General Description. System Block Diagram. Support. Ordering Information. zglue Integration Platform (ZiP ) zorigin ZGLZ1BA Preliminary Datasheet

Transcription

1 General Description System Block Diagram The zglue Integration Platform (ZiP ) aims at revolutionizing the way SoCs are being designed, customized and manufactured. The ZiP is based on zglue s proprietary 2.5D active integration technology that allows designers to stack chips on demand by combining the essential pieces of any smart thing - processing, sensing, memory, and communication into one chip. The flexible silicon platform delivers the most cost-effective approach for individual customization and feature addition, unleashing speedy and high quality SoC designs to businesses of any sizes, and makers with any needs. At the heart of the ZiP is the Smart Fabric TM, an active programmable silicon interposer that empowers heterogeneous integration. It adopts a bed of nails approach to allow zglue-certified chiplets to be easily placed and automatically interconnected. ZGLZ1BA is the first commercially available example of creating a SoC using ZiP technology. ZGLZ1BA is a tiny Bluetooth low energy (BLE) fitness and health tracking system. The zorigin reference design was built based on ZGLZ1BA. ZGLZ1BA utilizes an industry standard BLE MCU, flash memory, a battery charger, a MEMS TCXO, a MEMS accelerometer, and an analog front end for heart rate measurement. These chiplets are automatically connected through a Smart Fabric TM along with application specific firmware at powerup. ZGLZ1BA is provided in a compact BGA solution with an easy to implement 800micron pitch. The full package is 8.8x9.2x1.5mm 3. Support zglue design software zcad streamlines the design process of ZiPs through proprietary algorithms and modular firmware. Proprietary intelligent algorithms ensure all chiplets work together optimally as a system, and either an SDK or BSP is available for ease of firmware development and support. Evaluation boards with preconfigured designs are available to support the development for ZiPs. Figure 1: Block Diagram ZGLZ1BA integrates the following components: Dialog Semiconductor DA MHz 32-bit ARM Cortex M0 MCU with BLE Analog Devices AD8233 Heart Rate Analog Front End (AFE) Macronix MX25R4035F 2 Mbit Flash Memory MCube MC3672 Accelerometer Maxim MAX77734 Power Managment IC (PMIC) SiTime SIT khz Oscillator Vishay SI8466EDB MOSFET 30 passives Ordering Information Part ZGLZ1BA0000 Operating Temp Range 0 C to+70 C Pin Package 100 BGA 8.8x9.2x1.5mm Please contact business@zglue.com for availability. 1

2 Benefits and Features Example Application System Ready to Go Solution, Only Requires Simple PCB SDK Available for Firmware Development Smallest Available Feature Rich Solution 32-bit ARM Cortex M0 processor 2.4GHz BLE radio Lithium Based Battery Charger Fast charging up to 300mA in 7.5mA steps 3-Axis Accelerometer 14-bit Resolution Contact-Based Heart Rate Sensor ECG Capable Low Power AFE 10-bit ADC Resolution Two LED Drivers with Programmable Patterns Thermistor Based Temperature Monitor Vibration Motor Controller Smallest Vibration Motor Compatible RoHS Compliant Reverse Battery Protection Thermal Shutdown Protection Short Circuit Protection ZGLZ1BA Figure 2: Example System Example Applications Wearable Fashion Accessory Wearable Fitness Activity Tracker Wearable Call/Text for Help Safety Device Medical Patient Monitoring, Fall Detection 2

3 Table of Contents General Description... 1 Support... 1 System Block Diagram... 1 Ordering Information... 1 Example Applications... 2 Example Application System... 2 List of Figures... 3 List of Tables... 3 Absolute Maximum Ratings... 4 Electrical Characteristics... 5 Pin Configuration... 6 Pin Description... 7 Detailed Description... 9 External Components Package Information Revision History Copyright Law List of Figures Figure 1: Block Diagram... 1 Figure 2: Example System... 2 Figure 3: BGA Ball Assignment... 6 Figure 4: ZGLZ1BA ZiP underside, exposed top and fully packaged... 9 Figure 5: MCU Pin Assignment Figure 7: 100 Pin BGA Outline Figure 8: 100 pin BGA package top marking List of Tables Table 1: Absolute Maximum Ratings... 4 Table 2: Electrical Characteristics... 5 Table 3: 100 Pin BGA Ball Descriptions... 7 Table 4: DA14585 Pin Assignments Table 5: Package Marking Descriptions Table 6: Revision History

