AOZ8312. Low Capacitance 2.5 V TVS Diode. Features. General Description. Applications

Transcription

1 Low Capacitance 2.5 V TVS Diode General Description The is a transient voltage suppressor array designed to protect high speed data lines from ESD and lightning. This incorporates twelve low capacitance steering diodes and a TVS in a single package. During transient conditions, the steering diodes direct the transient to either the positive side of the power supply line or to ground. The may be used to meet the ESD immunity requirements of IEC , Level 4 and IEC The TVS diodes provide effective suppression of ESD voltages: ±30 kv (air discharge) and ±30 kv (contact discharge). The comes in a Halogen Free and RoHS compliant 3.5 mm x 2.5 mm x 0.55 mm DFN- package and is rated over a -40 C to +85 C ambient temperature range. The is compatible with both lead free and SnPb assembly techniques. The small size, low capacitance and high ESD protection makes the ideal for protecting high speed video and data communication interfaces. Features ESD protection for high-speed data lines: IEC , level 4 (ESD) immunity test ±30 kv (air discharge) and ±30 kv (contact discharge) IEC (EFT) 40 A (5/50 ns) IEC (Lightning) 18 A Human Body Model (HBM) ±30 kv Small package saves board space Low insertion loss Protects twelve lines Low clamping voltage Low operating voltage: 2.5 V Green product Pb-free device Applications Video graphics cards Monitors and flat panel displays Digital Video Interface (DVI) T1/E1 telecom ports Typical Application Circuit Diagram Protection of Twelve Lines Rev. 1.0 August Page 1 of 7

2 Ordering Information Part Number Ambient Temperature Range Package Environmental DI -40 C to +85 C 3.5 mm x 2.5 mm DFN- Green Product AOS Green Products use reduced levels of Halogens, and are also RoHS compliant. Please visit for additional information. Pin Configuration DFN- (Top View) Absolute Maximum Ratings Exceeding the Absolute Maximum ratings may damage the device. Parameter Rating Peak Pulse Current (I PP ), t P = 8/20 µs 18 A Peak Power Dissipation (8 x 20 µs@ 25 C) 160 W Storage Temperature (T S ) -65 C to +150 C ESD Rating per IEC , Contact (1) ±30 kv ESD Rating per IEC , Air (1) ±30 kv ESD Rating per Human Body Model (2) ±30 kv Notes: 1. IEC discharge with C Discharge = 150 pf, R Discharge = 330 Ω. 2. Human Body Discharge per MIL-STD-883, Method 3015 C Discharge = 100 pf, R Discharge = 1.5 kω. Maximum Operating Ratings Parameter Rating Junction Temperature (T J ) -40 C to +5 C Rev. 1.0 August Page 2 of 7

3 Electrical Characteristics T A = 25 C unless otherwise specified. Symbol Parameter Conditions Min. Typ. Max. Units = 8/20 µs, any pin to (3) 2.3 V RWM Reverse Working Voltage Between any pin 5 and (4) 2.5 V I R Reverse Leakage Current V RWM = 2.5 V, between any pin 5 and 1 µa V BR Reverse Breakdown Voltage I T = 100 µa 2.8 V V CL Channel Clamp Voltage I PP = 2 A, tp Positive Transients 3.5 V Channel Clamp Voltage I PP = 10 A, tp = 8/20 µs, any pin to (3) Positive Transients 6.5 V Channel Clamp Voltage I PP = 18 A, tp = 8/20 µs, any pin to (3) Positive Transients 9 V C j Junction Capacitance V R = 0 V, f = 1 MHz, any pin to Ground 3.5 pf V R = 0 V, f = 1 MHz, between pins (3) 1.2 pf Notes: 3. These specifications are guaranteed by design. 4. The working peak reverse voltage, V RWM, should be equal to or greater than the DC or continuous peak operating voltage level. 5. V BR is measured at the pulse test current I T. Rev. 1.0 August Page 3 of 7

4 Typical Performance Characteristics 10 Clampling Voltage vs. Peak Pulse Current (IEC /20µs pulse current) 10 Forward Voltage vs. Forward Current (IEC /20µs pulse current) 9 9 Peak Voltage (V) Forward Voltage (V) Peak Pulse Current (A) Forward Current (A) Capacitance vs. Reverse Bias 1.1 Normalized Capacitance Reverse Bias (V) Rev. 1.0 August Page 4 of 7

5 Package Dimensions, DFN 3.5mm x 2.5mm x 0.55mm, L, EP2 D E 3xL3 14xb k2 e3 k3 k1 4xb1 2xL1 Pin #1 Dot by Marking TOP VIEW 2xL2 e2 e1 e 2 1 xl BOTTOM VIEW A A1 A2 SIDE VIEW RECOMMENDED LAND PATTERN x0.25 3x (2.40) x UNIT: mm Dimensions in Millimeters Symbols Min. A 0.50 A A2 b 0.15 b D 3.40 E 2.40 e e1 e2 e3 k1 k2 k3 L 0.30 L L L Nom. Max (0.15) BSC 0.60 BSC 1.10 BSC 1.10 BSC (0.20) (0.30) (0.13) Dimensions in Millimeters Symbols A A1 A2 b b1 D E e e1 e2 e3 k1 k2 k3 L L1 L2 L3 Min Nom (0.006) Max BSC BSC BSC BSC (0.008) (0.0) (0.005) Notes: 1. Controlling dimension is millimeter. Converted inch dimensions are not necessarily exact. 2. Tolerance: unless otherwise specified. 3. Radius on all corners is max., unless otherwise specified. 4. Package warpage: 0.0 max. 5. No any plastic flash allowed on the top and bottom lead surface. 6. Pad planarity: Crack between plastic body and lead is not allowed. Rev. 1.0 August Page 5 of 7

6 Tape and Reel Dimensions, DFN 3.5mm x 2.5mm x 0.55mm, L, EP2 Carrier Tape 3 Max. C L T B0 K0 Section Y-Y D0 D1 Y P2 R 0.3 Typical X X P1 A0 P F(III) E1 4.2 W UNIT: mm Feeding Direction Package DFN 3.5x2.5 A B0 K0 D0 D1 W E1 F P0 P1 P2 T / / ± Reel W1 S OPTION 1 M N K OPTION 2 W H UNIT: mm Tape Size Reel Size M N W W1 H S K mm ø178 ø178 ±1.0 ø54 ± ± ±0.5 ø / ± ±0.2 Leader / Trailer & Orientation Unit Per Reel: 2000 pcs Trailer Tape 300mm Min. Components Tape Orientation in Pocket Leader Tape 500mm Min. Rev. 1.0 August Page 6 of 7

7 Part Marking DI (DFN-) Part Number Code AA0A YWLT Assembly Location Code Option Code Year & Week Code Assembly Lot Code LEGAL DISCLAIMER Alpha and Omega Semiconductor makes no representations or warranties with respect to the accuracy or completeness of the information provided herein and takes no liabilities for the consequences of use of such information or any product described herein. Alpha and Omega Semiconductor reserves the right to make changes to such information at any time without further notice. This document does not constitute the grant of any intellectual property rights or representation of non-infringement of any third party s intellectual property rights. LIFE SUPPORT POLICY ALPHA AND OMEGA SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Rev. 1.0 August Page 7 of 7