Optical Spectrum Analyzer (OSA) to analyze full spectral characteristics such as side mode suppression ration and center wavelength ( p, c). Since every device is traceable with data, the Chroma offers the ability to correlate unpackaged optical performance with final package performance, and helps in justifying a reduced final package test requirement. carrier Flexible user interface Characterization System Model Burn-In system Model 58604

11 Auto-alignment Fiber with AOI Assistance Utilizing the experiences in semiconductor IC testing and technology development, the released by Chroma introduces a batch process of sharing carrier and changing kit to the Laser Diode industry. The carrier protects the laser diode from being handled and damaged during burnin and characterization process that can help increasing the productivity and yields. This same carrier is designed to operate with the Chroma Optoelectronic SMU Module for seamless burn-in and testing. Through a change kit, as the laser diode under test changes (by evolving design or new product), the system can adapt to various form factors and features. This flexibility allows the system to test TO-Can, Chip on Carrier, etc. Auto-aligment Fiber with AOI Assistance SPECIFICATIONS Model Device Under Test Form Factor CoC, CoS Channels in Carrier 80 Channels per cycle *1 Current Ranges (Chroma Model 52401) Current Range (Source & Measurement) 200nA / 2µA / 20µA / 200µA /2mA / 20mA / 200mA Current Resolution 1.6pA/ 16pA/ 160pA/ 1.6nA/ 16nA/ 160nA/ 1.6µA Current Accuracy (Source & Measurement) I range 1mA : 0.1% + 0.1% FS ; I range < 1mA : 0.05%+0.2% FS Voltage Ranges Compliance Voltage Range 0.5V/1V/2.5V/5V/10V/25V Compliance Voltage Accuracy 1V: 0.05% %FS ; <1V: 0.05% + 0.1%FS Voltage Measurement 3.8nV~ 25V Voltage Measurement Accuracy 0.05% + to 0.05% + Test Parameters Electrical L-I-V Curves, Ith, Vf, Rs, Linearity (Kink) Spectral Peak wavelength, SMSR, etc. Optical Spectrum Analyzer*(Optional) Wavelength Range 700 nm to 1700 nm Resolution Bandwidth < 0.1 nm SMSR Measurement > 40 db Wavelength Accuracy 0.03 nm Temperature Control Temperature Range 25 ~85 ; -5 ~85 (optional) Temperature Accuracy 0.3 Temperature Uniformity (0.5 +1% T) *3 Mechanical Specification Motion Stage Travel Distance 400 mm Minima Fine Stage Resolution 20 nm System Size (W x D x H) 1000 mm x 1200 mm x 1350 mm System Weight Kg Power Input 220V single phase 50/60 Hz Water flow Rate <3~5 lpm Operating Environment Temperature : 20 ~25 ; Humidity : <70% Software Operating System Supported Microsoft Windows 2000, XP or 7 Note *1 : Capacity of carrier depends on the DUT size and form factor Note *2 : Chroma is compatible with multiple Optical Spectrum Analyzers. Please inquire for further details. Note *3 : T = l Ambient temperature - setting temperature l All specifications are subject to change without notice. Please visit our website for the most up to date specifications.