4 Absolute Maximum Ratings Table 1: Absolute Maximum Ratings Parameter Minimum Rating Maximum Supply Voltage (VDD) V Battery Voltage (VBATT) V Charger Voltage (VCHGIN) V Vsys Voltage V LDO Input Voltage (VLDO_IN) V LED Sink Voltage (VLED1, VLED2) V All Other Pins Voltage V ESD (HBM) 2000 V Operating Temperature C Storage Temperature C Soldering Temperature for Reflow 260 C Junction temperature 140 C Junction to Ambient (ΘJA) 27 C Continuous Power Dissipation TBD mw Stresses beyond those listed in the Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Unit 4

5 Electrical Characteristics Table 2: Electrical Characteristics Parameter Symbol Conditions Min Typ Max Units CHGIN Valid Voltage Range VCHGIN Initial CHGIN voltage before charging begins V Battery Voltage VBATT Acceptable battery voltage V Battery Factory-Ship Mode Current IBATT-FSM Factory-ship mode, TA = +25 C, VBATT = 3.7V, SYS = LDO_IN = 0V.5 1 μa VDD VDD Normal mode, VLDO_OUT = VDD 2.7 LDO_OUT 3.15 V Average Current Draw IVDDavg zorigin platform only low power mode current draw Operating Temperature TA Sensors only specified over this range 0 70 C Full System Standby Current Istandby Current from the battery, with all chiplets in lowest power mode TBD TBD μa μa 5

6 Pin Configuration Figure 3: BGA Ball Assignment 6

7 Pin Description Table 3: 100 Pin BGA Ball Descriptions BALL No. SIGNAL Type Description A4 nenldo Input LDO enable. Leave this pin unconnected. A5 POKLDO Output LDO Power-okay. Tie this pin to FABRIC_EN, and pull up to LDO_OUT with a 100KΩ resistor. A6 FABRIC_EN Input When using LDO connect to POKLDO, otherwise drive this p to VDD at least 1ms after VDD comes up. B3 BATT Power input Battery input. Connect to high side of battery. B5 ELCTRD_LA Analog input Heart rate electrode input. Connect this pin to an electrode. B6 ELCTRD_RA Analog input Heart rate electrode input. Connect this pin to an electrode. B7 STARTUP_OK Output Signals that the ZiP has initialized successfully. B8 SDA Input/output I2C data pin. Pulled high internally. C2 CHGIN Power input 5V input for battery charger. C3 pmldo Input LDO power mode control. Leave this pin unconnected. C4 VIB+ Output Current limited vibrator supply pin for high current vibrators. Connect to high side of vibration motor. This pin is connected to BATT with a 49.9Ω resistor internally. C5 VIB_C/MISO Output Vibration motor control pin. Connect to a MOSFET to control a vibration motor. This pin is duplexed and also used as MISO C6 RST Input MCU reset pin. Pull low with 100kΩ externally. C8 INT Input Open drain interrupt. Pulled high internally. C9 SCL Input/output I2C clock pin. Pulled high internally. D1 SYS Power Battery voltage. Connect to a 10uF bypass cap and output LDO_IN D2 LDO_IN Power input PMIC LDO input D8 SW_CLK Input/output MCU JTAG debugging pin, can also be used as extra chip select for SPI or GPIO at the expense of JTAG. E1 LDO_OUT Power LDO output. Connect to VDD if using internal LDO. E2 SCK Input/output SPI clock for external sensors. E8 SWDIO Input/output MCU JTAG debugging pin, can also be used as extra chip select for SPI at the expense of JTAG. F2 VIB_C/MISO Input/output Connect to other VIB_C/MISO pin. F10 DCDC Power Dialog buck VDCDC pin. Connect to Switch pin through an inductor. See external parts section for details on inductors. G1 THM Input Thermistor input. Connect a thermistor from this pin to ground, and a thermal connection from whatever you want to measure to the ground of the thermistor pin. G2 MOSI Input/output SPI MOSI from MCU. For external sensors. 7

8 G10 SWITCH Power Dialog buck switched node. Connect to VDCDC pin through an inductor. See external parts section for detail on inductors. J7 XTAL16Mp Input/output Connect one side of the 16MHz crystal to this pin. J8 XTAL16Mm Input/output Connect the other side of the 16MHz crystal to this pin. K4 LED1 Input LED current sink. Connect the cathode of an LED to this pin, and the anode to SYS K5 LED2 Input LED current sink. Connect the cathode of an LED to this pin, and the anode to SYS K6 RFIOp Output BLE RF output. Connect this to an antenna through a matching network. See external components section for more details on RF. K7 RFIOm Power BLE ground. Connect this to ground near the antenna. H8 Reserved Input/output Connect to H9 H9 Reserved Input/output Connect to H8 G3 Reserved Input/output Pull to GND with a 500kΩ resistor. D4, D6, E5, E7, F4, F6, F8, G5, GND Power Power supply ground. G7, G8 D5, D7,E4, E6, F1, F5,F7, G4, G6, H6 VDD Power A1, A2, A3, A7, A8, A9, A10, B1, B2, B4, B9, B10, C1, C7, C10, D3, D9, D10, E3, E9, E10, F3, F9, G9, H1, H2, H3, H4, H5, H7, H10, J1, J2, J3, J4, J5, J6, J9, J10, K1, K2, K3, K8, K9, K10 System 3V supply. Power from LDO_OUT if using the LDO, or external buck if using Buck. All pins must be connected. N.C. No connect Reserved. Do not connect. Reserved Pins: No Connect (Reserved) pins are expected to be soldered down to a pad, but not connected to anything or each other. 8

9 Detailed Description ZGLZ1BA consists of the chiplets below: Dialog Semiconductor DA Microcontroller with BLE SiTime SiT kHz oscillator MCube MC Accelerometer Macronix MX25R2035F - Flash memory Maxim Integrated MAX Power Management IC (PMIC) Analog Devices AD Heart rate Analog Front End (AFE) Figure 4: ZGLZ1BA ZiP underside, exposed top and fully packaged ZGLZ1BA is preconfigured at startup to integrate all these chiplets and connect them to form a cohesive system. zorigin also has a current limited supply pin to drive a vibration motor and pin to control such a motor. 9

10 DA14585 The DA14585 is an industry standard 16MHz 32-bit ARM Cortex M0 microcontroller; it also includes a BLE radio. The DA14585 is not only what controls the system, but also how it communicates. For complete information on this part refer to its datasheet. The one included in zorigin is the WLCSP variant. At startup the DA14585 must complete the configuration of the zorigin, and after this the pins on it are connected as follows Figure 5: MCU Pin Assignment Table 4: DA14585 Pin Assignments Pin VDCDC, SWITCH RST SW_CLK SWDIO P0_0 P0_1 Connection Buck converter. Connect a 2.2μH inductor between VDCDC (zorigin pin DCDC) and SWITCH. All other necessary parts are provided internally. Available as ball RST on zorigin ZiP Module package. Available as SW_CLK on zorigin ZiP Module package. Available as SWDIO on zorigin ZiP Module package. SPI clock. Connected to MX25R4035F internally. Available as SCK on zorigin package. Connected to output of AD8233 internally. 10

11 P0_2 P0_3 P0_4 P0_5 P0_6 P0_7 P1_0 P1_1 P1_2 P1_3 XTAL32Kp XTAL16Mp and XTAL16Mm RFIOp RFIOm Connected to AMUX pin on MAX77734 internally. Connected to chip select for MX25R4035F internally. Reserved for zorigin Module setup. SPI MISO line. Connected to MX25R4035F MISO internally. Available as MISO on zorigin ZiP Module package. This pin is also used to drive the gate of the external MOSFET used to control the vibration motor. SPI MOSI line. Connected to MX25R4035F MOSI internally. Available as MOSI on zorigin ZiP Module package. Reserved for zorigin Module setup.* I2C SCL line. Connected to MAX77734, MC3673, and pulled high internally. Available as SCL on zorigin ZiP Module package. I2C SDA line. Connected to MAX77734, MC3673, and pulled high internally. Available as SDA on zorigin ZiP Module package. Connected to open drain interrupts from MC3672, MAX77734 and pulled high internally. Available as INT pin on zorigin ZiP Module Package. Connected to SDN pin on AD8233 internally. Connected to output of SiT1552 internally. Connected to pins of the same name on zorigin ZiP Module, connect an external crystal across these pins. Connected to pin of the same name on zorigin ZiP Module, connect to an external antenna. Connected to pin of the same name on zorigin ZiP Module. The Dialog MCU can be programmed via OTA with the app provided by Dialog. For more information or other options contact zglue. *This pin could be made available in future revisions. 11