12 TOSA/BOSA Temperature Control System Model 58690/58691 TOSA (transmitter optical sub assembly) and BOSA (bi-directional optical sub assembly) are two very important components for optical communication. Since the characteristics of TOSA and BOSA are sensitive to temperature (such as threshold current and wavelength), they need to go through temperature testing before shipment. The Chroma 58690/58691 are brand new models integrated with outstanding temperature control technology specifically designed for TOSA and BOSA. They are featured in fast heating, cooling and excellent temperature uniformity that can substantially increase the test throughput. Excellent Temperature Uniformity Different from warming up the DUT ambient to get the temperature control effect, the Chroma 58690/58691 use contact temperature platform to perfectly control the carrier's temperature in achieving uniformity when working with a high precision TEC controller. The temperature platform presents excellent temperature uniformity as it has 4 temperature sensors evenly distributed with a temperature feedback controller in the center. Fast Heating and Cooling Currently the TOSA/BOSA temperature control system requires tri-state temperature tests during mass production. The 58690/58691 configured with Chroma s high precision TEC controller has excellent temperature control capability that is able to complete a tritemperature cycle (including soaking time) within 25 minutes which significantly improves the productivity. High Precision Customized Fixtures Chroma provides high precision fixtures for various TOSA/BOSA packing types to use. The fixtures comprise the temperature control platform required by DUT. Moreover, electrical and optical connection interfaces are devised to test the optical and electrical characteristics on DUT. These fixtures enable the user to place DUTs in the temperature control system easily and connect to the testing systems directly. Different channels of fixtures are also provided for different DUT packing types. The TO-56 packing type TOSA, for example, can support up to 72 channels to expand the throughput of production lines. User Friendly Interface The user interface provided to configure the 58690/58691 and TEC controller is able to set up and read temperature parameters, check TEC current and temperature vs. time curve, record data to documents, set temperature cycling and rising/falling speed, etc. The PID, current limit and other essential settings are set in engineering mode. Wide temperature range (-40 ~ 85 ) Excellent temperature uniformity to make sure all DUTs are under the same temperature condition Within 0.5 temperature stability Fast heating and cooling to shorten testing time Temperature control up to 72 DUTs at the same time to increase testing output TOSA/BOSA provides the following for mass production: - Electrical test connector - Optical fiber connector * Depending on DUT form factor

13 TOSA/BOSA Temperature Control Fixture (58690) TOSA/BOSA Temperature Control Fixture (58691) Optical Communication Devices Test Application min. No overshoot -40 Fast Heating and Cooling Excellent Temperature Control Ability SPECIFICATIONS Model Device Under Thermal Control Form Factor QFSP TOSA Cylindrical TOSA, BOSA Temperature Area 440 x 350 (mm) 440 x 350 (mm) DUT Number *1 20 typically 72 typically Communication Port Ethernet Ethernet Temperature Control Temperature Setting Range -40 to to 85 Temperature Setting/Reading Resolution Temperature Control Stability *2 < 0.5 < 0.5 Temperature Uniformity < (1+1% T) *3 < (1+1% T) *3 Temperature Cycle *2 25 minutes typically 25 minutes typically Mechanical Specifications Dimension (W x D x H) 700mm x 900mm x 1511mm 700mm x 900mm x 1511mm System Weight 220kg 220kg Facility Power Requirement 220 VAC, 50/60Hz, 2kW 220 VAC, 50/60Hz, 2kW Operation Temperature 10 to to 35 Dry Air Meets ISO :2001 Class Flow Rate 50 LPM Note *1 : Dependent on DUT form factor (e.g. 64 channel for TOSA TO-CAN form factor) Note *2 : Under the condition that is without loading and stable thermal loading Note *3 : T = ambient temperature setting temperature Meets ISO :2001 Class Flow Rate 50 LPM All specifications are subject to change without notice. Please visit our website for the most up to date specifications.

14 TO-CAN Package Inspection System Model 7925 The Chroma 7925 is an automatic inspection system for TO-CAN package that is able to detect over 30 m of lens scratches with clearly displayed particles through the advanced illumination technology. As the height of tray and package varies as specified, the Chroma 7925 can calculate the focus distance and compensate the variation with auto focus function. The user can edit the defect criteria with versatile pass/fail settings to pick out the defect packages in another tray by defect code. The entire machine process is fully automated from loading, inspection, picking to unloading. It reduces the probability of operating error and abnormal procedure. The engineer can get a detailed inspection raw data and defect images. It helps analyzing the process problem and increasing the yield through the data got from the package inspection system. Able to inspect lens scratches, cracks, particles and metal cap defects of TO-CAN package Auto focus function for various height adaption of tray or package Defect criteria editor for versatile pass/fail settings Higher reliability and repeatability than visual inspection More than UPH 3600 throughput Auto-cassette function to reduce operator loading/unloading time Customized inspection report and defect images for analysis TO-CAN Defect Items Abnormal Coating Lens Scratch Lens Contamination Lens Crack Cap Scratch Wrong Cap SPECIFICATIONS Model 7925 Target TO-CAN package Tray Size < 6 (width) X 6 (Length) Optical side inspector X1 Station Layout Auto cassette X 2 Picker X1 Throughput UPH 3600 (depends on the numbers of lighting) Stages X, Y axis motorized stages Algorithm Provide enable/ disable function and external algorithm interface Image Save All/ defect/ none image selectable Monitor Real-time tray map Report *.txt, including chip position, defect type Dimension 1500mm x 1200 mm x 1800mm