12 SiT1552 The SiT1552 is a 32KHz MEMs oscillator. This is used with the DA14585 to provide a stable 32KHz oscillation and save power. This enables the DA14585 to not need its 32KHz sleep clock, which saves a considerable amount of power. MC3672 The MC3672 is a MEMs accelerometer with ranges from +/-2g to +/-16g, up to 12-bit and up to 1300 samples/sec resolution with its FIFO, and 14-bit single samples. The MC3672 is connected over I2C, its 7-bit I2C address is set to 0x6C, and its interrupt is configured as open drain. MX25R4035F The MX25R4035F is a 2Mb flash memory chip. It is connected over SPI to the DA It is where the code that runs on the MCU is stored, and loaded at startup. It can also be used to store data. MAX77734 The MAX77734 is a PMIC that serves a few purposes in the system. Its main purpose is its LDO, which is what supplies VDDIO to the system. It also contains a battery charger and LED driver. The LED driver is programmable. The MAX77734 is connected over I2C with its interrupt pin configured as open drain. It s two LED pins are connected to LED1 and LED2 on the zorigin package. BATT, CHGIN, and THM are connected to the BATT, CHGIN, and THM pins on the zorigin module. THM can be connected to a thermistor externally, and the other side of the thermistor should be grounded. For more information about thermistors see the recommended parts section. The AMUX pin is connected to AMUX on the zorigin module, and an ADC on the MCU, this is how battery voltage and the thermistor/temperature are measured. AD8233 The AD8233 is a low-power AFE for measuring heart rate and ECG. It s output is connected to an ADC on the MCU, and it s shutdown control pin is also driven from the MCU. All of the passives required for the this part are included inside the zorigin Module, and all that is necessary externally to detect heart rate are two electrodes connected to the body with a path across the heart. Vibration Motor Control ZGLZ1BA provides a current limited supply pin to drive a vibration motor, and a GPIO pin on the MCU to drive the gate of an external MOSFET to turn the vibrator on and off. 12

13 External Components There are some external parts that are required for the ZGLZ1BA to function, and some that are recommended to make use of the features. Minimum Required parts The parts below are the bare minimum to have a system that is able to turn on. Battery: Li-ion rechargeable battery. 16MHz crystal: Crystal should be laid out as close to the ZiP as possible, and connected to pins XTAL16Mp and XTAL16Mm Inductor: An μH inductor laid out as close to the ZiP as possible, between pins DCDC and Switch. Antenna and matching network: a 2.4GHz antenna with an appropriate matching network. Charging connector: A solution to connect 5V to for charging. Bypass caps: μF on SYS and BATT, μF on CHGIN. Pull down resistor: 100kΩ on RST pin. Pull up resistor: 100kΩ on POKLDO pin. Pull down resistor: 500kΩ on pin G3. Parts to Enable Full Functionality The parts below are necessary (in addition to the minimum above) to enable full functionality of the zorigin Module. A 2 color LED (or two single color LEDs). A vibration motor and MOSFET to control it. Two electrodes for heart rate monitoring. A thermistor (100k Ohms at 25 C recommended) and electrode for it to measure temperature. Recommended Parts To see an already implemented system refer to the zorigin. This is a fully featured system on a 28.1x11mm PCB 13

14 Figure 6: zorigin Reference Design Schematic zglue Inc. Revised August,

15 Package Information Figure 6: 100 Pin BGA Outline 15

16 Figure 7: 100 pin BGA package top marking Table 5: Package Marking Descriptions Line 1 Dot Pin A1 marker Line 2 Symbol zglue Logo Line 3 ZGLZ1BA Indicates this is the zorigin ZiP Module XXXX For zglue use Line 4 XXXX For zglue use XX-XX Date code Line 5 XXXXX For zglue use O RoHS Approval symbol 16

17 Revision History Table 6: Revision History Date Version Changes June 2018 Rev A Initial Release July 2018 Rev A.1 Corrected erroneous flash memory part number August 2018 Rev A.2 Corrected pinout and necessary components. Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. zglue, Inc., its affiliates, agents, officers, directors and employees, and all persons acting on its or their behalf (collectively, zglue ), specifically disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. zglue makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, zglue disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on zglue s knowledge of typical requirements that are often placed on zglue products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer s responsibility to validate that a particular product with the properties described in the zglue product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer s technical experts. Product specifications do not expand or otherwise modify zglue s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, zglue products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the zglue product could result in personal injury or death. Customers using or selling zglue products not expressly indicated for use in such applications do so at their own risk. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of zglue. Copyright Law The contents and works on these pages compiled by zglue are subject to copyright law. Copying, processing, distribution and any kind of use outside the limits of copyright law require the written consent of zglue. In case the content is not created by zglue, the copyrights of third parties are being observed. In particular contents of third parties are marked as such. However, if a user becomes aware of a copyright infringement, zglue asks the user for notification. Upon notification of such violations, zglue will remove the content immediately. 17