15 TEC Controller Model 54130/54180 Series External and internally induced thermal stresses on laser diodes strongly influence spectral and other electro-optical characteristics. Due to these issues, the Chroma includes a temperature control platform with a high precision Chroma W TEC Controller and a Chroma Data Logger. These are highly regarded as world class instruments to ensure the uniformity of the carrier temperature and hence the devices under test. There are several thermal sensors placed along the carrier platform to ensure a high degree of temperature uniformity and stability Series 25 Temp Series Stability 0.01 Time Bidirectional driving with 150W (24V 8A), 300W (24V 13A), or 800W (40V/20A) output Temperature reading and setting range -70~250 with 0.01 resolution and 0.3 absolute accuracy Feature true TEC large signal PID auto tune for best control performance RS232 serial communication port for PC remote operation and thermal data recording Temp. SV PID control chroma Convention on/off control Time Temp. Large signal and bi-directional driving method for PID auto tune SV PID auto tune & optimized(chroma) PID not optimized(others) Time SPECIFICATIONS Model TEC Output Voltage 27VDC 40VDC TEC Output Current 12A 20A TEC Driving Output Power 300W 800W Temperature Control Setting Temperature Range -49 to to 250 *1 Setting Temperature Resolution 0.01 Temperature Control Stability Short Term : 0.01 ; Long Term : 0.05 Temperature Monitoring Monitoring Temperature Range -49 to to 250 *1 Temperature Sensor Type T-type thermocouple Standard : T-type Optional : K-type Monitoring Temperature Resolution 0.01 Monitoring Temperature Relative Accuracy < 0.3 Monitoring Temperature Absolute Accuracy < ( T-25 ) Note *1 : Platform temperature range is highly relating to the structure and design and will need to apply external elements to reach extreme conditions. To reach below -30 degree, it will need extra coolant. To reach beyond 150 degree, other heating material will need to be considered. High Precision Source Measure Unit Model 52400e Series Light emitting devices such as LEDs or laser diodes require sourcing, loading and optical power measurement when conducting parametric test for LIV as well as reverse characteristics. The 52400e series SMUs can either be programmed as a current source to drive the DUT testing forward device characteristics or may also be set as a voltage source performing device reverse characteristics. 1- Slot PXI express module 2/4 independent channels (4 ch for Model 52401e-6-1) 18-bit resolution Four quadrant operation 6-wire Force/Sense/Guard Low output noise DIO/Trigger bits Deterministic hardware sequencer Programmable resistance 16 control bandwidth selection SMU Ch1 LED (DUT) Sync Photo Diode SMU Ch2 Typical LIV test setup for LED Power (mw) Power Voltage Current (ma) Typical LIV Curve of LED/LD Voltage (V) All specifications are subject to change without notice. Please visit our website for the most up to date specifications.

16 HEADQUARTERS CHROMA ATE INC. 66 Huaya 1st Road, Guishan, Taoyuan 33383, Taiwan T F info@chromaate.com ASIA CHROMA JAPAN CORP. 888 Nippa-cho, Kouhoku-ku, Yokohama-shi, Kanagawa, Japan T F CHROMA ATE (SUZHOU) CO., LTD. Building 7, ShiShan Industrial Gallery, No. 855, Zhu Jiang Rd., Suzhou New District, Jiang Su, China T F QUANTEL PTE LTD. (A company of Chroma Group) 46 Lorong 17 Geylang # Enterprise Industrial Building, Singapore T F sales@sg.quantel-global.com USA CHROMA ATE INC. (U.S.A.) 7 Chrysler Irvine, CA T F Toll Free info@chromaus.com EUROPE CHROMA ATE EUROPE B.V. Morsestraat 32, 6716 AH Ede, The Netherlands T F sales@chromaeu.com CHROMA ATE GERMANY Südtiroler Str. 9, Augsburg, Germany T F support-germany@chromaeu.com Chroma ATE Inc. All Rights Reserved E-pdf